Probe test assembly and test device

Abstract

The utility model discloses a probe testing assembly and a testing device, and relates to the technical field of chip testing, the probe testing assembly comprises a shell, a piezoelectric part, an insulating part and a probe, one end of the piezoelectric part is movably connected with the shell, and one end of the insulating part is connected with the other end of the piezoelectric part. The probe is connected with the other end of the insulating part, the probe can drive the piezoelectric part to deform through the counter-acting force of the chip to generate the piezoelectric effect when abutting against the chip, the force conduction strain part can be connected with a converter, and the converter can convert the piezoelectric effect generated by the force conduction strain part into electrical parameters for reference of workers. A worker can adaptively control the movement of the probe according to the electrical parameters, so that the probe applies a proper acting force to the chip. Compared with the prior art, the probe device provided by the utility model can accurately adjust the downward pressure of the probe on the chip, and improves the stability of the chip during testing.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and particularly relates to a probe testing component and a testing device. Background Art

[0002] In the research and development and large-scale production processes of semiconductor chips, various performances of the chips need to be tested. During the manufacturing process of the chips, probes are required for testing to ensure that the chip quality meets the production requirements. Specifically, the probes are brought into contact with the designated positions of the chips and good contact is ensured to guarantee the stability and reliability during the power-on test. At the same time, excessive downward pressure of the probes on the chips may damage the chips; if the downward displacement of the probes in contact with the chips is too small, poor contact will lead to unstable testing. Therefore, controlling the downward pressure of the probes pressing against the chips is a key factor.

[0003] The prior art with the publication number CN216434188U discloses a chip testing probe device, which includes a base, a top plate, a lifting plate, and a motor arranged on the base. A lead screw is arranged on the motor, a guide rail is opened on the base, a sliding seat is slidably clamped in the guide rail, a guide ball and a buffer cavity are arranged on the sliding seat, a buffer seat and a buffer spring are arranged in the buffer cavity, an IPT cap rod is arranged on the buffer seat, a chip is arranged on the IPT cap rod, an installation block is arranged on the lifting plate, a locking pin and a probe circuit board are arranged on the installation block, and a test probe is arranged on the probe circuit board. It improves the smoothness and anti-disengagement of the overall movement of the sliding seat and the IPT cap rod with the chip in the guide rail, can effectively buffer and unload the downward pressing force of the chip on the test probe, avoid the situation of the test probe hard pressing against the chip and causing chip damage, and realize the convenient disassembly and replacement of a new set of the probe circuit board and the test probe as a whole, thereby improving the accurate quality of chip testing.

[0004] However, there are still deficiencies in this existing probe device. For example, although it can avoid chip damage through the buffering of the buffer spring, it cannot accurately adjust the downward pressure of the probe on the chip and cannot ensure the stability during chip testing. Summary of the Utility Model

[0005] The purpose of the utility model is to overcome the above technical deficiencies, and propose a probe testing component and a testing device to solve the technical problem that the existing probe device cannot accurately adjust the downward pressure of the probe on the chip and cannot ensure the stability during chip testing.

[0006] To achieve the above technical purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a probe testing component, including:

[0008] A housing;

[0009] A piezoelectric component, one end of which is movably connected to the housing;

[0010] An insulating member, one end of which is connected to the other end of the piezoelectric component; and

[0011] A probe, connected to the other end of the insulating member, which can drive the piezoelectric component to deform to generate a piezoelectric effect through the reaction force of the chip when pressing against the chip.

[0012] In some embodiments, the probe test assembly further includes an elastic member, one end of which is connected to the housing, and the other end of which is connected to the piezoelectric component. When the piezoelectric component deforms, it can drive the elastic member to deform to store elastic force.

[0013] In some embodiments, the probe test assembly further includes a first buffer member located between the two ends of the piezoelectric component. The first buffer member is connected to the piezoelectric component and can drive the first buffer member to store elastic force when the piezoelectric component deforms.

[0014] In some embodiments, the housing is provided with a movable space, one end of which penetrates the housing. The piezoelectric component and the elastic member are both located in the movable space, and the piezoelectric component and the elastic member can move in the movable space when deforming.

