Novel solid-state power amplifier
By using technical means such as 50W die, broadband 3dB 90-degree bridge and oxygen-free copper carrier plate in GaN technology solid-state power amplifier, the problems of heat dissipation and broadband matching under high power are solved, and stable high-power output and good heat dissipation performance are achieved.
Patent Information
- Application Number
- CN202421966151.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-08-14
AI Technical Summary
Existing GaN technology solid-state power amplifiers have difficulty dissipating heat at high power, and there are challenges in broadband matching and circuit connection.
It adopts a 50W die and a broadband 3dB 90-degree bridge, combined with an oxygen-free copper carrier plate and high-precision RF inductors, capacitors, and resistors for heat dissipation and matching, and uses welding technology and eutectic technology to enhance connection stability.
It achieves high power stable output, improves heat dissipation efficiency and broadband matching capabilities, and ensures that the amplifier is damaged for a long time outdoor use.
Smart Images
Figure CN223007543U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of microwave solid-state power amplifiers, and specifically relates to a novel solid-state power amplifier. Background Art
[0002] A microwave power amplifier is a very important component of a remote radar and communication system. Its function is to amplify the radio frequency signal of the radio frequency front end and then transmit it through an antenna, which can achieve a longer radar detection range, a longer communication distance, and better communication effects. Its performance directly determines the quality of the radar and communication system.
[0003] In the development history of existing solid-state power amplifiers, the amplifier die has gradually experienced silicon-based technology, GaAs technology, and GaN technology; among them, the GaN amplifier die has a higher saturation output power and a higher energy conversion efficiency, and is the current mainstream technology; however, it also has certain defects, such as a smaller area, which requires faster heat dissipation, greater broadband matching difficulty, and is prone to burning when connected to other circuits. Therefore, in order to realize a microwave power solid-state circuit based on GaN technology, it is necessary to solve the heat dissipation problem and the problem of easy connection of the circuit under broadband matching.
[0004] In summary, the utility model provides a novel solid-state power amplifier to solve the above problems. Summary of the Utility Model
[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:
[0006] A novel solid-state power amplifier includes a broadband 3dB 90-degree hybrid, a 50W die, and an oxygen-free copper carrier board. The broadband 3dB 90-degree hybrid is located before the input matching and after the output matching of the power amplifier, and uses the excellent return loss characteristics of the broadband 3dB 90-degree hybrid to improve the input and output return loss performance of the power amplifier module. The power amplifier die uses a 50W die, and the 50W die is used to ensure that the output power of the amplifier circuit can be stabilized above 30W. The input and output of the 50W die both use broadband passive matching, and mainly use microstrip lines and lumped components. The lumped components are high-precision radio frequency inductors, radio frequency capacitors, and resistors.
[0007] Further, in the utility model, an integrated boss is provided on the oxygen-free copper carrier board, and the 50W die is assembled on the integrated boss.
[0008] Further, in the utility model, a circuit board is installed on the surface of the oxygen-free copper carrier board, and the oxygen-free copper carrier board is used for heat dissipation of the circuit board and the 50W die.
[0009] Further, in the present utility model, the 50W die is assembled by a soldering process. The soldering material for the 50W die is tin-gold alloy foil, and the eutectic process is used.
