Probe card for eliminating resonance

Abstract

The utility model relates to a probe card used for eliminating resonance, comprising a first PCB and a second PCB, a medium socket is arranged between the first PCB and the second PCB, the medium socket is provided with a signal pin and a ground pin, the ground pin is arranged at one side of the surface edge of the medium socket, and the signal pin is connected with the ground pin. The signal pin is arranged on the inner side of the ground pin and is far away from one side of the surface edge of the medium socket; the first PCB and the second PCB are both provided with grounding plates and signal lines, the grounding plates are located at the bottoms of the first PCB and the second PCB, and the signal lines are located at the tops of the first PCB and the second PCB; ground plates at the bottoms of the first PCB and the second PCB are connected with ground pins of the dielectric socket; signal lines on the top of the first PCB and the top of the second PCB are connected with signal pins of the medium socket. The probe card constructed by the utility model can effectively eliminate the resonance influence.

Description

Technical Field

[0001] The utility model relates to the technical field of probe card design, in particular to a probe card for eliminating resonance. Background Art

[0002] In recent pogo pin research, pogo pins with frequencies up to 30 GHz (including the 5G band) have been analyzed. In particular, some studies have only used high-frequency structure simulator (HFSS) to simulate and analyze the transmission and coupling performance of pogo pin arrays below 30 GHz. Another study developed a prototype pogo pin with an operating insertion loss of 20 dB and a frequency up to 30 GHz. However, the prototype pogo pin structure is different from the actual test environment because the printed circuit board used is a vertical structure. Recently, research has also been conducted on probe cards that use a combination of dielectric sockets and PCB lines, which is similar to the probe cards used in actual tests. By measuring and analyzing the dielectric socket, pogo pin, and PCB, it is found that when the height of the dielectric socket matches half of the wavelength, a resonance problem occurs at 28 GHz, and a radiation problem occurs in the high-frequency band. Existing solutions include using short pogo pins to increase the resonance frequency, but there are practical limitations in terms of ease of manufacturing and loss of durability.

[0003] In summary, when designing and using high-frequency pogo pins, various factors need to be considered, including structural design, signal integrity, insertion loss, resonance frequency, radiation problems, and manufacturing feasibility. With the development of 5G and higher-frequency technologies, the performance requirements for contact devices such as pogo pins will become more stringent, and continuous technological innovation is needed to meet these requirements. Summary of the Utility Model

[0004] Therefore, the technical problem to be solved by the utility model is to overcome the problem of resonance influence in the existing probe card design.

[0005] To solve the above technical problem, the utility model provides a probe card for eliminating resonance, which includes a first PCB board and a second PCB board. A dielectric socket is installed between the first PCB board and the second PCB board. The dielectric socket is provided with signal pins and ground pins. The ground pins are arranged on one side of the surface edge of the dielectric socket, and the signal pins are arranged inside the ground pins and on the side far from the surface edge of the dielectric socket. The signal pins are used to transmit electrical signals, and the ground pins are used to provide a grounding connection.

[0006] Both the first PCB board and the second PCB board are provided with a ground plane and signal lines. The ground plane is located at the bottom of the first PCB board and the second PCB board, and the signal lines are located at the top of the first PCB board and the second PCB board.

[0007] The ground planes at the bottoms of the first PCB board and the second PCB board are respectively connected to the ground pins of the dielectric socket; the signal lines at the tops of the first PCB board and the second PCB board are respectively connected to the signal pins of the dielectric socket.

[0008] In an embodiment of the present invention, a plurality of probe holes are formed on the surface of the dielectric socket, and the probe holes are used for installing signal pins and ground pins.

[0009] In an embodiment of the present invention, both ends of the signal pins and the ground pins extend linearly from the inside to the outside of the dielectric socket.

[0010] In an embodiment of the present invention, the first PCB board and the second PCB board are both provided with vias, and the signal lines at the tops of the first PCB board and the second PCB board are connected to the signal pins of the dielectric socket through their respective vias.

[0011] In an embodiment of the present invention, pads are further provided at the vias of the first PCB board and the second PCB board respectively, and the pads are used for fixing the signal lines at the vias.

[0012] In an embodiment of the present invention, the dielectric socket is arranged between the ground plane of the first PCB board and the ground plane of the second PCB board.

[0013] In an embodiment of the present invention, one or two ground pins are arranged inside the signal pins.

[0014] In an embodiment of the present invention, the height of the probe card is 65 millimeters.

[0015] In an embodiment of the present invention, the signal pins are pogo pin needles.

