Battery device and electric device

Abstract

The utility model relates to a battery device and a power utilization device. The battery device comprises a battery monomer and a circuit board, the circuit board comprises a plurality of insulating layers and a plurality of circuit layers, the insulating layers and the circuit layers are alternately arranged in the thickness direction of the circuit board, each circuit layer comprises at least one circuit, each circuit comprises a wire and a bonding pad which are connected, at least part of each wire is arranged between every two adjacent insulating layers, and one side, in the thickness direction, of each bonding pad is not covered by the corresponding insulating layer. The pads are connected to the battery cells. According to the battery device provided by the invention, the number of circuits and bonding pads is remarkably increased through the circuit layers arranged in multiple layers, and the integration level of the circuit board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of battery production, and in particular to battery devices and electrical devices. Background Art

[0002] Battery monomers are widely used in electronic devices, such as mobile phones, laptop computers, battery cars, electric cars, electric airplanes, electric ships, electric toy cars, electric toy ships, electric toy airplanes, and electric tools, etc. Battery monomers may include nickel-cadmium batteries, nickel-hydrogen batteries, lithium-ion batteries, and secondary alkaline zinc-manganese batteries, etc.

[0003] In the development of batteries, how to improve the reliability of battery cells is a technical problem that needs to be solved urgently in battery technology. Utility Model Content

[0004] The present application provides a battery device and an electrical device, aiming to improve the reliability of the battery device to a certain extent.

[0005] In a first aspect, the present application proposes a battery device, the battery device comprising a battery cell and a circuit board. The circuit board comprises a plurality of insulating layers and a plurality of circuit layers, the plurality of insulating layers and the plurality of circuit layers are alternately arranged along the thickness direction of the circuit board, the circuit layer comprises at least one circuit, the circuit comprises a connected wire and a pad, at least part of the wire is arranged between adjacent insulating layers, one side of each pad along the thickness direction is not covered by the insulating layer, and the pad is connected to the battery cell.

[0006] In the battery device provided by the present application, at least part of the wire is arranged between adjacent insulating layers, and one side of each pad along the thickness direction is not covered by the insulating layer. Therefore, the insulating layer can not only expose the pad for connecting to the battery cell, but also play a blocking role for the wires of different layers, effectively improving the occurrence of short circuits. In addition, the insulating layer and the circuit layer are arranged in multiple layers, which can reduce the width of the circuit board, reduce the problem that the circuit and the pad cannot be arranged reasonably due to the limited width and space of the circuit board, significantly increase the number of circuits and pads, and improve the integration of the circuit board, thereby improving the performance and practicality of the circuit board, and can also be applied to application scenarios with limited width and space.

[0007] According to an embodiment of the present application, at least part of the multiple insulating layers are provided with openings, and at least part of the pads of the multiple circuit layers are opposite to the openings along the thickness direction.

[0008] In these optional embodiments, the opening provides more space for wiring planning, so that the circuit design can break through the limitation of the insulation layer. In addition, the opening design simplifies the insulation layer structure and can also reduce the occupied space of the insulation layer to a certain extent.

[0009] According to an embodiment of the present application, the plurality of insulating layers include a first insulating layer, a second insulating layer, and a third insulating layer stacked in sequence along the thickness direction. The plurality of circuit layers include a first circuit layer and a second circuit layer. The first circuit layer is disposed between the first insulating layer and the second insulating layer, and the second circuit layer is disposed between the second insulating layer and the third insulating layer. The side of the pad of the first circuit layer facing away from the first insulating layer is not covered by the second insulating layer and the third insulating layer, and the side of the pad of the second circuit layer facing away from the first insulating layer is not covered by the third insulating layer.

[0010] According to an embodiment of the present application, the second insulating layer is provided with a first opening, and the first opening is opposite to the pad of the first circuit layer along the thickness direction. The third insulating layer is provided with a second opening, and the second opening is opposite to the pad of the second circuit layer along the thickness direction.

[0011] In these alternative embodiments, each insulating layer is provided with an opening corresponding to the pad of the circuit layer on its adjacent side. The first opening and the second opening are relatively independent and do not interfere with each other. The independent opening design also effectively isolates the influence between different circuit layers.

[0012] According to an embodiment of the present application, the third insulating layer is provided with a third opening, and the third opening is opposite to the first opening along the thickness direction.

[0013] In these alternative embodiments, with such a setting, the third insulating layer can expose all pads.

[0014] According to an embodiment of the present application, in the width direction of the circuit board, at least one end of the second insulating layer protrudes from the third insulating layer, and the first opening is disposed in the part of the second insulating layer that protrudes from the third insulating layer.

[0015] In these alternative embodiments, the width of the third insulating layer is smaller than that of the second insulating layer to expose the pads of the first circuit layer. Moreover, with such a setting, the weight of the circuit board can be reduced, which is beneficial to the lightweight of the battery device.

[0016] According to an embodiment of the present application, the second insulating layer is provided with a plurality of first openings, the plurality of first openings are spaced along the length direction of the circuit board, the first circuit layer includes a plurality of circuits, and the plurality of pads correspond to the plurality of first openings one by one along the thickness direction. The third insulating layer is provided with a plurality of second openings, the plurality of second openings are spaced along the length direction of the circuit board, and the plurality of second openings are arranged in a staggered manner with the plurality of first openings along the length direction of the circuit board. The second circuit layer includes a plurality of circuits, and the plurality of pads correspond to the plurality of second openings one by one along the thickness direction.

[0017] In these alternative embodiments, the circuits and openings are reasonably planned to increase the number of wirings per layer and improve the overall integration and performance of the circuit board.

[0018] According to an embodiment of the present application, the second insulating layer includes a film body. An avoidance groove is provided at one end of the film body away from the pad along the length direction of the circuit board. The avoidance groove is used to avoid the end of the wire away from the pad.

[0019] In these alternative embodiments, the end of the exposed wire is used to connect to a connector.

[0020] According to an embodiment of the present application, the film body includes a first film body and a second film body arranged along the length direction. The first film body is connected to the second film body. The width of the first film body is smaller than the width of the second film body. A first opening is provided on the first film body, and an avoidance groove is provided on the second film body.

[0021] In these alternative embodiments, the first film body and the second film body are differentially arranged, so that the narrower first film body can be flexibly embedded in a space-limited area, and the first film body occupies less space.

[0022] According to an embodiment of the present application, the first insulating layer includes a third film body and a fourth film body arranged along the length direction. The third film body is connected to the fourth film body. The width of the third film body is smaller than the width of the fourth film body. The width of the first film body is less than or equal to the width of the third film body, and the width of the second film body is less than the width of the fourth film body.

