Glass substrate coating equipment

Abstract

The utility model discloses glass substrate coating equipment, which comprises a deposition chamber, a transfer chamber, a manipulator and a temperature control system, and the transfer chamber and the deposition chamber can be communicated or respectively sealed through a sealing door; the manipulator is arranged in the transfer chamber and is used for transferring the glass substrate between the transfer chamber and the deposition chamber; the temperature control system comprises a compressor, a heat release device, a throttling device and a heat absorption device, the compressor, the heat release device, the throttling device and the heat absorption device are sequentially connected end to end to form a circulating flow channel, and a heat exchange medium flows in the circulating flow channel. The heat absorption device is in heat conduction connection with the transfer chamber, so that heat of the transfer chamber is taken away when the heat exchange medium evaporates and absorbs heat, the transfer chamber is cooled, volatilization of lubricating oil on the manipulator is inhibited, an oil film is prevented from being attached to the inner wall of the transfer chamber, oil film foreign matter is prevented from dripping on a glass substrate, and the yield is increased. The heat release device is in heat conduction connection with the deposition chamber, heat generated during condensation and heat release of the heat exchange medium is supplied to the deposition chamber, and more energy is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of display screen manufacturing, in particular to a coating device for glass substrates. Background Art

[0002] In the manufacturing process of display screens, it is necessary to coat glass substrates, and chemical vapor deposition is a commonly used coating method. As Figure 1 shown, the glass substrate coating device generally includes a first chamber 1' and a plurality of second chambers 2', and the plurality of second chambers 2' are arranged around the first chamber 1'. A vacuum manipulator 3' is arranged in the first chamber 1', and the vacuum manipulator 3' is used to transfer the glass substrate 4', and it can drive the glass substrate 4' to move vertically, move horizontally and rotate around the vertical axis. The inside of the second chamber 2' is a high-temperature environment for realizing the deposition coating of the glass substrate 4'. A door body 5' is arranged between the second chamber 2' and the first chamber 1'. When the door body 5' is opened, the vacuum manipulator 3' puts the glass substrate 4' into the second chamber 2' for coating, or takes out the glass substrate 4' in the second chamber 2'.

[0003] The prior art has the following defects: To ensure the flexible operation of the vacuum manipulator 3', lubricating oil needs to be regularly added to the vacuum manipulator 3'. When the door body 5' between the first chamber 1' and the second chamber 2' is opened, the hot air flow inside it will enter the first chamber 1', resulting in an increase in the temperature inside the first chamber 1'. The vacuum manipulator 3' is in a high-temperature environment, causing the lubricating oil on the vacuum manipulator 3' to volatilize due to the high temperature. Moreover, the heat generated by the friction between the components of the vacuum manipulator 3' will also accelerate the volatilization of the lubricating oil. After the lubricating oil volatilizes, it adheres to the inner wall of the first chamber 1' to form an oil film, and the oil film cannot be automatically cleaned. After being affected by high temperature, it will soften and drip onto the glass substrate 4', contaminating the glass substrate 4', resulting in poor quality of the glass substrate 4', and further reducing the yield rate of the display screen products and increasing the scrapping cost. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a coating device for glass substrates, which can avoid the problem that the glass substrate is contaminated by the dripping of oil film foreign matters, improve the yield rate of display screen products, and is beneficial to reducing energy consumption.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] Provide a coating device for glass substrates, including:

[0007] A deposition chamber;

[0008] A transfer chamber, which can be communicated with the deposition chamber or be sealed separately through a sealed door;

[0009] A manipulator is provided in the transfer chamber. The manipulator is used to transfer a glass substrate between the transfer chamber and the deposition chamber.

[0010] A temperature control system includes a compressor, a heat release device, a throttling device, and a heat absorption device. The compressor, the heat release device, the throttling device, and the heat absorption device are sequentially connected end to end to form a circulation flow path. A heat exchange medium is used to flow in the circulation flow path. The compressor is used to compress the heat exchange medium. The heat release device is used to condense the heat exchange medium from a gas to a liquid. The throttling device is used to reduce the pressure of the heat exchange medium. The heat absorption device is used to evaporate the heat exchange medium from a liquid to a gas. The heat release device is thermally connected to the deposition chamber, and the heat absorption device is thermally connected to the transfer chamber.

