Power module and air conditioner

Abstract

The utility model provides a power module and an air conditioner, and belongs to the technical field of semiconductor technologies, and the power module comprises a packaging layer, a three-phase rectification unit and a three-phase inversion unit. The three-phase rectification unit and the three-phase inversion unit are integrated in the packaging layer, the three-phase rectification unit is electrically connected with the first pin, and the three-phase inversion unit is electrically connected with the second pin. The three-phase rectification unit can control the current waveform through the switch module, so that the current waveform and the voltage waveform are in the same phase, the harmonic content is reduced, harmonic pollution is improved, and interference to other equipment is reduced. The three-phase inversion unit can efficiently convert direct current into controllable alternating current, the electric energy quality and the utilization efficiency are improved through the synergistic effect of the three-phase inversion unit and a peripheral circuit, and the power module has good flexibility and expandability. The three-phase rectification unit and the three-phase inversion unit are integrated in the packaging layer, the complexity of wiring can be reduced, stray inductance in a system is reduced, energy loss is reduced, the transmission efficiency of energy is improved, and therefore the overall system performance is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of semiconductor processes, and particularly to a power module and an air conditioner. Background Art

[0002] With the continuous improvement of the requirements for energy efficiency and comfort in modern buildings and industrial fields, as an important energy consumer, the optimization of the energy efficiency and performance of air conditioning systems has become particularly important.

[0003] As a key component in an air conditioning system, the power module has a decisive impact on the stability and efficiency of the system. Through the power module, parameters such as the magnitude of the current and voltage can be restricted, thereby regulating the power output of the air conditioner and keeping the operating state of the air conditioner within an appropriate range. And by reasonably controlling the output power of the electrical appliance, the energy consumption and operating cost are effectively reduced, and the energy utilization efficiency is improved.

[0004] However, conventional power modules use two packaging modules to package the rectifying unit and the inverting unit respectively, which occupy a large space on the control board and the wiring of the peripheral circuit is complex, resulting in relatively large electromagnetic interference and affecting the performance of the entire system. Summary of the Utility Model

[0005] The embodiments of the present application provide a power module and an air conditioner. The power module integrates a three-phase rectifying unit, a three-phase inverting unit, and a temperature detection unit. By improving the integration degree, the space of the control board is effectively utilized, and the total area occupied by the power module on the control board is reduced. In addition, the distance between the three-phase rectifying unit, the three-phase inverting unit, and the temperature detection unit is shortened, which not only reduces the complexity of wiring, but also reduces the stray inductance in the system, reduces energy loss and improves energy transmission efficiency, thereby improving the overall system performance.

[0006] The embodiments of the present application provide the following technical solutions to solve the above technical problems:

[0007] The embodiments of the present application provide a power module, including:

[0008] A packaging layer, on which a first pin and a second pin are provided;

[0009] A three-phase rectifying unit and a three-phase inverting unit, which are integrated in the packaging layer;

[0010] The three-phase rectifying unit is electrically connected to the first pin, and the three-phase inverting unit is electrically connected to the second pin.

[0011] Advantages of the embodiments of the present application: The power module provided by the embodiments of the present application includes a packaging layer, a three-phase rectification unit, and a three-phase inversion unit. Among them, a first pin and a second pin are provided on the packaging layer. The three-phase rectification unit and the three-phase inversion unit are integrated in the packaging layer. The three-phase rectification unit is electrically connected to the first pin, and the three-phase inversion unit is electrically connected to the second pin. Among them, the three-phase rectification unit serves as a power factor correction converter, which can effectively avoid shoot-through of the bridge arm, achieve three-phase clamping, ensure circuit protection under specific conditions such as overvoltage or overcurrent, and improve the safety and reliability of the system. In addition, the three-phase rectification unit can control the current waveform through the switching module so that it is in phase with the voltage waveform, reduce the harmonic content, improve the harmonic pollution, and reduce the interference to other devices. At the same time, the three-phase inversion unit can efficiently convert direct current into controllable alternating current. By cooperating with the peripheral circuit, the power quality and utilization efficiency are improved. The power module has good flexibility and scalability. Integrating the three-phase rectification unit and the three-phase inversion unit in the packaging layer can reduce the complexity of wiring, reduce the stray inductance in the system, reduce energy loss, and improve the energy transmission efficiency, thereby improving the overall system performance.

[0012] In a possible implementation manner, a temperature detection unit is integrated in the packaging layer; a third pin is provided on the packaging layer, and the temperature detection unit is electrically connected to the third pin. In this way, the temperature inside the power module can be monitored in real time through the temperature detection unit to prevent damage or performance degradation caused by overheating.

[0013] In a possible implementation manner, the three-phase rectification unit includes a rectifier bridge and a switching module; the rectifier bridge has three input terminals, a first output terminal, and a second output terminal. The three input terminals are used to be electrically connected to three-phase alternating current respectively; the switching module has a first terminal, a second terminal M, and a driving terminal. The first terminal is connected to the rectifier bridge, and the second terminal M, the first output terminal, and the second output terminal form a three-level structure. In this way, the rectifier bridge can convert the alternating current input from the input terminals into direct current and output it through the first output terminal and the second output terminal. The switching module can also perform current processing or conversion on the voltage output by the rectifier bridge according to the control signal of the control board. Capacitors are connected from the peripheral circuit to form a three-level structure together, so that the switching module can operate at different voltage levels to meet the requirements of different power electronics applications.

