Offline verification device for precision heater of semiconductor automatic screening machine
By designing the offline verification device for precision heater of semiconductor automatic screening machine, and using gas-circuit drive components and temperature sensors for offline function verification, the problems of waste of production work hours, product quality accidents and damage to production equipment spare parts during the maintenance of semiconductor automatic screening machine precision heater are solved, and an efficient maintenance verification process is achieved.
Patent Information
- Application Number
- CN202422044429.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-22
AI Technical Summary
During the precision heater failure repair process of semiconductor automatic screening machines, hardware replacement and software settings need to be frequently replaced, resulting in waste of production labor hours, product quality accidents and damage to production equipment spare parts.
A semiconductor automatic screening machine precision heater offline verification device is designed. The device includes a fixed base, a support frame, an air-circuit drive assembly and a temperature sensor. The precision heater is driven to drop to abutment with the temperature sensor through the gas-circuit drive assembly, and its temperature is measured under a preset pressure to achieve offline function verification.
Through the offline verification device, there is no need to install the repaired precision heater on the production equipment for functional verification, which solves the time and cost conflict between maintenance and normal production, avoids product quality accidents and damage to spare parts of production equipment, and supports functional verification of precision heaters of different specifications.
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Figure CN222984995U_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present disclosure belong to the technical field of semiconductor equipment, and particularly relate to a device for offline verification of a precision heater of a semiconductor automatic screening machine. Background Art
[0002] Currently, when repairing a fault of a precision heater in a semiconductor automatic screening machine, it is necessary to install the precision heater to be verified after repair on the production equipment, i.e., the semiconductor automatic screening machine, for function verification.
[0003] When verifying a precision heater on the production equipment, i.e., the semiconductor automatic screening machine, the following
[0004] several problems exist:
[0005] 1) Different models of precision heaters need to be replaced with matching hardware and software settings of the production equipment, i.e., the semiconductor automatic screening machine, which will occupy the production time of the semiconductor automatic screening machine of the production equipment and affect the company's production capacity.
[0006] 2) Frequent replacement of hardware and modification of software settings on the production equipment, i.e., the semiconductor automatic screening machine, are likely to cause product quality accidents.
[0007] 3) Frequent replacement of hardware and modification of software settings on the production equipment, i.e., the semiconductor automatic screening machine, are likely to cause damage to spare parts of the production equipment.
[0008] In view of the above problems, it is necessary to propose a device for offline verification of a precision heater of a semiconductor automatic screening machine with reasonable design and which can effectively improve the above problems. Summary of the Utility Model
[0009] Embodiments of the present disclosure aim to at least solve one of the technical problems existing in the prior art, and provide a device for offline verification of a precision heater of a semiconductor automatic screening machine.
[0010] Embodiments of the present disclosure provide a device for offline verification of a precision heater of a semiconductor automatic screening machine, the device comprising:
[0011] A fixed base;
[0012] A support frame, arranged on the fixed base;
[0013] An air circuit driving component, arranged on the support frame and used for detachably connecting with the precision heater to drive the precision heater to lift;
[0014] A temperature sensor, arranged on the fixed base and corresponding to the position of the precision heater; wherein,
[0015] When performing functional verification on the precision heater, the gas path driving component is used to drive the precision heater to descend and abut against the temperature sensor, and the temperature sensor is used to measure the temperature of the precision heater under a preset pressure.
[0016] Optionally, the gas path driving component includes a pressing cylinder, a main gas path pipeline, a pressing gas path pipeline, and a rising gas path pipeline;
[0017] The first ends of the pressing gas path pipeline and the rising gas path pipeline are selectively communicated with the main gas path pipeline, and the second ends of the pressing gas path pipeline and the rising gas path pipeline are respectively communicated with the first air inlet and the second air inlet of the pressing cylinder;
[0018] The first end of the pressing cylinder is fixedly connected to the support frame, and the second end of the pressing cylinder is used for detachably connecting with the precision heater.
[0019] Optionally, the gas path driving component further includes a first pneumatic pressure regulating valve, and the first pneumatic pressure regulating valve is serially arranged in the main gas path pipeline.
[0020] Optionally, the gas path driving component further includes a pressing cylinder control switch;
[0021] The first end of the pressing cylinder control switch is communicated with the main gas path pipeline, and the second end of the pressing cylinder control switch is selectively communicated with the pressing gas path pipeline and the rising gas path pipeline.
[0022] Optionally, the pressing gas control switch is a manual valve.