[0011] As a preferred solution of the glass substrate coating equipment, the heat release device includes a heat release coil for flowing the heat exchange medium. The heat release coil extends in a curved shape and is thermally connected to the deposition chamber.

[0012] The heat absorption device includes a heat absorption coil for flowing the heat exchange medium. The heat absorption coil extends in a curved shape and is thermally connected to the transfer chamber.

[0013] As a preferred solution of the glass substrate coating equipment, the deposition chamber includes a first bottom plate, and the heat release coil is arranged on the bottom surface of the first bottom plate.

[0014] The transfer chamber includes a second bottom plate, and the heat absorption coil is arranged on the outer bottom surface of the second bottom plate.

[0015] As a preferred solution of the glass substrate coating equipment, the heat release coil is spirally wound outward from the center of the first bottom plate, and the heat exchange medium in the heat release coil flows from the center of the first bottom plate to the outside.

[0016] As a preferred solution of the glass substrate coating equipment, the heat absorption coil is spirally wound outward from the center of the second bottom plate, and the heat exchange medium in the heat absorption coil flows from the edge of the second bottom plate to the center of the second bottom plate.

[0017] As a preferred solution of the glass substrate coating equipment, it further includes a first thermal conductive adhesive layer and a second thermal conductive adhesive layer.

[0018] The heat release coil is bonded to the first bottom plate through the first thermal conductive adhesive layer.

[0019] The heat absorption coil is bonded to the second bottom plate through the second thermal conductive adhesive layer.

[0020] As a preferred solution for the glass substrate coating equipment, an inlet / outlet for passing the glass substrate is provided in the transfer chamber, and the transfer chamber is communicated with the deposition chamber through the inlet / outlet;

[0021] A surrounding baffle is convexly provided on the inner wall of the transfer chamber towards the inside of the transfer chamber, and the surrounding baffle is arranged around the periphery of the inlet / outlet.

[0022] As a preferred solution for the glass substrate coating equipment, the surrounding baffle includes a top baffle and two side baffles. The top baffle is arranged at the top of the inlet / outlet, and the two side baffles are respectively arranged on both sides of the inlet / outlet.

[0023] As a preferred solution for the glass substrate coating equipment, the distal ends of the top baffle and the side baffles both bend and extend in a direction away from the inlet / outlet.

[0024] As a preferred solution for the glass substrate coating equipment, a plurality of deposition chambers are provided, and the plurality of deposition chambers are arranged around the transfer chamber. The heat release device is thermally connected to at least one of the deposition chambers.

[0025] The beneficial effects of the present utility model are as follows: When the temperature control system works, the heat exchange medium flows in the circulation channel formed by the compressor, the heat release device, the throttling device and the heat absorption device. When flowing through the heat release device, the heat release device condenses the heat exchange medium from a gas to a liquid, and heat is released during the condensation process. When flowing through the heat absorption device, the heat absorption device evaporates the heat exchange medium from a liquid to a gas, and heat is absorbed during the evaporation process. By thermally connecting the heat absorption device to the transfer chamber, the heat of the transfer chamber can be taken away when the heat exchange medium evaporates and absorbs heat, so as to cool the transfer chamber, thereby inhibiting the volatilization of the lubricating oil on the manipulator in a high-temperature environment, avoiding the adhesion of oil film foreign matters on the inner wall of the transfer chamber, and further preventing the oil film foreign matters from dripping on the glass substrate and causing defects in the coated glass substrate, thus improving the yield of the display product. By thermally connecting the heat release device to the deposition chamber, the heat generated when the heat exchange medium condenses and releases heat can be supplied to the deposition chamber, which is beneficial to maintaining the high temperature in the deposition chamber, can reduce the power of the equipment used to heat the deposition chamber, and is more energy-saving. Description of the Drawings

[0026] The present utility model will be further described in detail below with reference to the drawings and embodiments.