[0023] In these alternative embodiments, as the bottom layer of multiple insulating layers, the first insulating layer can provide support for the second insulating layer, the third insulating layer, and each circuit layer, and can also block interference from outside the circuit board, ensuring the lifespan and performance of the circuit board.

[0024] According to an embodiment of the present application, the wire includes a connection section and a straight section. The straight section is connected to the end of the connection section and the pad. The straight section extends along the length direction of the circuit board. The connection sections on each circuit layer do not overlap in the thickness direction.

[0025] In these alternative embodiments, each circuit layer is arranged in a staggered layout in the thickness direction for connecting to a connector. The straight sections can be partially overlapped under the blocking of each insulating layer

[0026] to maximize the use of space, improve the utilization rate of the wiring space, and thus accommodate more circuit layers.

[0027] According to an embodiment of the present application, the connection section includes a straight portion and a connection portion. The connection portion is connected to the straight portion and the straight section. The straight portion extends along the length direction, and the straight portion and the straight section are not collinear. At least part of the connection portion is arc-shaped.

[0028] In these alternative embodiments, with such a setting, it is easy to achieve that the connection sections on each circuit layer do not overlap in the thickness direction.

[0029] According to an embodiment of the present application, the connection segments on each circuit layer partially overlap in the thickness direction.

[0030] In these optional embodiments, based on the effective barrier of the insulating layer, the connection segments on each circuit layer partially overlap in the thickness direction, thereby improving the integration degree of the circuit board.

[0031] According to an embodiment of the present application, the battery device further includes a connector, which is disposed at one end of the circuit board along the length direction of the circuit board, and the connector is connected to a wire.

[0032] In these optional embodiments, the connector provides an external connection port for the circuit board, facilitating the connection of external devices.

[0033] In a second aspect, the present application provides an electrical device, including the battery device described above, and the battery device is used to store or provide electrical energy.

[0034] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other objects, features and advantages of the present application more obvious and understandable, the following specifically illustrates the specific embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The features, advantages and technical effects of the exemplary embodiments of the present application will be described below with reference to the drawings.

[0036] Figure 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application;

[0037] Figure 2 is an exploded view of a battery device provided by an embodiment of the present application;

[0038] Figure 3 is a schematic structural diagram of a battery cell provided by an embodiment of the present application;

[0039] Figure 4 is an exploded view of a circuit board and a connector provided by an embodiment of the present application;

[0040] Figure 5 is a schematic structural diagram of a circuit board provided by an embodiment of the present application;

[0041] Figure 6 is a top view of a circuit board provided by an embodiment of the present application;

[0042] Figure 7 is an exploded view of a circuit board provided by an embodiment of the present application;

[0043] Figure 8 is a schematic structural diagram of the circuit of a circuit board provided by an embodiment of the present application.

[0044] The accompanying drawings are not necessarily drawn to scale.

[0045] Explanation of reference numerals in the accompanying drawings:

[0046] 1000, vehicle;

[0047] 100, battery device; 200, controller; 300, motor;

[0048] 1a, battery module; 1b, first box body; 1c, second box body;

[0049] 1, battery cell;

[0050] 2, circuit board; 21, insulating layer; 211, opening; 2111, first opening; 2112, second opening; 2113, third opening; 212, first insulating layer; 2121, third film body; 2122, fourth film body; 213, second insulating layer; 2131, film body; 2132, first film body; 2133, second film body; 2134, avoidance groove; 214, third insulating layer; 22, circuit layer; 221, circuit; 2211, wire; 22111, connection segment; 22112, straight segment; 22113, straight portion; 22114, connection portion; 2212, pad; 222, first circuit layer; 223, second circuit layer;

[0051] 3, connector;

[0052] z, thickness direction; x, length direction; y, width direction. Detailed implementation manners

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0054] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs; the terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "including" and "having" and any variations thereof in the specification and claims of the present application and the above accompanying drawing descriptions are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of the present application or the above accompanying drawings are used to distinguish different objects and are not used to describe a specific order or primary-secondary relationship.

[0055] Reference to "embodiment" in this application means that the specific features, structures, or characteristics described in connection with the embodiment may be included in at least one embodiment of this application. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments.

[0056] In the description of this application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled", and "attached" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0057] The term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally represents an "or" relationship between the associated objects before and after.

[0058] In the embodiments of this application, the same reference numerals represent the same components, and for the sake of brevity, in different embodiments, the detailed description of the same components is omitted. It should be understood that the thickness, length, width, etc. of various components in the embodiments of this application shown in the drawings, as well as the overall thickness, length, width, etc. of the integrated device, are only illustrative and should not constitute any limitation to this application.

[0059] The term "a plurality of" appearing in this application refers to two or more (including two).

[0060] Currently, from the perspective of the development of the market situation, the application of batteries is becoming more and more extensive. Batteries are not only used in energy storage power systems such as hydropower, thermal power, wind power, and solar power plants, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, and electric cars, as well as in many fields such as aerospace.

[0061] A battery device generally refers to a single physical module including a plurality of battery cells to provide a higher voltage and capacity. A battery cell can be the smallest unit that makes up a battery device.

[0062] To improve the reliable operation of a battery device, information such as the voltage and temperature of each battery cell is sampled, and the status information of the battery cells is collected in real time through a circuit board to determine whether there are potential risks such as explosion and combustion in the battery cells. Due to its advantages of stable performance, small size, and low cost, the circuit board can effectively save a certain amount of internal space in the grouped battery device and thus has been gradually widely used. However, due to the limited internal space of the battery device, the width space of the circuit board is insufficient, the circuit layout is restricted, and it is difficult to meet the requirements for diverse information collection of battery cells. The above statements are only used to provide background technical information related to the present application and do not necessarily constitute prior art.

[0063] In the battery device provided by the present application, at least part of the wire is disposed between adjacent insulating layers, and one side of each pad along the thickness direction is not covered by the insulating layer. Therefore, the insulating layer can not only expose the pads for connecting to the battery cells but also play a role in blocking the wires of different layers, effectively improving the occurrence of short circuits. In addition, multiple layers of insulating layers and circuit layers are provided, which can reduce the width of the circuit board, reduce the problem that the circuits and pads cannot be reasonably arranged due to limited width space of the circuit board, significantly increase the number of circuits and pads, improve the integration of the circuit board, thereby improving the performance and practicality of the circuit board, and can also be applicable to application scenarios with limited width space.

