Novel LED packaging structure

Abstract

The utility model discloses a novel LED packaging structure, which comprises a bowl cup, an LED wafer, a first colloid layer, a second colloid layer and a third colloid layer, and is characterized in that the bowl cup comprises a substrate and a frame body arranged on the substrate; the LED wafer is arranged on the substrate and located in the bowl cup, and the LED wafer is electrically connected with the substrate; the first colloid layer is arranged in the bowl cup and covers the lower area of the peripheral wall of the LED wafer, and the top surface of the first colloid layer is provided with an annular frame-shaped groove; the second colloid layer is arranged on the top surface of the first colloid layer and covers the upper area of the LED wafer, and when the novel LED packaging structure is overlooked, the second colloid layer is located in a central area enclosed by the annular frame-shaped groove and is located right above the LED wafer; the third colloid layer is arranged in the bowl cup and covers the first colloid layer and the second colloid layer, and part of the third colloid layer is located in the filling ring frame-shaped groove. The easy-to-hydrolyze fluorescent powder in the novel LED packaging structure is not easy to hydrolyze, and the novel LED packaging structure is long in service life.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, and particularly relates to a novel LED packaging structure. Background Art

[0002] As a new type of solid semiconductor device, LED has the advantages of small volume, light weight, high luminous efficiency, energy conservation and environmental protection, and has now been widely applied to various industries. At present, the main implementation method of white LED is the scheme of exciting phosphor by blue or violet wafers. With the continuous development of white LED technology, higher requirements are also put forward for the luminous performance of LED. And using more efficient phosphors has become the most common solution. Among them, fluoride phosphors and quantum dot phosphors have good application prospects in white LEDs due to their advantages such as high luminous efficiency and wide color gamut.

[0003] However, most common fluoride phosphors are doped with Mn ions, resulting in unstable chemical properties and easy hydrolysis reaction with water in the environment to generate brown MnO 2 , resulting in phenomena such as blackening and color coordinate drift of the LED, seriously affecting the service life of the LED. And due to the presence of easily hydrolyzable elements (such as containing S or Se) in the chemical composition of quantum dot phosphors, hydrolysis reaction will also occur after contacting with water in the environment, resulting in problems such as changes in the emission color and reduction in luminous efficiency of the LED, which also affects the service life of the LED. Summary of the Utility Model

[0004] The technical problem solved by the utility model is to provide a novel LED packaging structure with a long service life.

[0005] In order to solve the above technical problem, the technical scheme adopted by the utility model is: a novel LED packaging structure, comprising:

[0006] A bowl cup, the bowl cup includes a substrate and a frame body provided on the substrate;

[0007] An LED chip, the LED chip is provided on the substrate and located inside the bowl cup, and the LED chip is electrically connected to the substrate;

[0008] A first colloid layer, the first colloid layer is provided inside the bowl cup and covers the lower region of the peripheral wall of the LED chip, and an annular groove is provided on the top surface of the first colloid layer;

[0009] A second colloid layer, the second colloid layer is provided on the top surface of the first colloid layer and covers the upper region of the LED chip. When looking down at the novel LED packaging structure, the second colloid layer is located in the central region surrounded by the annular groove and directly above the LED chip;

[0010] A third colloid layer, which is disposed inside the bowl cup and covers the first colloid layer and the second colloid layer, and a part of the third colloid layer is located in the annular frame-shaped groove for filling.

[0011] In one embodiment, the height of the region on the peripheral wall of the LED chip that is not covered by the first colloid layer is 10 ± 3 um.

[0012] In one embodiment, the top surface of the first colloid layer is a concave arc surface.

[0013] In one embodiment, the LED chip is electrically connected to the substrate through a gold wire bonding wire. When looking down at the novel LED packaging structure, the connection part of the gold wire bonding wire and the substrate is located in the central region enclosed by the annular frame-shaped groove.

[0014] In one embodiment, the annular frame-shaped groove is integrally in a ring shape, an elliptical ring shape or a polygonal frame shape.

[0015] In one embodiment, the cross-section of the annular frame-shaped groove is rectangular, semi-circular or triangular.

[0016] In one embodiment, the number of the annular frame-shaped grooves on the first colloid layer is one or more.

[0017] In one embodiment, the second colloid layer is doped with hydrolyzable phosphor.

[0018] In one embodiment, the first colloid layer is a reflective layer, a phosphor mixed colloid layer or a transparent colloid layer.

[0019] In one embodiment, the third colloid layer is a phosphor mixed colloid layer or a transparent colloid layer.

