Vacuum chuck structure and vacuum adsorption device

Abstract

The utility model provides a vacuum suction cup structure and a vacuum adsorption device, the vacuum suction cup structure comprises a suction cup, one side, in contact with a silicon wafer, of the suction cup is provided with at least two suction cup holes, and the suction cup is internally provided with an air path communicated with the suction cup holes; the air pipe is communicated with the air path, and an adjusting valve is arranged on the air pipe; the sensing piece is used for sensing the thickness of the silicon wafer; the main controller is used for controlling the adjusting valve to adjust the air inlet pressure of the air pipe according to the thickness of the silicon wafer so as to adjust the pressure value of the suction cup hole for adsorbing the silicon wafer, so that the adsorption pressure value is automatically adjusted according to different thickness degrees of the silicon wafer, the probability of occurrence of fragments in the wafer taking process is avoided, and the production efficiency is improved. And the production and manufacturing cost is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor silicon wafer manufacturing, and specifically relates to a vacuum suction cup structure and a vacuum adsorption device. Background Art

[0002] As the cost of silicon wafers in the photovoltaic industry continues to rise, companies have to make the cells as thin as possible to reduce the production cost of solar silicon wafers, resulting in the thickness of solar cells being reduced from the initial 180 microns to the current 110 microns in the workshop. The subsequent thickness will continue to drop, and the requirements for slicing technology are becoming more and more stringent. However, the existing slicing cannot achieve the same thickness for each slice, and the thickness of different slices will inevitably be uneven.

[0003] The suction pressure provided by the existing vacuum suction cup structure for adsorbing silicon wafers is usually a constant value. The suction pressure value cannot be adjusted for unevenly thick silicon wafers, which is prone to cracks during the wafer removal process, causing silicon wafers to break, resulting in increased production costs. Therefore, how to automatically adjust the suction pressure value according to the thickness of the silicon wafer to reduce the probability of fragmentation is an urgent problem to be solved. Utility Model Content

[0004] The present application provides a vacuum suction cup structure and a vacuum adsorption device to solve the problem of how to automatically adjust the adsorption pressure value according to the thickness of the silicon wafer to reduce the probability of fragmentation.

[0005] In order to solve the above technical problems, the present application provides a vacuum suction cup structure, comprising:

[0006] A suction cup, wherein at least two suction cup holes are provided on a side of the suction cup in contact with the silicon wafer, and an air path connected to the suction cup holes is provided inside the suction cup;

[0007] An air pipe, the air pipe is connected to the air path, and a regulating valve is provided on the air pipe;

[0008] A sensing element, the sensing element is used to sense the thickness of the silicon wafer; and

[0009] The main controller is used to control the regulating valve to adjust the air intake pressure of the air pipe according to the thickness of the silicon wafer, so as to adjust the pressure value of the suction cup hole to adsorb the silicon wafer.

[0010] As a further improvement of the present application, the sensing element, the main controller and the regulating valve are connected via wired / wireless means;

[0011] The master controller is configured to receive the thickness information of the silicon wafer obtained by the sensing element, and control the regulating valve according to the thickness of the silicon wafer, so that the regulating valve adjusts the intake pressure of the air pipe.

[0012] As a further improvement of the present application, the sensing element includes one or more sensors among a capacitive sensor, a photoelectric sensor, and a Hall sensor;

[0013] The number of the sensing elements is configured to be at least two, and at least two of the sensing elements are arranged along the length extension direction of the silicon wafer.

[0014] As a further improvement of the present application, a plurality of the suction cup holes are symmetrically arranged in pairs on both sides of the corresponding sensing element with the extension direction of the sensing element as the symmetry axis, and a plurality of the suction cup holes on the same side are arranged at equal intervals along the length extension direction of the silicon wafer.

[0015] As a further improvement of the present application, the number of the air pipes is configured to be at least two, and each air pipe is connected to at least one of the suction cup holes through the air path.

