VIA plug hole structure of PCB

Abstract

The utility model relates to the technical field of PCB (printed circuit board) hole filling, and discloses a VIA hole plugging structure of a PCB, which comprises a PCB provided with a VIA hole and a printing ink plug column used for plugging the hole, the printing ink plug column is formed by printing ink accumulation, a cavity is arranged in the printing ink plug column, the cavity is filled with viscous liquid, and the printing ink plug column is filled with the viscous liquid. One end or two ends of the ink plug column is / are covered with a copper-plated layer, and the copper-plated layer is / are flush with the inside of the outer surface of the PCB. According to the VIA plug hole structure of the PCB, the printing ink plug column is directly plugged into the VIA hole, pressure is applied to the printing ink plug column, so that the printing ink plug column and the cavity are broken, viscous liquid permeates into the printing ink plug column and the contact position of the printing ink plug column and the VIA hole, then after the printing ink plug column is dried, the redundant printing ink plug column is polished away, and the printing ink plug column and the cavity are separated from each other. And the surface of the ink plug column is covered with the copper-plated layer, and the whole operation only comprises plugging, polishing and plating of the copper-plated layer, so that the effect of simple operation is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board via hole filling, in particular to a VIA plug hole structure of a PCB board. Background Technique

[0002] VIA is called a via hole, which is divided into through holes, blind holes, and buried holes. It is mainly used for wire connection of networks on different layers and plays an electrical connection role.

[0003] The existing plug hole methods are generally divided into three types:

[0004] A: Plug the hole with an aluminum sheet and then brush green oil on the whole board. The filling degree of the plug hole can reach about 65%.

[0005] B: Screen-print green oil on the whole board to connect the plug holes. The filling degree of the plug hole is about 30%.

[0006] C: Resin plug hole. The plug hole is filled and flush with the copper surface of the PCB, but the production cost is high, the process is complex, and the equipment for resin plug hole is relatively expensive.

[0007] For small-sized PCB boards, in order to save wiring space, many VIA holes are directly drilled on the pads of SMDs. This drilling method is likely to cause phenomena such as insufficient soldering and false soldering on the pads when using the above methods A and B. Therefore, the resin plug hole method is mostly used for repair.

[0008] When using the resin plug hole, its process is very complex and extremely inconvenient to operate. For example, in the Chinese invention patent with the publication number: CN110769609A and the name "A Photosensitive Film Plug Hole Board and a PCB Board Resin Plug Hole Method", it discloses that "the PCB board resin plug hole method includes the following steps: a. Drill a through hole (F) on the PCB substrate; b. Paste a photosensitive film (D) on the upper surface of the PCB substrate, and the photosensitive film (D) covers the through hole (F); c. Perform vacuum hot pressing on the photosensitive film (D) so that the photosensitive film (D) is squeezed into the through hole (F), and the photosensitive film (D) in the through hole (F) is the plug hole photosensitive resin (D1); d. Use the light source (E) of an exposure machine to expose the lower surface of the PCB substrate, and the light source (E) enters the through hole (F), and the plug hole photosensitive resin (D1) is exposed to generate crosslinking and curing; e. Perform a developing process on the photosensitive film (D) to remove the unexposed part on the photosensitive film (D); f. Remove the excess resin at both ends of the plug hole photosensitive resin (D1) through a grinding machine".

[0009] It can be seen that the operation of resin plug hole is relatively complex.

[0010] Therefore, a VIA plug hole structure of a PCB board is proposed to simplify the plug hole operation of the PCB board and make the plug hole operation simpler. Summary of the Invention

[0011] The purpose of the present utility model is to provide a VIA plug hole structure for a PCB board to solve the problems raised in the above-mentioned background technology.

[0012] To solve the above technical problems, the present utility model provides the following technical solutions: A VIA plug hole structure for a PCB board, including a PCB circuit board, and VIA holes are opened on the PCB circuit board;

[0013] It further includes an ink plug column for plugging the holes, and the ink plug column is formed by piling up ink;

[0014] A cavity is arranged inside the ink plug column, and a viscous liquid is filled inside the cavity;

[0015] One end or both ends of the ink plug column are covered with a copper plating layer;

[0016] After the copper plating layer is installed, the outer surface is flush with the outer surface of the PCB circuit board.

[0017] Preferably, both the upper and lower ends of the ink plug column are inwardly tapered, the diameters of both ends of the ink plug column are smaller than the inner diameter of the VIA hole, and the diameter in the middle of the ink plug column is larger than the diameter of the VIA hole.

[0018] Preferably, the outer surface of the ink plug column is covered with honeycomb holes, and the ink plug column deforms and breaks from the honeycomb holes when pressed.

[0019] Preferably, the inner wall of the cavity is a smooth surface, and the inside of the cavity is a closed space.