[0016] In an embodiment of the present invention, the ground pins are pogo pin needles.

[0017] The above technical solution of the present invention has the following advantages compared with the prior art:

[0018] The probe card designed by the present invention can eliminate resonance by optimizing the positions of the signal pins and the ground pins of the dielectric socket;

[0019] The probe card designed by the present utility model also optimizes the first PCB board and the second PCB board. For example, it is not necessary to invert the first PCB board and the second PCB board as in the prior art. The dielectric socket is arranged between the ground planes of the first PCB board and the second PCB board, making the test effect of the probe card better.

[0020] The probe card designed by the present utility model has a simple structure, is portable, and has strong practicability, and is easy to be popularized on a large scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the content of the present utility model easier to be clearly understood, the following further details the present utility model according to specific embodiments of the present utility model in conjunction with the drawings, wherein

[0022] Figure 1 is a schematic structural diagram of the probe card of the present utility model;

[0023] Figure 2 is a top view of the dielectric socket of the present utility model;

[0024] Figure 3 is a side view of the probe card of the present utility model.

[0025] Description of the reference numerals in the drawings: 1. First PCB board; 2. Second PCB board; 3. Dielectric socket; 4. Signal pin; 5. Ground pin; 6. Ground plane; 7. Signal line; 8. Via hole; 9. Probe hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The following further describes the present utility model in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and be able to implement it, but the embodiments cited do not limit the present utility model.

[0027] Referring to Figure 1 、 Figure 2 、 Figure 3 As shown, the present utility model relates to a probe card for eliminating resonance, including a first PCB board 1 and a second PCB board 2. A dielectric socket 3 is installed between the first PCB board 1 and the second PCB board 2. The dielectric socket 3 is provided with signal pins 4 and ground pins 5. The ground pins 5 are arranged on one side of the surface edge of the dielectric socket 3. The signal pins 4 are arranged inside the ground pins 5 and on the side far from the surface edge of the dielectric socket 3. And the position of the ground pins 5 is far from the surface edge of the dielectric socket 3 relative to the position of the signal pins 4. The signal pins 4 are used for transmitting electrical signals, and the ground pins 5 are used for providing a grounding connection.

[0028] Both the first PCB board 1 and the second PCB board 2 are provided with a ground plane 6 and signal lines 7. The ground plane 6 is located at the bottom (also known as the bottom layer) of the first PCB board 1 and the second PCB board 2 to form a shielding structure, that is, the ground plane 6 is equivalent to a shielding structure; the signal lines 7 are located at the top (also known as the top layer) of the first PCB board 1 and the second PCB board 2. It should be noted that the top layer (Top Layer) of the PCB board is also called the component layer, mainly used for placing components; the bottom layer (Bottom Layer) of the PCB board is also called the soldering layer, mainly used for wiring and soldering.

[0029] The ground planes 6 at the respective bottoms of the first PCB board 1 and the second PCB board 2 are both connected to the ground pins 5 of the dielectric socket 3; the signal lines 7 at the respective tops of the first PCB board 1 and the second PCB board 2 are both connected to the signal pins 4 of the dielectric socket 3, where the signal line 7 is the PCB board circuit.

[0030] At millimeter-wave frequencies, the heights of the dielectric socket 3 and the signal pin 4 match the length of half a wavelength (the socket height and the length of the signal pin 4 are equal to half a wavelength at a specific frequency (specifically the specified frequency)), so that the dielectric socket 3 functions as a resonator. When the leakage signal of the signal line 7 (PCB circuit) is coupled to the 2.9-mm-high dielectric socket 3 and the signal pin 4, resonance at a frequency of 28 GHz will occur. Therefore, in this embodiment, the ground plane 6 (ground plane) is used as a shielding structure to minimize this resonance and radiation loss.

[0031] It is worth mentioning that in this embodiment, one or two rows of ground pins 5 must be placed outside the signal pin 4, aiming to not only eliminate the inversion of the electric field polarity but also eliminate resonance.

[0032] Furthermore, a plurality of probe holes 9 (the probe holes 9 can penetrate the dielectric socket 3) are formed on the surface of the top view of the dielectric socket 3, and the probe holes 9 are used for installing the signal pins 4 and the ground pins 5.

[0033] It should be noted that the number and arrangement of the probe holes 9 on the dielectric socket 3 are different, and the user can determine them according to the actual situation.

[0034] Furthermore, both ends of the signal pin 4 and the ground pin 5 extend linearly from the inside to the outside of the dielectric socket 3.

