Plastic processing injection mold with efficient cooling function

Abstract

The utility model relates to an injection mold, in particular to a plastic processing injection mold with an efficient cooling function, which comprises a rack, a mounting plate, a static mold, a first air guide pipe, a hydraulic cylinder, a movable mold and the like, the lower part of the rack is connected with the mounting plate, the top of the mounting plate is connected with the static mold, the first air guide pipe is connected in the static mold, and the rack is connected with the hydraulic cylinder. And a movable mold is connected to a telescopic rod of the hydraulic cylinder. According to the injection mold, injection molding liquid can be heated through the heater, injection molding is conducted on an injection molding part, cold air is injected into the second air guide pipe and the first air guide pipe through the cold air pump, the static mold and the movable mold are cooled, the injection molding part is solidified, the static mold can be cooled through the semiconductor cooler, and the cooling efficiency of the static mold is improved; and the injection-molded part can be solidified more quickly.

Description

Technical Field

[0001] The utility model relates to an injection mold, in particular to a plastic processing injection mold with an efficient cooling function. Background Art

[0002] With the wide application of plastic products in various industries, the demand for plastic processing injection molds is increasing day by day. The plastic processing process is a delicate technology, in which temperature control plays a crucial role. The reasonable adjustment of temperature directly affects the molding quality of plastic products.

[0003] The injection mold is composed of a stationary mold and a moving mold. The injection liquid is injected between the stationary mold and the moving mold for injection molding. There are air guide grooves on both the stationary mold and the moving mold. Cold air is injected into the air guide grooves to cool the stationary mold and the moving mold, so that the injection molded part solidifies. The injection temperature is very high, and it is difficult to cool only by cold air, and it takes a long time for the injection molded part to solidify. Summary of the Utility Model

[0004] In order to overcome the disadvantages that the injection temperature is very high, it is difficult to cool only by cold air, and it takes a long time for the injection molded part to solidify, the utility model provides a plastic processing injection mold with an efficient cooling function.

[0005] Technical Solution: A plastic processing injection mold with an efficient cooling function includes a frame, a mounting plate, a stationary mold, a first air duct, a hydraulic cylinder, a moving mold, a second air duct, a heater, a cold air pump and a cooling mechanism. The lower part of the frame is connected with a mounting plate, the top of the mounting plate is connected with a stationary mold, the first air duct is connected inside the stationary mold, the hydraulic cylinder is connected to the frame, the telescopic rod of the hydraulic cylinder is connected with a moving mold, the second air duct is connected inside the moving mold, and the second air duct will be butted with the first air duct when moving downward. A heater is connected inside the moving mold, a cold air pump is connected to the top of the moving mold, and the air outlet end of the cold air pump is connected to the upper end of the second air duct. The mounting plate is provided with a cooling mechanism for cooling the stationary mold and the moving mold.

[0006] Furthermore, the cooling mechanism includes a semiconductor refrigerator and a plugging component. An accommodation opening is opened at the bottom of the mounting plate, and a semiconductor refrigerator is slidably connected to the bottom of the mounting plate. The semiconductor refrigerator can pass through the accommodation opening and contact the bottom of the stationary mold. The mounting plate is provided with a plugging component for sealing the accommodation opening.

[0007] Furthermore, the plugging component includes a mounting frame, an electric push rod, a connecting plate, a plugging plate, a sliding shaft and a pushing rail. The mounting frame is connected to the bottom of the mounting plate, the electric push rod is connected to the bottom of the mounting frame, the telescopic rod of the electric push rod is connected with a connecting plate, the connecting plate is connected with a plugging plate for sealing the accommodation opening, sliding shafts are connected to both the left and right sides of the semiconductor refrigerator, and pushing rails are connected to both the left and right sides of the plugging plate. The sliding shafts are located inside the pushing rails.

[0008] Further, it further includes a moving plate, a moving frame and a pushing plate. Moving plates are connected to both the left and right sides of the moving mold. Moving frames are slidably connected to the moving plates. The moving frames slidably penetrate through the mounting plate and the bottom of the stationary mold. A pushing plate is commonly connected to the tops of the two moving frames. A receiving groove for accommodating the pushing plate is formed in the inner bottom of the stationary mold. When the pushing plate moves downward, it will enter the receiving groove.

