Second-generation high-temperature superconducting strip

Abstract

The utility model discloses a second-generation high-temperature superconducting tape, and belongs to the field of superconducting tapes. The second-generation high-temperature superconducting strip comprises a silver-plated strip, at least one sputtering copper-plated layer and at least one electro-coppering layer, the sputtering copper-plated layers and the electro-coppering layers are arranged on the outer side of the silver-plated strip, the sputtering copper-plated layers and the electro-coppering layers are alternately arranged, and the electro-coppering layer is arranged on the outermost side of the second-generation high-temperature superconducting strip. According to the utility model, through the alternate structure of the sputtering copper plating layer and the electroplating copper layer, the electroplating copper layer has the advantages of uniform size, difficulty in generating copper layer cracks, good surface quality and the like of the sputtering copper plating process when the thickness of the manufactured electroplating copper layer is increased, and has the advantage that the manufacturing speed of the electroplating copper process is higher than that of the sputtering copper plating process; the problems that when an electroplated layer manufactured through an existing copper electroplating process is thickened, the size is not uniform, copper layer cracks are prone to occurring, and the surface quality is poor are solved, and meanwhile the problem that when an electroplated layer manufactured through a sputtering copper plating process is thickened, manufacturing is slow is solved.

Description

Technical Field

[0001] The utility model belongs to the field of superconducting tapes, and specifically relates to a second-generation high-temperature superconducting tape. Background Art

[0002] In recent years, with the continuous development of superconducting technology, the research on superconducting power equipment mainly based on superconductivity has developed rapidly, and remarkable achievements have been made in the fields of superconducting energy storage, superconducting motors, superconducting cables, superconducting fault current limiters, superconducting transformers, superconducting synchronous condensers, etc. In many applications, the second-generation high-temperature superconducting tape is the core component.

[0003] The production process of the second-generation high-temperature superconducting tape generally includes polishing Hastelloy, plating a buffer layer on the polished Hastelloy, then growing a superconducting layer on the buffer layer, followed by silver plating, then copper plating, and then winding the coil or preparing the conductor. The existing copper plating layer usually includes an electroplated copper layer made by the electroplating copper process and a sputtered copper plating layer made by the sputtering copper plating process.

[0004] In the electroplating copper process, since the width of the superconducting tape as the cathode is only 2 mm - 12 mm, the large difference in the sizes of the anode and the cathode, as well as the electroplating copper method itself, all result in the uneven size of the second-generation high-temperature superconducting tape after electroplating copper. When the electroplated layer is thickened, copper layer cracks often occur, and the surface quality is poor and it cannot be used.

[0005] Although the sputtered copper plating layer made by the sputtering copper plating process has the advantages of uniform size, not easy to appear copper layer cracks, and good surface quality, this process has the problem of slow production when the electroplated layer is thickened. Summary of the Utility Model

[0006] Utility Model Purpose: To provide a second-generation high-temperature superconducting tape, through the alternating structure of sputtering copper plating and electroplating copper, it solves the problems of uneven size, easy occurrence of copper layer cracks, and poor surface quality when the electroplated layer is thickened by the existing electroplating copper process, and at the same time solves the problem of slow production when the electroplated layer is thickened by the sputtering copper plating process.

[0007] The technical solution of the utility model is: A second-generation high-temperature superconducting tape includes: a silver-plated tape, at least one sputtered copper plating layer, and at least one electroplated copper layer.

[0008] The sputtered copper plating layer and the electroplated copper layer are arranged on the outer side of the silver-plated tape, and the sputtered copper plating layer and the electroplated copper layer are arranged alternately.

[0009] The outermost layer of the second-generation high-temperature superconducting tape is the electroplated copper layer.

[0010] In a further embodiment, the second-generation high-temperature superconducting tape includes: a silver-plated tape, a first sputtered copper plating layer, and a first electroplated copper layer arranged in sequence from the inside to the outside.

[0011] In a further embodiment, the second-generation high-temperature superconducting tape includes: a silver-plated tape, a first sputtered copper layer, a first electroplated copper layer, a second sputtered copper layer, and a second electroplated copper layer, which are sequentially arranged from the inside to the outside.

[0012] In a further embodiment, the thickness of the first electroplated copper layer ≥ the thickness of the first sputtered copper layer.

[0013] In a further embodiment, the thickness of the first sputtered copper layer is 1 - 3 μm.

[0014] The thickness of the first electroplated copper layer is 5 - 8 μm.

[0015] In a further embodiment, the thicknesses of the first sputtered copper layer and the second sputtered copper layer are respectively 1 - 3 μm.

[0016] The thickness of the first electroplated copper layer is 5 - 8 μm.

[0017] The thickness of the second electroplated copper layer is 1 - 5 μm.

[0018] In a further embodiment, when having the same thickness, the resistance value of the sputtered copper layer is 13 - 17% of the resistance value of the electroplated copper layer.