[0064] The battery cells described in the embodiments of the present application are applicable to batteries and electrical devices using batteries. The battery cells can be but are not limited to being used in batteries, and can also be used in products such as vehicles, airplanes, ships, electronic devices, and power tools, which can improve the reliability of these products.

[0065] The electrical device can be a vehicle, a mobile phone, a portable device, a laptop computer, a ship, a spacecraft, an electric toy, and a power tool, etc. The vehicle can be a fuel vehicle, a gas vehicle, or a new energy vehicle, and the new energy vehicle can be a pure electric vehicle, a hybrid electric vehicle, or an extended-range electric vehicle, etc.; the spacecraft includes airplanes, rockets, space shuttles, and spacecraft, etc.; the electric toy includes fixed or mobile electric toys, for example, game consoles, electric vehicle toys, electric ship toys, and electric airplane toys, etc.; the power tool includes metal cutting power tools, grinding power tools, assembly power tools, and railway power tools, for example, electric drills, electric grinders, electric wrenches, electric screwdrivers, electric hammers, impact electric drills, concrete vibrators, and electric planers, etc.

[0066] For the convenience of description in the following embodiments, a vehicle is taken as an example of an electrical device in an embodiment of the present application for illustration.

[0067] See Figure 1As shown, an embodiment of the present application provides a vehicle 1000. The vehicle 1000 can be a fuel vehicle, a gas vehicle, or a new energy vehicle. The new energy vehicle can be a pure electric vehicle, a hybrid vehicle, an extended-range vehicle, etc. In an embodiment of the present application, the vehicle 1000 can include a motor 300, a controller 200, and a battery device 100. The controller 200 is used to control the battery device 100 to supply power to the motor 300. The motor 300 is connected to the wheels through a transmission mechanism, thereby driving the vehicle 1000 to move forward. The battery device 100 can be used as the driving power source of the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000. In one example, the battery device 100 can be disposed at the bottom, the front end, or the rear end of the vehicle 1000. The battery device 100 can be used to supply power to the vehicle 1000. In one example, the battery device 100 can be used as the operating power source of the vehicle 1000 and is used for the circuit system of the vehicle 1000. Exemplarily, the battery device 100 can be used for the starting, navigation, and working power requirements during the operation of the vehicle 1000.

[0068] Please refer to Figure 2 , Figure 2 which is an exploded view of the battery device 100 provided in some embodiments of the present application.

[0069] In some embodiments, the battery device 100 may include one or more battery cell assemblies for providing voltage and capacity.

[0070] The battery cell assembly may include a plurality of battery cells ( Figure 2 not shown), and the plurality of battery cells are connected in series, parallel, or in a hybrid connection through a busbar component. A hybrid connection means that there are both series and parallel connections among the plurality of battery cells.

[0071] The battery cell can be a secondary battery cell, which refers to a battery cell that can activate the active material through charging after discharging.

[0072] As an example, the battery cell can be a lithium-ion battery cell, a sodium-ion battery cell, a sodium-lithium-ion battery cell, a lithium-metal battery cell, a sodium-metal battery cell, a lithium-sulfur battery cell, a magnesium-ion battery cell, a nickel-metal hydride battery cell, a nickel-cadmium battery cell, a lead-acid battery cell, etc.

[0073] As an example, the battery cell can be a prismatic battery cell, a pouch battery cell, or a battery cell of other shapes. The prismatic battery cell includes a square-shell battery cell, a blade-shaped battery cell, a multi-prismatic battery cell, and the multi-prismatic battery cell is, for example, a hexagonal-prismatic battery cell, etc.

[0074] In some embodiments, a battery cell assembly is generally formed by arranging a plurality of battery cells; as an example, the battery cell assembly may be a battery module 1a, and the battery module 1a is formed by arranging and fixing a plurality of battery cells into an independent module. As an example, the battery module 1a may be formed by bundling a plurality of battery cells with cable ties.

[0075] In some embodiments, the battery device 100 may be a battery pack, and the battery pack includes a box body and one or more battery cell assemblies, and the battery cell assemblies are accommodated in the box body. As an example, the battery cell assembly may be a battery module 1a, and the battery cell assembly may be accommodated in the box body by fixing the battery module 1a in the box body. As an example, the battery cell assembly may also be accommodated in the box body by directly fixing a plurality of battery cells in the box body.

[0076] In some embodiments, the box body is used to accommodate battery cells, and the box body may be of various structures.

[0077] In some embodiments, the box body may include a first box body 1b and a second box body 1c, the first box body 1b and the second box body 1c cover each other, and the first box body 1b and the second box body 1c jointly define an accommodation space for accommodating battery cells. The second box body 1c may be a hollow structure with one end open, and the first box body 1b may be a plate-like structure. The first box body 1b covers the open side of the second box body 1c so that the first box body 1b and the second box body 1c jointly define an accommodation space; the first box body 1b and the second box body 1c may also both be hollow structures with one side open, and the open side of the first box body 1b covers the open side of the second box body 1c. Of course, the box body formed by the first box body 1b and the second box body 1c may be of various shapes, such as a cylinder, a cuboid, etc.

[0078] In some embodiments, the box body may include a top cover, a frame and a bottom plate. The top cover and the bottom plate are respectively connected to the frame, so that a closed space is formed inside the box body to accommodate the battery cell assembly. As an example, the frame may include a plurality of side beams.

[0079] In some embodiments, the box body may be part of the chassis structure of a vehicle. For example, a part of the box body may become at least a part of the floor of the vehicle, or a part of the box body may become at least a part of the cross beam and longitudinal beam of the vehicle.

[0080] In some embodiments, the battery device 100 may be an energy storage device.

[0081] Energy storage devices can be used in energy storage power stations, wind power generation systems, solar power generation systems, mobile power systems, or temporary power supply systems, etc. The energy storage device can store electrical energy as needed and output electrical energy at an appropriate time. For example, the energy storage device can store electrical energy during low electricity consumption periods and provide electrical energy to relevant users or electrical equipment during high electricity consumption periods.

[0082] In some embodiments, the energy storage device includes an energy storage container, an energy storage electrical cabinet, etc.

[0083] Figure 3 It is a schematic structural diagram of a battery cell provided by an embodiment of the present application.

[0084] In some embodiments, as Figure 3 shown, there are multiple battery cells 1. Multiple battery cells 1 are first connected in series, parallel, or in a hybrid connection to form a battery module 1a. Multiple battery modules 1a are then connected in series, parallel, or in a hybrid connection to form a whole and are accommodated in a box.