[0015] In some embodiments, the probe test assembly further includes an adjusting member, which is threadedly connected to the housing. One end of the adjusting member is located outside the housing, and the other end of the adjusting member is connected to the first buffer member. When the adjusting member rotates, it can adjust the pre-tightening force of the first buffer member.

[0016] In some embodiments, the probe test assembly further includes a second buffer member located outside the housing. The two ends of the second buffer member are respectively connected to the adjusting member and the housing. When the adjusting member rotates, it can adjust the pre-tightening force of the second buffer member.

[0017] In some embodiments, the probe test assembly further includes a probe clamp, one end of which is connected to the probe, and the other end of which is detachably connected to the insulating member by a screw.

[0018] In some embodiments, the probe clamp is provided with a probe hole and a mounting hole. The probe hole and the mounting hole are connected and arranged at an angle. The probe hole is used for inserting the probe, and the mounting hole is used for threadedly connecting a tightening screw so that the tightening screw presses against the probe in the probe hole.

[0019] In a second aspect, the present utility model further provides a testing device, including a position adjustment component and the above-mentioned probe testing component. The position adjustment component is connected to the probe testing component and is used to drive the probe testing component to move in a three-dimensional space.

[0020] In some embodiments, the number of the probe testing components and the position adjustment components is multiple. Each position adjustment component is correspondingly connected to the probe testing component, and the probes of the multiple probe testing components can converge at the same position.

[0021] Compared with the prior art, during the process of testing a chip by the probe testing component provided by the present utility model, when manipulating the probe to press against the chip, the chip has a reaction force on the probe. This reaction force is sequentially conducted to the piezoelectric component through the probe and the insulating member, so that the piezoelectric component generates a piezoelectric effect. A force conduction strain member can be connected to a converter, and the converter can convert the piezoelectric effect generated by the force conduction strain member into electrical parameters for reference by the staff. The staff can adaptively control the movement of the probe according to the electrical parameters, so that the probe exerts an appropriate acting force on the chip. Compared with the prior art, the probe testing component of the present utility model can accurately adjust the downward pressure of the probe on the chip and improve the stability during chip testing. Description of the Drawings

[0022] Figure 1 is a schematic structural diagram of the probe testing component provided by an embodiment of the present utility model;

[0023] Figure 2 is a schematic cross-sectional view of the probe testing component provided by an embodiment of the present utility model;

[0024] Figure 3 is a schematic structural diagram of the testing device provided by an embodiment of the present utility model. Detailed Embodiments

[0025] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0026] In order to solve the technical problem in the prior art that the probe device cannot accurately adjust the downward pressure of the probe on the chip and cannot ensure the stability during chip testing, the present utility model provides a probe testing component, which can realize reading the pressure received by the chip through the piezoelectric effect, provide a visual reference for the staff to adjust the pressure of the probe on the chip, so as to facilitate the staff to accurately control the pressure of the probe on the chip and improve the stability of chip testing.

[0027] It should be noted that the probe test assembly described in the present utility model is used for but not limited to test devices, etc. For the convenience of description, in the present utility model, only the case where the probe test assembly is applied to a test device is taken as an example for description, and the principle of the probe test assembly applied to other types of devices is substantially the same as that applied to the test device, and will not be elaborated here one by one.

[0028] Please refer to Figure 1 and Figure 2 , Figure 1 , which is a schematic structural diagram of a probe test assembly 100 in an embodiment of the present utility model. The probe test assembly 100 includes a housing 1, a piezoelectric component 2, an insulating component 3, and a probe 4. Among them, one end of the piezoelectric component 2 is movably connected to the housing 1, so that the piezoelectric component 2 can move relative to the housing 1, and thus the piezoelectric component 2 generates a piezoelectric effect. The piezoelectric component 2 can be an existing full-bridge strain gauge or a foil strain gauge high-precision pressure sensor. When the piezoelectric component 2 is subjected to an external force, it can generate an obvious piezoelectric effect. One end of the insulating component 3 is connected to the other end of the piezoelectric component 2, specifically, it is connected to the end of the piezoelectric component 2 far from the housing 1. The probe 4 is connected to the other end of the insulating component 3. When the probe 4 presses against the chip, it can drive the piezoelectric component 2 to deform through the reaction force of the chip to generate a piezoelectric effect. A converter can be connected to the piezoelectric component 2, and this converter can display corresponding electrical parameters according to the piezoelectric effect generated by the piezoelectric component 2 for the visualization reference of the staff. The probe test assembly 100 controls its movement through a corresponding position adjustment assembly to control the movement of the probe 4, so as to control the force of the probe 4 on the chip. Therefore, the staff can adaptively control the position adjustment assembly according to the electrical parameters of the converter, so that the position adjustment assembly controls the force of the probe 4 on the chip to be in a suitable state, which can not only avoid damage to the chip caused by excessive force, but also enable the probe 4 to be in full contact with the chip, improving the stability of chip testing.

