Capacitor and circuit integrated AME board

Abstract

The utility model discloses a capacitor and circuit integrated AME board which comprises a board body used for bearing circuit elements, a wire and a capacitor are integrated in the board body, a side surface bonding pad used for being connected with an external electronic element is arranged on the side surface of the board body, and a surface bonding pad used for being connected with the external electronic element is arranged on the surface of the board body. And the capacitor, the side bonding pad and the surface bonding pad are connected in a circuit connected by the lead. According to the utility model, through the integrated design of the capacitor and the circuit board, possible welding defects such as poor welding and insufficient welding in the traditional welding process are reduced, so that the stability and the reliability of the circuit are remarkably improved; the integrated design of the capacitor and the circuit board and the application of the side pads provide larger design space and flexibility for circuit designers, so that complex geometrical shapes and irregular layouts are realized, and the requirement of high-density integration is met.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic circuit manufacturing, and relates to a capacitive circuit integrated board realized by using additive manufactured electronics (AME) technology. Background Art

[0002] Traditional pad layouts are usually located at the bottom or top of the circuit board. This layout restricts the flexibility of circuit designers in component placement and circuit routing. Designers must perform component layout and routing design within a limited space, which to a certain extent limits the innovation and optimization space of circuit design. With the development of electronic devices towards miniaturization and high performance, high-density integration of circuit boards has become the norm. In this case, traditional soldering and wiring methods may lead to an extremely crowded circuit board layout, which not only increases the design difficulty but also may prevent the achievement of the optimal circuit design due to space limitations.

[0003] As an indispensable component in the circuit, the connection method of the capacitor to the circuit board plays a crucial role in the overall performance and reliability of the circuit.

[0004] Capacitors are usually connected to the surface pads of the circuit board by soldering. Although this connection method is widely used in the field of electronic manufacturing, it also brings a series of challenges. Poor soldering and dry joints are common soldering defects, which may lead to unstable circuit connections and even open or short circuits during circuit operation, thus affecting the stability and reliability of the entire circuit.

[0005] The soldering process itself requires multiple steps, including solder paste preparation, component placement, soldering, and subsequent cleaning and inspection, etc. These steps not only increase the manufacturing cost but also extend the time from product design to market. In addition, the investment in soldering equipment and materials is also part of the manufacturing cost, which is a significant financial burden for small and medium-sized enterprises. Content of the Utility Model

[0006] In view of this, the purpose of the utility model is to provide an AME board with fewer connection points and higher connection efficiency.

[0007] Through long-term exploration and attempts, as well as multiple experiments and efforts, and continuous reform and innovation, the inventors provide the following technical solution to solve the above technical problems: provide a capacitive circuit integrated AME board, including a board body for carrying circuit components, with wires and capacitors integrated in the board body, side pads for connecting to external electronic components arranged on the side of the board body, and surface pads for connecting to external electronic components arranged on the surface of the board body. The capacitor, side pads, and surface pads are connected in a circuit connected to the wires.

[0008] According to an embodiment of the integrated capacitor - circuit AME board, the capacitor is a multilayer ceramic capacitor, including a first pin and a second pin connected to a wire. The first pin is connected with at least one first electrode, the second pin is connected with at least one second electrode, and a dielectric layer is arranged between the first electrode and the second electrode.

[0009] According to an embodiment of the integrated capacitor - circuit AME board, the wire, the first pin, the first electrode, the second pin, the second electrode, the side pads, and the surface pads are printed with conductive ink; the board body is printed with dielectric ink.

[0010] According to an embodiment of the integrated capacitor - circuit AME board, the conductive ink is nano - silver conductive ink.

[0011] According to an embodiment of the integrated capacitor - circuit AME board, the number of layers of the dielectric layer is 1 - 75 layers.

[0012] According to an embodiment of the integrated capacitor - circuit AME board, the single - layer thickness of the first electrode and the second electrode is more than 17μm, and the thickness of the dielectric layer is more than 23μm.

[0013] According to an embodiment of the integrated capacitor - circuit AME board, the leakage current of the capacitor is less than 1.5%, and the breakdown voltage is greater than 1kV.

[0014] According to an embodiment of the integrated capacitor - circuit AME board, the temperature stability coefficient of the capacitor is 0.2 - 0.4% / °C.

[0015] According to an embodiment of the integrated capacitor - circuit AME board, a groove is arranged on the side of the board body, and the side pads are located in the groove; the number and size of the side pads and the surface pads are adapted to the number and size of the components.