[0027] Figure 1 It is a schematic structural diagram of an existing glass substrate coating equipment.

[0028] Figure 2 It is a schematic structural diagram of the glass substrate coating equipment provided by the embodiment of the present utility model.

[0029] Figure 3Schematic structural diagram of the temperature control system of the glass substrate coating equipment provided by the embodiment of the present utility model.

[0030] Figure 4 Schematic layout diagram of the heat release coil and the heat absorption coil provided by the embodiment of the present utility model.

[0031] Figure 5 For Figure 4 Partial view in

[0032] Figure 6 Schematic diagram showing that the heat release coil is connected to the deposition chamber through the first thermal conductive adhesive provided by the embodiment of the present utility model.

[0033] Figure 7 Schematic diagram showing that the heat absorption coil is connected to the transfer chamber through the second thermal conductive adhesive provided by the embodiment of the present utility model.

[0034] Figure 8 Schematic structural diagram of the enclosure baffle provided by the embodiment of the present utility model.

[0035] Figure 1 Among them:

[0036] 1′, the first chamber; 2′, the second chamber; 3′, the vacuum manipulator; 4′, the glass substrate; 5′, the door body.

[0037] Figures 2 to 8 Among them:

[0038] 1, deposition chamber; 11, the first bottom plate; 12, the first side plate;

[0039] 2, transfer chamber; 21, the second bottom plate; 22, the second side plate; 221, the inlet and outlet; 23, the enclosure baffle; 231, the top baffle; 232, the side baffle;

[0040] 3, manipulator; 31, the base; 32, the rotating mechanism; 33, the lifting frame; 34, the bearing part;

[0041] 4, temperature control system; 40, the circulation channel; 41, the compressor; 42, the heat release device; 421, the heat release coil; 43, the throttling device; 44, the heat absorption device; 441, the heat absorption coil;

[0042] 5, the first thermal conductive adhesive layer;

[0043] 6, the second thermal conductive adhesive layer;

[0044] 7, transition chamber;

[0045] 8, airtight door;

[0046] 100, glass substrate. Detailed implementation manners

[0047] Advantages, features, and methods for realizing the same of the present utility model will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present utility model is not limited to the embodiments disclosed below, but can be implemented in various different forms. The provision of these embodiments is merely to complete the disclosure of the present utility model and enable those skilled in the art to fully understand the scope of the present utility model, and the present utility model is only defined by the scope of the claims. The same reference numerals denote the same components throughout the specification.

[0048] Hereinafter, the present utility model will be described in detail with reference to the accompanying drawings.

[0049] As Figure 2 shown, the glass substrate coating equipment provided by the embodiment of the present utility model includes a deposition chamber 1, a transfer chamber 2, and a manipulator 3. A sealed door 8 is provided between the transfer chamber 2 and the deposition chamber 1. When the sealed door 8 is opened, the transfer chamber 2 and the deposition chamber 1 are in communication with each other. When the sealed door 8 is closed, the transfer chamber 2 and the deposition chamber 1 are each sealed. The manipulator 3 is disposed in the transfer chamber 2 and is used to transfer the glass substrate 100 between the transfer chamber 2 and the deposition chamber 1, transfer the glass substrate 100 into the deposition chamber 1 for coating, or take out the glass substrate 100 that has been coated in the deposition chamber 1. Specifically, the manipulator 3 includes a base 31, a rotating mechanism 32, a lifting frame 33, and a carrying portion 34. The base 31 is fixedly disposed in the transfer chamber 2. The rotating mechanism 32 is rotatably disposed on the base 31 about a vertical axis. The lifting frame 33 is movably disposed on the rotating mechanism 32 in the vertical direction. The carrying portion 34 is movably disposed on the lifting frame 33 in the horizontal direction. The carrying portion 34 is used to carry the glass substrate 100, for example, a fork plate, which can fork the glass substrate 100. The lifting frame 33 is exemplarily a structure that can be telescoped in the horizontal direction to realize the horizontal movement of the carrying portion 34.