[0016] As a further improvement of the present application, at least one air path is provided between two of the suction cup holes, the air path is connected to the corresponding two suction cup holes, and each air path is connected to a corresponding one of the air pipes.

[0017] As a further improvement of the present application, a plurality of adjusting members are provided on the side of the suction cup away from the silicon wafer, a limiting groove adapted to the adjusting member is provided in the suction cup along the thickness direction, and after the plurality of adjusting members penetrate through the corresponding limiting grooves, the suction cup is erected above the silicon wafer.

[0018] As a further improvement of the present application, a connecting pipe is provided between the air path and the air pipe, a first end of the connecting pipe is connected to the air path, a second end of the connecting pipe is connected to the corresponding air pipe, and the first end of the connecting pipe is perpendicularly arranged with respect to the second end of the connecting pipe;

[0019] The height of the adjusting member is greater than the height of the connecting pipe.

[0020] As a further improvement of the present application, a plurality of suction cup pads are provided on the side of the suction cup in contact with the silicon wafer, and each suction cup hole is provided on a corresponding one of the suction cup pads.

[0021] The present application also provides a vacuum adsorption device, which includes any one of the above-mentioned vacuum suction cup structures, and further includes an air pump connected to the air pipe, and the regulating valve is arranged between the air pump and the air pipe.

[0022] Compared with the prior art, the vacuum chuck structure and the vacuum adsorption device provided by the embodiments of the present application are provided with a plurality of chuck holes on the side where the chuck contacts the silicon wafer, and an air path communicating with the chuck holes is arranged inside the chuck. The trachea is communicated with the chuck holes through this air path. An induction member is arranged on the chuck to sense the thickness of the silicon wafer, and the main controller adjusts the intake pressure of the trachea according to the obtained thickness of the silicon wafer, and further adjusts the pressure value of the chuck adsorbing the silicon wafer, thereby realizing automatically adjusting the adsorption pressure value according to different thicknesses of the silicon wafers, avoiding the probability of chip fragmentation during the wafer picking process, and reducing the production and manufacturing costs. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 is a schematic structural diagram of the vacuum chuck structure provided by the embodiments of the present application;

[0025] Figure 2 is a schematic structural diagram of the adjusting member in the vacuum chuck structure provided by the embodiments of the present application;

[0026] Figure 3 is a side view of the vacuum chuck structure provided by the embodiments of the present application;

[0027] Figure 4 is a schematic structural diagram of the adapter tube in the vacuum chuck structure provided by the embodiments of the present application;

[0028] Figure 5 is a specific embodiment of the air path in the vacuum chuck structure provided by the embodiments of the present application Figure 1 ;

[0029] Figure 6 is a specific embodiment of the air path in the vacuum chuck structure provided by the embodiments of the present application Figure 2 ;

[0030] Figure 7 is a schematic structural diagram of the vacuum chuck structure provided by the embodiments of the present application when the chuck is in a horizontal state;

[0031] Figure 8 is a schematic structural diagram of the vacuum chuck structure provided by the embodiments of the present application when the chuck is in an inclined state;

[0032] Figure 9 is a specific embodiment diagram of the vacuum chuck structure provided by the prior art;

[0033] Description of reference numerals:

[0034] 10 - Suction cup; 11 - Suction cup hole; 12 - Air pipe; 13 - Inductive part; 14 - Adjusting part; 15 - Adapter pipe; 16 - Suction cup pad; 17 - Air passage; 18 - Limit groove. Detailed implementation manners

[0035] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0036] In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0037] In order to make the description of the present disclosure more detailed and complete, the following provides an illustrative description of the implementation manners and specific embodiments of the present application; however, this is not the only form for implementing or applying the specific embodiments of the present application. The implementation manners cover the features of multiple specific embodiments and the method steps and their sequences for constructing and operating these specific embodiments. However, other specific embodiments can also be used to achieve the same or equivalent functions and step sequences.

