PCBA board for PTC heater

Abstract

The utility model brings forward a PCBA board used for a PTC heater, the PCBA board comprises a PCB board and a plurality of modules arranged on the PCB board, the PCBA board is divided into a low-voltage control area and a high-voltage power area, the low-voltage control area comprises a low-voltage plug connector, a CAN / LIN communication module, a master control MCU module, a low-voltage EMI filtering module and a DCDC voltage conversion module, and the high-voltage power area comprises a high-voltage power conversion module. The high-voltage power area comprises a slave control MCU module, a driving and power switch module, an X / Y capacitor module and a high-voltage input module. Wherein the CAN / LIN communication module and the low-voltage EMI filtering module are arranged close to a low-voltage plug connector, the master control MCU module is arranged close to the CAN / LIN communication module, the DCDC voltage conversion module is arranged close to the low-voltage EMI filtering module, the slave control MCU module is arranged close to the master control MCU module of a low-voltage control area, and the driving and power switch module is arranged close to the slave control MCU module. And the X / Y capacitor module is arranged between the driving and power switch module and the high-voltage input module. The PCBA board is compact in layout structure, the purposes of reducing the size and enhancing the EMC performance are achieved, and meanwhile the quality detection cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electric vehicle PTC heaters, and particularly relates to a PCBA board for a PTC heater. Background Art

[0002] With the continuous development and technological progress of the automotive industry, the application scope of automotive PTC heaters is also constantly expanding, and it has gradually become the mainstream heating element for heating automotive power batteries.

[0003] At present, the quality of the board layout structures of PTC heaters on the market varies. Constrained by various factors such as space, EMC, and connectors, it is often necessary to continuously change the layout design to meet the high-quality requirements of vehicle control boards. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a PCBA board for a PTC heater, by standardizing the layout structures of key components, PCB materials, positions of key connectors, etc., to achieve the purpose of reducing size, enhancing EMC performance, and at the same time being able to reduce the quality inspection cost and improve the detection quality. The specific technical solutions are as follows:

[0005] A PCBA board for a PTC heater, the PCBA board includes a PCB board and a plurality of modules arranged on the PCB board. The PCBA board is divided into a low-voltage control area and a high-voltage power area. The low-voltage control area includes a low-voltage connector, a CAN / LIN communication module, a main control MCU module, a low-voltage EMI filtering module, and a DCDC voltage conversion module. The high-voltage power area includes a slave control MCU module, a drive and power switch module, an X / Y capacitor module, and a high-voltage input module.

[0006] Further, the low-voltage connector is used to access a low-voltage power supply and communication equipment. The input end of the low-voltage EMI filtering module is connected to the low-voltage connector, and the output end of the low-voltage EMI filtering module is connected to the CAN / LIN communication module, the main control MCU module, and the DCDC voltage conversion module. The main control MCU module is also connected to the CAN / LIN communication module and the DCDC voltage conversion module;

[0007] The high-voltage input module is used to access a high-voltage power supply. The output end of the high-voltage input module is connected to the X / Y capacitor module, the output end of the X / Y capacitor module is connected to the drive and power switch module. The drive and power switch module is also connected to the slave control MCU module. The slave control MCU module is connected to the main control MCU module and the DCDC voltage conversion module.

[0008] Further, the low-voltage connector is arranged at a position near the edge of the middle of the PCB board. The CAN / LIN communication module and the low-voltage EMI filtering module are arranged closely to the low-voltage connector. The main control MCU module is arranged closely to the CAN / LIN communication module and near the center of the PCB board. The DCDC voltage conversion module is arranged closely to the low-voltage EMI filtering module.

[0009] Further, the slave control MCU module is arranged at a position near the main control MCU module and below the middle of the PCB board. The drive and power switch module is arranged on one side of the slave control MCU module. The high-voltage input module is arranged at a position near the edge of one side of the PCB board. The X / Y capacitor module is arranged between the high-voltage input module and the drive and power switch module.

[0010] Further, the PCB board adopts a double-sided four-layer structure. The top layer of the PCB board arranges the low-voltage connectors and multiple modules. The bottom layer of the PCB board arranges all detection points.

[0011] Further, the CAN / LIN communication module includes a communication IC chip. The output end of the communication IC chip is connected to the TX pin and RX pin of the MCU chip in the main control MCU module.