[0019] The beneficial effects of the present utility model are as follows: Through the alternating structure of the sputtered copper layer and the electroplated copper layer, when making the copper layer thicker, the electroplated copper layer can have the advantages of the sputtered copper process, such as uniform size, not easily having copper layer cracks, and good surface quality, and at the same time combines the advantage that the production speed of the electroplated copper process is greater than that of the sputtered copper process. It solves the problems of non-uniform size, easy occurrence of copper layer cracks, and poor surface quality in the existing electroplated copper process when making the electroplated layer thicker, and at the same time solves the problem of slow production in the sputtered copper process when making the electroplated layer thicker.

[0020] By arranging the electroplated copper layer on the outermost side, it can ensure that the outermost side of the overall copper layer of the second-generation high-temperature superconducting tape has anti-oxidation treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic cross-sectional structure diagram of the present utility model.

[0022] Figure 2 It is a schematic process flow diagram of the present utility model.

[0023] The reference numerals shown in the figure are: silver-plated tape 1, first sputtered copper layer 2, first electroplated copper layer 3, second sputtered copper layer 4, second electroplated copper layer 5. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] In the following description, numerous specific details are given to provide a more thorough understanding of the present utility model. However, it will be apparent to those skilled in the art that the present utility model may be practiced without one or more of these details. In other instances, some well-known technical features are not described to avoid obscuring the present utility model.

[0025] The present utility model discloses a second-generation high-temperature superconducting tape. Through an alternating structure of sputtered copper plating and electroplated copper plating, it solves the problems of uneven dimensions, easy occurrence of copper layer cracks, and poor surface quality when thickening the electroplated layer by the existing electroplated copper process. At the same time, it solves the problem of slow production when thickening the electroplated layer by the sputtered copper plating process.

[0026] The second-generation high-temperature superconducting tape includes: a silver-plated tape 1, at least one sputtered copper plating layer, and at least one electroplated copper plating layer.

[0027] The sputtered copper plating layer and the electroplated copper plating layer are arranged on the outer side of the silver-plated tape 1, and the sputtered copper plating layer and the electroplated copper plating layer are arranged alternately.

[0028] The outermost layer of the second-generation high-temperature superconducting tape is an electroplated copper plating layer.

[0029] In this embodiment, the second-generation high-temperature superconducting tape includes: a silver-plated tape 1, a first sputtered copper plating layer 2, and a first electroplated copper plating layer 3 arranged in sequence from the inside to the outside.

[0030] In Figure 1 In the shown embodiment, the second-generation high-temperature superconducting tape includes: a silver-plated tape 1, a first sputtered copper plating layer 2, a first electroplated copper plating layer 3, a second sputtered copper plating layer 4, and a second electroplated copper plating layer 5 arranged in sequence from the inside to the outside, where

[0031] In this embodiment, the thickness of the first electroplated copper plating layer 3 ≥ the thickness of the first sputtered copper plating layer 2.

[0032] In this embodiment, the thickness of the first sputtered copper plating layer 2 is 1 - 3 μm, and the thickness of the first electroplated copper plating layer 3 is 5 - 8 μm.

[0033] In this embodiment, the thicknesses of the first sputtered copper plating layer 2 and the second sputtered copper plating layer 4 are respectively 1 - 3 μm, the thickness of the first electroplated copper plating layer 3 is 5 - 8 μm, and the thickness of the second electroplated copper plating layer 5 is 1 - 5 μm.

[0034] In this embodiment, when having the same thickness, the resistance value of the sputtered copper plating layer is 13 - 17% of the resistance value of the electroplated copper plating layer. For a 12-mm-wide sample, using the four-probe test method, with a voltage electrode spacing of 30 mm and tested at room temperature, when the thicknesses of both the sputtered copper plating layer and the electroplated copper plating layer are 1 μm, the electroplated copper plating layer is about 100 mΩ, and the sputtered copper plating layer is about 15 mΩ.

[0035] When the thicknesses of both the sputtered copper layer and the electroplated copper layer are 3 μm, the resistance of the electroplated copper layer is about 33 mΩ, and that of the sputtered copper layer is about 5 mΩ.

[0036] When the thicknesses of both the sputtered copper layer and the electroplated copper layer are 5 μm, the resistance of the electroplated copper layer is about 20 mΩ, and that of the sputtered copper layer is about 3 mΩ. That is, when the thicknesses are the same, the sputtered copper layer is about 15% of the electroplated copper layer.

[0037] When the sputtered copper layer and the electroplated copper layer are alternately arranged, with the thickness of the sputtered copper layer being 2 μm and that of the electroplated copper layer being 3 μm, the resistance of the sputtered copper layer and the electroplated copper layer is about 10 mΩ.

[0038] Manufacturing process: After the double-sided silver plating of the second-generation high-temperature superconducting tape, the preparation of the first sputtered copper layer 2 is carried out first. Among them, a magnetron sputtering copper plating device is used to sputter copper on the double-sided silver-plated tape 1. The constant power mode is adopted, only 1 / 4 of the target positions are opened, the tape running speed is 0.8 m / min, the sputtering gas pressure is 0.1 Pa, the target-substrate distance is 60 mm, the voltage is 286 V, and the current is 3.5 A. The preparation of the first sputtered copper layer 2 is completed, and the sputtered copper thickness is 1 - 3 μm.