[0014] In a possible implementation, the rectifier bridge includes three rectification circuits connected in parallel, and each rectification circuit includes two first diodes connected in parallel; the three input terminals are respectively connected to the three rectification circuits, the three rectification circuits are all connected to the first output terminal and the second output terminal, and the three rectification circuits are all connected to the switch module. In this way, the switch module can receive the voltages from each rectification circuit and process or convert the voltages of each rectification circuit according to the requirements of the control signal, further adjust the output voltage, and implement functions such as overcurrent protection and short-circuit protection.

[0015] In a possible implementation, the switch module includes three power switches connected in parallel, and each power switch has the first terminal and the drive terminal; each power switch is connected to the second terminal M; the first terminals of the three power switches are respectively connected to the three rectification circuits. In this way, each power switch can be independently controlled to realize the on-off control of the paths of different circuits by the switch module, achieve precise control and optimization of the paths of different circuits, and thus improve the performance and efficiency of the system.

[0016] In a possible implementation, the drive terminal includes a first drive terminal, a second drive terminal, and a third drive terminal. The first drive terminals of each power switch are respectively connected to the three rectification circuits; the second drive terminals of each power switch are all connected to the second terminal M. In this way, the power switches achieve independent and precise control through different drive terminals, improve the flexibility, reliability, energy efficiency ratio, and maintainability of the system, and at the same time reduce the possibility of electromagnetic interference.

[0017] In a possible implementation, each power switch includes a first switch and a second switch connected in series, and both the first switch and the second switch include a first IGBT and a second diode; the first switch has the first terminal, the first drive terminal, and a third terminal; the second switch has a fourth terminal, a fifth terminal, and the second drive terminal, and the fifth terminal is connected to the second terminal M; the third terminal and the fourth terminal are both connected to the third drive terminal. In this way, the first switch in each power switch can be connected to the rectifier bridge through the first terminal, and the first switch in each power switch can receive the control signal from the control board through the first drive terminal to turn on and off the first IGBT therein. The second switch in each power switch can be connected to the second terminal M through the fifth terminal, and the second switch in each power switch can receive the control signal from the control board through the second drive terminal to turn on and off the first IGBT therein. The on-off states of different power switches can be independently controlled, and the system can optimize the distribution and use of electric energy according to the actual load conditions.

[0018] In a possible implementation, the three-phase inverter unit has a positive terminal, three negative terminals, a third output terminal, and a gate terminal. The positive terminal and the negative terminals are used to be electrically connected to direct current respectively. In this way, the three-phase inverter unit can convert the direct current power supply into alternating current, and output the inverted alternating current to the peripheral circuit through the third output terminal, providing a stable power supply for the peripheral circuit, thereby ensuring the stable operation of the entire system.

[0019] In a possible implementation, the three-phase inverter unit includes three parallel inverter circuits. Each inverter circuit has a first gate terminal and a second gate terminal; each inverter circuit is connected to the positive terminal, and the three inverter circuits are respectively connected to the three negative terminals; each inverter circuit is respectively connected to the third output terminal. In this way, each inverter circuit is responsible for processing the current of one phase, and receives the control signal through the gate terminal, so that each inverter circuit forms the alternating current waveform required by the peripheral circuit.

[0020] In a possible implementation, each inverter circuit includes a first inverter module and a second inverter module connected in series. The first inverter module and the second inverter module both include a second IGBT and a third diode connected in parallel. The second IGBT of the first inverter module has the first gate terminal, and the second IGBT of the second inverter module has the second gate terminal; the first inverter module has a sixth terminal and a seventh terminal, and one end of the second IGBT and the third diode is connected to the positive terminal through the sixth terminal; the second inverter module has an eighth terminal and a ninth terminal, and one end of the second IGBT and the third diode is connected to the negative terminal through the ninth terminal; the seventh terminal and the eighth terminal are connected and both are connected to the third output terminal.

[0021] In a possible implementation, the temperature detection unit includes a thermistor, and temperature protection is achieved by monitoring the thermistor. In this way, the peripheral circuit can infer the temperature of the power module by measuring the resistance value of the thermistor.

[0022] In a possible implementation, the encapsulation layer includes a first encapsulation. The first encapsulation includes a housing and a bottom plate. The housing and the bottom plate are connected by a compression ring; the first pin, the second pin, and the third pin are located on the housing, and an opening is provided on the housing. In this way, the electronic components on the power module can be protected by the encapsulation layer to prevent interference or damage from the external environment.

[0023] In a possible implementation, the encapsulation layer further includes a second encapsulation, the second encapsulation is located within the first encapsulation, and the three-phase rectification unit, the three-phase inversion unit, and the temperature detection unit are integrated within the second encapsulation. In this way, the three-phase rectification unit, the three-phase inversion unit, and the temperature detection unit are integrated and fixed within the second encapsulation, which can effectively provide insulation and moisture protection.

[0024] In a possible implementation, the encapsulation layer further includes a first lead wire, a second lead wire, and a third lead wire; one end of the first lead wire is connected to the three-phase rectification unit, and the other end of the first lead wire is connected to the first pin; one end of the second lead wire is connected to the three-phase inversion unit, and the other end of the second lead wire is connected to the second pin; one end of the third lead wire is connected to the temperature detection unit, and the other end of the third lead wire is connected to the third pin.