[0009] Further, it further includes a positioning rod. A positioning groove is formed in the top of the stationary mold. A positioning rod is connected to the bottom of the moving mold. When the positioning rod moves downward, it will enter the positioning groove.

[0010] Further, the rear part of the pushing rail slopes upward.

[0011] Compared with the prior art, the present utility model has the following advantages: The present utility model can heat the injection liquid through the heater to perform injection molding on the injection molded part. The cold air pump injects cold air into the second air duct and the first air duct to cool the stationary mold and the moving mold, so that the injection molded part solidifies. The semiconductor cooler can cool the stationary mold, improve the cooling efficiency of the stationary mold, and enable the injection molded part to solidify faster. Description of the Drawings

[0012] Figure 1 It is a three-dimensional structural schematic diagram of the present utility model.

[0013] Figure 2 It is a cross-sectional view of the stationary mold of the present utility model.

[0014] Figure 3 It is a cross-sectional view of the moving mold of the present utility model.

[0015] Figure 4 It is a docking state diagram of the second air duct and the first air duct of the present utility model.

[0016] Figure 5 It is a three-dimensional structural schematic diagram of the cooling mechanism of the present utility model.

[0017] Figure 6 It is a three-dimensional structural schematic diagram of the receiving opening, the moving plate and the moving frame of the present utility model.

[0018] Figure 7 It is a three-dimensional structural schematic diagram of the moving frame and the pushing plate of the present utility model.

[0019] Figure 8 It is a three-dimensional structural schematic diagram of the receiving groove of the present utility model.

[0020] Names and serial numbers of components in the figure: 1. Frame, 2. Mounting plate, 3. Stationary mold, 4. First air duct, 5. Hydraulic cylinder, 6. Moving mold, 7. Second air duct, 8. Heater, 9. Cold air pump, 10. Accommodating opening, 11. Semiconductor refrigerator, 12. Mounting frame, 13. Electric push rod, 14. Connecting plate, 15. Sealing plate, 151. Slide shaft, 152. Pushing rail, 16. Moving plate, 17. Moving frame, 18. Pushing plate, 19. Accommodating groove, 20. Positioning groove, 21. Positioning rod. Detailed implementation manners

[0021] The embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

[0022] As Figures 1-6 shown, a plastic processing injection mold with an efficient cooling function includes a frame 1, a mounting plate 2, a stationary mold 3, a first air duct 4, a hydraulic cylinder 5, a moving mold 6, a second air duct 7, a heater 8, a cold air pump 9 and a cooling mechanism. The lower part of the frame 1 is connected with the mounting plate 2, the top of the mounting plate 2 is connected with the stationary mold 3, the first air duct 4 is connected inside the stationary mold 3, the middle of the top of the frame 1 is connected with the hydraulic cylinder 5, the lower end of the telescopic rod of the hydraulic cylinder 5 is connected with the moving mold 6, the upper part inside the moving mold 6 is connected with the second air duct 7, and when the second air duct 7 moves downward, it will be docked with the first air duct 4. The lower part inside the moving mold 6 is connected with the heater 8, the right side of the top of the moving mold 6 is connected with the cold air pump 9, the air outlet end of the cold air pump 9 is connected with the upper end of the second air duct 7, and the mounting plate 2 is provided with a cooling mechanism for cooling the stationary mold 3 and the moving mold 6.

[0023] As Figure 5 and Figure 6 shown, the cooling mechanism includes a semiconductor refrigerator 11 and a sealing component. An accommodating opening 10 is formed in the middle of the bottom of the mounting plate 2. A semiconductor refrigerator 11 is slidably connected to the middle of the bottom of the mounting plate 2. The semiconductor refrigerator 11 can pass through the accommodating opening 10 and contact the bottom of the stationary mold 3. The mounting plate 2 is provided with a sealing component for sealing the accommodating opening 10.