[0023] Optionally, the device further includes a mounting plate;
[0024] The first end of the mounting plate is fixedly connected to the pressing cylinder, and the second end of the mounting plate is used for detachably connecting with the precision heater.
[0025] Optionally, the mounting plate is provided with a plurality of first clamping members, the precision heater is provided with a plurality of second clamping members, and the second clamping members are clamped in the corresponding first clamping members.
[0026] Optionally, the device further includes a buffer gas path pipeline and a second pneumatic pressure regulating valve serially arranged in the buffer gas path pipeline;
[0027] The first end of the buffer gas path pipeline is in gas communication with the gas path driving component, and the second end of the buffer gas path pipeline is communicated with the internal buffer cylinder of the precision heater; wherein,
[0028] When the air circuit driving component includes a first pneumatic regulating valve, the first pneumatic regulating valve and the second pneumatic regulating valve are used to detect the airtightness of the precision heater under a preset pressure according to the change of the pressure values of the two.
[0029] Optionally, when the air circuit driving component includes a main air circuit pipeline, the first end of the buffer air circuit pipeline is communicated with the main air circuit pipeline.
[0030] Optionally, when the device includes a mounting plate, a through hole is provided at the mounting plate corresponding to the air inlet of the internal buffer cylinder of the precision heater;
[0031] The second end of the buffer air circuit pipeline passes through the through hole and is communicated with the air inlet.
[0032] For the offline verification device of the precision heater of the semiconductor automatic screening machine in the embodiment of the present disclosure, with this offline verification device, it is not necessary to install the repaired precision heater on the production equipment for function verification, changing the verification method of the precision heater to be verified. The offline verification device solves the time and cost conflicts between maintenance and normal production. There will be no product quality accidents in offline verification, and there will be no damage to the spare parts of the production equipment. Different specifications of precision heaters can be functionally verified through this offline verification device, and it has a wide range of applications. Description of the Drawings
[0033] Figure 1 It is a perspective view of an offline verification device for a precision heater of a semiconductor automatic screening machine in an embodiment of the present disclosure;
[0034] Figure 2 It is a perspective view of an offline verification device for a precision heater of a semiconductor automatic screening machine in another embodiment of the present disclosure;
[0035] Figure 3 It is a side view of an offline verification device for a precision heater of a semiconductor automatic screening machine in another embodiment of the present disclosure;
[0036] Figure 4 It is a perspective view of an offline verification device for a precision heater of a semiconductor automatic screening machine in another embodiment of the present disclosure. Detailed Embodiments
[0037] To enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the following further describes the embodiments of the present disclosure in detail with reference to the drawings and specific embodiments.
[0038] Such as Figure 1As shown in the figure, an offline verification device 100 for a precision heater of a semiconductor automatic screening machine is proposed in an embodiment of the present disclosure. The device 100 includes a fixed base 110, a support frame 120, a gas circuit driving component 130, and a temperature sensor 140.
[0039] The support frame 120 is disposed on the fixed base 110.
[0040] The gas circuit driving component 130 is disposed on the support frame 120 and is used for detachably connecting with the precision heater 200 to drive the precision heater 200 to move up and down.
[0041] The temperature sensor 140 is disposed on the fixed base 110 and corresponds to the position of the precision heater 200. Specifically, in this embodiment, the temperature sensor 140 can be fixed to the fixed base 110 by screws. Of course, the temperature sensor 140 can also be fixed to the fixed base 110 in other ways. This embodiment does not make specific limitations and can be selected according to actual needs.
[0042] Wherein, when performing functional verification on the precision heater 200, the gas circuit driving component 130 is used to drive the precision heater 200 to descend until it abuts against the temperature sensor 140, and the temperature sensor 140 is used to measure the temperature of the precision heater 200 under a preset pressure.
[0043] It should be noted that since a certain contact pressure must be maintained when detecting the surface temperature of the precision heater 200, and the temperature values are different under different pressures, we set the corresponding preset pressure according to the different products produced by the precision heater 200 to be verified and based on the specification of the product, and measure the temperature while maintaining the preset pressure.
[0044] Specifically, as Figure 1 shown, when performing functional verification on the repaired precision heater 200, the precision heater 200 is fixed to the gas circuit driving component 130, and the gas circuit driving component 130 drives the precision heater 200 to descend until the surface of the precision heater 200 abuts against the temperature sensor 140. At the same time, the gas circuit driving component 130 provides a preset pressure for the precision heater 200, and the temperature sensor 140 disposed on the fixed base 110 is used to measure the temperature of the precision heater 200 in a constant pressure state, ensuring that the temperature and pressure of the repaired precision heater 200 are stably controlled within the specified range.
