PIN welding structure of LED suite circuit board

Abstract

The utility model discloses a PIN needle welding structure of an LED suite circuit board, which comprises a solder mask layer arranged on the circuit board, a plurality of PIN disks arranged on the circuit board and PIN holes arranged on the PIN disks, the solder mask layer extends towards the PIN disks to form a built-in solder mask layer, the built-in solder mask layer is provided with a solder mask window, and the PIN holes are arranged on the PIN disks. The solder mask window is of a structure which gradually shrinks from the middle to the upper end and the lower end, and the PIN holes are located in the solder mask window. According to the utility model, a PIN disk built-in windowing mode is adopted to replace an existing PIN disk peripheral windowing mode, and the olive-shaped solder mask window structure design is adopted, so that tin can be led to the upper end and the lower end during welding, and under the condition that the size and the structure of the PIN disk are kept unchanged, on one hand, the distance between the welding parts of the adjacent PIN disks is enlarged, and the welding quality of the PIN disks is improved; on the other hand, the amount of tin on the left side and the right side during tin immersion welding is reduced, the probability of occurrence of poor tin connection during PIN welding is greatly reduced, the production efficiency is improved, and the yield and the quality of the LED suite are guaranteed.

Description

Technical Field

[0001] The utility model belongs to the field of LED kits, relates to the design of circuit boards, and particularly relates to a PIN pin soldering structure of an LED kit circuit board. Background Technique

[0002] In an LED kit, the circuit board is a core component. PIN pins need to be soldered on the circuit board, and the client is connected through the PIN pins. The existing PIN pin soldering structures and methods are as Figure 1 shown. Solder mask windows 2 are arranged and opened on the solder mask layer 1 of the circuit board 10, then the PIN pads 3 are fitted into the solder mask windows 2, and PIN holes 4 are opened on the PIN pads 3. The soldering ends of the PIN pins are soldered on the PIN pads 3 by means of dip soldering through the PIN holes 4.

[0003] In the actual application process of the above soldering structure, due to the layout limitation on the circuit board 10 and the size requirement of the PIN pads 3, the welding parts of two adjacent PIN pads 3 are relatively close, and it is easy to cause the situation of solder bridging between the two pads during dip soldering, resulting in solder bridging defects that cannot pass the test and need to be repaired, seriously affecting the production efficiency. Summary of the Invention

[0004] Object of the Invention: In order to overcome the deficiencies existing in the prior art, a PIN pin soldering structure of an LED kit circuit board is provided, which greatly reduces the occurrence probability of solder bridging in PIN pin soldering, improves the production efficiency, and ensures the output and quality of the LED kit.

[0005] Technical Solution: To achieve the above object, the utility model provides a PIN pin soldering structure of an LED kit circuit board, including a solder mask layer located on the circuit board, a plurality of PIN pads arranged on the circuit board, and PIN holes opened on the PIN pads. The solder mask layer extends and covers the PIN pads to form an internal solder mask layer. The internal solder mask layer is provided with solder mask windows, and the solder mask windows are structures that gradually contract from the middle to the upper and lower ends. The PIN holes are located within the solder mask windows.

[0006] Further, the solder mask window is an olive-shaped structure.

[0007] Further, the PIN holes are coaxially arranged on the PIN pads.

[0008] Further, the solder mask layer and the internal solder mask layer are respectively an ink solder mask layer and an ink internal solder mask layer.

[0009] Beneficial effects: Compared with the prior art, the present utility model uses the method of opening a window inside the PIN disk to replace the existing method of opening a window around the PIN disk, and adopts the solder mask window structure design of an olive shape. During welding, the amount of solder can be guided to the upper and lower ends. Without changing the size and structure of the PIN disk, on the one hand, the distance of the welding part between adjacent PIN disks is enlarged, and on the other hand, the amount of solder on the left and right sides during dip soldering is reduced. Combining these two aspects, on the premise of ensuring the welding effect, the occurrence probability of poor solder bridging of the PIN pins is greatly reduced, the production efficiency is improved, and the output and quality of the LED kit are guaranteed. Description of the Drawings

[0010] Figure 1 is a schematic diagram of the existing PIN pin welding structure;

[0011] Figure 2 is a schematic diagram of the PIN pin welding structure in the present utility model;

[0012] Figure 3 is a schematic diagram of the circuit board using the existing PIN pin welding structure in this embodiment;

[0013] Figure 4 is a schematic diagram of the circuit board using the PIN pin welding structure provided by the present utility model in this embodiment. Detailed Embodiment

[0014] The following further clarifies the present utility model in conjunction with the drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate the present utility model and not to limit the scope of the present utility model. After reading the present utility model, various equivalent modifications made by those skilled in the art to the present utility model all fall within the scope defined by the appended claims of this application.

[0015] As Figure 2 shown, the present utility model provides a PIN pin welding structure for an LED kit circuit board, which includes an ink solder mask layer 1 located on the circuit board 10, four PIN disks 3 provided on the circuit board 10, and PIN holes 4 opened on the PIN disks 3. The ink solder mask layer 1 extends and covers onto the PIN disks 3 to form an ink built-in solder mask layer 5. A solder mask window 7 is opened on the ink built-in solder mask layer 5. The solder mask window 7 is gradually contracted from the middle to the upper and lower ends to form an olive shape. In this way, the exposed part of the PIN disk 3 inside the solder mask window 7 serves as the welding part 6, and the PIN hole 4 is coaxially arranged in the middle of the welding part 6 on the PIN disk 3.

[0016] In order to verify the actual effect of the above PIN pin welding structure, an example comparison was conducted in this embodiment, which is specifically as follows:

[0017] Figure 3 is the circuit board using the existing PIN pin welding structure, Figure 3The solder mask spacing between adjacent PIN pads is 0.87 mm.

[0018] Figure 4 For a circuit board adopting the PIN pin soldering structure provided by the present utility model, Figure 4 the minimum solder mask spacing is 1.10 mm and the maximum is 2.25 mm.

[0019] It can be seen that the solder mask spacing of the PIN pin soldering structure provided by the present utility model is significantly enlarged. Moreover, due to the solder mask window 7 of the olive shape, the solder amount on both left and right sides during dip soldering will also be reduced a lot. Therefore, on the premise of ensuring the soldering effect, the occurrence probability of poor soldering of PIN pins is greatly reduced, the production efficiency is improved, and the output and quality of the LED kit are guaranteed.

Claims

1. A PIN pin welding structure of a circuit board of an LED kit, comprising a solder resist layer on the circuit board, a plurality of PIN pads arranged on the circuit board, and PIN holes opened on the PIN pads, characterized in that: The solder resist layer extends onto the PIN pad to form a built-in solder resist layer, the built-in solder resist layer is provided with a solder resist window, the solder resist window is a structure that gradually shrinks from the middle to the upper and lower ends, and the PIN hole is located in the solder resist window.

2. The PIN welding structure of the LED kit circuit board according to claim 1, characterized in that: The solder resist window is an olive-shaped structure.

3. The PIN welding structure of the LED kit circuit board according to claim 1, characterized in that: The PIN hole is coaxially arranged on the PIN disk.

4. The PIN welding structure of the LED kit circuit board according to claim 1, characterized in that: The solder resist layer and the built-in solder resist layer are respectively an ink solder resist layer and an ink built-in solder resist layer.

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