[0020] Preferably, both sides of the copper plating layer are provided with wire drawing patterns, and the copper plating layer contacts and adheres to the outer surface of the ink plug column with the viscous liquid exuded from the ink plug column.

[0021] Compared with the prior art, the beneficial effects achieved by the present utility model are:

[0022] First, the present utility model directly plugs the ink plug column into the VIA hole and applies pressure to the ink plug column, causing the ink plug column and the cavity to break, so that the viscous liquid penetrates inside the ink plug column and at the contact position between the ink plug column and the VIA hole. Then, after the ink plug column dries, the excess ink plug column is polished off, and a copper plating layer is covered on the surface of the ink plug column. The whole operation only includes plugging, polishing, and plating the copper plating layer, achieving the effect of simple operation.

[0023] Second, in the present utility model, honeycomb holes are distributed all over the outer surface of the ink plug column, so that the viscous liquid can penetrate, increasing the strength of the ink plug column and the connection strength with the VIA hole. A wire drawing pattern is set on the outer surface of the copper plating layer to increase the contact area. When soldering, the adhesion of soldering is improved, achieving the effects of enhancing stability and soldering stability. Description of the Drawings

[0024] Figure 1 It is a schematic structural diagram of the present utility model;

[0025] Figure 2 It is a schematic structural diagram of the ink plug column of the present utility model;

[0026] Figure 3 It is a cross-sectional view of the structure of the ink plug column of the present utility model;

[0027] Figure 4 It is a schematic diagram of the plug hole structure of the present utility model.

[0028] Among them: 1. Ink plug column; 2. Cavity; 3. Viscous liquid; 4. Copper plating layer; 5. PCB circuit board; 6. VIA hole. Specific Embodiments

[0029] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0030] Please refer to Figures 1-4 , a VIA plug hole structure of a PCB board, including a PCB circuit board 5, and a VIA hole 6 is opened on the PCB circuit board 5;

[0031] It further includes an ink plug column 1 for plugging the hole. The ink plug column 1 is formed by stacking ink. Generally, the ink is in fine particle form. After being stacked together, under the action of external pressure, it is easy to break at the connection of the particles, resulting in the collapse and fragmentation of the overall structure;

[0032] A cavity 2 is arranged inside the ink plug column 1, and a viscous liquid 3 is filled inside the cavity 2. The viscous liquid 3 can be a liquid with viscosity and fluidity such as glue;

[0033] One end or both ends of the ink plug column 1 are covered with a copper plating layer 4, depending on whether the VIA hole 6 is a through hole or a blind hole. If it is a through hole, two copper plating layers 4 are set, and if it is a blind hole, only one copper plating layer 4 is set;

[0034] After the copper plating layer 4 is installed, its outer surface is flush with the outer surface of the PCB circuit board 5.

[0035] Through the above technical solution, the ink plug column 1 is directly inserted into the VIA hole 6, and pressure is applied to the ink plug column 1, causing the ink plug column 1 and the cavity 2 to break due to the pressure, so that the viscous liquid 3 penetrates inside the ink plug column 1 and at the contact position between the ink plug column 1 and the VIA hole 6. Subsequently, after the ink plug column 1 dries, the excess ink plug column 1 is polished off, and a copper plating layer 4 is covered on the surface of the ink plug column 1. The whole operation only includes inserting, polishing, and plating the copper plating layer 4, achieving the effect of simple operation.

[0036] The specific usage steps are as follows:

[0037] S1. Insert the ink plug column 1 into the inside of the VIA hole 6, and continue to apply pressure to the ink plug column 1 to make the ink plug column 1 break and completely fill the VIA hole 6;

[0038] S2. When the ink plug column 1 breaks, the viscous liquid 3 will seep out from the inside of the cavity 2, thereby filling inside the ink plug column 1 and at the connection between the ink plug column 1 and the VIA hole 6, enhancing the connection strength between the ink plug column 1 and the VIA hole 6;

[0039] S3. After waiting for the ink plug column 1 to dry, polish the ink plug column 1 protruding from the PCB board to make the surface of the ink plug column 1 flush with the board surface of the PCB board;

[0040] S4. Plate the copper plating layer 4 and make the outer surface of the copper plating layer 4 flush with the surface of the PCB.

[0041] Among them, if the VIA hole 6 is a through hole, copper plating layers 4 are arranged on both sides of the VIA hole 6. When the VIA hole 6 is a blind hole, only a single-sided copper plating layer 4 needs to be set.

[0042] Specifically, both the upper and lower ends of the ink plug column 1 are tapered inward, the diameters of both ends of the ink plug column 1 are smaller than the inner diameter of the VIA hole 6, and the diameter in the middle of the ink plug column 1 is larger than the diameter of the VIA hole 6.