[0045] The offline verification device for the precision heater of the semiconductor automatic screening machine according to the embodiments of the present disclosure can verify the function of the precision heater after maintenance without installing it on the production equipment. It changes the verification method of the precision heater to be verified, resolves the time and cost conflicts between maintenance and normal production through the offline verification device, and there will be no product quality accidents or damage to the spare parts of the production equipment during offline verification. The function of precision heaters of different specifications can be verified through this offline verification device, and it has a wide range of applications. This verification device can simulate the environment of the precision heater during actual production, that is, measure the temperature value of the precision heater under a specified constant pressure state.
[0046] Exemplarily, as Figure 2 and Figure 3 shown, the gas path driving assembly 130 includes a pressing cylinder 131, a main gas path pipe 132, a pressing gas path pipe 133, and a rising gas path pipe 134.
[0047] The first end of the pressing gas path pipe 133 and the first end of the rising gas path pipe 134 are selectively connected to the main gas path pipe 132, and the second end of the pressing gas path pipe 133 and the second end of the rising gas path pipe 134 are respectively connected to the first air inlet and the second air inlet of the pressing cylinder 131. Among them, each gas path pipe is arranged on the support frame 120.
[0048] Specifically, as Figure 2 and Figure 3 shown, the gas source selectively enters the pressing gas path pipe 133 and the rising gas path pipe 134 after passing through the main gas path pipe 132. Among them, when the pressing cylinder 131 needs to descend, the main gas path pipe 132 is connected to the pressing gas path pipe 133, and the gas source sequentially passes through the main gas path pipe 132 and the pressing gas path pipe 133 and enters the first air inlet above the pressing cylinder 131. The piston of the pressing cylinder 131 moves downward under the action of air pressure, and then the entire pressing cylinder 131 moves downward. When the pressing cylinder 131 needs to rise, the main gas path pipe 132 is connected to the rising gas path pipe 134, and the gas source sequentially passes through the main gas path pipe 132 and the rising gas path pipe 134 and enters the second air inlet below the pressing cylinder 131 (the directions of the first air inlet and the second air inlet are opposite). The piston of the pressing cylinder 131 moves upward under the action of air pressure, and then the entire pressing cylinder 131 moves upward.
[0049] Among them, the first end of the pressing cylinder 131 is fixedly connected to the support frame 120, and the second end of the pressing cylinder 131 is used for detachably connecting to the precision heater 200.
[0050] Specifically, as Figure 2 and Figure 3As shown, in this embodiment, the first end of the downward pressing air cylinder 131 can be fixed to the top of the support frame 120 by bolts, and the second end of the downward pressing air cylinder 131 is detachably connected to the precision heater 200.
[0051] In this embodiment, the precision heater 200 is detachably connected to the downward pressing air cylinder 131, which is convenient for disassembly. Different specifications of precision heaters 200 can be connected to the second end of the downward pressing air cylinder 131 for corresponding function verification, increasing the application range of this verification device.
[0052] Exemplarily, as Figure 2 and Figure 3 shown, the air path driving assembly 130 further includes a first pneumatic pressure regulating valve 135, and the first pneumatic pressure regulating valve 135 is serially arranged in the main air path pipeline 132.
[0053] In this embodiment, the opening and closing of the first pneumatic pressure regulating valve 135 control the opening and closing of the main air path pipeline 132. In addition, the gas pressure entering the main air path pipeline 132 can be adjusted through the first pneumatic pressure regulating valve 135, and then the pressure of the downward pressing air cylinder 131 can be adjusted, so that while the downward pressing air cylinder 131 drives the precision heater 200 to descend, a corresponding preset pressure is provided, providing a constant pressure environment for the temperature sensor 140 to measure the temperature of the surface of the precision heater 200.
[0054] Exemplarily, as Figure 2 and Figure 3 shown, the air path driving assembly 130 further includes a downward pressing air cylinder control switch 136. The first end of the downward pressing air cylinder control switch 136 is connected to the main air path pipeline 132, and the second end of the downward pressing air cylinder control switch 136 is selectively connected to the downward pressing air path pipeline 133 and the rising air path pipeline 134. The downward pressing air cylinder control switch 136 is used to selectively conduct the main air path pipeline 132 with one of the downward pressing air path pipeline 133 and the rising air path pipeline 134. In this embodiment, the downward pressing air cylinder control switch 136 can adopt a manual valve.