[0085] The multiple battery cells 1 in the battery module 1a can be electrically connected through a busbar component to achieve parallel, series, or hybrid connection of the multiple battery cells 1 in the battery module 1a. The busbar component can be one or more, and each busbar component is used to electrically connect at least two battery cells 1.

[0086] Referring to Figure 4 and Figure 5 , Figure 4 is an exploded view of a circuit board and a connector provided by an embodiment of the present application; Figure 5 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.

[0087] As Figures 3 to 5 shown, the present application proposes a battery device. The battery device includes a battery cell 1 and a circuit board 2. The circuit board 2 includes multiple insulating layers 21 and multiple circuit layers 22. The multiple insulating layers 21 and the multiple circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. The circuit layer 22 includes at least one circuit 221. The circuit 221 includes a connected wire 2211 and a pad 2212. At least a part of the wire 2211 is disposed between adjacent insulating layers 21. One side of each pad 2212 along the thickness direction z is not covered by the insulating layer 21, and the pad 2212 is connected to the battery cell 1.

[0088] The circuit board 2 is a substrate for supporting and connecting electronic components, used for assembling and wiring electronic components so that the circuit can operate properly. Generally, the circuit board 2 includes an insulating layer 21 and a plurality of circuit layers 22. The plurality of insulating layers 21 and the plurality of circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. During the manufacturing process, the unnecessary parts of the circuit layer 22 on the circuit board 2 are removed by methods such as chemical etching or machining according to the design pattern to form the required conducting wires 2211 and pads 2212. The conducting wires 2211 and pads 2212 are used to connect various electronic components.

[0089] Optionally, the pad 2212 is connected to the battery cell 1.

[0090] In some examples, the circuit board 2 can have various shapes, such as regular shapes like rectangles, squares, circles, etc., or other irregular shapes.

[0091] Optionally, the circuit board 2 is an FPC (Flexible Printed Circuit) or an FDC (Flexible Die-cutting Circuit).

[0092] In some examples, each circuit layer 22 includes a plurality of circuits. The plurality of circuits 221 are arranged in parallel. Each circuit 221 includes a connected conducting wire 2211 and a pad 2212, and the plurality of pads 2212 on each circuit layer 22 are arranged at intervals.

[0093] The circuit 221 includes a connected conducting wire 2211 and a pad 2212. At least part of the conducting wire 2211 is disposed between adjacent insulating layers 21. With such an arrangement, the risk of short circuit between the conducting wires 2211 can be improved.

[0094] Optionally, each insulating layer 21 is provided with an avoidance portion to avoid the pad 2212. Exemplarily, the avoidance portion includes an opening or an avoidance groove.

[0095] Optionally, at least part of the plurality of insulating layers 21 has a relatively narrow width to avoid the pads 2212 of part of the circuit layers 22.

[0096] In some examples, the plurality of insulating layers 21 and the plurality of circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. The plurality of insulating layers 21 include an insulating layer one, an insulating layer two, and an insulating layer three arranged in sequence along the thickness direction z. The circuit layer one is disposed between the insulating layer one and the insulating layer two, and the circuit layer two is disposed between the insulating layer two and the insulating layer three. The insulating layer two is provided with a first avoidance portion to avoid the pad 2212 of the circuit layer one, and the insulating layer three is provided with a second avoidance portion to avoid the pad 2212 of the circuit layer two and a third avoidance portion to avoid the pad 2212 of the circuit layer one.

[0097] In some other examples, a plurality of insulating layers 21 and a plurality of circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. The plurality of insulating layers 21 include a first insulating layer, a second insulating layer, and a third insulating layer that are sequentially arranged along the thickness direction z. The first circuit layer is arranged between the first insulating layer and the second insulating layer, and the second circuit layer is arranged between the second insulating layer and the third insulating layer. The first insulating layer is provided with a first avoidance portion to avoid the pad 2212 of the first circuit layer, and the third insulating layer is provided with a second avoidance portion to avoid the pad 2212 of the second circuit layer.

[0098] In some examples, a plurality of insulating layers 21 and a plurality of circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. The plurality of insulating layers 21 include a first insulating layer, a second insulating layer, and a third insulating layer that are sequentially arranged along the thickness direction z. The first circuit layer is arranged between the first insulating layer and the second insulating layer, and the second circuit layer is arranged between the second insulating layer and the third insulating layer. One end of the second insulating layer facing the pad 2212 of the first circuit layer along the width direction y does not overlap with the pad 2212 of the first circuit layer. Both ends of the second insulating layer along the width direction y do not overlap with the pad 2212 of the first circuit layer and the pad 2212 of the second circuit layer.

[0099] In some other examples, a plurality of insulating layers 21 and a plurality of circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. The plurality of insulating layers 21 include a first insulating layer, a second insulating layer, and a third insulating layer that are sequentially arranged along the thickness direction z. The first circuit layer is arranged between the first insulating layer and the second insulating layer, and the second circuit layer is arranged between the second insulating layer and the third insulating layer. One end of the first insulating layer facing the pad 2212 of the first circuit layer along the width direction y does not overlap with the pad 2212 of the first circuit layer, and one end of the third insulating layer facing the pad 2212 of the second circuit layer along the width direction y does not overlap with the pad 2212 of the second circuit layer.

[0100] In the battery device provided by the present application, at least a part of the wire 2211 is disposed between adjacent insulating layers 21, and one side of each pad 2212 along the thickness direction z is not covered by the insulating layer 21. Therefore, the insulating layer 21 can not only expose the pad 2212 for connecting with the battery cell 1, but also play a blocking role for the wires 2211 in different layers, effectively improving the occurrence of short circuits. In addition, by providing multiple layers of the insulating layer 21 and the circuit layer 22, the width of the circuit board 2 can be reduced, thus reducing the problem that the circuits 221 and the pads 2212 cannot be reasonably arranged due to limited width space of the circuit board 2, significantly increasing the number of the circuits 221 and the pads 2212, improving the integration degree of the circuit board 2, thereby improving the performance and practicality of the circuit board 2, and being applicable to application scenarios with limited width space.

[0101] According to an embodiment of the present application, as Figure 4 and Figure 5As shown, at least part of the multiple insulating layers 21 is provided with openings 211, and at least part of the pads 2212 of the multiple circuit layers 22 is opposite to the openings 211 in the thickness direction z.

[0102] Optionally, at least part of the multiple insulating layers 21 is provided with openings 211, and one side of the pads 2212 of the multiple circuit layers 22 in the thickness direction z is opposite to the openings 211 in the thickness direction z.