[0012] Further, the main control MCU module includes an MCU chip and a crystal oscillator. The crystal oscillator is arranged on one side of the main control MCU module near the center of the PCB board.

[0013] Further, the DCDC voltage conversion module includes a transformer and a power control IC. The transformer is arranged on one side of the DCDC voltage conversion module near the middle of the PCB board. The DCDC voltage conversion module converts 12V voltage into 15V or 5V voltage and outputs it to the slave control MCU module and the drive and power switch module.

[0014] Further, the drive and power switch module includes a drive circuit and an IGBT.

[0015] Further, the X / Y capacitor module includes an X capacitor and a Y capacitor. The Y capacitor is close to the high-voltage input module.

[0016] A PCBA board for a PTC heater provided by the present utility model has the following beneficial effects:

[0017] 1. A PCBA board for a PTC heater provided by the present utility model has a compact layout structure. For example, the low-voltage EMI filtering module is close to the low-voltage power supply inlet to achieve the best filtering effect; the CAN / LIN communication module is close to the low-voltage connector, and at the same time, the main control MCU module is close to the CAN / LIN communication module to ensure the shortest communication line path; the drive and power switch module is close to the slave control MCU module to ensure the shortest transmission path of the drive signal; the layout structure of this PCBA board achieves the purpose of reducing size and enhancing EMC performance.

[0018] 2. A PCBA board for a PTC heater provided by the present utility model adopts a double-sided four-layer structure design, making the detection points concentrated on one side. This not only improves the detection efficiency but also can avoid placing high components on the bottom surface during board layout, increasing the reliability of detection. The four-layer board structure adopts a general board design structure of signal-ground-power-signal, which can ensure the integrity of the ground plane. And through the electrical connection characteristics of vias, the available routing area is increased by nearly 3 times, which is beneficial to reducing crosstalk between traces and improving the stability of EMC. Description of the Drawings

[0019] Figure 1 is a schematic diagram of the layout structure of a PCBA board for a PTC heater provided by the present utility model;

[0020] Figure 2 is a physical diagram of the top layer of the PCBA board in an embodiment of the present utility model.

[0021] Reference numerals: 1 - low-voltage connector, 2 - CAN / LIN communication module, 3 - main control MCU module, 4 - low-voltage EMI filtering module, 5 - DCDC voltage conversion module, 6 - slave control MCU module, 7 - drive and power switch module, 8 - X / Y capacitor module, 9 - high-voltage input module. Detailed Embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings provided by the present utility model. According to the following description, the advantages and features of the present utility model will be clearer. It should be noted that the drawings are all in a very simplified form and use non-precise scales, only for the purpose of conveniently and clearly assisting in explaining the embodiments of the present utility model.

[0023] In the description of the present utility model, unless otherwise clearly specified and defined, the terms "connection" and "connection" shall be interpreted in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0024] In the description of the present utility model, the orientation or positional relationships such as "upper", "lower", "left", "right", "front", "rear", "center", "horizontal", "vertical", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings. It is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0025] Embodiment:

[0026] This embodiment provides a PCBA board for a PTC heater. Refer to Figure 1 As shown, the PCBA board includes a PCB board and a plurality of modules mounted on the PCB board. The layout structure of the PCBA board is divided into a low-voltage control area and a high-voltage power area. The low-voltage control area includes a low-voltage connector 1, a CAN / LIN communication module 2, a main control MCU module 3, a low-voltage EMI filter module 4, and a DCDC voltage conversion module 5. The high-voltage power area includes a slave control MCU module 6, a drive and power switch module 7, an X / Y capacitor module 8, and a high-voltage input module 9. Among them, the input end of the low-voltage EMI filter module 4 in the low-voltage control area is connected to the low-voltage connector 1, and the output end of the low-voltage EMI filter module 4 is connected to the CAN / LIN communication module 2, the main control MCU module 3, and the DCDC voltage conversion module 5. The main control MCU module 3 is also connected to the CAN / LIN communication module 2 and the DCDC voltage conversion module 5. The output end of the high-voltage input module 9 in the high-voltage power area is connected to the input end of the X / Y capacitor module 8, the output end of the X / Y capacitor module 8 is connected to the input end of the drive and power switch module 7, the slave control MCU module 6 is connected to the drive and power switch module 7, and is also connected to the main control MCU module 3 and the DCDC voltage conversion module 5 in the low-voltage control area.

[0027] The following specifically describes the layout structure of the PCBA board and each module.