[0025] In a possible implementation, it further includes a substrate, the substrate is located within the encapsulation layer; the three-phase rectification unit, the three-phase inversion unit, and the temperature detection unit are all located on the substrate. In this way, the substrate can transfer the heat generated during the operation of the three-phase rectification unit, the three-phase inversion unit, and the temperature detection unit to the bottom plate, and dissipate the heat in a timely manner, ensuring the normal operation and stability of the power module.

[0026] In a possible implementation, the substrate includes a first substrate and a second substrate, the three-phase rectification unit is located on the first substrate, and the three-phase inversion unit and the temperature detection unit are located on the second substrate. In this way, by placing different circuit components on the first substrate and the second substrate respectively, functional partitioning can be achieved, reducing electromagnetic interference and signal crosstalk between different electronic components, thereby improving the stability and reliability of the system.

[0027] In a possible implementation, several pin pins are provided on the housing, and the first substrate and the second substrate are connected to the pin pins through connection wires.

[0028] In a possible implementation, the bottom plate is a heat-dissipating copper bottom plate; the substrate is an alumina ceramic double-sided copper-clad substrate; the second encapsulation layer is a silicone gel layer.

[0029] The embodiment of the present application further provides an air conditioner, including:

[0030] A control board, and the above-mentioned power module, the power module is located on the control board.

[0031] In addition to the technical problems solved by this application, the technical features constituting the technical solution, and the beneficial effects brought by the technical features of these technical solutions described above, other technical problems that can be solved by a power module and an air conditioner provided by this application, other technical features included in the technical solution, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manner. Description of the Drawings

[0032] In order to more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the following will briefly introduce the drawings required for describing the embodiments of this application or the prior art. Obviously, the drawings in the following description are only a part of the embodiments of this application. These drawings and the text description are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0033] Figure 1 Schematic diagram of the power module structure provided by the embodiment of this application;

[0034] Figure 2 Exploded view of the power module provided by the embodiment of this application;

[0035] Figure 3 Topology diagram of the power module provided by the embodiment of this application;

[0036] Figure 4 Topology diagram of the three-phase rectification unit of the power module provided by the embodiment of this application;

[0037] Figure 5 Topology diagram of the three-phase inverter unit of the power module provided by the embodiment of this application.

[0038] Description of the reference numerals:

[0039] 100 - Encapsulation layer; 110 - Housing; 120 - Bottom plate; 140 - Pressure ring; 150 - Connecting wire;

[0040] 111 - Opening; 112 - Pin;

[0041] 131 - First substrate; 132 - Second substrate;

[0042] 200 - Three-phase rectification unit; 210 - Rectifier bridge; 220 - Rectification circuit; 230 - Switch module; 240 - Power switch; 250 - First diode; 260 - Second diode; 270 - First IGBT;

[0043] 241 - First switch; 242 - Second switch;

[0044] 300 - Three - phase inverter unit; 310 - Inverter circuit; 320 - First inverter module; 330 - Second inverter module; 340 - Third diode; 350 - Second IGBT;

[0045] 400 - Temperature detection unit. Detailed implementation manner

[0046] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0047] Figure 1 It is a schematic diagram of the power module structure provided by the embodiment of the present application. Figure 2 It is an exploded view of the power module provided by the embodiment of the present application. Figure 3 It is a topology diagram of the power module provided by the embodiment of the present application. Figure 4 It is a topology diagram of the three - phase rectification unit of the power module provided by the embodiment of the present application. Figure 5 It is a topology diagram of the three - phase inverter unit of the power module provided by the embodiment of the present application.

[0048] The embodiment of the present application can provide an air conditioner, which includes a control board and a power module, and the power module is located on the control board. The control board can receive user quality, monitor the operating state of the internal system, and send corresponding control signals to the power module. Through the power module, the conversion, distribution, and protection of electric energy can be controlled. According to the instructions of the control board, the magnitude, frequency, and direction of the current can be adjusted to meet the power demand of the air - conditioner system. It can be understood that the power module and the control board can be connected by wires, and the control signals and electric energy are carried by the wires to ensure that the power module can accurately execute the instructions of the control board.

[0049] The power module provided by the embodiment of the present application, as Figure 1 and Figure 3 shown, includes a package layer 100, a three - phase rectification unit 200, and a three - phase inverter unit 300. Among them, a first pin and a second pin are provided on the package layer 100. The three - phase rectification unit 200 and the three - phase inverter unit 300 are integrated in the package layer 100, the three - phase rectification unit 200 is electrically connected to the first pin, and the three - phase inverter unit 300 is electrically connected to the second pin.

[0050] The three-phase rectifier unit 200 and the three-phase inverter unit 300 are integrated within a packaging layer 100, which can improve the integration degree, realize the miniaturization of the power module, and thus reduce the occupied area on the control board. Through the packaging layer 100, electronic components such as the three-phase rectifier unit 200 and the three-phase inverter unit 300 can be protected from the influence of the external environment such as dust, moisture, vibration, etc., and mechanical support and electrical isolation can also be provided. Moreover, the input and output of electric energy on the power module can be realized through the first pin and the second pin provided on the packaging layer 100.

[0051] In a possible implementation manner, the three-phase rectifier unit 200 can convert alternating current into direct current. The three-phase rectifier unit 200 is electrically connected to the first pin. The external alternating current power supply can supply power to the three-phase rectifier unit 200 through the first pin, and after the alternating current is converted into direct current by the three-phase rectifier unit 200, it can be output through the first pin. It should be noted that the direct current rectified by the three-phase rectifier unit 200 can be used by the subsequent three-phase inverter power supply, or can also be used by other circuits that require a direct current power supply.