[0055] Specifically, when the downward pressing air cylinder 131 needs to descend, the manual valve can be moved in the first direction to connect the main air path pipeline 132 with the downward pressing air path pipeline 133; when the downward pressing air cylinder 131 needs to rise, the manual valve can be moved in the second direction to connect the main air path pipeline 132 with the rising air path pipeline 134.
[0056] In this embodiment, by setting the downward pressing air cylinder control switch, the lifting of the downward pressing air cylinder can be controlled, and the operation is convenient.
[0057] Exemplarily, as Figure 1 and Figure 2As shown, the offline verification device 100 for the precision heater of the semiconductor automatic screening machine further includes a mounting plate 150. The first end of the mounting plate 150 is fixedly connected to the downward pressing cylinder 131, and the second end of the mounting plate 150 is used for detachably connecting to the precision heater 200.
[0058] Exemplarily, as Figure 2 and Figure 4 shown, the mounting plate 150 is provided with a plurality of first clamping members 151, and the precision heater 200 is provided with a plurality of second clamping members, and the second clamping members are clamped in the corresponding first clamping members 151.
[0059] In this embodiment, the first end of the mounting plate 150 can be fixed to the second end of the downward pressing cylinder 131 by bolts. Two first clamping members 151 are respectively provided on the side walls of the mounting plate 150 along its width. Correspondingly, the precision heater 200 is provided with second clamping members at the positions corresponding to the first clamping members 151, and the second clamping members are clamped in the corresponding first clamping members 151 to fix the precision heater 200 to the second end of the mounting plate 150. Specifically, in this embodiment, the first clamping member 151 can be a hook. Correspondingly, the precision heater 200 is provided with a hanging buckle, and the precision heater 200 is fixed to the hook of the mounting plate 150 by hanging the hanging buckle, thereby fixing the precision heater 200 to the mounting plate 150.
[0060] It should be noted that in this embodiment, the connection relationship between the precision heater 200 and the mounting plate 150 is not specifically limited and can be selected according to actual needs.
[0061] Exemplarily, as Figures 2 to 4 shown, the offline verification device 100 for the precision heater of the semiconductor automatic screening machine further includes a buffer air pipeline 160 and a second pneumatic pressure regulating valve 170 arranged in series in the buffer air pipeline 160.
[0062] The first end of the buffer air pipeline 160 is in air communication with the air path driving assembly 130, and the second end of the buffer air pipeline 160 is in communication with the internal buffer cylinder of the precision heater 200. Among them, when the air path driving assembly 130 includes a first pneumatic pressure regulating valve 135, the first pneumatic pressure regulating valve 135 and the second pneumatic pressure regulating valve 170 are used to detect the airtightness of the precision heater 200 under a preset pressure according to the change of the pressure values of the two, that is to say, it can be used to detect whether the precision heater 200 leaks air under a preset pressure.
[0063] In this embodiment, through the buffer gas circuit pipeline connected to the internal buffer cylinder of the gas circuit drive assembly 130 and the precision heater 200 respectively and the first air pressure regulating valve 135 and the second air pressure regulating valve 170, the air tightness of the precision heater 200 under a preset pressure can be detected, and the air tightness function of the precision heater 200 can be further verified.
[0064] For example, Figure 2 and Figure 3 As shown, when the gas circuit driving assembly 130 includes the main gas circuit pipeline 132 , the first end of the buffer gas circuit pipeline 160 is connected to the main gas circuit pipeline 132 .
[0065] Specifically, Figures 1 to 4 As shown, the first air pressure regulating valve 135 is opened, and the downward pressure cylinder control switch 136 is moved to connect the main air pipeline 132 with the downward pressure air pipeline 133, thereby lowering the downward pressure cylinder 131. At the same time, the second air pressure regulating valve 170 is opened to connect the main air pipeline 132 with the buffer air pipeline 160 to supply air to the buffer air pipeline 160.