[0043] Through the above technical solution, the two ends of the ink plug column 1 are set to be tapered inward, so that the ink plug column 1 can be more easily inserted into the inside of the VIA hole 6 initially. When the end of the ink plug column 1 is inserted into the inside of the VIA hole 6 and pressure is continuously applied to the ink plug column 1, the ink plug column 1 breaks because its diameter is larger than that of the VIA hole 6, thus filling the voids at the bottom and top of the VIA hole 6.

[0044] Specifically, the outer surface of the ink plug column 1 is covered with honeycomb holes, and the ink plug column 1 deforms and breaks from the honeycomb holes when pressed.

[0045] Through the above technical solution, the outer surface of the ink plug post 1 is covered with honeycomb holes. Thus, after the ink plug post 1 is broken, the viscous liquid 3 can penetrate more quickly through the honeycomb holes between the ink plug posts 1 and at the connection between the ink plug post 1 and the VIA hole 6, playing an adhesive role. Moreover, the honeycomb holes also make the ink plug post 1 easier to break.

[0046] Specifically, the inner wall of the cavity 2 is a smooth surface, and the inside of the cavity 2 is a closed space.

[0047] Through the above technical solution, the inner wall of the cavity 2 is set as a smooth surface, aiming to prevent the viscous liquid 3 from being siphoned or penetrated by the honeycomb holes when not in use, resulting in the loss of the viscous liquid 3.

[0048] And setting the cavity 2 as a closed space is used to isolate the contact between the viscous liquid 3 and air, preventing the viscous liquid 3 from solidifying and becoming ineffective when not in use.

[0049] Specifically, wire drawing patterns are provided on both sides of the copper plating layer 4. The copper plating layer 4 contacts and adheres to the viscous liquid 3 oozing out from the ink plug post 1 on the outer surface of the ink plug post 1.

[0050] Through the above technical solution, the purpose of providing wire drawing patterns on the outer surface of the copper plating layer 4 is to increase the contact area. The wire drawing patterns on the side facing the ink plug post 1 contact the ink plug post 1 and the viscous liquid 3, enabling the copper plating layer 4 to be more firmly fixed on the ink plug post 1 and the PCB circuit board 5.

[0051] And wire drawing patterns are provided on the side of the copper plating layer 4 facing outward, which can increase the contact area with soldering, improve the adhesion of soldering, and reduce the probability of false soldering and de-soldering.

[0052] During use, by directly inserting the ink plug post 1 into the VIA hole 6 and applying pressure to the ink plug post 1, the ink plug post 1 and the cavity 2 are broken, allowing the viscous liquid 3 to penetrate inside the ink plug post 1 and at the contact position between the ink plug post 1 and the VIA hole 6. Subsequently, after the ink plug post 1 dries, the excess ink plug post 1 is polished off, and a copper plating layer 4 is covered on the surface of the ink plug post 1. The whole operation only involves insertion, polishing, and plating the copper plating layer 4, achieving the effect of simple operation.

[0053] By covering the outer surface of the ink plug post 1 with honeycomb holes, the viscous liquid 3 can penetrate, increasing the strength of the ink plug post 1 and the connection strength with the VIA hole 6. And wire drawing patterns are provided on the outer surface of the copper plating layer 4 to increase the contact area. When performing soldering, the adhesion of soldering is improved, achieving the effect of enhancing stability and soldering stability.

[0054] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A VIA plugging structure of a PCB board, comprising a PCB circuit board (5), wherein a VIA hole (6) is provided on the PCB circuit board (5); Features: Also included is an ink plug (1) for plugging the hole, wherein the ink plug (1) is formed by ink accumulation; The ink plug (1) is provided with a cavity (2) inside, and the cavity (2) is filled with a viscous liquid (3); One end or both ends of the ink plug (1) are covered with a copper plating layer (4); After installation, the outer surface of the copper-plated layer (4) is flush with the outer surface of the PCB circuit board (5).

2. The VIA plugging structure of a PCB board according to claim 1, characterized in that: The upper and lower ends of the ink plug (1) are both pulled inwards, the diameters of both ends of the ink plug (1) are smaller than the inner diameter of the VIA hole (6), and the diameter in the middle of the ink plug (1) is larger than the diameter of the VIA hole (6).

3. The VIA plugging structure of a PCB board according to claim 1, characterized in that: The outer surface of the ink plug (1) is covered with honeycomb holes, and the ink plug (1) is deformed and broken from the honeycomb holes after being compressed.

4. The VIA plugging structure of a PCB board according to claim 1, characterized in that: The inner wall of the cavity (2) is a smooth surface, and the interior of the cavity (2) is a closed space.

5. The VIA plugging structure of a PCB board according to claim 3, characterized in that: Both sides of the copper plating layer (4) are provided with brushed patterns, and the copper plating layer (4) is in contact with the viscous liquid (3) seeping out of the ink plug (1) and adheres to the outer surface of the ink plug (1).

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