[0029] In one of the embodiments, please refer to Figure 2 , the probe test assembly 100 further includes an elastic member 5. One end of the elastic member 5 is connected to the housing 1, and the other end of the elastic member 5 is connected to the piezoelectric component 2. When the piezoelectric component 2 deforms, it can drive the elastic member 5 to deform to accumulate elastic force. In this embodiment, the elastic member 5 is a leaf spring. One end of the leaf spring is embedded inside the housing 1, and the other end of the leaf spring is connected to the piezoelectric component 2. The leaf spring can undergo elastic deformation to move relative to the housing 1 when subjected to an external force. Therefore, the piezoelectric component 2 can move relative to the housing 1 through the leaf spring. In other embodiments, the leaf spring can also be replaced by a rotating shaft, and the piezoelectric component 2 is rotatably connected to the housing 1 through the rotating shaft and can also move relative to the housing 1. When the piezoelectric component 2 deforms due to an external force, the piezoelectric component 2 can drive the leaf spring to undergo elastic deformation, so that both the piezoelectric component 2 and the probe 4 can be buffered, avoiding the probe 4 generating a rigid force on the chip and damaging the chip.

[0030] In one embodiment, please refer to Figure 2 , the housing 1 is provided with an activity space 11. One end of the activity space 11 penetrates through the housing 1, and the other end is closed. The piezoelectric component 2 and the elastic member 5 are both located in the activity space 11, and the piezoelectric component 2 and the elastic member 5 can move in the activity space 11 when deforming. In this embodiment, arranging the piezoelectric component 2 and the elastic member 5 inside the housing 1 is beneficial to saving occupied space. In addition, the piezoelectric component 2 and the elastic member 5 are hidden inside the housing 1, which can protect the piezoelectric component 2 and the elastic member 5.

[0031] In one embodiment, please refer to Figure 2 , the probe test assembly 100 further includes a first buffer member 6. The first buffer member 6 is located between the two ends of the piezoelectric component 2. The first buffer member 6 is connected to the piezoelectric component 2 and can drive the first buffer member 6 to accumulate elastic force when the piezoelectric component 2 deforms. In this embodiment, the first buffer member 6 is mainly used to elastically buffer the piezoelectric component 2. The above-mentioned elastic member 5 is mainly to enable the piezoelectric component 2 to move and incidentally provide a certain amount of buffering. When the probe 4 presses against the chip, the reaction force given by the chip to the probe 4 can successively drive the insulating member 3 and the piezoelectric component 2 to move. When the piezoelectric component 2 moves, it presses against the first buffer member 6. The first buffer member 6 can be a spring. The piezoelectric component 2 presses against the spring to accumulate elastic force; when the probe 4 detaches from the chip, the first buffer member 6 can release the elastic force to drive the piezoelectric component 2 to reset.

[0032] In one embodiment, please refer to Figure 2 , the probe test assembly 100 further includes an adjusting member 7. The adjusting member 7 is a screw. The staff can manually turn the top of the adjusting member 7 to drive the adjusting member 7 to rotate. The adjusting member 7 is threadedly connected to the housing 1. One end of the adjusting member 7 is located outside the housing 1, and the other end of the adjusting member 7 is connected to the first buffer member 6. When the adjusting member 7 rotates, it can move up and down relative to the housing 1. When the adjusting member 7 descends, it can press against the first buffer member 6 to drive the first buffer member 6 to accumulate elastic force; when the adjusting member 7 ascends, the first buffer member 6 can release the elastic force and gradually reset. Therefore, by rotating the adjusting member 7, the pre-tightening force of the first buffer member 6 can be adjusted to adjust the buffering ability of the probe 4 to the chip. In addition, the piezoelectric component 2 has a boss 21, and the boss 21 is used to clamp the first buffer member 6 to improve the connection stability between the first buffer member 6 and the piezoelectric component 2.

