Packaging structure of chip electrolytic capacitor

Abstract

The packaging structure comprises a capacitor shell, a rubber cover is arranged at the bottom of the interior of the capacitor shell, an electrode is arranged at the top of the rubber cover, two pins are arranged at the bottom of the rubber cover, a heat dissipation base is arranged at the bottom of the capacitor shell, and the heat dissipation base comprises an installation base arranged at the bottom of the capacitor shell; the second heat dissipation holes are formed in the middle of the mounting base, and the second heat dissipation holes are formed in the mounting base in parallel at equal intervals; the second heat dissipation blocks are arranged in the second heat dissipation holes, heat generated by the electrodes is fully absorbed through the anti-explosion gaskets, the multiple heat dissipation fins are matched, the heat dissipation area is increased, heat dissipation is conducted in the circumferential direction, and the axial heat transfer rate is increased through the first heat dissipation blocks arranged in the first heat dissipation holes and the second heat dissipation blocks arranged in the second heat dissipation holes; and axial heat dissipation is carried out in cooperation with the ventilation slots, so that the heat dissipation effect is improved, the capacity change of the capacitor caused by temperature change is prevented, and the service life is prolonged.

Description

Technical Field

[0001] The present application relates to the field of capacitors, and particularly to a packaging structure of a chip electrolytic capacitor. Background Art

[0002] As an important electronic component, chip electrolytic capacitors are widely used in various electronic circuits, mainly for functions such as energy storage, filtering, and coupling. Due to their small size and characteristics suitable for surface mounting, they are widely used in modern electronic devices. The packaging structure of chip electrolytic capacitors plays a crucial role in their performance and service life.

[0003] However, in the process of implementing related technical solutions, it is found that there are at least the following technical problems: Chip electrolytic capacitors generate heat during operation. After continuous operation for a long time, if effective heat dissipation is not carried out, the temperature of the capacitor will rise, which will affect the capacitance of the capacitor, resulting in low stability of the capacitor and also reducing the service life of the capacitor. Summary of the Utility Model

[0004] The present application provides a packaging structure of a chip electrolytic capacitor, which solves the problem of poor heat dissipation of capacitors in the prior art and realizes the effect of quickly dissipating heat from the capacitor.

[0005] The present application provides a packaging structure of a chip electrolytic capacitor, including a capacitor housing. A rubber cover is provided at the bottom inside the capacitor housing. An electrode is provided on the top of the rubber cover. Two pins are provided at the bottom of the rubber cover. A heat dissipation base is provided at the bottom of the capacitor housing. The heat dissipation base includes: a mounting base provided at the bottom of the capacitor housing; a plurality of second heat dissipation holes all opened in the middle of the mounting base, and the plurality of second heat dissipation holes are arranged equidistantly and parallelly on the mounting base; a second heat dissipation block provided inside the second heat dissipation holes.

[0006] Further, through grooves are opened on both sides of the middle of the mounting base, and grooves are opened on both sides of the bottom of the mounting base. The pins are arranged inside the through grooves and the grooves.

[0007] Further, ventilation grooves are opened on all four sides of the mounting base, and the bottom of the capacitor housing is connected to the outside through the four ventilation grooves.

[0008] Further, a heat dissipation component is provided on the capacitor housing. The heat dissipation component includes: an explosion-proof gasket provided inside the capacitor housing, and the explosion-proof gasket fills the outside of the rubber cover and the electrode; a plurality of heat dissipation fins provided on the outside of the capacitor housing, and the plurality of heat dissipation fins are arranged equidistantly and annularly on the outside of the capacitor housing.

[0009] Furthermore, a plurality of first heat dissipation holes are formed in both the top and bottom of the capacitor housing, and the plurality of first heat dissipation holes are arranged in an equidistant circular pattern on the capacitor housing. A first heat dissipation block is disposed inside the plurality of first heat dissipation holes.