[0024] As Figure 5 shown, the sealing component includes a mounting frame 12, an electric push rod 13, a connecting plate 14, a sealing plate 15, a slide shaft 151 and a pushing rail 152. The mounting frame 12 is connected to the rear side of the bottom of the mounting plate 2. The electric push rod 13 is connected to the bottom of the mounting frame 12. The front end of the telescopic rod of the electric push rod 13 is connected with the connecting plate 14. The upper part of the rear side of the connecting plate 14 is connected with the sealing plate 15. The top of the sealing plate 15 contacts the bottom of the mounting plate 2. Slide shafts 151 are connected to both the left and right sides of the semiconductor refrigerator 11. Pushing rails 152 are connected to both the left and right sides of the sealing plate 15. The slide shafts 151 are located inside the pushing rails 152, and the rear part of the pushing rails 152 is inclined upward.

[0025] As Figure 1 、Figure 6 , Figure 7 and Figure 8 As shown in Figure 6 , Figure 7 and Figure 8 , it further includes a moving plate 16, a moving frame 17 and a pushing plate 18. Moving plates 16 are connected to both the left and right sides of the moving mold 6. Moving frames 17 are slidably connected to the sides of the two moving plates 16 that are close to each other. The moving frames 17 slidably penetrate through the bottom of the mounting plate 2 and the stationary mold 3. The tops of the two moving frames 17 are commonly connected to a pushing plate 18. A receiving groove 19 is formed in the inner bottom of the stationary mold 3. When the pushing plate 18 moves downward, it will enter the receiving groove 19.

[0026] As Figure 1 shown in Figure 1 , it further includes positioning rods 21. Positioning grooves 20 are symmetrically formed in the front and back on both the left and right sides of the top of the stationary mold 3. Positioning rods 21 are symmetrically connected to the front and back on both the left and right sides of the bottom of the moving mold 6. When the positioning rods 21 move downward, they will enter the positioning grooves 20.

[0027] The staff controls the telescopic rod of the hydraulic cylinder 5 to extend, driving the moving die 6, the second air duct 7, the moving plate 16 and the positioning rod 21 to move downward. The moving die 6 moves downward to be clamped with the stationary die 3. When the positioning rod 21 moves downward, it will enter the positioning groove 20 to position the moving die 6, enabling the moving die 6 and the stationary die 3 to be clamped smoothly. The second air duct 7 moves downward and will be butted against the first air duct 4. The moving plate 16 moves downward and no longer supports the moving frame 17 and the ejector plate 18. The moving frame 17 and the ejector plate 18 move downward under the action of their own gravity. When the ejector plate 18 moves downward, it will enter the receiving groove 19. After the moving die 6 and the stationary die 3 are clamped, the injection liquid is injected between the moving die 6 and the stationary die 3. The heater 8 heats the injection liquid to inject and form the injection molded part. The sealing plate 15 seals the receiving opening 10 to prevent heat loss from the stationary die 3. After the injection molded part is formed, the heater 8 is turned off, and then the cold air pump 9 is started. The cold air pump 9 injects cold air into the second air duct 7 and the first air duct 4. Subsequently, the cold air is discharged through the first air duct 4. The cold air can cool the stationary die 3 and the moving die 6 to solidify the injection molded part. Control the telescopic rod of the electric push rod 13 to extend, driving the connecting plate 14 and the sealing plate 15 to move forward. The sealing plate 15 no longer seals the receiving opening 10. When the sealing plate 15 moves forward, it can drive the push rail 152 to move forward. When the inclined part at the rear of the push rail 152 contacts the sliding shaft 151, the push rail 152 will push the sliding shaft 151 to move upward. The sliding shaft 151 drives the semiconductor cooler 11 to move upward. The semiconductor cooler 11 passes through the receiving opening 10 and contacts the bottom of the stationary die 3. The semiconductor cooler 11 can cool the stationary die 3 to improve the cooling efficiency of the stationary die 3 and enable the injection molded part to solidify faster. After the injection molded part solidifies, control the telescopic rod of the hydraulic cylinder 5 to shorten, driving the moving die 6, the second air duct 7, the moving plate 16 and the positioning rod 21 to move upward. The moving die 6 and the stationary die 3 are separated from contact. The second air duct 7 and the first air duct 4 are separated. The positioning rod 21 is removed from the positioning groove 20. The moving plate 16 moves upward and drives the moving frame 17 and the ejector plate 18 to move upward. The ejector plate 18 is removed from the receiving groove 19. Then the ejector plate 18 ejects the injection molded part, facilitating the staff to take the injection molded part.