[0038] Please refer to Figures 1 - 9 , in order to solve the problem of how to automatically adjust the adsorption pressure value according to the thickness of the silicon wafer in the prior art and reduce the probability of fragmentation, the embodiments of the present application provide a vacuum suction cup structure and a vacuum adsorption device. Please refer to Figure 1 , which is a schematic structural diagram of the vacuum suction cup structure provided by the embodiments of the present application. The vacuum suction cup structure provided by the present application includes a suction cup 10, an air pipe 12, an inductive part 13 and a main controller to adsorb and pick up the battery silicon wafers with uneven thicknesses.

[0039] As an optional implementation manner, at least two suction cup holes 11 are opened on one side of the suction cup 10 in contact with the silicon wafer, and an air passage 17 communicating with the suction cup holes 11 is arranged inside the suction cup 10. The air pipe 12 is communicated with the air passage 17, so that the gas in the air pipe 12 is transmitted to the corresponding suction cup holes 11 through the air passage 17.

[0040] It can be understood that one end of the suction cup hole 11 provided in the present application is communicated with the corresponding trachea 12 through the gas path 17, and the gas in the trachea 12 is transmitted to the corresponding suction cup hole 11 through the gas path 17. The other end of the suction cup 11 is communicated with the outside for adsorbing the silicon wafer.

[0041] Furthermore, the present application senses the thickness of the silicon wafer through the sensing member 13. The setting position of the sensing member 13 can be set on the suction cup 10 to sense the thickness of the battery silicon wafer on the side in contact with the suction cup 10. The main controller is connected to the sensing member in a wired or wireless manner, so as to receive the signal including the thickness of the battery silicon wafer obtained by the sensing member 13, and adjust the intake pressure of the trachea 12 according to the thickness of the silicon wafer measured in real time, thereby adjusting the pressure value of the suction cup 10 for adsorbing the silicon wafer.

[0042] As an optional implementation manner, the present application is provided with a regulating valve (not shown in the figure) on the trachea 12. The sensing member, the main controller and the regulating valve are connected in a wired or wireless manner. The main controller receives the thickness information of the silicon wafer obtained by the sensing member, controls the regulating valve according to the thickness of the silicon wafer, and then adjusts the intake pressure of the trachea 12 through the regulating valve, thereby realizing the corresponding adjustment of the pressure value for the battery silicon wafers with uneven thickness, avoiding the occurrence of hidden cracks or fragments in the silicon wafers, and reducing the fragment rate.

[0043] In a specific embodiment provided by the present application, please refer to Figure 2 , which is a schematic structural diagram of the adjusting member 14 in the vacuum suction cup structure provided by the embodiment of the present application. The number of the above-mentioned sensing members 13 is preferably set to at least two. It can be observed that the two sensing members 13 are arranged along the extending direction of the length of the silicon wafer. A plurality of suction cup holes 11 are also arranged along the extending direction of the length of the silicon wafer. That is, when the cost permits, the sensing members 13 and the suction cup holes 11 can be arranged in one-to-one correspondence and are both arranged along the extending direction of the length of the silicon wafer. In this way, the suction cup 10 can be divided into at least two regions for separate control.

[0044] Specifically, the sensing member 13 provided by the present application can be set as one or more types of sensors such as a capacitive sensor, a photoelectric sensor and a Hall sensor. Since the number of sensing members is set to two or more, different types of sensors can be set in different regions of the suction cup 10 according to requirements, or the same type of sensors can be set for convenient later maintenance. When the sensing member 13 is set as a photoelectric sensor, the photoelectric sensor needs to be set on the side of the suction cup 10 for adsorbing the silicon wafer. Any sensor type that can sense the thickness of the silicon wafer, or any mechanical structure that can measure the thickness of the silicon wafer is feasible. The present application does not limit this.

[0045] As an alternative embodiment, the present application adjusts the intake pressure of the air pipe 12 through a regulating valve (not shown in the figure). The regulating valve is disposed on the air pipe 12 and is connected to the main controller in a wired or wireless manner, and adjusts the intake pressure of the air pipe 12 according to the instructions of the main controller, thereby adjusting the pressure value of the suction cup 10 for adsorbing the silicon wafer. The specific process and implementation principle of how the regulating valve adjusts the intake pressure of the air pipe 12 have been widely applied in the valve technology field, so the present application will not elaborate on this too much.