[0016] According to an embodiment of the integrated capacitor - circuit AME board, the minimum width of the wire is 110±18μm, the thickness is 17 - 101μm, and the wire pitch is not less than 110μm; one or more of vias, PTHs, and vias are also arranged on the board body; the via diameter is more than 400μm, the PTH diameter is more than 400μm, the via diameter is more than 200μm, and the aperture error is within 36μm.

[0017] Compared with the prior art, one of the above - mentioned technical solutions has the following advantages:

[0018] a) By integrating the capacitor with the circuit board, the present utility model reduces the welding defects that may occur in the traditional welding process, such as poor welding and false soldering, thereby significantly improving the stability and reliability of the circuit.

[0019] b) By using AME technology, capacitors and conductive circuits are directly printed on the circuit board, eliminating the extra processes and equipment required for traditional soldering, simplifying the manufacturing process, effectively reducing production costs, and shortening the product time to market.

[0020] c) The integrated design of the capacitor and the circuit board, as well as the application of side pads, provide greater design space and flexibility for circuit designers, enabling the realization of complex geometries and irregular layouts, and meeting the requirements of high-density integration.

[0021] d) The integrated capacitor design reduces the connection points in the circuit, decreases resistance and inductance, thereby improving the overall performance of the circuit. The capacitor is directly embedded in the circuit board, reducing signal attenuation and noise interference, and enhancing signal quality.

[0022] e) When used as a bypass capacitor, it can reduce electromagnetic interference (EMI) in the circuit, improve the anti-interference ability of the circuit, filter out noise, and remove clutter from the signal.

[0023] f) The close combination of the capacitor and the circuit board reduces the space occupied by components, makes the circuit more compact, significantly improves the space utilization efficiency, and is especially suitable for miniaturized and portable electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 is a front view structural schematic diagram of a preferred embodiment of the integrated capacitor-circuit AME board of the present utility model.

[0026] Figure 2 is a schematic diagram of the internal circuit layout structure in the integrated capacitor-circuit AME board of the present utility model.

[0027] Figure 3 is Figure 1 a schematic diagram of the side structure of the integrated capacitor-circuit AME board.

[0028] Figure 4 is a schematic diagram of the capacitor structure in the integrated capacitor-circuit AME board of the present utility model.

[0029] Figure 5 is Figure 4 a partial enlarged schematic diagram of I in

[0030] The markings in the figure are respectively:

[0031] 100 Plate body

[0032] 110 Conducting wire

[0033] 111 Surface pad

[0034] 120a First capacitor

[0035] 120b Second capacitor

[0036] 121 First pin

[0037] 1211 First electrode

[0038] 122 Second pin

[0039] 1221 Second electrode

[0040] 131 First side pad

[0041] 131a First solder joint

[0042] 131b Second solder joint

[0043] 132 Second side pad

[0044] 132a Third solder joint

[0045] 132b Fourth solder joint Detailed implementation manners

[0046] The following is described with reference to the accompanying drawings and a specific embodiment.

[0047] To make the purpose, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model. Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model to be protected, but merely represents the selected embodiments of the present utility model.

[0048] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it may not be further defined and explained in subsequent drawings.

[0049] The integrated AME board with capacitance circuit described in this embodiment is printed using a Dragonfly 3D printer, which includes a first print head and a second print head. The printing material of the first print head is nano-silver conductive ink with a viscosity of 20 cp, a density of 1.8 g / ml, and a silver content of 50%; the printing material of the second print head is dielectric polymer ink with a viscosity of 12 cp and a density of 1.1 g / ml. Both the nano-silver conductive ink and the dielectric polymer ink are existing materials, and this utility model does not involve the improvement of materials.

[0050] See Figures 1 to 5 . The integrated AME board with capacitance circuit includes a board body 100 for carrying circuit elements, in which wires 110 and capacitors are integrated. The minimum width of the wire 110 is 110 ± 18 μm, the thickness is 17 - 101 μm, and the spacing between the wires 110 is not less than 110 μm; one or more of through holes, PTHs, and vias are also provided on the board body 100; the diameter of the through hole is more than 400 μm, the diameter of the PTH is more than 400 μm, the diameter of the via is more than 200 μm, and the diameter error is within 36 μm. The wires 110 and capacitors are distributed in layers in the board body 100 according to the actual requirements of the circuit. The through hole passes through the entire board body 100 and can be used for internal interconnection or as a mounting and positioning hole for components; PTH is a plated through hole, and via is a blind hole.

[0051] In the AME board, the wires 110 and capacitors can be printed out at one time by additive manufacturing technology, reducing the multi-step soldering and assembly in the traditional manufacturing process. By distributing the wires 110 and capacitors on different layers in the board body 100, the space can be utilized more effectively, reducing the volume of the circuit board and meeting the requirements of miniaturization and high-density integration. The layered distribution allows designers to consider the layout of all layers at the early stage of circuit design, thus improving the efficiency and accuracy of the design.