[0103] In some examples, each insulating layer 21 is provided with an opening 211, and the opening 211 is opposite to all the pads 2212 on one side of each insulating layer 21 in the thickness direction z.

[0104] In other examples, each insulating layer 21 is provided with multiple openings 211, and the multiple openings 211 are in one-to-one correspondence with all the pads 2212 on one side of each insulating layer 21 in the thickness direction z.

[0105] Exemplarily, the multiple insulating layers 21 and the multiple circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. The multiple insulating layers 21 include an insulating layer one, an insulating layer two, and an insulating layer three arranged in sequence along the thickness direction z. The circuit layer one is arranged between the insulating layer one and the insulating layer two, and the circuit layer two is arranged between the insulating layer two and the insulating layer three. The insulating layer two is provided with an opening one, and the opening one is opposite to the pad 2212 of the circuit layer one in the thickness direction z. The insulating layer two is provided with an opening two, and the opening two is opposite to the pad 2212 of the circuit layer one and the pad 2212 of the circuit layer two in the thickness direction z.

[0106] Exemplarily, the multiple insulating layers 21 and the multiple circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. The multiple insulating layers 21 include an insulating layer one, an insulating layer two, and an insulating layer three arranged in sequence along the thickness direction z. The circuit layer one is arranged between the insulating layer one and the insulating layer two, and the circuit layer two is arranged between the insulating layer two and the insulating layer three. The insulating layer two is provided with an opening one, and the opening one is opposite to the pad 2212 of the circuit layer one in the thickness direction z. The insulating layer three is provided with an opening two, and the opening two is opposite to the pad 2212 of the circuit layer two in the thickness direction z, and one end of the insulating layer three facing the pad 2212 of the circuit layer one along the width direction y does not overlap with the pad 2212 of the circuit layer one.

[0107] In these optional embodiments, the openings 211 provide more space for wiring planning, enabling the circuit design to break through the limitations of the insulating layer 21. In addition, the design of the openings 211 simplifies the structure of the insulating layer 21 and can also reduce the occupied space of the insulating layer 21 to a certain extent.

[0108] According to an embodiment of the present application, as Figure 4As shown, the plurality of insulating layers 21 include a first insulating layer 212, a second insulating layer 213, and a third insulating layer 214 that are sequentially stacked in the thickness direction z. The plurality of circuit layers 22 include a first circuit layer 222 and a second circuit layer 223. The first circuit layer 222 is disposed between the first insulating layer 212 and the second insulating layer 213, and the second circuit layer 223 is disposed between the second insulating layer 213 and the third insulating layer 214. One side of the pad 2212 of the first circuit layer 222 facing away from the first insulating layer 212 is not covered by the second insulating layer 213 and the third insulating layer 214, and one side of the pad 2212 of the second circuit layer 223 facing away from the first insulating layer 212 is not covered by the third insulating layer 214.

[0109] The plurality of insulating layers 21 include a first insulating layer 212, a second insulating layer 213, and a third insulating layer 214 that are sequentially stacked in the thickness direction z. The plurality of circuit layers 22 include a first circuit layer 222 and a second circuit layer 223. The first circuit layer 222 is disposed between the first insulating layer 212 and the second insulating layer 213, and the second circuit layer 223 is disposed between the second insulating layer 213 and the third insulating layer 214. It can be understood that along the thickness direction z, the first insulating layer 212, the first circuit layer 222, the second insulating layer 213, the second circuit layer 223, and the third insulating layer 214 are sequentially provided.

[0110] In some examples, one side of the pad 2212 of the first circuit layer 222 facing away from the first insulating layer 212 is not covered by the second insulating layer 213 and the third insulating layer 214, and openings are provided in both the second insulating layer 213 and the third insulating layer 214. At least a part of the opening is opposite to the pad 2212 of the first circuit layer 222 in the thickness direction z. Alternatively, at least one end of the second insulating layer 213 in the width direction y of the circuit board 2 protrudes from the third insulating layer 214, and the first opening 2111 is provided in the part of the second insulating layer 213 that protrudes from the third insulating layer 214.

[0111] In some examples, one side of the pad 2212 of the second circuit layer 223 facing away from the first insulating layer 212 is not covered by the third insulating layer 214, and the third insulating layer 214 may be provided with an opening 211. At least a part of the opening 211 is opposite to the pad 2212 of the second circuit layer 223 in the thickness direction z. Alternatively, one end of the second insulating layer 213 in the width direction y of the circuit board 2 close to the pad 2212 of the second circuit layer 223 does not overlap with the pad 2212 of the second circuit layer 223.

[0112] According to an embodiment of the present application, as Figure 4As shown, the second insulating layer 213 is provided with a first opening 2111, and the first opening 2111 and the pad 2212 of the first circuit layer 222 are opposite to each other in the thickness direction z. The third insulating layer 214 is provided with a second opening 2112, and the second opening 2112 and the pad 2212 of the second circuit layer 223 are opposite to each other in the thickness direction z.

[0113] Optionally, the first circuit layer 222 is provided with a plurality of circuits. The plurality of circuits of the first circuit layer 222 are arranged in parallel.

[0114] Optionally, the second circuit layer 223 is provided with a plurality of circuits. The plurality of circuits of the second circuit layer 223 are arranged in parallel.

[0115] In some examples, the first circuit layer 222 is provided with a plurality of circuits. The second insulating layer 213 is provided with one first opening 2111 or a plurality of first openings 2111. When the second insulating layer 213 is provided with one first opening 2111, the first opening 2111 is opposite to the plurality of pads 2212 of the first circuit layer 222 in the thickness direction z. When the second insulating layer 213 is provided with a plurality of first openings 2111, the plurality of first openings 2111 and the plurality of pads 2212 of the first circuit layer 222 are arranged in one-to-one correspondence in the thickness direction z.

[0116] In some examples, the second circuit layer 223 is provided with a plurality of circuits. The third insulating layer 214 is provided with one second opening 2112 or a plurality of second openings 2112. When the second insulating layer 213 is provided with one second opening 2112, the second opening 2112 is opposite to the plurality of pads 2212 of the second circuit layer 223 in the thickness direction z. When the third insulating layer 214 is provided with a plurality of second openings 2112, the plurality of second openings 2112 and the plurality of pads 2212 of the second circuit layer 223 are arranged in one-to-one correspondence in the thickness direction z.

[0117] The third insulating layer 214 is provided with a second opening 2112, and the second opening 2112 is opposite to the plurality of pads 2212 of the second circuit layer 223 in the thickness direction z. The second opening 2112 is also opposite to the plurality of pads 2212 of the first circuit layer 222 in the thickness direction z.