[0046] It should be noted that several sensing elements 13 are preferably disposed on the vertical bisector of the suction cup 10. When the number of the sensing elements 13 is configured to be two, the two sensing elements 13 should be arranged on the vertical bisector of the suction cup 10 along the length extension direction of the silicon wafer. At this time, several suction cup holes 11 are correspondingly and equally spaced on both sides of the sensing element 13, that is, several suction cup holes 11 are arranged in pairs on both sides of the corresponding sensing element with the extension direction of the sensing element as the symmetry axis, and several suction cup holes 11 on the same side satisfy the positional relationship of being equally spaced when extending along the length direction of the silicon wafer.

[0047] The present application obtains the thickness of the silicon wafer in this area through the sensing element 13, and then the main controller adjusts the pressure value of the adjacent suction cup holes 11 for adsorbing the silicon wafer according to the thickness of the silicon wafer, so as to control the pressure value of the suction cup 10 in a sub-region manner and avoid damaging the adsorbed silicon wafer.

[0048] In a specific embodiment provided by the present application, please refer to Figure 5 , which is a specific embodiment of the air path 17 in the vacuum suction cup structure provided by the embodiment of the present application Figure 1 , it can be observed that the suction cup 10 is provided with air paths 17 equal in number to the suction cup holes 11. Each air path 17 is communicated with the suction cup hole 11 at the corresponding position and is communicated with the corresponding externally provided air pipe 12. That is, on the premise that the cost and the accommodation space permit, the above-mentioned suction cup holes 11, air pipes 12, air paths 17, and sensing elements 13 can have a one-to-one corresponding positional relationship.

[0049] However, in practical applications, considering the final volume of the suction cup 10 and the available accommodation space, the present application provides at least one air path 17 between two suction cup holes 11. Please refer to Figure 6 , which is a specific embodiment of the air path in the vacuum suction cup structure provided by the embodiment of the present application Figure 2, it can be observed that two corresponding suction cup holes 11 are connected through an air passage 17. When the actual number of suction cup holes 11 is relatively large, it is considered to connect the air passage 17 with two adjacent suction cup holes 11 for use. Of course, each air passage 17 is still connected to a corresponding trachea 12, that is, the air passage 17 and the trachea 12 still satisfy the one-to-one setting relationship. However, the air passage 17 and the corresponding suction cup holes 11 satisfy a one-to-two setting relationship under the consideration of cost savings, so that the trachea 12 is further connected to the two suction cup holes 11 corresponding to the air passage 17 by connecting the trachea 12 with the corresponding air passage 17.

[0050] Please refer to Figure 3 , which is a side view of the vacuum suction cup structure provided by the embodiment of the present application. In a specific embodiment provided by the present application, the number of sensing elements 13 is set to two, and the number of suction cup holes 11 is set to eight. It can be observed that the eight suction cup holes 11 are symmetrically arranged in pairs on both sides of the sensing element 13 and are arranged at equal intervals along the length extension direction of the silicon wafer. The two sensing elements 13 are arranged on the vertical bisector of the suction cup 10. The number of tracheas 12 is set to four, and four air passages 17 are correspondingly arranged inside the suction cup 10. The number of corresponding regulating valves is also set to four. Each air passage 17 is connected to two suction cup holes 11 on adjacent sides, and the trachea 12 is connected to the corresponding air passage 17 in a one-to-one correspondence, so that the suction cup 10 is divided into upper and lower two control regions by the two sensing elements 13.

[0051] Of course, without considering cost, the number of sensing elements 13 can also be increased to four. At this time, the suction cup 10 is divided into four control regions from top to bottom by the four sensing elements. Each sensing element 13 senses the thickness of the silicon wafer at the corresponding position, and the main controller controls the intake pressure of each trachea 12 by adjusting the regulating valve at the corresponding position according to the thickness of the silicon wafer. At this time, the control accuracy of the four control regions will be greater than that of the above two control regions.