[0028] Specifically, the PCB board adopts a stacked structure, namely a double-sided four-layer structure. The copper thickness of the top and bottom layers is 2 oz each, and the copper thickness of the two inner layers in the middle is 1 oz each. The PCB board is made of FR-4 material with CTI≥175 and TG≥150. Each module is arranged on the top layer of the PCB board, and the detection points are concentrated on the bottom layer of the PCB board. The middle layer is used for routing. The double-sided four-layer design greatly improves the space utilization rate of the PCB board, making the detection points concentrated on one side, which not only improves the detection efficiency but also avoids placing components on the bottom surface during board layout, increasing the reliability of detection.

[0029] Specifically, the low-voltage connector 1 is used to access the low-voltage power supply and communication equipment and can be arranged at a position near the edge of the middle part of the top layer of the PCB board.

[0030] Specifically, the CAN / LIN communication module 2 is used for information exchange between the main control MCU module 3 and external communication equipment. Its main components include a communication IC chip. The output end of the communication IC chip is connected to the TX pin and RX pin of the MCU chip in the main control MCU module 3. Since the input of the CAN / LIN communication module 2 comes from the communication interface of the low-voltage connector 1 and the EMC performance needs to be considered, the CAN / LIN communication module 2 is arranged at a position close to the communication interface of the low-voltage connector 1, and at the same time, the CAN / LIN communication module 2 is between the low-voltage connector 1 and the main control MCU module 3.

[0031] Specifically, the main control MCU module 3 is used to control the operation of the entire PCBA board, so it is arranged at a position close to the center of the PCB board. Its main components include an MCU chip and a crystal oscillator. Due to the EMC sensitivity of the crystal oscillator, it must be far away from the heat source and the board edge, so it is arranged at a position close to the inner side of the main control MCU module 3 to ensure the shortest communication path while the crystal oscillator of the MCU can also be far away from the edge of the PCB board.

[0032] Specifically, the low-voltage EMI filtering module 4 is used to filter the common-mode and differential-mode interference of the low-voltage power supply. Its main components include a common-mode inductor, a power inductor, and a capacitor. The low-voltage EMI filtering module 4 is arranged at a position close to the low-voltage power supply interface of the low-voltage connector 1 to achieve the best filtering effect.

[0033] Specifically, the DCDC voltage conversion module 5 is used for isolation and voltage conversion. Its main components include a transformer and a power control IC. A switching power supply is generally a typical noise source and sensitive device on the control board. The most crucial aspects are the placement of the transformer and the suppression of clutter. Since the transformer is a typical interference source, it must be arranged towards the middle of the PCB board to avoid magnetic flux leakage from the edge of the PCB board. Additionally, an RC absorption circuit is arranged in the circuit principle to suppress the noise at the noise generation node. The DCDC voltage conversion module 5 is arranged after the low-voltage EMI filtering module 4 to ensure that a clean power supply is used for voltage conversion and to suppress the conducted interference generated by the DCDC conversion circuit. The DCDC voltage conversion module 5 converts the 12V voltage in the low-voltage control area into 15V or 5V voltage and outputs it to the slave hole MCU module 6, drive, and power switch module 7 in the high-voltage control area.

[0034] Specifically, the main components of the slave MCU module 6 include an MCU chip and a crystal oscillator. Similarly, the crystal oscillator is far from the edge of the PCB board. The slave MCU module 6 is used to collect information such as temperature, voltage, and current on the high-voltage power side, interact with the master MCU module 3, and transfer the control information of the master MCU module 3 to the drive and power switch module 7. Therefore, the slave MCU module 6 is arranged close to the master MCU module 3, that is, at a position close to the center below the PCB board surface, ensuring that the slave MCU module 6 is far from the high-voltage power area while also ensuring that the crystal oscillator is not close to the edge of the PCB board.

[0035] Specifically, the drive and power switch module 7 is used to turn on and off the PTC heater load. Its main components include a drive circuit and an IGBT. The drive and power switch module 7 is arranged close to the slave MCU module 6 to ensure the shortest transmission path of the drive signal and to meet the isolation and current-carrying requirements for the wiring loop with the power connector.