[0050] When the glass substrate 100 is being coated in the deposition chamber 1, the sealed door 8 is in the closed state to cut off the communication between the deposition chamber 1 and the transfer chamber 2, so as to keep a vacuum environment in the deposition chamber 1. When the sealed door 8 is opened, the manipulator 3 can transfer the glass substrate 100 between the deposition chamber 1 and the transfer chamber 2. After the sealed door 8 is opened, the high-temperature gas flow in the deposition chamber 1 diffuses into the transfer chamber 2, causing the transfer chamber 2 to be at a high temperature, resulting in the volatilization of the lubricating oil on the manipulator 3, and then adhering to the inner wall of the transfer chamber 2 to form an oil film. The friction generated during the relative movement of the components of the manipulator 3 will also accelerate the volatilization of the lubricating oil. The oil film is softened by the high temperature and is likely to drip onto the glass substrate 100, causing contamination of the glass substrate 100 and reducing the yield.

[0051] To solve the above problems, the glass substrate coating equipment provided by this embodiment further includes a temperature control system 4. See Figure 2 andFigure 3 , the temperature control system 4 includes a compressor 41, a heat release device 42, a throttling device 43, and a heat absorption device 44. The compressor 41, the heat release device 42, the throttling device 43, and the heat absorption device 44 are connected end to end in sequence to form a circulation channel 40, and a heat exchange medium is used to flow in the circulation channel 40. The heat exchange medium flows through the compressor 41, the heat release device 42, the throttling device 43, and the heat absorption device 44 in sequence, and then returns to the compressor 41 to achieve circular flow.

[0052] The compressor 41 is used to compress the heat exchange medium, increase the temperature and pressure of the heat exchange medium, and convert the heat exchange medium into a high-temperature and high-pressure gas. The heat exchange medium in the form of a high-temperature and high-pressure gas then passes through the heat release device 42, and the heat release device 42 condenses the heat exchange medium from a gas to a liquid. The temperature of the heat exchange medium decreases and is converted into a low-temperature and high-pressure liquid. Then it flows through the throttling device 43, and the throttling device 43 is used to reduce the pressure of the heat exchange medium. The heat exchange medium flowing through the throttling device 43 is converted into a low-temperature and low-pressure liquid. The heat exchange medium in the form of a low-temperature and low-pressure liquid continues to flow and reaches the heat absorption device 44. The heat absorption device 44 is used to evaporate the heat exchange medium from a liquid to a gas, and then the heat exchange medium returns to the compressor 41, is re-converted into a high-temperature and high-pressure gas form, and enters the next cycle.

[0053] Furthermore, the heat exchange medium can be dichlorofluoromethane, tetrafluoroethane, etc.

[0054] Specifically, the heat release device 42 is thermally connected to the deposition chamber 1 to achieve heat transfer between the heat release device 42 and the deposition chamber 1. The heat absorption device 44 is thermally connected to the transfer chamber 2 to achieve heat transfer between the heat absorption device 44 and the transfer chamber 2.

[0055] In the glass substrate coating equipment provided in this embodiment, when the temperature control system 4 works, the heat exchange medium flows in the circulation channel 40 formed by the compressor 41, the heat release device 42, the throttling device 43, and the heat absorption device 44. When flowing through the heat release device 42, the heat release device 42 condenses the heat exchange medium from a gas to a liquid, and heat is released during the condensation process. When flowing through the heat absorption device 44, the heat absorption device 44 evaporates the heat exchange medium from a liquid to a gas, and heat is absorbed during the evaporation process. By thermally connecting the heat absorption device 44 to the transfer chamber 2, the heat of the transfer chamber 2 can be taken away when the heat exchange medium evaporates and absorbs heat, cooling the transfer chamber 2, thereby inhibiting the volatilization of the lubricating oil on the manipulator 3 in a high-temperature environment, avoiding the adhesion of oil film foreign matters on the inner wall of the transfer chamber 2, and further preventing the oil film foreign matters from dripping on the glass substrate 100, resulting in poor quality of the coated glass substrate 100, and improving the yield rate of the display product. By thermally connecting the heat release device 42 to the deposition chamber 1, the heat generated when the heat exchange medium condenses and releases heat can be supplied to the deposition chamber 1, which is beneficial to maintaining the high temperature in the deposition chamber 1, can reduce the power of the equipment used to heat the deposition chamber 1, and is more energy-efficient.