[0020] The beneficial effects of the present utility model are as follows: The first colloid layer and the third colloid layer can completely surround the second colloid layer, making it difficult for the hydrolyzable phosphor in the second colloid layer to combine with external water vapor. The setting of the annular frame-shaped groove on the first colloid layer can extend the water vapor intrusion path and increase the difficulty of water vapor intrusion, thereby reducing the risk of the hydrolyzable phosphor in the second colloid layer combining with external water vapor to a greater extent, ensuring that the hydrolyzable phosphor in the second colloid layer can play a role for a long time, and being beneficial to extending the service life of the novel LED packaging structure. In addition, due to the existence of the annular frame-shaped groove, the first colloid layer and the third colloid layer form an interlocking structure, increasing the bonding area between the first colloid layer and the third colloid layer, and thus better isolating external water vapor. Description of the Drawings

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0022] Figure 1 It is a cross-sectional view of the novel LED packaging structure of the first embodiment of the present invention.

[0023] Explanation of the reference numerals in the drawings:

[0024] 1. Bowl cup; 11. Substrate; 12. Frame;

[0025] 2. LED chip; 21. Gold wire bonding wire;

[0026] 3. First colloid layer; 31. Ring-shaped groove;

[0027] 4. Second colloid layer;

[0028] 5. Third colloid layer. Detailed implementation manners

[0029] The realization of the object, functional features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the drawings.

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] It should be noted that if there are directional indications such as up, down, left, right, front, back... in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture as shown in the drawings. If the specific posture changes, the directional indications will also change accordingly.

[0032] In addition, if there are descriptions such as "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0033] In addition, the meaning of "and / or" as used throughout the text is that it includes three parallel solutions. Taking "and / or" as an example, it includes the solution, or the solution, or the solution that satisfies both simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or is unachievable, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0034] In this application, unless otherwise clearly specified and defined, terms such as "installed", "connected", "coupled", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] Embodiment 1

[0036] Please refer to Figure 1 , Embodiment 1 of this utility model is: a novel LED packaging structure, including a bowl cup 1, an LED chip 2, a first colloid layer 3, a second colloid layer 4, and a third colloid layer 5. The bowl cup 1 includes a substrate 11 and a frame 12 provided on the substrate 11. The LED chip 2 is provided on the substrate 11 and is located inside the bowl cup 1. The LED chip 2 is electrically connected to the substrate 11. The first colloid layer 3 is provided inside the bowl cup 1 and covers the lower region of the peripheral wall of the LED chip 2. The upper region of the peripheral wall of the LED chip 2 and the top surface of the LED chip 2 are exposed relative to the first colloid layer 3. A ring-shaped groove 31 is provided on the top surface of the first colloid layer 3. The second colloid layer 4 is doped with hydrolyzable phosphor, and the hydrolyzable phosphor includes but is not limited to quantum dot phosphor, fluoride phosphor, etc. The second colloid layer 4 is provided on the top surface of the first colloid layer 3 and covers the upper region of the LED chip 2. When looking down at the novel LED packaging structure, the second colloid layer 4 is located in the central region surrounded by the ring-shaped groove 31 and is directly above the LED chip 2. The third colloid layer 5 is provided inside the bowl cup 1 and covers the first colloid layer 3 and the second colloid layer 4. A part of the third colloid layer 5 is located in the ring-shaped groove 31 for filling.

[0037] It is easy to understand that the outer periphery of the first colloid layer 3 and the outer periphery of the third colloid layer 5 are both in contact with and connected to the inner wall of the frame 12.

[0038] The first colloid layer 3 and the third colloid layer 5 can completely surround the second colloid layer 4, effectively preventing fluoride phosphors, quantum dot phosphors or other moisture-sensitive phosphors in the second colloid layer 4 from combining with external water molecules to produce hydrolysis, solving the problem of variation defects in the color temperature, x / y coordinates and brightness of white LEDs due to the hydrolysis of the powder in the package, and facilitating the improvement of the reliability and service life of the LED packaging structure.

[0039] The height of the area on the peripheral wall of the LED chip 2 not covered by the first colloid layer 3 is 10 ± 3 um. The height of the effective light-emitting surface on the side of the LED chip 2 is from 10 ± 3 um away from the top surface of the LED chip 2 to the top surface of the LED chip 2. This area on the peripheral wall of the LED chip 2 is not covered by the first colloid layer 3, which can ensure the normal light emission of the side of the LED chip 2.

[0040] Optionally, the top surface of the first colloid layer 3 is a concave arc surface. In this way, during the processing, the second colloid layer 4 can be more concentrated in the central position of the top surface of the first colloid layer 3, reducing the risk of the second colloid layer 4 flowing into the annular groove 31.