[0035] Furthermore, the first PCB board 1 and the second PCB board 2 are both provided with vias 8, and the signal lines 7 at the respective tops of the first PCB board 1 and the second PCB board 2 are connected to the signal pins 4 of the dielectric socket 3 through their respective vias 8.

[0036] Further, pads are also provided at the vias 8 of the first PCB board 1 and the second PCB board 2 respectively, and the pads are used to fix the signal line 7 at the vias 8.

[0037] Further, the dielectric socket 3 is disposed between the ground planes 6 of the first PCB board 1 and the second PCB board 2.

[0038] Further, one or two ground pins 5 are disposed inside the signal pin 4.

[0039] Please refer to Figure 2 , on both sides of the edge of the dielectric socket 3 of this embodiment, one signal pin 4 is provided respectively, and one or two ground pins 5 are disposed inside each signal pin 4 (in practice, it should be one column or two columns of ground pins 5. Here, since Figure 2 it is a top view of the dielectric socket 3, it is convenient to understand with one or two ground pins 5).

[0040] Further, the height of the probe card of this embodiment is 65 mm. In order to improve the signal transmission performance, the length of the dielectric socket 3 can also be further reduced.

[0041] Further, the signal pin 4 is a pogo pin.

[0042] Further, the ground pin 5 is a pogo pin.

[0043] Please refer to Figure 1 , during actual testing, after the two ends of the two signal lines 7 on the first PCB board 1 are respectively connected to both sides of the first PCB board 1, connection interfaces (ports) are respectively provided at the connection points. After the connection interfaces (ports) are connected to the connectors via cables and then connected to the cables of an external test device (VNA), the dielectric socket 3 and the second PCB board 2 can be tested through the test device (VNA). It should be noted that the second PCB board 2 can be other devices under test (DUT) during actual testing, and the devices under test (DUT) can be, for example, chips, etc.

[0044] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of the creative utility model.

Claims

1. A probe card for eliminating resonance, characterized in that: The invention comprises a first PCB board (1) and a second PCB board (2), wherein a medium socket (3) is installed between the first PCB board (1) and the second PCB board (2), wherein the medium socket (3) is provided with a signal pin (4) and a ground pin (5), wherein the ground pin (5) is arranged on one side of the surface edge of the medium socket (3), and the signal pin (4) is arranged on the inner side of the ground pin (5) and away from the side of the surface edge of the medium socket (3); the signal pin (4) is used to transmit an electrical signal, and the ground pin (5) is used to provide a ground connection; The first PCB board (1) and the second PCB board (2) are both provided with a grounding plate (6) and a signal line (7), the grounding plate (6) is located at the bottom of the first PCB board (1) and the second PCB board (2), and the signal line (7) is located at the top of the first PCB board (1) and the second PCB board (2); The grounding plates (6) at the bottom of each of the first PCB board (1) and the second PCB board (2) are connected to the ground pin (5) of the medium socket (3); and the signal lines (7) at the top of each of the first PCB board (1) and the second PCB board (2) are connected to the signal pin (4) of the medium socket (3).

2. The probe card for eliminating resonance according to claim 1, characterized in that: A plurality of probe holes (9) are provided on the surface of the medium socket (3), and the probe holes (9) are used to install signal pins (4) and ground pins (5).

3. The probe card for eliminating resonance according to claim 1, characterized in that: Both ends of the signal pin (4) and the ground pin (5) extend linearly from the inside of the medium socket (3) to the outside.

4. The probe card for eliminating resonance according to claim 1, characterized in that: The first PCB board (1) and the second PCB board (2) are both provided with via holes (8), and the signal lines (7) on the top of the first PCB board (1) and the second PCB board (2) are connected to the signal pins (4) of the medium socket (3) through their respective via holes (8).

5. The probe card for eliminating resonance according to claim 1, characterized in that: A soldering pad is also provided at each of the via holes (8) of the first PCB board (1) and the second PCB board (2), and the soldering pad is used to fix the signal line (7) at the via hole (8).

6. The probe card for eliminating resonance according to claim 1, characterized in that: The medium socket (3) is arranged between the grounding plate (6) of the first PCB board (1) and the grounding plate (6) of the second PCB board (2).

7. The probe card for eliminating resonance according to claim 1, characterized in that: One or two ground pins (5) are arranged inside the signal pin (4).

8. The probe card for eliminating resonance according to claim 1, characterized in that: The height of the probe card is 65 mm.

9. The probe card for eliminating resonance according to claim 1, characterized in that: The signal pin (4) is a pogo pin.

10. The probe card for eliminating resonance according to claim 1, characterized in that: The ground pin (5) is a pogo pin.

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