[0056] See Figure 4 and Figure 5 In this embodiment, the heat release device 42 includes a heat release coil 421 for flowing a heat exchange medium. The heat release coil 421 extends in a curved shape and is thermally connected to the deposition chamber 1. The curved heat release coil 421 can increase the flow path of the heat exchange medium, thereby increasing the contact area and contact time between the heat exchange medium and the deposition chamber 1, providing as much heat as possible for the deposition chamber 1, and improving the heat utilization rate.

[0057] The heat absorption device 44 includes a heat absorption coil 441 for flowing a heat exchange medium. The heat absorption coil 441 extends in a curved shape and is thermally connected to the transfer chamber 2. The curved heat absorption coil 441 can increase the flow path of the heat exchange medium, thereby increasing the contact area and contact time between the heat exchange medium and the transfer chamber 2, improving the cooling effect on the transfer chamber 2, and preventing the lubricating oil on the manipulator 3 from volatilizing due to excessive temperature in the transfer chamber 2.

[0058] In this embodiment, the heat release device 42 is a condenser, and the heat absorption device 44 is an evaporator. Further, the throttling device 43 is an expansion valve, and the condenser, evaporator, compressor 41, and expansion valve form a heat pump system.

[0059] The capillary of the expansion valve extends in a spiral shape, with a diameter between 0.5 mm and 2.2 mm and a length between 5 m and 10 m. The compressor 41 outputs a high-temperature and high-pressure gas heat exchange medium. When the heat exchange medium flows through the heat release coil 421 of the heat release device 42, it condenses and releases heat, converting into a high-pressure and low-temperature liquid heat exchange medium. That is, the inlet end of the capillary of the expansion valve is a high-pressure and low-temperature liquid heat exchange medium. The high-pressure and low-temperature liquid heat exchange medium can be effectively depressurized after flowing through the capillary of the expansion valve, ensuring that it is converted into a low-pressure and low-temperature liquid form of the heat exchange medium. The boiling point of the low-pressure and low-temperature liquid form of the heat exchange medium is reduced, facilitating the evaporation of the heat exchange medium by the evaporator.

[0060] As Figure 6 shown, the deposition chamber 1 includes a first bottom plate 11, a first top plate (not shown in the figure), and a plurality of first side plates 12. The first bottom plate 11, the first top plate, and the plurality of first side plates 12 enclose an internal cavity of the deposition chamber 1. The heat release coil 421 is disposed on the bottom surface of the first bottom plate 11. Usually, heating wires are provided on the outer walls of the plurality of first side plates 12 of the deposition chamber 1. After the heating wires are energized, they are used to heat the deposition chamber 1 to maintain a high-temperature environment in the deposition chamber 1, for example, maintained at 350 degrees Celsius. Disposing the heat release coil 421 on the bottom surface of the first bottom plate 11 can avoid interference with the heating wires outside the first side plates 12 of the deposition chamber 1, and at the same time can improve the heating uniformity of the deposition chamber 1. The heating wires and the heat release coil 421 work together to heat the deposition chamber 1 on the bottom surface and multiple sides.

[0061] Further, there are four first side plates 12. The first bottom plate 11, the first top plate, and the four first side plates 12 enclose a deposition chamber 1 in the shape of an approximate cuboid.