[0052] It can be understood that the present application does not impose any restrictions on the specific numbers of the above suction cup holes 11, tracheas 12, and sensing elements 13. When cost permits, it is also feasible to set the suction cup holes 11, tracheas 12, and sensing elements 13 in one-to-one correspondence. The present application does not impose too many restrictions on this.

[0053] Please refer to Figure 9 , which is a specific embodiment diagram of the vacuum suction cup structure provided by the prior art. It can be observed that only one suction cup hole 11 and one trachea 12 are provided on the suction cup 10 in the prior art. The adsorption pressure of the suction cup 11 cannot be adjusted in regions, and the thickness of the silicon wafer cannot be detected either. Only the adsorption pressure of the suction cup 11 can be adjusted as a whole, and regional control adjustment cannot be achieved. Therefore, hidden cracks and fragment defects will occur during the wafer picking process, resulting in an increase in the cost of the finished battery wafer.

[0054] Moreover, the embodiments of the present application can at least achieve sub-region adjustment of the upper and lower control regions, and can achieve adsorption pressure adjustment of more than two control regions when the cost permits, and can adjust the pressure of the suction cups for different thickness regions, effectively controlling the production cost.

[0055] In a specific embodiment provided by the present application, the above main controller can be set in the form of a main controller such as a single-chip microcomputer, a PLC (Programmable Logic Controller), an MCU (Microcontroller Unit), an FPGA (Field Programmable Gate Array), etc. Since suction cup pressure data corresponding to silicon wafers of different thicknesses are set, the corresponding relationship between the silicon wafer thickness and the suction cup pressure value can be entered into the main controller in advance. The main controller judges the most suitable pressure value for adsorbing the silicon wafer according to the thickness of the silicon wafer during the actual detection process, and controls the regulating valve to adjust the intake pressure of the air pipe 12 at this time, thereby realizing the automatic adjustment of the adsorption pressure value of the suction cup 10 according to different silicon wafer thicknesses.

[0056] As for the corresponding relationship between the silicon wafer thickness and the suction cup pressure value, reference can be made to the existing suction cup pressure standard table, or it can be tested and adjusted on the basis of this suction cup pressure standard table according to the actual silicon wafer adsorption situation. The present application will not elaborate on this too much.

[0057] As an optional implementation manner, the present application further provides a plurality of suction cup pads 16 on the side of the suction cup 10 in contact with the silicon wafer. The number of the suction cup pads 16 is not less than the number of the suction cup holes 11. Preferably, the number of the suction cup pads 16 is equal to the number of the suction cup holes 11. When the suction cup holes 11 are arranged on the suction cup pads 16, a one-to-one corresponding arrangement relationship needs to be satisfied; Figure 1 For example, in the present application, 8 corresponding suction cup pads 16 are provided for 8 suction cup holes 11, and the suction cup holes 11 are arranged on the corresponding suction cup pads 16, so as to provide buffering for the silicon wafer through the suction cup pads 16 during the adsorption process and avoid damaging the adsorbed silicon wafer.

[0058] Further, please continue to refer to Figure 2 and Figure 7 In the present application, a plurality of adjusting members 14 are provided through the side of the suction cup 10 away from the suction cup holes 11. It can be observed that a limiting groove 18 adapted to the adjusting member is provided along the thickness direction inside the suction cup 10. After the plurality of adjusting members 14 pass through the limiting grooves 18 at the corresponding positions, the suction cup 10 is erected above the silicon wafer. By adjusting the locking degree between the plurality of adjusting members 14 and the suction cup 10, the inclination degree of the suction cup 10 and the relative distance between the suction cup 10 and the silicon wafer can be adjusted.

[0059] As an alternative embodiment, the adjusting member 14 is preferably arranged in the form of an adjusting bolt, and the number is at least four. The four adjusting bolts are correspondingly arranged at the four corners of the suction cup 10. An internal thread adapted to the external thread of the adjusting bolt is arranged in the limiting groove 18, so that the adjusting bolt penetrates through the suction cup 10 by screwing.