[0039] Then, based on the first sputtered copper layer 2, the preparation of the first electroplated copper layer 3 is carried out. Among them, an acid copper additive that allows working at a current density of 0.5 - 15 A / dm2 is added to the copper electroplating solution. The composition of the copper electroplating solution is: 180 - 220 parts of copper sulfate; 40 - 60 parts of sulfuric acid; 0.09 - 0.15 parts of chloride ions; the tape running speed is 1 - 3 m / min. The preparation of the first electroplated copper layer 3 is completed, and the first electroplated copper thickness is 4 - 8 μm.

[0040] Based on the first electroplated copper layer 3, the preparation of the second sputtered copper layer 4 is carried out. The process of the second sputtered copper layer 4 is the same as that of the first sputtered copper layer 2.

[0041] Then, based on the second sputtered copper layer 4, the preparation of the second electroplated copper layer 5 is carried out. Among them, an acid copper additive that allows working at a current density of 0.5 - 15 A / dm2 is added to the copper electroplating solution. The composition of the copper electroplating solution is: 180 - 220 parts of copper sulfate; 40 - 60 parts of sulfuric acid; 0.09 - 0.15 parts of chloride ions; the tape running speed is 3 - 5 m / min. The preparation of the second electroplated copper layer 5 is completed, and the second electroplated copper thickness is 1 - 5 μm.

[0042] Through the above copper plating process, the preparation of the copper plating layer with a total thickness of 7 - 19 μm is finally completed.

[0043] When performing magnetron sputtering copper plating, two modes of constant current mode and constant power can be selected. When the constant current mode is adopted, the power is generally 1500 W - 2000 W; when the constant power mode is adopted, the power is generally 800 W - 1200 W.

[0044] After completing the alternating copper plating according to the above process, it should be ensured that the last copper plating is electroplated copper to ensure that the outermost layer of the overall copper plating layer has anti-oxidation treatment. The thickness of the last electroplated copper can be selected according to actual requirements, and generally 1-5 μm can be chosen.

[0045] By alternately performing magnetron sputtering copper plating and electroplating copper, the substrate during electroplating copper is a dense magnetron sputtering copper plating layer, which provides a good substrate for electroplating copper. Therefore, the compactness of the copper plating layer can be effectively improved, and the problem of uneven external dimensions of electroplated copper can be effectively solved.

[0046] By alternately performing magnetron sputtering copper plating and electroplating copper, the electroplated copper of each layer does not need to be plated too thick, thus solving the problem of large internal stress when the electroplated copper layer is thick.

[0047] Each layer of magnetron sputtering copper plating does not need to be plated too thick, so the process speed of magnetron sputtering copper plating can be increased. When making the copper plating layer thicker, the alternating copper plating process speed can be faster than the single magnetron sputtering copper plating process speed.

[0048] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as a limitation of the present invention itself. Various changes can be made in its form and details without departing from the spirit and scope of the present invention defined by the appended claims.

Claims

1. A second generation high temperature superconducting tape, characterized in that: include: a silver-plated strip, at least one sputtered copper layer, and at least one electroplated copper layer; The sputtering copper layer and the electroplating copper layer are arranged outside the silver-plated belt, and the sputtering copper layer and the electroplating copper layer are arranged alternately; The outermost side of the second generation high temperature superconducting tape is the electroplated copper layer.

2. A second generation high temperature superconducting tape according to claim 1, characterized in that: include: A silver-plated belt, a first sputtered copper layer and a first electroplated copper layer are sequentially arranged from the inside to the outside.

3. A second generation high temperature superconducting tape according to claim 1, characterized in that: include: A silver-plated belt, a first sputtered copper-plated layer, a first electroplated copper layer, a second sputtered copper-plated layer and a second electroplated copper layer are sequentially arranged from the inside to the outside.

4. A second generation high temperature superconducting tape according to claim 2 or 3, characterized in that: The thickness of the first electroplated copper layer is greater than or equal to the thickness of the first sputtered copper layer.

5. A second generation high temperature superconducting tape according to claim 4, characterized in that: The thickness of the first sputtered copper layer is 1-3 μm; The thickness of the first electroplated copper layer is 5-8 μm.

6. A second generation high temperature superconducting tape according to claim 3, characterized in that: The thickness of the first sputtered copper layer and the second sputtered copper layer are 1-3 μm respectively; The thickness of the first electroplated copper layer is 5-8 μm; The thickness of the second electroplated copper layer is 1-5 μm.

7. A second generation high temperature superconducting tape according to any one of claims 1 to 3, characterized in that: When the thickness is the same, the resistance value of the sputtered copper layer is 13-17% of the resistance value of the electroplated copper layer.

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