[0062] Refer to Figure 7 , the transfer chamber 2 includes a second bottom plate 21, a second top plate (not shown in the figure), and a plurality of second side plates 22. The second bottom plate 21, the second top plate, and the plurality of second side plates 22 enclose an internal cavity of the transfer chamber 2. The manipulator 3 is disposed on the bottom wall inside the transfer chamber 2, that is, on the second bottom plate 21. The heat absorption coil 441 is disposed on the outer bottom surface of the transfer chamber 2, that is, on the outer bottom surface of the second bottom plate 21. On the one hand, the heat absorption coil 441 helps to cool the manipulator 3 disposed on the second bottom plate 21 and inhibits the evaporation of the lubricating oil on the manipulator 3. On the other hand, the second side plate 22 of the transfer chamber 2 is close to the deposition chamber 1. The heat absorption coil 441 is disposed on the bottom surface of the second bottom plate 21 instead of on the second side plate 22 to prevent affecting the temperature of the deposition chamber 1 and avoid the temperature on the side of the deposition chamber 1 close to the transfer chamber 2 being too low, resulting in uneven temperature in the coating environment.

[0063] Further, there are six second side plates 22. The second bottom plate 21, the second top plate, and the six second side plates 22 enclose a deposition chamber 1 in the shape of a hexagonal prism.

[0064] See Figure 5 , in some embodiments, the heat release coil 421 is spirally wound outward from the center of the first bottom plate 11. The heat exchange medium in the heat release coil 421 flows from the center of the first bottom plate 11 outward. The flow direction of the heat exchange medium in the heat release coil 421 is as shown by the arrow in Figure 5 . The spirally wound heat release coil 421 can make the heating of the deposition chamber 1 more uniform. Since the heating wire is wound outside the side wall of the deposition chamber 1, the edge of the deposition chamber 1 has a higher temperature than the middle part. Since the heat exchange medium flows from the center of the first bottom plate 11 outward, it can timely heat the middle part of the deposition chamber 1 and supplement heat to the relatively cooler middle part in time, improving the temperature uniformity in the entire deposition chamber 1 and making the heat utilization of the heat release coil 421 more reasonable.

[0065] Further, the heat absorption coil 441 is spirally wound outward from the center of the second bottom plate 21. The heat exchange medium in the heat absorption coil 441 flows from the edge of the second bottom plate 21 to the center of the second bottom plate 21. The flow direction of the heat exchange medium in the heat absorption coil 441 is as shown by the arrow in Figure 5As shown by the arrow in the figure. The spirally wound heat absorption coil 441 can improve the temperature uniformity of the transfer chamber 2. Since the edge of the transfer chamber 2 is closer to the deposition chamber 1, affected by the high temperature of the deposition chamber 1, the temperature at the edge of the transfer chamber 2 is higher than that at the middle part. Since the heat exchange medium flows from the edge of the second bottom plate 21 to the center of the second bottom plate 21, it can timely take away the heat in the edge area of the transfer chamber 2, quickly cool down the position of the second side plate 22 close to the deposition chamber 1, and avoid too high temperature at the edge of the transfer chamber 2. When there is a trace of oil film attached to the inner wall of the second side plate 22, it can prevent the oil film from being softened by high temperature and dripping.

[0066] As Figure 6 shown, in some embodiments, the heat release coil 421 is bonded to the first bottom plate 11 through the first thermal conductive adhesive layer 5. On the one hand, it can improve the connection strength between the heat release coil 421 and the deposition chamber 1, and on the other hand, it can improve the heat conduction effect between the heat release coil 421 and the deposition chamber 1, reduce the loss when transferring heat between the two, and improve the heat utilization rate of the heat release coil 421.

[0067] As Figure 7 shown, in some embodiments, the heat absorption coil 441 is bonded to the second bottom plate 21 through the second thermal conductive adhesive layer 6. On the one hand, it can improve the connection strength between the heat absorption coil 441 and the transfer chamber 2, and on the other hand, it can improve the heat conduction effect between the heat absorption coil 441 and the transfer chamber 2, so that the heat absorption coil 441 can take away more heat from the transfer chamber 2.