[0010] Beneficial effects: The present utility model has the following beneficial effects:
[0011] By adopting a 50W die in the present utility model, it is ensured that the output power of the amplifier circuit can be stabilized above 30W. By adding a broadband 3dB 90-degree hybrid in front of the input matching of the power amplifier and after the output matching, the excellent return loss characteristics of the broadband 3dB 90-degree hybrid are utilized to improve the input and output return loss performance of the power amplifier module, so that the cascading of two-stage amplifiers does not affect the performance of a single-stage amplifier, achieving a very good cascading effect. At the same time, due to the very small insertion loss introduced, broadband matching under the cascading of two-stage amplifiers and 30W saturated output are achieved, and this amplifier is not damaged during long-term testing with an antenna connected outdoors, thus solving the problems of heat dissipation at high power and easy connection under broadband matching. Description of the drawings
[0012] Figure 1 Schematic diagram of the 30W 1-2GHz solid-state power amplifier circuit based on a 3dB 90-degree hybrid;
[0013] Figure 2 Appearance dimensions of the 3dB 90-degree hybrid;
[0014] Figure 3 Test data of the 3dB 90-degree hybrid;
[0015] Figure 4 PCB of the final-stage (second-stage) amplifier circuit of the 30W 1-2GHz solid-state power amplifier based on a 3dB 90-degree hybrid;
[0016] Figure 5 Carrier board of the final-stage circuit of the 30W 1-2GHz solid-state power amplifier based on a 3dB 90-degree hybrid;
[0017] Figure 6 Small-signal gain test results of the 30W 1-2GHz solid-state power amplifier based on a 3dB 90-degree hybrid;
[0018] Figure 7 30W saturated output test results of the 30W 1-2GHz solid-state power amplifier based on a 3dB 90-degree hybrid;
[0019] Figure 8 30W saturated output gain test results of the 30W 1-2GHz solid-state power amplifier based on a 3dB 90-degree hybrid. Detailed implementation manners
[0020] To better understand the technical content of the present utility model, specific embodiments are hereby given and described in conjunction with the accompanying drawings as follows. In the present disclosure, aspects of the present utility model are described with reference to the drawings, and many illustrative embodiments are shown in the drawings. The embodiments of the present disclosure do not necessarily define all aspects of the present utility model. It should be understood that the various concepts and embodiments introduced above, as well as those concepts and embodiments described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed by the present utility model are not limited to any implementation manner. Additionally, some aspects disclosed by the present utility model can be used alone, or in any suitable combination with other aspects disclosed by the present utility model.
[0021] Embodiment 1
[0022] As Figure 1-8 shown, this is the first embodiment of the present utility model. This embodiment provides a novel solid-state power amplifier, which includes a broadband 3dB 90-degree hybrid coupler, a 50W die, and an oxygen-free copper carrier board. The broadband 3dB 90-degree hybrid coupler is located before the input matching and after the output matching of the power amplifier, and uses the excellent return loss characteristics of the broadband 3dB 90-degree hybrid coupler to improve the input and output return loss performance of the power amplifier module. The power amplifier die uses a 50W die, and the 50W die is used to ensure that the output power of the amplifier circuit can be stabilized above 30W. Both the input and output of the 50W die use broadband passive matching, and mainly use microstrip lines and lumped elements. The lumped elements are high-precision RF inductors, RF capacitors, and resistors.
[0023] As Figure 1-8 shown, by using a 50W die, it is ensured that the output power of the amplifier circuit can be stabilized above 30W, and broadband passive matching is performed before and after the 50W die respectively. The specific matching method is a hybrid matching of microstrip and lumped elements (R / L / C). The size of the matching circuit is reduced by using lumped elements. A broadband 3dB 90-degree hybrid coupler is added before the input matching and after the output matching, and the excellent return loss characteristics of the broadband 3dB 90-degree hybrid coupler are used to improve the input and output return loss performance of the power amplifier module, so that the cascading of two-stage amplifiers does not affect the performance of a single-stage amplifier, achieving a very good cascading effect. At the same time, because the introduced insertion loss is very small, broadband matching and 30W saturated output under the cascading of two-stage amplifiers are achieved, and this amplifier is not damaged during long-term outdoor connection to the antenna for testing.
[0024] Embodiment 2
[0025] Referring to Figure 2 、 4 and 5, this is the second embodiment of the present utility model. This embodiment is based on the previous embodiment.
[0026] In this embodiment, an integrated boss is provided on the oxygen-free copper carrier board, and a 50W die is assembled on the integrated boss.
[0027] A circuit board is mounted on the surface of the oxygen-free copper carrier board, and the oxygen-free copper carrier board is used for heat dissipation of the circuit board and the 50W die.
[0028] The 50W die is assembled by a soldering process. The soldering material of the 50W die is tin-gold alloy foil, and the eutectic process is used.