[0033] In one embodiment, please refer to Figure 2, the probe test assembly 100 further includes a second buffer member 8 located outside the housing 1. Two ends of the second buffer member 8 are respectively connected to the adjusting member 7 and the housing 1. When the adjusting member 7 rotates, it can adjust the pre-tightening force of the second buffer member 8. In this embodiment, the adjusting member 7 includes a first section 71, a second section 72, and a third section 73 with increasing diameters. Two ends of the second section 72 are connected to the first section 71 and the third section 73. The bottom of the second section 72 is threadedly connected to the housing 1. The above-mentioned first buffer member 6 is sleeved on the first section 71, and the second buffer member 8 is sleeved on the second section 72. One end of the second buffer member 8 abuts against the housing 1, and the other end abuts against the third section 73. When the adjusting member 7 descends by rotation, the third section 73 presses against the second buffer member 8 and drives the second buffer member 8 to accumulate elastic force. The second buffer member 8 drives the adjusting member 7 to be in a taut state through the elastic force, so as to prevent the adjusting member 7 from being easily loosened during long-term use.

[0034] In one embodiment, please refer to Figure 2 , the probe test assembly 100 further includes a probe clip 9. One end of the probe clip 9 is connected to the probe 4, and the other end of the probe clip 9 is detachably connected to the insulating member 3 by a screw, so as to facilitate the replacement of the probe clip 9. In other embodiments, the probe clip 9 can also be connected to the insulating member 3 by welding or fixed connection.

[0035] Furthermore, the probe clip 9 is provided with a probe hole 91 and a mounting hole 92. The probe hole 91 and the mounting hole 92 are communicated and arranged at an angle. The probe hole 91 is used for the probe 4 to be inserted, so that the probe 4 can be detachably arranged along the probe hole 91 to replace the probe 4. The mounting hole 92 is used for threadedly connecting a tightening screw (not shown in the figure) so that the tightening screw presses against the probe 4 in the probe hole 91 to fix the probe 4. The tightening screw can quickly lock or unlock the probe 4 by being threadedly connected to the probe clip 9, which is convenient to use.

[0036] In a second aspect, please refer to Figure 3 , the present invention further provides a testing device 101, including a position adjusting assembly 102 and the above-mentioned probe test assembly 100. The position adjusting assembly 102 is connected to the probe test assembly 100 and is used to drive the probe test assembly 100 to move in a three-dimensional space, thereby driving the probe 4 to move in a three-dimensional space to accurately press down on the chip.

[0037] In one embodiment, please refer to Figure 3 , the number of the probe test assemblies 100 and the position adjusting assemblies 102 are both multiple. Each position adjusting assembly 102 is correspondingly connected to the probe test assembly 100. The probes of multiple probe test assemblies 100 can converge at the same position to jointly detect the chips at the same position. Figure 3The number of probe test components 100 in the illustrated embodiment is five. Through the control of the position adjustment component 102, the five probes 4 can converge at the same position to test the same chip, which can reduce the space occupation.

[0038] The position adjustment component 102 includes a main adjustment mechanism 30, a secondary adjustment mechanism 31, and a rotation motor 32. The rotation motor 32 is provided on the main adjustment mechanism 30. The number of secondary adjustment mechanisms 31 is five. Each secondary adjustment mechanism 31 is connected to the corresponding probe test component 100. The rotation motor 32 is connected to the five secondary adjustment mechanisms 31 through a bracket 13. The rotation motor 32 can drive the bracket 13 to rotate, so as to drive the five probe test components 100 to rotate simultaneously. The structures of the main adjustment mechanism 30 and the secondary adjustment mechanism 31 are the same and are both prior arts, so they will not be described redundantly here. The main adjustment mechanism 30 is used to control the rotation motor 32, all the secondary adjustment mechanisms 31, and all the probe test components 100 to move simultaneously in three-dimensional space. Each secondary adjustment mechanism 31 is used to control the corresponding probe test component 100 to move in three-dimensional space, so as to have a large position adjustment range for each probe 4.

