Flexible grounding tool used for three-temperature environment radio frequency device test
By using beryllium bronze shrapnel covered with PI film for flexible grounding connection in RF device testing, the problem of lossless connection in traditional welding grounding methods in three-temperature environment is solved, and the stability and reliability of RF device testing is achieved.
Patent Information
- Application Number
- CN202421702106.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-07-18
AI Technical Summary
In RF device testing, traditional welding grounding testing methods cannot achieve lossless connections in normal temperature and high and low temperature environments, and it is difficult to ensure the stability of RF transmission.
A flexible grounding tool is designed, using beryllium bronze shrapnel covered with PI film to make flexible grounding connection with the chip, grounding is achieved through the extrusion connection of the elastic sheet, and the pallet design ensures stable contact during insertion and removal.
It realizes convenient RF device testing in three-temperature environments, with stable and excellent RF index testing, and reliable connection in high and low temperature environments, avoiding the problem of unstable grounding in traditional methods.
Smart Images
Figure CN223022176U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a flexible grounding tool for testing radio frequency devices in three-temperature environments, and is applied to S parameter testing of microwave radio frequency devices and non-destructive testing parameter evaluation of isoelectric performance. Background Art
[0002] In RF device testing, good grounding is particularly critical to the RF transmission of the device. For the RF transmission and microstrip grounding of chip pins in three environments (-40℃~+125℃) at room temperature and high and low temperature, the traditional solution is mainly welding grounding test, which is contrary to the customer's requirement for lossless connection method. Therefore, the above problem needs to be solved. Summary of the invention
[0003] In view of the above problems, the purpose of the present utility model is to provide a flexible grounding tool for testing radio frequency devices in three temperature environments, which uses springs to perform flexible grounding connection with chips in three environments.
[0004] In order to achieve the above purpose, the solution of the utility model is:
[0005] A flexible grounding tool for testing radio frequency devices in three-temperature environments comprises a test base, wherein the test base is provided with a positioning frame for the radio frequency device under test, and three vertical surfaces of the radio frequency device under test are respectively provided with grounding contact pins, and inner side surfaces of the positioning frame corresponding to the grounding contact pins of the radio frequency device under test are respectively provided with elastic sheets, wherein the elastic sheets are beryllium bronze springs covered with PI films, and when the radio frequency device under test is placed in the positioning frame, the elastic sheets are squeezed and connected to the grounding contact pins.
[0006] The scheme is further as follows: the elastic sheet includes a connecting sheet and an elastic sheet with an upper end of the connecting sheet bent downward in an arc greater than 120 degrees, the elastic sheet is fixed to an adjustment block through the connecting sheet, the adjustment block is fixed in a positioning frame, the elastic sheet of the elastic sheet elastically tilts forward and upward, a support plate is provided in the positioning frame, the support plate is used to locate the placement depth of the RF device under test, the support plate covers the cross-section of the front end of the elastic sheet, so that the extrusion point where the ground contact pin of the RF device under test contacts the elastic sheet is in the middle section of the longitudinal direction of the elastic sheet.
[0007] The beneficial effects of the utility model are as follows: convenient use, stable and excellent radio frequency index testing; reliable connection of the beryllium bronze spring covered with a PI film under high and low temperature environments; the utility model covers the cross-section of the front end of the spring with a support plate, so that the extrusion point where the ground contact pin of the radio frequency device under test contacts the spring is designed in the middle section of the longitudinal direction of the spring, so that when inserting and removing the radio frequency device under test, the ground contact pin and the spring are always in smooth contact, and the spring will not be lifted up when the radio frequency device under test is taken out.