[0118] The third insulating layer 214 is provided with a second opening 2112, and the second opening 2112 is opposite to the plurality of pads 2212 of the second circuit layer 223 in the thickness direction z. The third insulating layer 214 is further provided with other openings for being opposite to the plurality of pads 2212 of the first circuit layer 222.

[0119] The third insulating layer 214 is provided with a second opening 2112, and the second opening 2112 faces a plurality of pads 2212 of the second circuit layer 223 in the thickness direction z. One end of the third insulating layer 214 close to the pads 2212 of the first circuit layer 222 in the width direction y of the circuit board 2 does not overlap with the pads 2212 of the first circuit layer 222.

[0120] In these optionally implemented embodiments, each insulating layer 21 is provided with an opening corresponding to the pads 2212 of the circuit layer 22 on the adjacent side. The first opening 2111 and the second opening 2112 are relatively independent and do not interfere with each other. The independent opening design also effectively isolates the influence between different circuit layers 22.

[0121] According to an embodiment of the present application, as Figure 4 shown, the third insulating layer 214 is provided with a third opening 2113, and the third opening 2113 faces the first opening 2111 in the thickness direction z.

[0122] In some examples, the third insulating layer 214 is provided with a third opening 2113 and a second opening 2112, and the third opening 2113 and the second opening 2112 are spaced apart in the width direction y. The third opening 2113 faces the first opening 2111 in the thickness direction z, and the second opening 2112 faces the pads 2212 of the second circuit layer 223 in the thickness direction z.

[0123] Exemplarily, the third insulating layer 214 is provided with a plurality of third openings 2113 and a plurality of second openings 2112, and the plurality of third openings 2113 and the plurality of second openings 2112 are staggered in the length direction x. The third opening 2113 faces the first opening 2111 in the thickness direction z, and the second opening 2112 faces the pads 2212 of the second circuit layer 223 in the thickness direction z.

[0124] In these optionally implemented embodiments, configured in this way, the third insulating layer 214 can expose all the pads 2212.

[0125] Referring to the same 6 Figure 7 , Figure 6 is a top view of a circuit board provided by an embodiment of the present application; Figure 7 is an exploded view of a circuit board provided by an embodiment of the present application.

[0126] According to an embodiment of the present application, as Figure 6 and Figure 7 shown, in the width direction y of the circuit board 2, at least one end of the second insulating layer 213 protrudes from the third insulating layer 214, and the first opening 2111 is provided in the part of the second insulating layer 213 that protrudes from the third insulating layer 214.

[0127] In some examples, in the width direction y of the circuit board 2, the second insulating layer 213 includes opposite first and second ends, and the third insulating layer 214 includes opposite third and fourth ends. The first end protrudes from the third end, and a first opening 2111 is provided at the first end. The second end is flush with the fourth end. A second opening 2112 is provided at the fourth end.

[0128] In these alternative embodiments, the width of the third insulating layer 214 is smaller than that of the second insulating layer 213 to expose the pad 2212 of the first circuit layer 222. Moreover, with such an arrangement, the weight of the circuit board 2 can be reduced, which is beneficial to the lightweight of the battery device.

[0129] According to an embodiment of the present application, as Figure 4 shown, the second insulating layer 213 is provided with a plurality of first openings 2111, and the plurality of first openings 2111 are spaced along the length direction x of the circuit board 2. The first circuit layer 222 includes a plurality of circuits, and the plurality of pads 2212 of the first circuit layer 222 correspond to the plurality of first openings 2111 one by one in the thickness direction z. The third insulating layer 214 is provided with a plurality of second openings 2112, and the plurality of second openings 2112 are spaced along the length direction x of the circuit board 2, and the plurality of second openings 2112 are arranged in a staggered manner with the first openings 2111 along the length direction x of the circuit board 2. The second circuit layer 223 includes a plurality of circuits, and the plurality of pads 2212 of the second circuit layer 223 correspond to the plurality of second openings 2112 one by one in the thickness direction z.

[0130] In these alternative embodiments, the circuits and the openings 211 are reasonably planned to increase the number of wirings per layer and improve the overall integration and performance of the circuit board 2.

[0131] According to an embodiment of the present application, in the thickness direction z, one end of the second insulating layer 213 facing the pad 2212 of the first circuit layer 222 along the width direction y of the circuit board 2 does not overlap with the pad 2212 of the first circuit layer 222. In the thickness direction z, one end of the third insulating layer 214 facing the pad 2212 of the second circuit layer 223 along the width direction y of the circuit board 2 does not overlap with the pad 2212 of the second circuit layer 223, and one end of the third insulating layer 214 facing the pad 2212 of the first circuit layer 222 along the width direction y of the circuit board 2 does not overlap with the pad 2212 of the first circuit layer 222.

[0132] Exemplarily, the second insulating layer 213 has opposite first and second ends along the width direction y of the circuit board 2. The first end faces the pad 2212 of the first circuit layer 222, and in the thickness direction z, the first end does not overlap with the pad 2212 of the first circuit layer 222. The third insulating layer 214 has opposite third and fourth ends along the width direction y of the circuit board 2. The fourth end faces the pad 2212 of the second circuit layer 223, the third end faces the pad 2212 of the first circuit layer 222, and in the thickness direction z, the fourth end does not overlap with the pad 2212 of the second circuit layer 223, and the third end does not overlap with the pad 2212 of the first circuit layer 222.

[0133] Optionally, the width of the third insulating layer 214 is less than the width of the second insulating layer 213, and the width of the second insulating layer 213 is less than the width of the first insulating layer 212.

[0134] In these alternative embodiments, with such an arrangement, it is possible to expose the pads 2212 while reducing the occupied area and weight of the insulating layer 21.

[0135] According to an embodiment of the present application, as Figure 7 shown, the second insulating layer 213 includes a film body 2131. At one end of the film body 2131 along the length direction x of the circuit board 2 away from the pad 2212, there is an avoidance groove 2134 for avoiding the end of the wire 2211 away from the pad 2212.

[0136] In some examples, the ends of the wires 2211 in the plurality of circuit layers 22 away from the pads 2212 do not overlap in the thickness direction z.

[0137] Optionally, each circuit layer 22 includes a plurality of circuits 221, and the ends of the plurality of wires 2211 in each circuit layer 22 away from the pads 2212 are arranged at intervals along the width direction y.

[0138] Optionally, the avoidance groove 2134 avoids the end of the wire 2211 away from the pad 2212, and the end is used to connect to the connector 3.