[0010] The technical solution provided by this application has at least the following technical effects or advantages:

[0011] The explosion-proof gasket fully absorbs the heat generated by the electrode, and cooperates with a plurality of heat dissipation fins to increase the heat dissipation area and dissipate heat in the circumferential direction. The first heat dissipation block disposed inside the first heat dissipation hole and the second heat dissipation block disposed inside the second heat dissipation hole increase the rate of axial heat transfer, and cooperate with the ventilation groove to dissipate heat in the axial direction, thereby improving the heat dissipation effect, preventing the capacitor from changing its capacitance due to temperature changes, and extending the service life of the capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the encapsulation structure in the embodiment of this application;

[0013] Figure 2 It is a schematic cross-sectional structure diagram of the capacitor housing in the embodiment of this application;

[0014] Figure 3 It is a schematic structure diagram of the heat dissipation base in the embodiment of this application;

[0015] In the figure: 10, capacitor housing; 20, rubber cover; 30, pins; 40, electrodes; 50, heat dissipation assembly; 60, heat dissipation base; 51, explosion-proof gasket; 52, heat dissipation fins; 53, first heat dissipation hole; 54, first heat dissipation block; 61, mounting base; 62, through groove; 63, groove; 64, ventilation groove; 65, second heat dissipation hole; 66, second heat dissipation block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The embodiment of this application discloses an encapsulation structure of a chip electrolytic capacitor. The circumferential direction is dissipated by the heat dissipation fins 52, and the axial direction of the capacitor housing 10 is dissipated by the first heat dissipation block 54 and the second heat dissipation block 66 inside the first heat dissipation hole 53 and the second heat dissipation hole 65, so as to quickly dissipate the heat generated inside the capacitor housing 10, prevent the capacitor temperature from rising and causing the capacitance to change, and improve the service life of the capacitor.

[0017] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings of the specification and specific embodiments.

[0018] Please refer to Figure 1 and Figure 2, this embodiment provides a packaging structure for a chip electrolytic capacitor, which includes a capacitor housing 10. At the bottom inside the capacitor housing 10, there is a glue cover 20. At the top of the glue cover 20, there is an electrode 40. At the bottom of the glue cover 20, there are two pins 30. The electrode 40 includes cathode and anode foils and electrolytic paper. The cathode and anode foils are respectively connected to the two pins 30. A heat dissipation component 50 is provided on the capacitor housing 10. The heat dissipation component 50 includes an explosion-proof gasket 51, heat sinks 52, first heat dissipation holes 53, and first heat dissipation blocks 54. The explosion-proof gasket 51 is arranged inside the capacitor housing 10. The explosion-proof gasket 51 fills the outside of the glue cover 20 and the electrode 40. A plurality of heat sinks 52 are arranged on the outside of the capacitor housing 10, and the plurality of heat sinks 52 are arranged in an equidistant circular pattern on the outside of the capacitor housing 10. A plurality of first heat dissipation holes 53 are opened at the top and bottom of the capacitor housing 10, and the plurality of first heat dissipation holes 53 are arranged in an equidistant circular pattern on the capacitor housing 10. The first heat dissipation block 54 is arranged inside the first heat dissipation hole 53. The explosion-proof gasket 51 is made of a metal material and has an explosion-proof effect. The explosion-proof gasket 51 fills the gap between the glue cover 20, the electrode 40 and the capacitor housing 10, so that the heat generated by the electrode 40 can be quickly transferred to the capacitor housing 10. The circumferential contact area with the outside is increased through the plurality of heat sinks 52. The first heat dissipation block 54 has a high thermal conductivity. An effective heat conduction channel is established axially through the first heat dissipation block 54 inside the first heat dissipation hole 53 to conduct the heat to the outside, thereby improving the heat dissipation effect.

[0019] Please refer to Figure 1 and Figure 3, a heat dissipation base 60 is provided at the bottom of the capacitor housing 10. The heat dissipation base 60 includes a mounting base 61, a through groove 62, a groove 63, a ventilation groove 64, a second heat dissipation hole 65, and a second heat dissipation block 66. The mounting base 61 is disposed at the bottom of the capacitor housing 10. A mounting groove matching the size of the capacitor housing 10 is provided in the middle of the top of the mounting base 61. Two through grooves 62 are opened on both sides of the middle of the mounting groove at the top of the mounting base 61. Two grooves 63 are opened on both sides of the bottom of the mounting base 61. The pins 30 are disposed inside the through grooves 62 and the grooves 63. Four ventilation grooves 64 are respectively opened on the four sides of the top of the mounting base 61. The four ventilation grooves 64 communicate with the mounting groove. The bottom of the capacitor housing 10 communicates with the outside through the four ventilation grooves 64. A plurality of second heat dissipation holes 65 are opened on both sides of the mounting groove in the middle of the mounting base 61, and the plurality of second heat dissipation holes 65 are arranged equidistantly and parallel to each other on the mounting base 61. The second heat dissipation block 66 is disposed inside the second heat dissipation hole 65. The pins 30 pass through the through grooves 62 and enter the bottom of the mounting base 61, and then pass out from the grooves 63 on both sides. Through the ventilation grooves 64 on the four sides, the bottom of the capacitor housing 10 can communicate with the outside, dissipating heat from the bottom of the capacitor housing 10. Through the second heat dissipation block 66 inside the second heat dissipation hole 65 at the bottom of the mounting base 61, cooperating with the first heat dissipation block 54 at the bottom of the capacitor housing 10, an effective heat conduction channel is established axially to conduct the heat at the bottom of the capacitor housing 10 to the outside, thereby improving the overall heat dissipation effect.