[0052] The three-phase inverter unit 300 can convert direct current into alternating current. The three-phase inverter unit 300 is electrically connected to the second pin. The external direct current power supply can supply power to the three-phase inverter unit 300 through the second pin, and after the direct current is converted into alternating current by the three-phase inverter unit 300, it can be output through the second pin. The three-phase alternating current after inversion can be supplied to loads that require a three-phase alternating current power supply such as motors and transformers, which will not be elaborated here.

[0053] In some embodiments of the present application, please continue to refer to Figure 1 and Figure 3 , the power module further includes a temperature detection unit 400, and the temperature detection unit 400 is integrated within the packaging layer 100. A third pin is provided on the packaging layer 100, and the temperature detection unit 400 is electrically connected to the third pin.

[0054] The temperature detection unit 400, the three-phase rectifier unit 200, and the three-phase inverter unit 300 are all integrated within the same packaging layer 100. Through the temperature detection unit 400, the temperature inside the power module can be monitored in real time to prevent damage or performance degradation caused by overheating. A third pin connected to an external circuit is provided on the packaging layer 100, and the temperature signal of the power module collected by the temperature detection unit 400 can be transmitted through the third pin. For example, when the temperature detection unit 400 collects a temperature signal, it can convert the temperature signal into an electrical signal and transmit it to the peripheral circuit through the third pin, so as to take corresponding cooling measures.

[0055] In some embodiments of the present application, such as Figure 3As shown, the three-phase rectification unit 200 includes a rectifier bridge 210 and a switch module 230. The rectifier bridge 210 has three input terminals, as well as a first output terminal P and a second output terminal N. The three input terminals are used to be electrically connected to three-phase alternating current respectively. The switch module 230 has a first terminal, a second terminal M, and a driving terminal. The first terminal is connected to the rectifier bridge 210, and the second terminal M, the first output terminal P, and the second output terminal N form a three-level structure.

[0056] It can be understood that the three input terminals of the rectifier bridge 210 can be used to be electrically connected to three-phase alternating current respectively. In the example of this application, as Figure 3 shown, the three-phase alternating current is composed of three alternating currents with a phase difference of 120 degrees and is connected to the rectifier bridge 210 through three input terminals. The three-phase alternating currents are the R phase, the S phase, and the T phase respectively. The rectifier bridge 210 further includes a first output terminal P and a second output terminal N for outputting the rectified voltage. For example, the first output terminal P is the positive pole of the output rectified direct current, and the second output terminal N is the negative pole of the output rectified direct current.

[0057] Please continue to refer to Figure 3 , the switch module 230 is connected to the rectifier bridge 210, and the first terminal of the switch module 230 is connected to the rectifier bridge 210 for receiving the voltage output by the rectifier bridge 210. The switch module 230 can perform current processing or conversion on the voltage output by the rectifier bridge 210 according to the control signal of the control board. In a possible implementation manner, the second terminal M of the switch module 230, the first output terminal P of the rectifier bridge 210, and the second output terminal N can access capacitors (not shown in the figure) from the peripheral circuit to form a three-level structure, so that the switch module 230 can operate at different voltage levels to meet different power application requirements.

[0058] It should be noted that the three-level structure is a circuit structure that can provide a smoother output voltage waveform, can reduce harmonic distortion, provide better waveform quality and higher efficiency, and has three levels to choose from. For example, in the embodiment of this application, the first output terminal P is the positive level, the second output terminal N is the negative level, and the second terminal M is the zero level.

[0059] It can be understood that the switch module 230 includes a driving terminal. The switch module 230 receives the control signal on the control board and drives the switch module 230 to act through the driving terminal to control the voltage output by the rectifier bridge 210 to implement the setting of circuit parameters, so as to accurately control and adjust the output voltage and current of the three-phase rectification unit 200 according to specific application requirements, so as to meet the specific application requirements of the system.

[0060] In some embodiments of this application, such as Figure 3 and Figure 4As shown, the rectifier bridge 210 includes three parallel rectifier circuits 220, and each rectifier circuit 220 includes two parallel first diodes 250. The three input terminals are respectively connected to the three rectifier circuits 220, and the three input terminals are used to connect to an external three-phase AC power supply, so as to ensure that each rectifier circuit 220 can receive the corresponding phase current. For example, the three input terminals of the rectifier circuit 220 can be connected to the R phase, S phase, and T phase of the external three-phase AC power supply in sequence.

[0061] In the example of this application, the rectifier bridge 210 includes six first diodes 250, namely the first diode D1, the first diode D2, the first diode D3, the first diode D4, the first diode D5, and the first diode D6. Among them, in the rectifier bridge 210, the three rectifier circuits 220 are respectively the first diode D1 in parallel with the first diode D2, the first diode D3 in parallel with the first diode D4, and the first diode D5 in parallel with the first diode D6. The rectifier circuit 220 in which the first diode D1 is in parallel with the first diode D2 is connected to the input terminal R phase, the rectifier circuit 220 in which the first diode D3 is in parallel with the first diode D4 is connected to the input terminal S phase, and the rectifier circuit 220 in which the first diode D5 is in parallel with the first diode D6 is connected to the input terminal T phase.

[0062] Please continue to refer to Figure 3 and Figure 4 , all three rectifier circuits 220 are connected to the first output terminal P and the second output terminal N. Through the first output terminal P and the second output terminal N, the rectified voltages of the three rectifier circuits 220 can be superimposed or combined. All three rectifier circuits 220 are connected to the switch module 230. The switch module 230 receives the voltage of each rectifier circuit 220 and processes or converts the voltage of each rectifier circuit 220 according to the needs of the control signal, further adjusting the output voltage, achieving functions such as overcurrent protection and short-circuit protection.