[0039] For a better understanding of the present invention, the following is combined with Figures 1 to 3 to describe the technical solution of the present invention in detail:

[0040] During the process of testing the chip by the probe test component 100 provided by the present invention, by manipulating the position adjustment component 102 to control the probe 4 to press against the chip at a suitable position, the chip has a reaction force on the probe 4. This reaction force is transmitted to the piezoelectric component 2 through the probe 4 and the insulating member 3 in sequence, so that the piezoelectric component 2 generates a piezoelectric effect. A converter can be connected to the piezoelectric component 2, and the converter can convert the piezoelectric effect generated by the piezoelectric component 2 into electrical parameters for the staff to refer to. The staff can adaptively manipulate the position adjustment component 102 to control the movement of the probe 4 according to the electrical parameters, so as to apply a suitable force to the chip by the probe. Compared with the prior art, the probe test component 100 of the present invention can accurately adjust the downward pressure of the probe 4 on the chip and improve the stability during chip testing.

[0041] The above specific embodiments of the present invention do not constitute a limitation to the protection scope of the present invention. Any other corresponding changes and deformations made according to the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A probe test assembly, characterized in that: include: case; A piezoelectric component, one end of which is movably connected to the housing; an insulating member, one end of which is connected to the other end of the piezoelectric component; as well as The probe is connected to the other end of the insulating member. When the probe presses against the chip, the reaction force of the chip can drive the piezoelectric component to deform to generate a piezoelectric effect.

2. The probe test assembly according to claim 1, characterized in that: The probe test assembly also includes an elastic member, one end of which is connected to the shell, and the other end of which is connected to the piezoelectric component. When the piezoelectric component is deformed, it can drive the elastic member to deform to accumulate elastic force.

3. The probe test assembly according to claim 2, characterized in that: The probe test assembly further includes a first buffer member, which is located between two ends of the piezoelectric component. The first buffer member is connected to the piezoelectric component and can drive the first buffer member to accumulate elastic force when the piezoelectric component is deformed.

4. The probe test assembly according to claim 3, characterized in that: The shell is provided with an activity space, one end of which passes through the shell, the piezoelectric component and the elastic component are both located in the activity space, and the piezoelectric component and the elastic component can move in the activity space when deformation occurs.

5. The probe test assembly according to claim 3, characterized in that: The probe test assembly also includes an adjusting member, which is threadedly connected to the shell, one end of the adjusting member is located outside the shell, and the other end of the adjusting member is connected to the first buffer member. The adjusting member can adjust the preload force of the first buffer member when rotating.

6. The probe test assembly according to claim 5, characterized in that: The probe test assembly further comprises a second buffer member located outside the shell, two ends of the second buffer member are respectively connected to the adjustment member and the shell, and the adjustment member can adjust the preload force of the second buffer member when rotating.

7. The probe test assembly according to claim 1, characterized in that: The probe test assembly also includes a probe clip, one end of which is connected to the probe, and the other end of which is detachably connected to the insulating member via a screw.

8. The probe test assembly according to claim 7, characterized in that: The probe clamp is provided with a probe hole and a mounting hole, the probe hole and the mounting hole are connected and arranged at an angle, the probe hole is used for the probe to be inserted, and the mounting hole is used for threaded connection with a tightening screw so that the tightening screw presses the probe in the probe hole.

9. A testing device, characterized in that: It comprises a position adjustment component and a probe testing component as described in any one of claims 1 to 8, wherein the position adjustment component is connected to the probe testing component and is used to drive the probe testing component to move in a three-dimensional space.

10. The testing device according to claim 9, characterized in that: There are multiple probe test components and multiple position adjustment components. Each position adjustment component is connected to a corresponding probe test component. The probes of multiple probe test components can be gathered at the same position.

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