[0139] In these alternative embodiments, the exposed ends of the wires 2211 are used to connect to the connector 3.

[0140] According to an embodiment of the present application, as Figure 7 shown, the film body 2131 includes a first film body 2132 and a second film body 2133 arranged along the length direction x. The first film body 2132 is connected to the second film body 2133. The width of the first film body 2132 is less than the width of the second film body 2133. The first film body 2132 is provided with a first opening 2111, and the second film body 2133 is provided with an avoidance groove 2134.

[0141] Optionally, the first film body 2132 and the second film body 2133 are integrally formed.

[0142] In some examples, the avoidance groove 2134 is provided at one end of the second film body 2133 away from the first opening 2111 along the length direction x.

[0143] In some examples, the third insulating layer 214 includes a fifth film body and a sixth film body arranged along the length direction x. The fifth film body and the sixth film body are connected. The width of the fifth film body is smaller than that of the sixth film body. The second opening 2112 and the third opening 2113 are provided on the fifth film body, and the avoidance groove 2134 is provided on the sixth film body.

[0144] Optionally, the width of the fifth film body is equal to that of the first film body 2132. One end of the second film body 2133 protrudes from the sixth film body along the width direction y, and the sixth film body protrudes from the other end of the second film body 2133.

[0145] Optionally, in the thickness direction z, the projection of the wire 2211 of the first circuit layer 222 on the first film body 2132 and the projection of the wire 2211 of the second circuit layer 223 on the first film body 2132 may partially overlap.

[0146] Optionally, in the thickness direction z, the projection of the wire 2211 of the first circuit layer 222 on the second film body 2133 and the projection of the wire 2211 of the second circuit layer 223 on the second film body 2133 are at least partially non - overlapping.

[0147] In these optional embodiments, the first film body 2132 and the second film body 2133 are differentially arranged, so that the narrower first film body 2132 can be flexibly embedded in a space - limited area, and the first film body 2132 occupies less space.

[0148] According to an embodiment of the present application, as Figure 7 shown, the first insulating layer 212 includes a third film body 2121 and a fourth film body 2122 arranged along the length direction x. The third film body 2121 is connected to the fourth film body 2122. The width of the third film body 2121 is smaller than that of the fourth film body 2122. The width of the first film body 2132 is less than or equal to the width of the third film body 2121, and the width of the second film body 2133 is less than the width of the fourth film body 2122.

[0149] Exemplarily, the first insulating layer 212 includes a first film body 2132 and a second film body 2133 arranged along the length direction x. The first film body 2132 is connected to the second film body 2133. The width of the first film body 2132 is smaller than that of the second film body 2133. A first opening 2111 is provided on the first film body 2132, and an avoidance groove 2134 is provided on the second film body 2133. The third insulating layer 214 includes a fifth film body and a sixth film body arranged along the length direction x. The fifth film body is connected to the sixth film body. The width of the fifth film body is smaller than that of the sixth film body. A second opening 2112 and a third opening 2113 are provided on the fifth film body, and an avoidance groove 2134 is provided on the sixth film body. The first insulating layer 212 includes a third film body 2121 and a fourth film body 2122 arranged along the length direction x. The third film body 2121 is connected to the fourth film body 2122. The widths of the first film body 2132 and the fifth film body are both equal to the width of the third film body 2121. The widths of the third film body 2121 and the sixth film body are both smaller than the width of the fourth film body 2122.

[0150] In these optional embodiments, the first insulating layer 212, as the bottom layer of the multiple insulating layers, can provide support for the second insulating layer 213, the third insulating layer 214, and each circuit layer 221, and can also block external interference from the circuit board 2, ensuring the lifespan and performance of the circuit board 2.

[0151] Refer to in combination Figure 8 , Figure 8 which is a schematic structural diagram of the circuit of the circuit board provided by an embodiment of the present application.

[0152] According to an embodiment of the present application, as shown in Figure 4 and Figure 8 , the wire 2211 includes a connection section 22111 and a straight section 22112. The straight section 22112 is connected to the end of the connection section 22111 and the pad 2212. The straight section 22112 extends along the length direction x of the circuit board 2. The connection sections 22111 on each circuit layer 22 do not overlap in the thickness direction z.

[0153] In some examples, the first circuit layer 222 includes a first wire 2211, the first wire 2211 includes a first connection segment 22111 and a first straight segment 22112, the first straight segment 22112 is connected to the end of the first connection segment 22111 and the pad 2212, and the first straight segment 22112 extends along the length direction x of the circuit board 2. The second circuit layer 223 includes a second wire 2211, the second wire 2211 includes a second connection segment 22111 and a second straight segment 22112, the second straight segment 22112 is connected to the end of the second connection segment 22111 and the pad 2212, and the second straight segment 22112 extends along the length direction x of the circuit board 2. The first connection segment 22111 and the second connection segment 22111 do not overlap in the thickness direction z.

[0154] Optionally, the first circuit layer 222 includes a plurality of first wires 2211 and a plurality of pads 2212. The plurality of first wires 2211 are arranged at intervals along the width direction y, and the plurality of pads 2212 are arranged at intervals along the length direction x. The first wire 2211 includes a first connection segment 22111 and a first straight segment 22112. Each first straight segment 22112 is connected to the end of the corresponding first connection segment 22111 and the pad 2212, and each first straight segment 22112 extends along the length direction x of the circuit board 2.

[0155] In some examples, the straight segments 22112 on each circuit layer 22 do not overlap in the thickness direction z. In other examples, the straight segments 22112 on each circuit layer 22 may partially overlap in the thickness direction z.

[0156] In some examples, at least a part of the connection segment 22111 can be at least one of a straight line shape, an arc shape, and a wave shape.

[0157] In these optional embodiments, each circuit layer 22 is arranged in a staggered manner in the thickness direction z for connecting the connector 3. The straight segments 22112 can be partially overlapped under the barrier of each insulating layer 21, maximizing the use of space, improving the utilization rate of the wiring space, and thus accommodating more circuit layers 22.

[0158] According to an embodiment of the present application, as Figure 4 and Figure 8 shown, the connection segment 22111 includes a straight portion 22113 and a connection portion 22114. The connection portion 22114 is connected to the straight portion 22113 and the straight segment 22112. The straight portion 22113 extends along the length direction x, and the straight portion 22113 is not collinear with the straight segment 22112. At least a part of the connection portion 22114 is arc-shaped.