[0063] In some embodiments of this application, in combination with Figure 3 and Figure 4 as shown, the switch module 230 includes three parallel power switches 240, and each power switch 240 has a first terminal and a drive terminal. Each power switch 240 is connected to the second terminal M. The first terminals of the three power switches 240 are respectively connected to the three rectifier circuits 220.

[0064] The three power switches 240 are connected in parallel to form the switch module 230. The first terminal of each power switch 240 is connected to the rectifier bridge 210, that is, the first terminals of the three power switches 240 are respectively connected to the three rectifier circuits 220. In the example of this application, the power switch connected to the input terminal R phase is defined as the first power switch, the power switch connected to the input terminal S phase is defined as the second power switch, and the power switch connected to the input terminal T phase is defined as the third power switch.

[0065] The rectifier circuit 220 in which the first diodes D1 and D2 are connected in parallel is connected to one end of the first power switch. The rectifier circuit 220 in which the first diodes D3 and D4 are connected in parallel is connected to one end of the second power switch. The rectifier circuit 220 in which the first diodes D5 and D6 are connected in parallel is connected to one end of the third power switch. The other end of each power switch 240 is connected to the second terminal M, and the second terminal M, the first output terminal P, and the second output terminal N are connected to a capacitor from the peripheral circuit to jointly form a three-level structure, which will not be elaborated here.

[0066] The drive terminal of each power switch 240 can receive the control signal from the control board, thereby controlling the connection or disconnection state of each power switch 240. By controlling each power switch 240 through the drive terminal, the switch module 230 controls the connection or disconnection state of different circuit paths, realizes the precise control and optimization of different circuit paths, and thus improves the performance and efficiency of the system.

[0067] In some embodiments of the present application, the drive terminal includes a first drive terminal, a second drive terminal, and a third drive terminal. The first drive terminal of each power switch 240 is respectively connected to three rectifier circuits 220. The second drive terminal of each power switch 240 is connected to the second terminal M.

[0068] As Figure 4 shown, one end of each power switch 240 can be respectively connected to three rectifier circuits 220 through the first drive terminal, the other end of each power switch 240 can be connected to the second terminal M through the second drive terminal, and the third drive terminal of each power module can be used to receive the control signal from the control board, thereby controlling the on-off state of each power switch 240.

[0069] Please continue to refer to Figure 4 , taking one power switch 240 as an example. The first drive terminal can be G11, the second drive terminal is G12, and the third drive terminal is M1. The first drive terminal G11 is connected to one of the rectifier circuits 220, the second drive terminal G12 is connected to the second terminal M, and the third drive terminal M1 is connected to the external circuit and can control the on-off state of the power switch 240 after receiving the control signal.

[0070] In some embodiments of the present application, as Figure 4As shown, each power switch 240 includes a first switch 241 and a second switch 242 connected in series. Both the first switch 241 and the second switch 242 include a first IGBT 270 and a second diode 260. The first switch 241 has a first terminal, a first drive terminal, and a third terminal. The second switch 242 has a fourth terminal, a fifth terminal, and a second drive terminal, and the fifth terminal is connected to the second terminal M. Both the third terminal and the fourth terminal are connected to the third drive terminal.

[0071] Please continue to refer to Figure 4 , taking one of the power switches 240 as an example. The first switch 241 in each power switch 240 can be connected to one of the rectifier circuits 220 through the first terminal. The first switch 241 in each power switch 240 can receive a control signal through the first drive terminal G11 to turn on or off the first IGBT 270 in the first switch 241. The second switch 242 in each power switch 240 is connected to the second terminal M through the fifth terminal. The second switch 242 in each power switch 240 receives a control signal through the second drive terminal G12 to turn on or off the first IGBT 270 in the second switch 242.

[0072] It should be noted that in each power switch 240, the third terminal of the first switch 241 is connected to the fourth terminal of the second switch 242, and the third drive terminal can be set between the third terminal and the fourth terminal. By receiving a control signal through the third drive terminal, precise control of the first IGBT 270 of the first switch 241 and the first IGBT 270 of the second switch 242 can be achieved, and bidirectional conduction can be realized during the rectification process, thereby improving the rectification efficiency and rectification performance of the three-phase rectification unit 200.

[0073] Please continue to refer to Figure 3 , in some embodiments of the present application, the three-phase inverter unit 300 has a positive terminal P2, three negative terminals DC-, a third output terminal, and a gate terminal. The positive terminal P2 and the negative terminals DC- are used to be electrically connected to direct current respectively. The positive terminal P2 of the three-phase inverter unit 300 can be connected to the positive pole of the DC power supply of the peripheral circuit, and the negative terminals DC- of the three-phase inverter unit 300 can be connected to the negative pole of the DC power supply of the peripheral circuit. A DC power input interface of the three-phase inverter unit 300 is formed through the positive terminal P2 and the negative terminals DC-. The three-phase inverter unit 300 converts direct current into alternating current and outputs the inverted alternating current to the peripheral circuit through the third output terminal. The third output terminal corresponds to the output of three-phase alternating current, that is, the outputs corresponding to the U phase, V phase, and W phase in the figure.