[0029] Such as Figure 2 、 4 As shown in 5, by assembling the circuit board on a whole oxygen-free copper carrier board, the function of rapid heat dissipation can be realized. By assembling the 50W die on the integrated boss, the rapid heat dissipation of the 50W die can be realized. By using tin-gold alloy foil for the soldering of the 50W die and using the eutectic soldering process, it has the characteristics of stronger soldering and better heat dissipation performance.
[0030] Embodiment 3
[0031] Referring to the figure, this is the third embodiment of the present invention, and this embodiment is based on the first two embodiments.
[0032] In this embodiment, through Figure 2 the appearance dimensions of the 3dB 90-degree power divider can be seen. The area is very small, only 14.22*8.89mm, and through Figure 3 the test data of the 3dB 90-degree power divider in, it shows good input and output return loss performance, small insertion loss of radio frequency signal transmission, excellent phase balance, and Figure 5 the die soldering boss is specifically marked in, and the area is much larger than the chip area. The chip area is 0.75mm*1.63mm. Through Figure 6-8 the test results of the 30W 1-2GHz solid-state power amplifier based on the 3dB 90-degree power divider can be seen, showing that the amplifier has achieved high linear gain and 30W saturated output.
[0033] In use, first, by adopting a 50W die, it is ensured that the output power of the amplifier circuit can be stabilized above 30W. Then, the 50W die is assembled on an integrated boss to achieve rapid heat dissipation of the 50W die. Immediately afterwards, broadband passive matching is carried out before and after the 50W die. The specific matching method is a hybrid matching of microstrip and lumped elements (R / L / C). The size of the matching circuit is reduced by lumped elements. A broadband 3dB 90-degree hybrid coupler is added before the input matching and after the output matching. The excellent return loss characteristics of the broadband 3dB 90-degree hybrid coupler are used to improve the input and output return loss performance of the power amplifier module, so that the cascading of two-stage amplifiers does not affect the performance of a single-stage amplifier, achieving a very good cascading effect. At the same time, because the introduced insertion loss is very small, broadband matching and 30W saturated output under the cascading of two-stage amplifiers are achieved. Moreover, this amplifier is not damaged during long-term testing with an antenna connected outdoors, thus solving the heat dissipation problem at high power and the easy connection problem under broadband matching.
[0034] The standard parts used in this application document can all be purchased from the market, and can also be customized according to the description in the specification and drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts, and equipment all adopt conventional models in the prior art. The control method is automatically controlled by a controller. The control circuit of the controller can be realized by simple programming by those skilled in the art, which belongs to the common general knowledge in this field. And this application document is mainly used to protect mechanical devices, so the control method and circuit connection will not be explained in detail in this application document.
[0035] Although the present utility model has been disclosed above with a preferred embodiment, it is not intended to limit the present utility model. Those with ordinary knowledge in the technical field to which the present utility model belongs can make various modifications and refinements without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to that defined by the claims.
Claims
1. A new solid-state power amplifier, comprising a broadband 3dB 90-degree bridge, a 50W die, and an oxygen-free copper substrate, characterized in that: The broadband 3dB 90-degree bridge is located before the input matching and after the output matching of the power amplifier, and the excellent echo characteristics of the broadband 3dB 90-degree bridge are used to improve the input and output echo performance of the power amplifier module. The power amplifier tube core adopts a 50W tube core, and the 50W tube core is used to ensure that the output power of the amplifier circuit can be stabilized at more than 30W. The input and output of the 50W tube core both adopt broadband passive matching, and mainly use microstrip lines and lumped components. The lumped components are high-precision RF inductors, RF capacitors and resistors.
2. The novel solid-state power amplifier according to claim 1, characterized in that: An integrated boss is provided on the oxygen-free copper carrier, and the 50W tube core is assembled on the integrated boss.
3. The novel solid-state power amplifier as claimed in claim 1, characterized in that: A circuit board is mounted on the surface of the oxygen-free copper carrier board, and the oxygen-free copper carrier board is used for heat dissipation of the circuit board and the 50W tube core.
4. The novel solid-state power amplifier as claimed in claim 1, characterized in that: The 50W tube core is assembled by welding process, the welding material of the 50W tube core is tin-gold alloy foil, and the eutectic process is used.