[0036] Specifically, the X / Y capacitor module 8 is used to filter out power line interference. Its main components include an X capacitor and a Y capacitor. The X / Y capacitor module 8 is arranged close to the high-voltage input module 9. Among them, the Y capacitor is closer to the high-voltage input module 9 because it can achieve good EMC effects. The high-voltage passes through the X / Y capacitor module 8 and is input to the drive and power switch module 7. Therefore, the X / Y capacitor module 8 is also close to the drive and power switch module 7, that is, the X / Y capacitor module 8 is arranged between the drive and power switch module 7 and the high-voltage input module 9.

[0037] Refer to Figure 2As shown, it is a physical diagram of the layout structure of the above PCBA board. This PCBA board not only has a compact layout structure, but also enhances the electromagnetic compatibility immunity and reduces the radiation emission, achieving the purpose of reducing the size and enhancing the EMC performance. At the same time, it can reduce the quality inspection cost and improve the detection quality.

[0038] Those skilled in the art of this technology should understand that the present utility model can be implemented in many other specific forms without departing from the spirit and scope of the present utility model. Based on the embodiments in the present utility model, any changes and modifications made by those of ordinary skill in the art of the present utility model according to the above disclosure shall fall within the protection scope of the claims.

Claims

1. A PCBA board for a PTC heater, characterized in that: The PCBA board includes a PCB board and a plurality of modules arranged on the PCB board, the PCBA board is divided into a low-voltage control area and a high-voltage power area, the low-voltage control area includes a low-voltage connector, a CAN / LIN communication module, a master control MCU module, a low-voltage EMI filter module and a DCDC voltage conversion module, and the high-voltage power area includes a slave control MCU module, a drive and power switch module, an X / Y capacitor module and a high-voltage input module; The low-voltage connector is used to access a low-voltage power supply and a communication device. The input end of the low-voltage EMI filter module is connected to the low-voltage connector. The output end of the low-voltage EMI filter module is connected to the CAN / LIN communication module, the main control MCU module and the DCDC voltage conversion module. The main control MCU module is also connected to the CAN / LIN communication module and the DCDC voltage conversion module. The high-voltage input module is used to access the high-voltage power supply, the output end of the high-voltage input module is connected to the X / Y capacitor module, the output end of the X / Y capacitor module is connected to the drive and power switch module, the drive and power switch module is also connected to the slave control MCU module, and the slave control MCU module is connected to the master control MCU module and the DCDC voltage conversion module; The low-voltage connector is arranged in the middle of the PCB board near the edge of the board, the CAN / LIN communication module and the low-voltage EMI filter module are arranged close to the low-voltage connector, the main control MCU module is arranged close to the CAN / LIN communication module and close to the center of the PCB board, and the DCDC voltage conversion module is arranged close to the low-voltage EMI filter module.

2. The PCBA board for a PTC heater according to claim 1, characterized in that: The slave control MCU module is arranged at a position close to the master control MCU module and below the middle of the PCB board, the drive and power switch module is arranged on one side of the slave control MCU module, the high voltage input module is arranged on one side of the PCB board close to the edge of the board, and the X / Y capacitor module is arranged between the high voltage input module and the drive and power switch module.

3. The PCBA board for a PTC heater according to any one of claims 1-2, characterized in that: The PCB board adopts a double-sided four-layer structure, the low-voltage connector and the plurality of modules are arranged on the top layer of the PCB board, and all detection points are arranged on the bottom layer of the PCB board.

4. The PCBA board for a PTC heater according to claim 3, characterized in that: The CAN / LIN communication module comprises a communication IC chip, and an output end of the communication IC chip is connected to a TX pin and a RX pin of an MCU chip in the main control MCU module.

5. The PCBA board for a PTC heater according to claim 3, characterized in that: The main control MCU module includes an MCU chip and a crystal oscillator, and the crystal oscillator is arranged on one side of the main control MCU module close to the center of the PCB board.

6. The PCBA board for a PTC heater according to claim 3, characterized in that: The DCDC voltage conversion module includes a transformer and a power control IC. The transformer is arranged on one side of the DCDC voltage conversion module close to the middle of the PCB board. The DCDC voltage conversion module converts 12V voltage into 15V or 5V voltage and outputs it to the slave control MCU module and the drive and power switch module.

7. The PCBA board for a PTC heater according to claim 3, characterized in that: The drive and power switch module includes a drive circuit and an IGBT.

8. The PCBA board for a PTC heater according to claim 3, characterized in that: The X / Y capacitor module includes an X capacitor and a Y capacitor, and the Y capacitor is close to the high-voltage input module.

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