[0074] In some embodiments of the present application, such as Figure 3 and Figure 5As shown, the three-phase inverter unit 300 includes three parallel inverter circuits 310, and each inverter circuit 310 has a first gate terminal and a second gate terminal. Each inverter circuit 310 is connected to the positive terminal P2, and the three inverter circuits 310 are respectively connected to the three negative terminals DC-, and each inverter circuit 310 is respectively connected to the third output terminal.

[0075] As Figure 5 shown, the three inverter circuits 310 are connected in parallel to form the three-phase inverter unit 300, and each inverter circuit 310 is responsible for processing the current of one phase. Each inverter circuit 310 is provided with a gate terminal, and the gate terminal is used to control the received signal, so as to control each inverter circuit 310 to form the AC waveform required by the peripheral circuit. For the convenience of subsequent explanation, the one connected to the third output terminal U phase is called the first inverter circuit, the one connected to the third output terminal V phase is called the second inverter circuit, and the one connected to the third output terminal W phase is called the third inverter circuit.

[0076] In some embodiments of the present application, as Figure 3 and Figure 5 shown, each inverter circuit 310 includes a first inverter module 320 and a second inverter module 330 connected in series. Both the first inverter module 320 and the second inverter module 330 include a second IGBT 350 and a third diode 340 connected in parallel. The second IGBT 350 of the first inverter module 320 has a first gate terminal, and the second IGBT 350 of the second inverter module 330 has a second gate terminal.

[0077] The first inverter module 320 has a sixth terminal and a seventh terminal, and one end of the second IGBT 350 and the third diode 340 of the first inverter module 320 is connected to the positive terminal P2 through the sixth terminal. The second inverter module 330 has an eighth terminal and a ninth terminal, and one end of the second IGBT 350 and the third diode 340 of the second inverter module 330 is connected to the negative terminal DC- through the ninth terminal. The seventh terminal and the eighth terminal are connected and are both connected to the third output terminal.

[0078] It can be understood that the first inverter module 320 of each inverter circuit 310 is connected to the positive terminal P2 to receive the positive pole of the DC power supply in the peripheral circuit. Taking one of the inverter circuits as an example, the first gate terminal UH in the first inverter module 320 can receive a control signal, so as to drive the conduction or cut-off of the second IGBT 350 in the first inverter module 320. Similarly, the second gate terminal UL in the second inverter module 330 can also receive a control signal, so as to drive the conduction or cut-off of the second IGBT 350 in the second inverter module 330. By independently controlling the switching states of the second IGBT 350 in the first inverter module 320 and the second inverter module 330, the required AC waveform of the peripheral circuit can be generated by this inverter circuit 310.

[0079] In addition, the first inverter module 320 and the second inverter module 330 in each inverter circuit 310 are connected in series through the sixth terminal and the seventh terminal, so that the first inverter module 320 and the second inverter module 330 of each inverter circuit 310 can work together to convert the DC power introduced into the three-phase inverter unit 300 into the AC power required by the system and output it from the third output terminal.

[0080] In some embodiments of the present application, as Figure 2 shown, the temperature detection unit 400 includes a thermistor, and temperature protection is realized by monitoring the thermistor. It should be noted that a thermistor is a resistor device whose resistance value changes with temperature. The peripheral circuit can infer the temperature of the power module by measuring the resistance value of the thermistor. In a possible implementation manner, the peripheral circuit can preset a temperature threshold of the thermistor to trigger a protection measure. When the temperature of the power module exceeds this threshold, the peripheral circuit can turn off the power supply of the power module or start other heat dissipation mechanisms to reduce the temperature of the power module.

[0081] In some embodiments of the present application, as Figure 1 and Figure 2 shown, the encapsulation layer 100 includes a first encapsulation, and the first encapsulation includes a housing 110 and a bottom plate 120. The housing 110 is connected to the bottom plate 120 through a compression ring 140. The first pin, the second pin and the third pin are located on the housing 110, and an opening 111 is provided on the housing 110. The housing 110 has a certain mechanical strength and electromagnetic shielding ability, which can protect the electronic components on the power module and prevent them from being interfered or damaged by the external environment. The bottom plate 120 serves as a support structure for the housing 110, and forms a space for accommodating the three-phase rectification unit 200, the three-phase inverter unit 300 and the temperature detection unit 400 with the housing 110.

[0082] In the embodiments of the present application, the housing 110 can be made of a plastic material with good insulation and high-temperature resistance, such as a material formed by mixing polybutylene terephthalate and glass fiber. The bottom plate 120 can be made of copper material with good heat dissipation performance. The housing 110 is connected to the bottom plate 120 through a sealant, and a compression ring 140 is further used to fix the bottom plate 120 and the housing, thereby improving the structural stability of the power module.

[0083] It should be noted that the pin pins 112 on the housing 110 connected to the three-phase rectifier unit 200 can be collectively referred to as the first pins, and the three-phase rectifier unit 200 is connected to the peripheral circuit through the first pins. The pin pins 112 on the housing 110 connected to the three-phase inverter unit 300 can be collectively referred to as the second pins, and the three-phase inverter unit 300 is connected to the peripheral circuit through the second pins. The pin pins 112 on the housing 110 connected to the temperature detection unit 400 can be collectively referred to as the third pins, and the temperature detection unit 400 is connected to the peripheral circuit through the third pins to realize real-time monitoring of the temperature of the power module.