[0068] Refer to Figure 8 , the transfer chamber 2 is provided with an inlet / outlet 221 for passing the glass substrate 100. The transfer chamber 2 is communicated with the deposition chamber 1 through the inlet / outlet 221. When they are communicated, the glass substrate 100 passes through the inlet / outlet 221 along the Figure 8 direction shown by the arrow in the figure. Specifically, the deposition chamber 1 is provided with a through-hole for passing the glass substrate 100. A communication channel is arranged between the through-hole and the inlet / outlet 221. The sealing door 8 is arranged in the communication channel or at the inlet / outlet 221 or at the through-hole, as long as the blocking and communication between the deposition chamber 1 and the transfer chamber 2 can be realized. Specifically, the inlet / outlet 221 is arranged on the second side plate 22 of the transfer chamber 2.

[0069] Optionally, the inner wall of the transfer chamber 2 protrudes inwardly into the transfer chamber 2 to form a surrounding baffle 23, and the surrounding baffle 23 surrounds the outer periphery of the inlet / outlet 221. Even if the oil film on the inner wall of the second side plate 22 is softened and drips, due to the existence of the surrounding baffle 23, when the glass substrate 100 passes through the inlet / outlet 221, it can block the oil film from directly dripping or splashing on the glass substrate 100, further ensuring that the glass substrate 100 is not contaminated.

[0070] Specifically, the enclosing baffle 23 includes a top baffle 231 and two side baffles 232. The top baffle 231 is disposed at the top of the inlet / outlet 221 and is used to receive the oil film dripping from above the inlet / outlet 221, preventing the oil film from directly dripping downward onto the glass substrate 100. The two side baffles 232 are respectively disposed on the left and right sides of the inlet / outlet 221, playing a protective role on the left and right sides of the glass substrate 100 respectively to prevent oil film foreign matters from splashing onto the glass substrate 100 from the side.

[0071] Further, the proximal ends of the top baffle 231 and the side baffles 232 are both connected to the inner wall of the transfer chamber 2, that is, to the inner wall of the second side plate 22. The distal ends of the top baffle 231 and the side baffles 232 both bend and extend in a direction away from the inlet / outlet 221. The top baffle 231 and the side baffles 232 form a structure similar to a flared opening, expanding the opening range to facilitate the passage of the glass substrate 100. Moreover, the top baffle 231 tilts upward. When there are oil film foreign matters on the side of the top baffle 231 facing away from the inlet / outlet 221, the oil film foreign matters will not drip onto the glass substrate 100 along the top baffle 231, improving the protection effect.

[0072] In this embodiment, referring to Figure 2 , there are multiple deposition chambers 1, and the multiple deposition chambers 1 are arranged around the transfer chamber 2. The heat release device 42 is thermally connected to at least one deposition chamber 1. At least one means one or more. In some embodiments, the heat release device 42 is thermally connected to one of the deposition chambers 1. Specifically, referring to Figure 4 , only a heat release coil 421 is provided at the bottom of one deposition chamber 1. Since the heat generated by the heat release coil 421 is limited, setting it at the bottom of one deposition chamber 1 can avoid excessive heat dispersion, making the generated heat concentratedly provided to this deposition chamber 1 and reducing the power of the device (i.e., the aforementioned heating wire) for heating this deposition chamber 1. In other embodiments, the heat release device 42 is thermally connected to at least two of the deposition chambers 1. When the heat generated by the heat release device 42 is sufficient, heat release coils 421 can be spirally wound around the bottoms of multiple deposition chambers 1 to respectively provide heat to the multiple deposition chambers 1, avoiding heat concentration in one deposition chamber 1 resulting in waste. For example, heat release coils 421 are provided at the bottoms of two of the deposition chambers 1 respectively, or, as shown in Figure 4 , heat release coils 421 are provided at the bottoms of all 5 deposition chambers 1 shown.