[0020] The functional principle of the present application can be elaborated through the following operation modes:

[0021] During use, the capacitor housing 10 is installed in the mounting groove at the top of the mounting base 61. The pins 30 at the bottom of the capacitor housing 10 extend from the through grooves 62 on the mounting base 61 into the bottom of the mounting base 61, and then extend out from the grooves 63 on both sides of the mounting base 61. When the internal electrodes 40 of the capacitor housing 10 are working, a large amount of heat is generated. The heat is transferred to the capacitor housing 10 through the explosion-proof gasket 51 made of metal material, and then dissipated to the outside through the plurality of circumferential heat dissipation fins 52. The plurality of heat dissipation fins 52 can increase the circumferential heat dissipation area, thereby improving the heat dissipation efficiency. The heat at the top and bottom of the capacitor housing 10 is transferred out through the first heat dissipation block 54 inside the first heat dissipation hole 53. The first heat dissipation block 54 can improve the heat conduction efficiency. The ventilation grooves 64 on the four sides of the mounting base 61 can enable the outside air to contact the bottom of the capacitor housing 10, dissipating heat from the bottom of the capacitor housing 10. The second heat dissipation blocks 66 inside the plurality of second heat dissipation holes 65 on the mounting base 61 can quickly conduct the heat at the bottom of the capacitor housing 10, improving the heat conduction efficiency, enabling the heat on the capacitor housing 10 to be quickly dissipated, preventing the capacitance from changing due to the increase in the internal temperature of the capacitor housing 10, and improving the service life of the capacitor.

[0022] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, provided that these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application is also intended to cover these modifications and variations.

[0023] As described above, it is only the preferred specific implementation manner of the embodiments of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this application, according to the technical solution and its concept of this application, makes equivalent substitutions or changes, and should be covered by the protection scope of this application.

Claims

1. A packaging structure of a chip electrolytic capacitor, comprising a capacitor housing (10), a rubber cover (20) disposed at the bottom of the capacitor housing (10), an electrode (40) disposed at the top of the rubber cover (20), and two pins (30) disposed at the bottom of the rubber cover (20), characterized in that: A heat sink (60) is provided at the bottom of the capacitor housing (10), and the heat sink (60) comprises: A mounting seat (61) is arranged at the bottom of the capacitor housing (10); A plurality of second heat dissipation holes (65) are all opened in the middle of the mounting seat (61), and the plurality of second heat dissipation holes (65) are arranged in parallel and at equal distances on the mounting seat (61); The second heat dissipation block (66) is arranged inside the second heat dissipation hole (65).

2. The packaging structure of a chip electrolytic capacitor according to claim 1, characterized in that: Through slots (62) are provided on both sides of the middle of the mounting seat (61), and grooves (63) are provided on both sides of the bottom of the mounting seat (61), and the pins (30) are arranged inside the through slots (62) and the grooves (63).

3. The packaging structure of a chip electrolytic capacitor according to claim 1, characterized in that: Ventilation slots (64) are provided on four sides of the mounting seat (61), and the bottom of the capacitor housing (10) is connected to the outside through the four ventilation slots (64).

4. The packaging structure of a chip electrolytic capacitor according to claim 1, characterized in that: The capacitor housing (10) is provided with a heat dissipation component (50), and the heat dissipation component (50) comprises: An explosion-proof gasket (51) is arranged inside the capacitor housing (10), and the explosion-proof gasket (51) is filled on the outside of the rubber cover (20) and the electrode (40); A plurality of heat sinks (52) are arranged on the outside of the capacitor housing (10), and the plurality of heat sinks (52) are arranged in an equidistant ring shape on the outside of the capacitor housing (10).

5. The packaging structure of a chip electrolytic capacitor according to claim 1, characterized in that: The top and bottom of the capacitor housing (10) are both provided with a plurality of first heat dissipation holes (53), the plurality of first heat dissipation holes (53) are arranged in an equidistant annular pattern on the capacitor housing (10), and a first heat dissipation block (54) is arranged inside the plurality of first heat dissipation holes (53).

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