[0084] In some embodiments of the present application, the encapsulation layer 100 further includes a second encapsulation. The second encapsulation is located inside the first encapsulation, and the three-phase rectifier unit 200, the three-phase inverter unit 300, and the temperature detection unit 400 are integrated inside the second encapsulation. The second encapsulation can use silicone gel, which is poured in from the opening 111 of the housing 110 to integrally fix the three-phase rectifier unit 200, the three-phase inverter unit 300, and the temperature detection unit 400 inside the second encapsulation.

[0085] It should be noted that silicone gel has strong moisture-proof and insulating capabilities and can protect the electronic components inside the power module. The second encapsulation can use silicone gel for filling, but it is not limited to silicone gel. Other materials can also be used for filling, and other materials for the second encapsulation can be selected according to actual working conditions.

[0086] In some embodiments of the present application, the encapsulation layer 100 further includes a first lead wire, a second lead wire, and a third lead wire. One end of the first lead wire is connected to the three-phase rectifier unit 200, and the other end of the first lead wire is connected to the first pin. One end of the second lead wire is connected to the three-phase inverter unit 300, and the other end of the second lead wire is connected to the second pin. One end of the third lead wire is connected to the temperature detection unit 400, and the other end of the third lead wire is connected to the third pin.

[0087] It should be noted that the pin pins 112 on the housing 110 need to be connected to the three-phase rectifier unit 200, the three-phase inverter unit 300, and the temperature detection unit 400 through connection wires 150. In the embodiments of the present application, the connection wires 150 can be aluminum bonding wires, but are not limited to aluminum bonding wires.

[0088] In this embodiment, the connecting wires 150 connecting the three-phase rectifying unit 200 to the first pin are collectively referred to as the first leads. The three-phase rectifying unit 200 is connected to the peripheral circuit through the first pin and the first leads to achieve the transmission of control signals and AC power, and to supply the processed direct current to the peripheral circuit for use.

[0089] The connecting wires 150 connecting the three-phase inverter unit 300 to the second pin are collectively referred to as the second leads. The three-phase inverter unit 300 is connected to the peripheral circuit through the second pin and the second leads to achieve the transmission of control signals and DC power, and to supply the processed alternating current with a specific frequency to the peripheral circuit for use.

[0090] The connecting wires 150 connecting the temperature detection unit 400 to the third pin are collectively referred to as the third leads. The temperature detection unit 400 is connected to the peripheral circuit through the third pin and the third leads to transmit the data monitored by the temperature detection unit 400 to the peripheral circuit for corresponding temperature protection or control operations on the power module.

[0091] In some embodiments of the present application, as Figure 2 shown, the power module further includes a substrate 130, and the substrate 130 is located within the encapsulation layer 100. The three-phase rectifying unit 200, the three-phase inverter unit 300, and the temperature detection unit 400 are all located on the substrate 130. In the example of the present application, the substrate 130 may adopt the alumina ceramic double-sided copper-clad technology. The middle layer of the substrate 130 is a ceramic layer, and both sides of the ceramic layer are copper-clad. One layer of copper cladding is used to connect to the three-phase rectifying unit 200, the three-phase inverter unit 300, and the temperature detection unit 400, and the other layer of copper cladding is used to connect to the bottom plate 120.

[0092] It can be understood that through the substrate 130, the heat generated during the operation of the three-phase rectifying unit 200, the three-phase inverter unit 300, and the temperature detection unit 400 can be transferred to the bottom plate 120, and the heat can be dissipated in time, ensuring the normal operation and stability of the power module.

[0093] In some embodiments of the present application, please continue to refer to Figure 2, the substrate 130 includes a first substrate 131 and a second substrate 132. The three-phase rectification unit 200 is located on the first substrate 131, and the three-phase inversion unit 300 and the temperature detection unit 400 are located on the second substrate 132. In this way, by placing different electronic components on the three-phase rectification unit 200, the three-phase inversion unit 300, and the temperature detection unit 400 on the first substrate 131 and the second substrate 132 respectively, functional partitioning can be achieved, reducing electromagnetic interference and signal crosstalk between different electronic components, thereby improving the stability and reliability of the system. Moreover, by placing different electronic components on the first substrate 131 and the second substrate 132 respectively, the thermal coupling effect between the electronic components can be reduced, further improving the heat dissipation efficiency.

[0094] Among them, terms such as "above" and "below" are used to describe the relative positional relationship of each structure in the drawings. They are only for the sake of clarity in narration and are not used to limit the scope of implementation of the present application. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope of implementation of the present application.

[0095] It should be noted that in the present application, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "below", "under", and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0096] In addition, in the present application, unless otherwise clearly specified and limited, terms such as "mount", "connect", "couple", "fix", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0097] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power module, characterized in that: include: A packaging layer (100), wherein a first pin and a second pin are provided on the packaging layer (100); A three-phase rectifying unit (200) and a three-phase inverter unit (300), wherein the three-phase rectifying unit (200) and the three-phase inverter unit (300) are integrated in the packaging layer (100); The three-phase rectifying unit (200) is electrically connected to the first pin, and the three-phase inverter unit (300) is electrically connected to the second pin.

2. The power module according to claim 1, characterized in that: A temperature detection unit (400), the temperature detection unit (400) being integrated in the packaging layer (100); A third pin is provided on the packaging layer (100), and the temperature detection unit (400) is electrically connected to the third pin.