[0060] In a specific embodiment provided by the present application, please refer to Figure 7 , which is a schematic structural diagram of the suction cup 10 in a horizontal state in the vacuum suction cup structure provided by the embodiment of the present application. The silicon wafer to be adsorbed is arranged at the bottom of the suction cup 10. When the relative distance between the suction cup 10 and the silicon wafer is too far or too close, by synchronously adjusting the locking degree between the four adjusting bolts and the suction cup 10, the relative distance between the suction cup and the silicon wafer can be adjusted. Corresponding to Figure 7 In the positional relationship shown in, it can be observed that the suction cup 10 is in a horizontal state, but the distance between the bottom of the suction cup 10 and the silicon wafer is too far. Therefore, it is necessary to synchronously loosen the four adjusting bolts to shorten the relative distance between the suction cup 10 and the silicon wafer.

[0061] When the suction cup 10 is tilted, the locking or loosening of individual adjusting bolts can also be carried out according to requirements to adjust the tilting degree of the suction cup 10 to make it more conform to the surface of the silicon wafer, which is beneficial to subsequent adsorption work.

[0062] Specifically, please refer to Figure 8 , which is a schematic structural diagram of the suction cup 10 in an inclined state in the vacuum suction cup structure provided by the embodiment of the present application. It can be observed that in Figure 8 , the suction cup 10 is in an upward inclined state. Therefore, the adjusting bolt on the right side that is upward inclined can be loosened first to make the suction cup 10 in a horizontal state, and then the four adjusting bolts can be synchronously loosened to shorten the relative distance between the suction cup 10 and the silicon wafer.

[0063] Of course, the above methods of further adjusting the relative distance between the suction cup 10 and the silicon wafer by adjusting the locking degree between the four adjusting members 14 and the silicon wafer 10 are all feasible. The present application does not further limit the specific locking or loosening methods and steps, and those skilled in the art should be aware of this.

[0064] As an alternative embodiment, please refer to Figure 4, which is a schematic structural diagram of the adapter 15 in the vacuum chuck structure provided by the embodiments of the present application. Since the air pipe 12 may be set in the form of a flexible hose in actual applications and may be worn out during long-term use, resulting in air leakage, the present application provides an adapter 15 between the air path 17 and the air pipe 12. The adapter 15 is preferably made of a rigid material such as metal or stainless steel. The present application sets the adapter 15 as a bent structure, connects the first end of the adapter 15 to the air path 17 at the corresponding position, and connects the second end of the adapter 15 to the air pipe 12 at the corresponding position. By setting the adapter 15 between the air pipe 12 and the air path 17, the air pipe 12 is prevented from being worn out during long-term use.

[0065] Since the adjusting member 13 is arranged around the chuck 10, it is necessary to limit the height of the adjusting member 13 to be greater than the height of the adapter 15 to prevent the excessive height of the adapter 15 from restricting the adjustment of the locking degree between the adjusting member 13 and the chuck 10. In a specific embodiment provided by the present application, the first end and the second end of the adapter 15 need to satisfy a perpendicular positional relationship. The present application arranges the first end of the adapter 15 in the vertical direction and arranges the second end of the adapter 15 in the horizontal direction to communicate with the corresponding air pipe 12. Similarly, the height of the first end of the adapter 15 needs to be less than the height of the adjusting member 13 to avoid affecting the locking or loosening between the adjusting member 13 and the chuck 10.

[0066] Based on the above vacuum chuck structure, the present application also provides a vacuum adsorption device. The adsorption device further includes an air pump (not shown in the figure) connected to the air pipe 12, and a regulating valve is arranged between the air pump and the corresponding air pipe 12. For other details of the above vacuum adsorption device to implement the above technical solutions, reference can be made to the description in the vacuum chuck structure provided in the above application embodiments, which will not be elaborated here.