[0073] Referring to Figure 2 , the glass substrate coating equipment further includes a transition chamber 7. The transition chamber 7 is used to place the glass substrate 100, and the manipulator 3 can transfer the glass substrate 100 between the transition chamber 7 and the transfer chamber 2.

[0074] Although embodiments of the present utility model have been described above with reference to the accompanying drawings, the present utility model is not limited to the above embodiments, but can be manufactured in various forms, and those skilled in the art will understand that the present utility model can be implemented in other specific forms without changing the technical spirit or basic characteristics of the present utility model. Therefore, it should be understood that the above embodiments are exemplary in all aspects and not restrictive.

Claims

1. Glass substrate coating equipment, characterized in that: include: a deposition chamber; A transfer chamber, which can be connected to the deposition chamber or sealed with a sealed door; A robot arm is disposed in the transfer chamber, and is used to transfer the glass substrate between the transfer chamber and the deposition chamber; The temperature control system includes a compressor, a heat release device, a throttling device and a heat absorption device. The compressor, the heat release device, the throttling device and the heat absorption device are connected end to end in sequence to form a circulation channel, and the circulation channel is used for the flow of heat exchange medium; the compressor is used to compress the heat exchange medium, the heat release device is used to condense the heat exchange medium from gas to liquid, and the throttling device is used to reduce the pressure of the heat exchange medium; the heat absorption device is used to evaporate the heat exchange medium from liquid to gas; the heat release device is thermally connected to the deposition chamber, and the heat absorption device is thermally connected to the transfer chamber.

2. The glass substrate coating equipment according to claim 1, characterized in that: The heat release device comprises a heat release coil for flowing a heat exchange medium, the heat release coil extends in a curved shape and is heat-conductingly connected to the deposition chamber; The heat absorption device comprises a heat absorption coil for flowing heat exchange medium, and the heat absorption coil extends in a curved shape and is heat-conductingly connected to the transfer chamber.

3. The glass substrate coating equipment according to claim 2, characterized in that: The deposition chamber comprises a first bottom plate, and the heat release coil is arranged on the bottom surface of the first bottom plate; The transfer chamber includes a second bottom plate, and the heat absorbing coil is arranged on the outer bottom surface of the second bottom plate.

4. The glass substrate coating equipment according to claim 3, characterized in that: The heat release coil is spirally wound outward from the center of the first bottom plate, and the heat exchange medium in the heat release coil flows outward from the center of the first bottom plate.

5. The glass substrate coating equipment according to claim 3, characterized in that: The heat absorbing coil is spirally wound outward from the center of the second bottom plate, and the heat exchange medium in the heat absorbing coil flows from the edge of the second bottom plate to the center of the second bottom plate.

6. The glass substrate coating equipment according to claim 3, characterized in that: Also includes a first thermally conductive adhesive layer and a second thermally conductive adhesive layer; The heat release coil is bonded to the first bottom plate through the first heat conductive adhesive layer; The heat absorbing coil is bonded to the second bottom plate through the second heat conductive adhesive layer.

7. The glass substrate coating device according to any one of claims 1 to 6, characterized in that: The transfer chamber is provided with an inlet and an outlet for passing the glass substrate, and the transfer chamber is connected with the deposition chamber through the inlet and the outlet; The inner wall of the transfer chamber is provided with a protective baffle protruding toward the interior of the transfer chamber, and the protective baffle is arranged around the outer periphery of the inlet and outlet.

8. The glass substrate coating equipment according to claim 7, characterized in that: The enclosure baffle includes a top baffle and two side baffles, wherein the top baffle is arranged at the top of the inlet and outlet, and the two side baffles are arranged at both sides of the inlet and outlet.

9. The glass substrate coating equipment according to claim 8, characterized in that: The distal ends of the top baffle and the side baffle are both bent and extended in a direction away from the inlet and outlet.

10. The glass substrate coating equipment according to any one of claims 1 to 6, characterized in that: There are multiple deposition chambers, and the multiple deposition chambers are arranged around the transfer chamber. The heat release device is thermally connected to at least one of the deposition chambers.

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