3. The power module according to claim 1 or 2, characterized in that: The three-phase rectifier unit (200) comprises a rectifier bridge (210) and a switch module (230); The rectifier bridge (210) has three input terminals, a first output terminal (P) and a second output terminal (N), and the three input terminals are used to be electrically connected to three-phase alternating current respectively; The switch module (230) has a first terminal, a second terminal (M) and a drive terminal, the first terminal is connected to the rectifier bridge (210), and the second terminal (M), the first output terminal (P) and the second output terminal (N) form three levels.

4. The power module according to claim 3, characterized in that: The rectifier bridge (210) comprises three rectifier circuits (220) connected in parallel, and each of the rectifier circuits (220) comprises two first diodes (250) connected in parallel; The three input terminals are respectively connected to the three rectifier circuits (220), the three rectifier circuits (220) are all connected to the first output terminal (P) and the second output terminal (N), and the three rectifier circuits (220) are all connected to the switch module (230).

5. The power module according to claim 4, characterized in that: The switch module (230) comprises three power switches (240) connected in parallel, each of the power switches (240) having the first terminal and the drive terminal; Each of the power switches (240) is connected to the second terminal (M); The first terminals of the three power switches (240) are respectively connected to the three rectifier circuits (220).

6. The power module according to claim 5, characterized in that: The driving terminal comprises a first driving terminal, a second driving terminal and a third driving terminal, and the first driving terminal of each power switch (240) is respectively connected to three rectifier circuits (220); The second drive terminal of each of the power switches (240) is connected to the second terminal (M).

7. The power module according to claim 6, characterized in that: Each of the power switches (240) comprises a first switch (241) and a second switch (242) connected in series, wherein the first switch (241) and the second switch (242) each comprise a first IGBT (270) and a second diode (260); The first switch (241) has the first terminal, the first drive terminal, and a third terminal; The second switch (242) has a fourth terminal, a fifth terminal, and the second drive terminal, and the fifth terminal is connected to the second terminal (M); The third terminal and the fourth terminal are both connected to the third driving terminal.

8. The power module according to claim 1 or 2, characterized in that: The three-phase inverter unit (300) has a positive terminal, three negative terminals, a third output terminal and a gate terminal, and the positive terminal and the negative terminal are used to be electrically connected to direct current respectively.

9. The power module according to claim 8, characterized in that: The three-phase inverter unit (300) comprises three inverter circuits (310) connected in parallel, each of the inverter circuits (310) having a first gate terminal and a second gate terminal; Each of the inverter circuits (310) is connected to the positive terminal, and the three inverter circuits (310) are respectively connected to the three negative terminals; Each of the inverter circuits (310) is respectively connected to the third output terminal.

10. The power module according to claim 9, characterized in that: Each of the inverter circuits (310) comprises a first inverter module (320) and a second inverter module (330) connected in series, the first inverter module (320) and the second inverter module (330) each comprising a second IGBT (350) and a third diode (340) arranged in parallel, the second IGBT (350) of the first inverter module (320) having the first gate terminal, and the second IGBT (350) of the second inverter module (330) having the second gate terminal; The first inverter module (320) has a sixth terminal and a seventh terminal, and one end of the second IGBT (350) and the third diode (340) is connected to the positive terminal via the sixth terminal; The second inverter module (330) has an eighth terminal and a ninth terminal, and one end of the second IGBT (350) and the third diode (340) is connected to the negative terminal via the ninth terminal; The seventh terminal and the eighth terminal are connected, and are both connected to the third output terminal.

11. The power module according to claim 2, characterized in that: The temperature detection unit (400) includes a thermistor.

12. The power module according to claim 2, characterized in that: The packaging layer (100) comprises a first packaging, the first packaging comprises an outer shell (110) and a bottom plate (120), the outer shell (110) and the bottom plate (120) are connected via a pressure ring; The first pin, the second pin and the third pin are located on the housing (110), and an opening is provided on the housing (110).

13. The power module according to claim 12, characterized in that: The packaging layer (100) further comprises a second packaging, wherein the second packaging is located inside the first packaging, and the three-phase rectification unit (200), the three-phase inverter unit (300) and the temperature detection unit (400) are integrated inside the second packaging.

14. The power module according to claim 13, characterized in that: Also includes a first lead, a second lead and a third lead; One end of the first lead is connected to the three-phase rectifier unit (200), and the other end of the first lead is connected to the first pin; One end of the second lead is connected to the three-phase inverter unit (300), and the other end of the second lead is connected to the second pin; One end of the third lead is connected to the temperature detection unit (400), and the other end of the third lead is connected to the third pin.

15. The power module according to claim 14, characterized in that: It also includes a substrate (130), wherein the substrate (130) is located inside the packaging layer (100); The three-phase rectifying unit (200), the three-phase inverter unit (300) and the temperature detection unit (400) are all located on the substrate (130).

16. The power module according to claim 15, characterized in that: The substrate (130) comprises a first substrate (131) and a second substrate (132); the three-phase rectifying unit (200) is located on the first substrate (131); and the three-phase inverter unit (300) and the temperature detection unit (400) are located on the second substrate (132).

17. The power module according to claim 16, characterized in that: The housing (110) is provided with a plurality of pin needles (112), and the first substrate (131) and the second substrate (132) are connected to the pin needles (112) via connecting wires.

18. The power module according to claim 17, characterized in that: The bottom plate (120) is a heat dissipation copper bottom plate, the substrate is an alumina ceramic double-sided copper-clad substrate, and the second package is a silicone gel layer.

19. An air conditioner, characterized in that: include: A control board, and a power module as described in any one of claims 1 to 18, wherein the power module is located on the control board.

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