[0041] The LED chip 2 is electrically connected to the substrate 11 through a gold wire bonding wire 21. When looking down at the novel LED packaging structure, the connection between the gold wire bonding wire 21 and the substrate 11 is located within the central area enclosed by the annular groove 31. In this way, during the processing, when pressing the annular groove 31 on the top surface of the first colloid layer 3, the gold wire bonding wire 21 will not be damaged, thus ensuring the normal conduction between the LED chip 2 and the substrate 11.

[0042] The overall shape of the annular groove 31 is annular, elliptical annular, polygonal frame 12-shaped or other shapes, which can be specifically set according to actual needs and production conditions.

[0043] The cross-section of the annular groove 31 is rectangular, semi-circular, triangular or other shapes.

[0044] In this embodiment, the number of the annular grooves 31 on the first colloid layer 3 is one. In other embodiments, the number of the annular grooves 31 on the first colloid layer 3 can also be multiple, which can isolate water vapor to a greater extent. When the number of the annular grooves 31 on the first colloid layer 3 is multiple, the multiple annular grooves 31 are coaxially arranged. At this time, when looking down at the novel LED packaging structure, the second colloid layer 4 is located within the central area enclosed by the innermost annular groove 31.

[0045] The first colloid layer 3 is a reflective layer, a phosphor mixed colloid layer or a transparent colloid layer; the third colloid layer 5 is a phosphor mixed colloid layer or a transparent colloid layer.

[0046] It is acceptable that the top surface of the third colloid layer 5 is lower than, flush with or higher than the top surface of the frame 12, and specific selection and setting can be made according to actual needs.

[0047] The manufacturing process of the novel LED packaging structure in this embodiment is briefly described as follows:

[0048] The LED chip 2 is adhered to the substrate 11 to form an electrical circuit with the substrate 11. Then, the first colloid layer 3 is disposed at the bottom of the cup 1, and heating and baking are performed to preliminarily cure the first colloid layer 3 into a jelly-like state. Then, a pressing mold is used to press the top surface of the first colloid layer 3 with the LED chip 2 as the center to form the annular groove 31. Subsequently, with the annular groove 31 as the boundary line, a second colloid layer 4 doped with hydrolyzable phosphors is disposed within the boundary line, and heating and baking are performed to preliminarily cure the second colloid layer 4 doped with hydrolyzable phosphors. Finally, a third colloid layer 5 is disposed in the remaining space of the cup 1, and finally, high-temperature baking is performed for curing and forming.

[0049] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made by using the description and drawings of the present invention under the inventive concept of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A new type of LED packaging structure, characterized in that: include A bowl cup, the bowl cup comprising a base plate and a frame arranged on the base plate; An LED chip, wherein the LED chip is disposed on the substrate and located in the bowl, and the LED chip is electrically connected to the substrate; A first colloid layer, the first colloid layer is arranged in the bowl and covers the lower area of ​​the peripheral wall of the LED chip, and the top surface of the first colloid layer is provided with a ring frame-shaped groove; A second colloid layer, the second colloid layer is arranged on the top surface of the first colloid layer and covers the upper area of ​​the LED chip. When the novel LED packaging structure is viewed from above, the second colloid layer is located in the central area enclosed by the ring-shaped groove and is located directly above the LED chip; A third colloid layer is disposed in the bowl and covers the first colloid layer and the second colloid layer, and a portion of the third colloid layer is located to fill the ring-shaped groove.

2. The novel LED packaging structure according to claim 1, characterized in that: The height of the area of ​​the peripheral wall of the LED chip not covered by the first colloid layer is 10±3 um.

3. The novel LED packaging structure according to claim 1, characterized in that: The top surface of the first colloid layer is a concave arc surface.

4. The novel LED packaging structure according to claim 1, characterized in that: The LED chip is electrically connected to the substrate via a gold bonding wire. When the novel LED packaging structure is viewed from above, the connection between the gold bonding wire and the substrate is located in the central area surrounded by the ring-shaped groove.

5. The novel LED packaging structure according to claim 1, characterized in that: The ring-frame-shaped groove is in the shape of a ring, an elliptical ring or a polygonal frame as a whole.

6. The novel LED packaging structure according to claim 1, characterized in that: The cross section of the ring-shaped groove is rectangular, semicircular or triangular.

7. The novel LED packaging structure according to claim 1, characterized in that: The number of the ring-shaped grooves on the first colloid layer is one or more.

8. The novel LED packaging structure according to claim 1, characterized in that: The second colloid layer is doped with easily hydrolyzable fluorescent powder.

9. The novel LED packaging structure according to claim 1, characterized in that: The first colloid layer is a reflective layer, a fluorescent powder mixed colloid layer or a transparent colloid layer.

10. The novel LED packaging structure according to claim 1, characterized in that: The third colloid layer is a phosphor mixed colloid layer or a transparent colloid layer.

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