[0028] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A plastic processing injection mold with efficient cooling function, characterized in that: The invention comprises a frame (1), a mounting plate (2), a static mold (3), a first air guide pipe (4), a hydraulic cylinder (5), a dynamic mold (6), a second air guide pipe (7), a heater (8), a cold air pump (9) and a cooling mechanism. The lower part of the frame (1) is connected to the mounting plate (2), the top of the mounting plate (2) is connected to the static mold (3), the static mold (3) is connected to the first air guide pipe (4), the frame (1) is connected to the hydraulic cylinder (5), the telescopic rod of the hydraulic cylinder (5) is connected to the dynamic mold (6), the dynamic mold (6) is connected to the second air guide pipe (7), the second air guide pipe (7) moves downward and docks with the first air guide pipe (4), the dynamic mold (6) is connected to the heater (8), the top of the dynamic mold (6) is connected to the cold air pump (9), the air outlet end of the cold air pump (9) is connected to the upper end of the second air guide pipe (7), and the mounting plate (2) is provided with a cooling mechanism for cooling the static mold (3) and the dynamic mold (6).

2. A plastic processing injection mold with efficient cooling function as claimed in claim 1, characterized in that: The cooling mechanism comprises a semiconductor refrigerator (11) and a sealing component. A receiving opening (10) is provided at the bottom of the mounting plate (2). The semiconductor refrigerator (11) is slidably connected to the bottom of the mounting plate (2). The semiconductor refrigerator (11) can pass through the receiving opening (10) and contact the bottom of the static mold (3). The mounting plate (2) is provided with a sealing component for sealing the receiving opening (10).

3. A plastic processing injection mold with efficient cooling function as claimed in claim 2, characterized in that: The blocking component comprises a mounting frame (12), an electric push rod (13), a connecting plate (14), a blocking plate (15), a sliding shaft (151) and a driving rail (152); the mounting frame (12) is connected to the bottom of the mounting plate (2); the electric push rod (13) is connected to the bottom of the mounting frame (12); the connecting plate (14) is connected to the telescopic rod of the electric push rod (13); the connecting plate (14) is connected to the blocking plate (15) for sealing the accommodating opening (10); the sliding shaft (151) is connected to the left and right sides of the semiconductor refrigerator (11); the driving rail (152) is connected to the left and right sides of the blocking plate (15); the sliding shaft (151) is located inside the driving rail (152).

4. A plastic processing injection mold with efficient cooling function as claimed in claim 3, characterized in that: The invention also comprises a movable plate (16), a movable frame (17) and an ejection plate (18). The movable plate (16) is connected to both left and right sides of the movable mold (6). The movable frame (17) is slidably connected to the movable plate (16). The movable frame (17) slides through the mounting plate (2) and the bottom of the static mold (3). The tops of the two movable frames (17) are commonly connected to the ejection plate (18). The bottom of the static mold (3) is provided with a receiving groove (19) for receiving the ejection plate (18). The ejection plate (18) moves downward and enters the receiving groove (19).

5. A plastic processing injection mold with efficient cooling function as claimed in claim 4, characterized in that: It also includes a positioning rod (21), a positioning groove (20) is opened on the top of the static mold (3), and the bottom of the movable mold (6) is connected with the positioning rod (21), and the positioning rod (21) moves downward and enters the positioning groove (20).

6. A plastic processing injection mold with efficient cooling function as claimed in claim 5, characterized in that: The rear portion of the push rail (152) is tilted upward.

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