[0008] The utility model is described in detail below in conjunction with the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 It is a schematic diagram of the structure decomposition of the utility model;
[0010] Figure 2 This is a schematic diagram of the structure of the utility model after installation;
[0011] Figure 3 It is a schematic diagram of the utility model being inserted into a radio frequency device under test. DETAILED DESCRIPTION
[0012] A flexible grounding fixture for testing radio frequency devices in three temperature environments, such as Figure 1 , Figure 2 and Figure 3 As shown, the flexible grounding tooling includes a test base 1, the test base is provided with a positioning frame 101 of the RF device under test 2, and the three vertical surfaces of the RF device under test are respectively provided with grounding contact pins 201 (grounding plates), and the inner side surfaces of the positioning frame 101 corresponding to the grounding contact pins 201 of the RF device under test 2 are respectively provided with elastic sheets 3. In order to adapt to the three-temperature environment (normal temperature and high and low temperature environments (-40°C~+125°C)), the elastic sheet 3 adopts a beryllium bronze shrapnel covered with a PI film. The beryllium bronze shrapnel covered with a PI film has good elastic deformation, wear resistance and fatigue resistance. After being covered with the PI film, a complete signal extraction material is formed, wherein PI (polyimide film) has extremely strong high and low temperature resistance and low dielectric constant, making it suitable for application in the test and measurement of semiconductor chips in high frequency and three-temperature environments. When the RF device under test 2 is placed in the positioning frame 101, the elastic sheet 3 is squeezed and connected to the grounding contact pin 201.
[0013] The elastic sheet 3 includes a connecting sheet 301 and an elastic sheet 302 whose upper end is bent downward in an arc greater than 120 degrees. In the automated test, the RF device under test is pressed into the positioning frame 101 and taken out from the positioning frame 101 by the clamping claws. In the embodiment: the elastic sheet 3 is fixed on an adjustment block 4 through the connecting sheet 301, and the adjustment block 4 is fixed in the positioning frame 101. The elastic sheet 302 of the elastic sheet 3 elastically tilts forward and upward. Since the RF device under test and the elastic sheet are in elastic pressure contact, in order to prevent the elastic sheet from being brought out or deformed and damaged during the extraction process, a support plate 102 is provided in the positioning frame 101. The support plate 102 is used to locate the placement depth of the RF device under test 2. At the same time, the support plate 102 covers the section 302-1 at the front end of the elastic sheet 302, so that the extrusion point where the ground contact pin 201 of the RF device under test 2 contacts the elastic sheet 302 is in the middle section of the longitudinal direction of the elastic sheet.
[0014] In the embodiment, a test interface SMA connector 5 is provided on the outer side of the positioning frame 101 corresponding to the ground contact pin 201 .
[0015] In the above-described flexible grounding tooling embodiment for testing radio frequency devices in a three-temperature environment, the beryllium bronze shrapnel covered with PI film provides reliable connection; the design of covering the cross-section at the front end of the shrapnel with a support plate, such that the extrusion point where the grounding contact foot of the radio frequency device under test contacts the shrapnel is in the middle section in the longitudinal direction of the shrapnel, ensures that the contact between the grounding contact foot and the shrapnel is always smooth when inserting and removing the radio frequency device under test, and prevents the phenomenon of lifting the shrapnel when removing the radio frequency device under test.
Claims
1. A flexible grounding tool for testing radio frequency devices in three temperature environments, comprising a test base, the test base is provided with a positioning frame of the radio frequency device under test, and the three vertical surfaces of the radio frequency device under test are respectively provided with grounding contact pins, characterized in that: The inner side surfaces of the positioning frame and the grounding contact pins of the RF device under test are respectively provided with elastic sheets, which are beryllium copper springs covered with PI film. When the RF device under test is placed in the positioning frame, the elastic sheets are squeezed and connected to the grounding contact pins.
2. The flexible grounding tool according to claim 1, characterized in that: The elastic sheet includes a connecting sheet and an elastic sheet with an upper end of the connecting sheet bent downward in an arc greater than 120 degrees. The elastic sheet is fixed on an adjustment block through the connecting sheet. The adjustment block is fixed in a positioning frame. The elastic sheet of the elastic sheet elastically tilts forward and upward. A support plate is provided in the positioning frame. The support plate is used to locate the placement depth of the radio frequency device under test. The support plate covers the cross-section of the front end of the elastic sheet so that the extrusion point where the ground contact pin of the radio frequency device under test contacts the elastic sheet is in the middle section of the longitudinal direction of the elastic sheet.