[0052] On the side of the board body 100, there are side pads for connecting to external electronic components. On the surface of the board body 100, there are surface pads 111 for connecting to external electronic components. The capacitor, side pads, and surface pads 111 are connected in a circuit connected by a wire 110. The setting of the side pads allows for connections on the side of the board body 100, which can make more effective use of space, especially when the circuit board needs to be miniaturized or highly integrated. By setting pads on the side of the board body 100, the complexity of the surface wiring of the board body 100 can be reduced because some connections can be directly achieved through the side pads without the need for additional wiring on the surface of the board body 100. The combination of the surface pads 111 and the side pads provides more design options, and designers can flexibly arrange the positions of the pads according to the specific requirements and layout of the circuit. The side pads and the surface pads 111 can be designed in different sizes and shapes to accommodate different types of external electronic components, such as through-hole components, surface mount components, etc.

[0053] The side pads are located within the groove; the number and size of the side pads and the surface pads 111 are adapted to the number and size of the components. The side pads being located within the groove can protect the pads from mechanical damage and at the same time provide a stable surface for soldering. Figure 3 It shows a situation where a first solder joint 131a and a second solder joint 131b are provided in the first side pad 131, and a situation where a third solder joint 132a and a fourth solder joint 132b are provided in the second side pad 132. The first side pad 131 is electrically connected to the first component, and the second side pad 132 is electrically connected to the second component. The side pads provide more possibilities for circuit connection. Compared with traditional top or bottom pads, the side pads can be more conveniently connected to other circuit boards or components, especially in cases where space is limited. The side pads not only improve the connection efficiency but also reduce the connection difficulty and cost.

[0054] Figure 2 It shows a situation where a first capacitor 120a and a second capacitor 120b are designed in the circuit. This illustration does not represent a specific limitation on the design position of the capacitors nor on the number of capacitors. Figures 1 to 3 It also shows a situation where a first side pad 131 and a second side pad 132 are designed in the circuit. This illustration does not represent a specific limitation on the design position of the side pads nor on the number of side pads. In the production of a specific circuit, first, use circuit design software (such as EDA tools) to design the shape, size, and position of the capacitors, as well as the circuit of the side pad layout according to the circuit requirements.

[0055] See Figure 4 and Figure 5, the capacitor is a stacked capacitor, including a first pin 121 and a second pin 122 connected to the wire 110. At least one first electrode 1211 is connected to the first pin 121, and at least one second electrode 1221 is connected to the second pin 122. A dielectric layer is provided between the first electrode 1211 and the second electrode 1221. The number of layers of the dielectric layer is 1 to 75 layers. The wire 110, the first pin 121, the first electrode 1211, the second pin 122, the second electrode 1221, the side pads, and the surface pad 111 are printed with conductive ink; the board 100 is printed with dielectric ink. The single-layer thickness of the first electrode 1211 and the second electrode 1221 is more than 17μm, and the thickness of the dielectric layer is more than 23μm. In an optional embodiment, the leakage current of the capacitor is less than 1.5%, the breakdown voltage is greater than 1kV, and the temperature stability coefficient is 0.2 to 0.4% / °C.

[0056] Print the integrated AME board of the capacitor circuit of the present invention. Put the designed file into the processing plug-in dedicated to the nano device for slicing. According to the design intention, specify each component in the file as a conductive material or a dielectric material, and export the Gerber file or the.pcbjc file. Import the Gerber file or the.pcbjc file into the Dragonfly 3D printer; set the printing platform temperature to 140°C, set the nozzle spraying mode to Random random mode, and set the Seed compensation parameter to 10. The designed circuit structure is printed layer by layer, and the capacitor and the side pads are printed together during the printing process. After printing, wait for the printing platform temperature to drop to room temperature and then remove the circuit board. Check whether the surface of the circuit board is smooth, clean, without obvious scratches, stains, bubbles and impurities, and at the same time ensure that the circuit lines are clear and smooth, without open circuit or short circuit. Adjust the printing parameters of the printer to the calibration file mode, call the nozzle status calibration file of the printer, and print the calibration file according to the operation process to observe the printing situation of the holes. When there is a blockage in the printing holes, it is necessary to print the calibration file for canceling the nozzles, find the blocked nozzles through a magnifying glass, and then cancel these holes in the device control software. Prevent the circuit board from having scratches, depressions, bubbles and impurities, as well as open circuits or short circuits.