[0066] According to the specifications of the precision heater 200, the first air pressure regulating valve 135 and the second air pressure regulating valve 170 are adjusted to make the pressure of the air circuit of the entire verification device reach the preset pressure. After the downward pressure cylinder 131 drops to abut against the temperature sensor 140 and stabilizes, the first air pressure regulating valve 135 is closed to form a constant pressure environment in the air circuit of the entire verification device. The changes in the values of the pressure gauges on the first air pressure regulating valve 135 and the second air pressure regulating valve 170 are observed. If there is a leak in the air circuit, the values of the pressure gauges on the first air pressure regulating valve 135 and the second air pressure regulating valve 170 will continue to decrease and finally return to zero. On the contrary, if the values of the pressure gauges on the first air pressure regulating valve 135 and the second air pressure regulating valve 170 do not change significantly for 5 minutes, it is considered that the precision heater 200 has no leak.
[0067] For example, Figure 1 and Figure 4 As shown, when the verification device 100 includes a mounting plate 150, a through hole is provided on the mounting plate 150 corresponding to the air inlet of the buffer cylinder inside the precision heater 200, and the second end of the buffer gas line pipe 160 passes through the through hole and is connected to the air inlet. That is, when the precision heater 200 is fixed to the mounting plate 150, the second end of the buffer gas line pipe 160 passes through the through hole on the mounting plate 150 and is connected to the air inlet of the buffer cylinder inside the precision heater 200.
[0068] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the embodiments of the present disclosure. However, the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the embodiments of the present disclosure.
Claims
1. A semiconductor automatic screening machine precision heater offline verification device, characterized in that: The device comprises: Fixed base; A support frame, arranged on the fixed base; An air circuit driving assembly, disposed on the support frame and used to be detachably connected to the precision heater to drive the precision heater to rise and fall; A temperature sensor is arranged on the fixed base and corresponds to the position of the precision heater; wherein, When performing function verification on the precision heater, the gas circuit driving assembly is used to drive the precision heater to descend until it abuts against the temperature sensor, and the temperature sensor is used to measure the temperature of the precision heater under a preset pressure.
2. The device according to claim 1, characterized in that The air circuit drive assembly includes a down-pressure cylinder, a main air circuit pipeline, a down-pressure air circuit pipeline and an up-pressure air circuit pipeline; The first end of the down-pressure air pipeline and the first end of the up-pressure air pipeline are selectively connected to the main air pipeline, and the second end of the down-pressure air pipeline and the second end of the up-pressure air pipeline are respectively connected to the first air inlet and the second air inlet of the down-pressure cylinder; The first end of the downward-pressing cylinder is fixedly connected to the support frame, and the second end of the downward-pressing cylinder is used for detachably connecting to the precision heater.
3. The device according to claim 2, characterized in that The air circuit driving assembly further includes a first air pressure regulating valve, which is arranged in series with the main air circuit pipeline.
4. The device according to claim 2, characterized in that The air circuit drive assembly also includes a downward pressure cylinder control switch; The first end of the downward pressure cylinder control switch is connected to the main air pipeline, and the second end of the downward pressure cylinder control switch is selectively connected to the downward pressure air pipeline and the upward air pipeline.
5. The device according to claim 4, characterized in that The downward pressure cylinder control switch is a manual valve.
6. The device according to claim 2, characterized in that The device also includes a mounting plate; The first end of the mounting plate is fixedly connected to the downward pressure cylinder, and the second end of the mounting plate is used for detachable connection with the precision heater.
7. The device according to claim 6, characterized in that The mounting plate is provided with a plurality of first clamping parts, and the precision heater is provided with a plurality of second clamping parts, and the second clamping parts are clamped in the first clamping parts corresponding thereto.
8. The device according to any one of claims 1 to 7, characterized in that The device also includes a buffer gas pipeline and a second air pressure regulating valve arranged in series with the buffer gas pipeline; The first end of the buffer gas pipeline is connected to the gas circuit of the gas circuit drive assembly, and the second end of the buffer gas pipeline is connected to the internal buffer cylinder of the precision heater; wherein, When the gas circuit driving assembly includes a first gas pressure regulating valve, the first gas pressure regulating valve and the second gas pressure regulating valve are used to detect the air tightness of the precision heater under a preset pressure according to changes in pressure values of the first gas pressure regulating valve and the second gas pressure regulating valve.
9. The device according to claim 8, characterized in that When the air circuit drive assembly includes a main air circuit pipeline, the first end of the buffer air circuit pipeline is connected to the main air circuit pipeline.
10. The device according to claim 8, characterized in that When the device includes a mounting plate, the mounting plate is provided with a through hole at the air inlet of the buffer cylinder inside the precision heater; The second end of the buffer gas pipeline passes through the through hole and is connected to the air inlet.