[0067] In the vacuum chuck structure and the vacuum adsorption device provided by the embodiments of the present application, a plurality of suction holes are arranged on the side of the chuck in contact with the silicon wafer, an air path communicating with the suction holes is arranged inside the chuck, the air pipe is communicated with the suction holes through the air path, an induction member is arranged on the chuck to sense the thickness of the silicon wafer, and the main controller adjusts the intake pressure of the air pipe according to the obtained thickness of the silicon wafer, further adjusting the pressure value of the chuck for adsorbing the silicon wafer, so as to automatically adjust the adsorption pressure value according to different thicknesses of the silicon wafer, avoid the probability of chip breakage during the chip taking process, and reduce the production and manufacturing cost.

[0068] It can be understood that the technical features of the above embodiments can be combined arbitrarily. For the sake of brief description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0069] The above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present application. However, the present application is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present application, and these modifications and improvements are also regarded as the protection scope of the present application.

Claims

1. A vacuum suction cup structure, characterized in that: include: A suction cup, wherein at least two suction cup holes are provided on a side of the suction cup in contact with the silicon wafer, and an air path connected to the suction cup holes is provided inside the suction cup; An air pipe, the air pipe is connected to the air path, and a regulating valve is provided on the air pipe; A sensing element, the sensing element is used to sense the thickness of the silicon wafer; and The main controller is used to control the regulating valve to adjust the air intake pressure of the air pipe according to the thickness of the silicon wafer, so as to adjust the pressure value of the suction cup hole to adsorb the silicon wafer.

2. The vacuum suction cup structure according to claim 1, characterized in that: The sensor, the main controller and the regulating valve are connected via wired / wireless means; The main controller is used to receive the thickness information of the silicon wafer obtained by the sensing component, and control the regulating valve according to the thickness information of the silicon wafer, so that the regulating valve adjusts the air intake pressure of the air pipe.

3. The vacuum suction cup structure according to claim 1, characterized in that: The sensing element includes one or more sensors selected from the group consisting of a capacitive sensor, a photoelectric sensor, and a Hall sensor; The number of the induction elements is configured to be at least two, and at least two of the induction elements are arranged along the length extension direction of the silicon wafer.

4. The vacuum suction cup structure according to claim 3, characterized in that: The plurality of suction cup holes are arranged on both sides of the sensing element at corresponding positions with the extending direction of the sensing element as the symmetry axis, and the plurality of suction cup holes on the same side are arranged equidistantly along the extending direction of the length of the silicon wafer.

5. The vacuum suction cup structure according to claim 1, characterized in that: The number of the air tubes is configured to be at least two, and each of the air tubes is connected to at least one of the suction cup holes through the air path.

6. The vacuum suction cup structure according to claim 5, characterized in that: At least one air path is arranged between the two suction cup holes, the air path is communicated with the corresponding two suction cup holes, and each air path is communicated with a corresponding air pipe.

7. The vacuum suction cup structure according to claim 1, characterized in that: A plurality of adjusting members are arranged on the side of the suction cup away from the silicon wafer, and a limiting groove matched with the adjusting member is arranged in the suction cup along the thickness direction. After the plurality of adjusting members penetrate the limiting grooves at corresponding positions, the suction cup is mounted above the silicon wafer.

8. The vacuum suction cup structure according to claim 7, characterized in that: A transfer tube is provided between the gas circuit and the gas pipe, the first end of the transfer tube is connected to the gas circuit, the second end of the transfer tube is connected to the corresponding gas pipe, and the first end of the transfer tube is vertically arranged with the second end of the transfer tube; The height of the adjusting member is greater than the height of the transfer tube.

9. The vacuum suction cup structure according to claim 1, characterized in that: A plurality of suction cup pads are arranged on the side of the suction cup in contact with the silicon wafer, and each suction cup hole is arranged on a corresponding suction cup pad.

10. A vacuum adsorption device, characterized in that: It comprises the vacuum suction cup structure as described in any one of claims 1 to 9 and an air pump connected to the air pipe, and the regulating valve is arranged between the air pump and the air pipe.

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