[0057] The design of the capacitor being tightly integrated with the circuit board brings significant advantages in the field of electronic manufacturing, especially in terms of space utilization and overall performance. In some circuit boards, the space occupied by the capacitor and other components is saved by more than 15%. A more compact design means that more circuit components can be integrated in the same volume or area, improving the space utilization efficiency.

[0058] The capacitor is integrated with the circuit board, reducing the number of connections and solder joints and lowering the failure rate. The capacitor is directly embedded in the circuit board, reducing the number of connections and solder joints, which can significantly reduce the 85% failure rate caused by poor soldering or loose connections, solving the problem that traditional soldering and connection methods are easily affected by process fluctuations, material aging, or external stress, resulting in connection failures or solder joint cracking. It helps reduce signal attenuation and noise interference in the circuit. As a bypass capacitor, it can be used to reduce electromagnetic interference (EMI) in the circuit, improve the anti-interference ability of the circuit, filter out noise, remove clutter in the signal, improve the signal quality, and thus enhance the overall performance of the circuit.

[0059] The integrated AME board of the present utility model allows designers to perform more customization and optimization during the manufacturing process, optimizing the circuit layout and routing. For example, designers can adjust the capacitance, shape, and size of the capacitor according to the specific requirements of the circuit to achieve the best circuit performance; the position of the capacitor can be optimized according to the circuit design, such as placing it close to the chip to reduce parasitic effects, or under the chip to utilize space; the circuit routing can be adjusted according to the optimal layout of the capacitor and other components to reduce the signal path length and improve signal integrity; for applications that require bypass capacitors, designers can select the appropriate plate area and number of layers to achieve the required capacitance value such as 10 nF; the capacitor can be designed as a low-frequency filtering capacitor for use in power supply circuits and amplifier circuits to filter out low-frequency noise; by precisely controlling the position and shape of the capacitor, the influence of parasitic capacitance and parasitic inductance can be minimized, especially in high-frequency applications; a reasonable capacitor layout helps reduce electromagnetic interference (EMI) and improve the electromagnetic compatibility of the circuit.

[0060] In the description of the present utility model, it should be understood that the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more unless otherwise specifically defined.

[0061] The above is only the preferred embodiment of the present utility model. It should be noted that the above preferred embodiment should not be construed as a limitation of the present utility model. The protection scope of the present utility model should be defined by the scope of the claims. For those of ordinary skill in the art in this technical field, without departing from the spirit and scope of the present utility model, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as within the protection scope of the present utility model.

Claims

1. An AME board with integrated capacitor circuit, characterized in that: It includes a board body for carrying circuit elements, with wires and capacitors integrated in the board body, side pads for connecting to external electronic elements are arranged on the side of the board body, and surface pads for connecting to external electronic elements are arranged on the surface of the board body, and the capacitors, side pads and surface pads are connected in a circuit connected by wires.

2. The capacitor circuit integrated AME board according to claim 1, characterized in that: The capacitor is a stacked capacitor, comprising a first pin and a second pin connected to a wire, the first pin is connected to at least one first electrode, the second pin is connected to at least one second electrode, and a dielectric layer is arranged between the first electrode and the second electrode.

3. The capacitor circuit integrated AME board according to claim 2, characterized in that: The wire, the first pin, the first electrode, the second pin, the second electrode, the side pads and the surface pads are printed by using conductive ink; and the board body is printed by using dielectric ink.

4. The capacitor circuit integrated AME board according to claim 3, characterized in that: The conductive ink is nano silver conductive ink.

5. The capacitor circuit integrated AME board according to claim 2, characterized in that: The number of the dielectric layers is 1 to 75.

6. The capacitor circuit integrated AME board according to claim 2, characterized in that: The single layer thickness of the first electrode and the second electrode is greater than 17 μm, and the thickness of the dielectric layer is greater than 23 μm.

7. The capacitor circuit integrated AME board according to claim 2, characterized in that: The leakage current of the capacitor is less than 1.5%, and the breakdown voltage is greater than 1 kV.

8. The capacitor circuit integrated AME board according to claim 2, characterized in that: The temperature stability coefficient of the capacitor is 0.2-0.4% / °C.

9. The capacitor circuit integrated AME board according to claim 1, characterized in that: A groove is arranged on the side of the plate body, and the side pad is located in the groove; the number and size of the side pads and the surface pads are adapted to the number and size of components.

10. The capacitor circuit integrated AME board according to claim 1, characterized in that: The minimum width of the wire is 110±18μm, the thickness is 17-101μm, and the wire spacing is not less than 110μm; the board is also provided with one or more of through holes, PTHs and vias; the through hole diameter is above 400μm, the PTH diameter is above 400μm, the via diameter is above 200μm, and the diameter error is within 36μm.

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