[0159] Optionally, the connecting portion 22114 includes a first arc segment and a second arc segment. The first arc segment is connected to the second arc segment and the straight segment 22112, and the second arc segment is connected to the straight portion 22113. The first arc segment is convex outward, and the second arc segment is concave inward.

[0160] More optionally, the connecting portion 22114 includes a first arc segment, a vertical segment, and a second arc segment. The first arc segment is connected to the vertical segment and the straight segment 22112, and the second arc segment is connected to the vertical segment and the straight portion 22113.

[0161] In some examples, the insulating layer 21 includes a first film body 2132 and a second film body 2133 arranged along the length direction x. The first film body 2132 is connected to the second film body 2133. The width of the first film body 2132 is smaller than the width of the second film body 2133. The first film body 2132 covers at least a part of the straight segment 22112 along the thickness direction z. An avoidance groove 2134 is provided on the second film body 2133, and the avoidance groove 2134 is used to expose the straight segment 22112.

[0162] In these optional embodiments, with such an arrangement, it is easy to ensure that the connecting segments 22111 on each circuit layer 22 do not overlap in the thickness direction z.

[0163] According to an embodiment of the present application, as Figure 4 and Figure 8 shown, the connecting segments 22111 on each circuit layer 22 partially overlap in the thickness direction z.

[0164] In these optional embodiments, based on the effective barrier of the insulating layer 21, the connecting segments 22111 on each circuit layer 22 partially overlap in the thickness direction z, thereby improving the integration degree of the circuit board 2.

[0165] According to an embodiment of the present application, the battery device further includes a connector 3. The connector 3 is arranged at one end of the circuit board 2 along the length direction x of the circuit board 2, and the connector 3 is connected to the wire 2211.

[0166] In some embodiments, the battery device further includes a connector 3. The connector 3 is arranged at one end of the circuit board 2 along the length direction x of the circuit board 2, and the connector 3 is connected to the wire 2211.

[0167] The connector 3 serves as an output component of the circuit board 2, and it can be plugged into a plug-in component (such as a plug-in bracket) of the battery device. The circuit board 2 is connected to the connector 3 through the wire 2211. The parameter information collected by the circuit board 2 is transmitted to the output connector 3 through the wire 2211, and then the collected information is output through the connector 3.

[0168] In these optionally implemented embodiments, the connector 3 provides an external port for the circuit board, facilitating the connection of external devices.

[0169] In a second aspect, the present application provides an electrical device, including the battery device described above, and the battery device is used to store or provide electrical energy.

[0170] According to some embodiments of the present application, referring to Figures 3 to 5 and Figure 8 , the present application provides a battery device, which includes battery cells 1, a circuit board 2, and a connector 3.

[0171] The circuit board 2 includes a plurality of insulating layers 21 and a plurality of circuit layers 22, and the plurality of insulating layers 21 and the plurality of circuit layers 22 are alternately arranged along the thickness direction z of the circuit board 2. At least some of the plurality of insulating layers 21 are provided with openings, and at least some of the pads 2212 of the plurality of circuit layers 22 are opposite to the openings along the thickness direction z. The plurality of insulating layers 21 include a first insulating layer 212, a second insulating layer 213, and a third insulating layer 214 that are sequentially stacked along the thickness direction z. The second insulating layer 213 is provided with a first opening 2111. The third insulating layer 214 is provided with a second opening 2112 and a third opening 2113.

[0172] The plurality of circuit layers 22 include a first circuit layer 222 and a second circuit layer 223. The first circuit layer 222 is disposed between the first insulating layer 212 and the second insulating layer 213, and the second circuit layer 223 is disposed between the second insulating layer and the third insulating layer 214. Each circuit layer 22 includes at least one circuit 221, and the circuit 221 includes a connected wire 2211 and a pad 2212. At least a part of the wire 2211 is disposed between adjacent insulating layers 21. The first opening 2111 is opposite to the pad 2212 of the first circuit layer 222 along the thickness direction z. The second opening 2112 is opposite to the pad 2212 of the second circuit layer 223 along the thickness direction z. The third opening 2113 is opposite to the first opening 2111 along the thickness direction z.

[0173] The second insulating layer 213 includes a film body 2131. An avoidance groove 2134 is provided at one end of the film body 2131 close to the wire 2211 along the length direction x of the circuit board 2. The avoidance groove 2134 is used to avoid the end of the wire 2211 away from the pad 2212. The film body 2131 includes a first film body 2132 and a second film body 2133 arranged along the length direction x. The first film body 2132 is connected to the second film body 2133. The width of the first film body 2132 is smaller than the width of the second film body 2133. A first opening 2111 is provided on the first film body 2132, and the avoidance groove 2134 is provided on the second film body 2133. The first insulating layer 212 includes a third film body 2121 and a fourth film body 2122 arranged along the length direction x. The third film body 2121 is connected to the fourth film body 2122. The width of the third film body 2121 is smaller than the width of the fourth film body 2122. The width of the first film body 2132 is smaller than or equal to the width of the third film body 2121, and the width of the second film body 2133 is smaller than the width of the fourth film body 2122.

[0174] The wire 2211 includes a connection section 22111 and a straight section 22112. The straight section 22112 is connected to the end of the connection section 22111 and the pad 2212. The straight section 22112 extends along the length direction x of the circuit board 2. The connection sections 22111 on each circuit layer do not overlap in the thickness direction z. The connection section 22111 includes a straight portion 22113 and a connection portion 22114. The connection portion 22114 is connected to the straight portion 22113 and the straight section 22112. The straight portion 22113 extends along the length direction x, and the straight portion 22113 is not collinear with the straight section 22112. The connection portion 22114 is at least partially arc-shaped. The connection sections 22111 on each circuit layer 22 partially overlap in the thickness direction z.

[0175] The connector 3 is provided at one end of the circuit board 2 along the length direction x of the circuit board 2. The connector 3 is connected to the wire 2211.

[0176] Although the present application has been described with reference to the preferred embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A battery device, characterized in that: include: Battery cells; A circuit board comprises a plurality of insulating layers and a plurality of circuit layers, wherein the plurality of insulating layers and the plurality of circuit layers are alternately arranged along the thickness direction of the circuit board, the circuit layer comprises at least one circuit, the circuit comprises connected wires and pads, at least a portion of the wires is arranged between adjacent insulating layers, one side of each of the pads along the thickness direction is not covered by the insulating layer, and the pads are connected to the battery cells.

2. The battery device according to claim 1, characterized in that: At least part of the plurality of insulating layers is provided with openings, and at least part of the pads of the plurality of circuit layers is opposite to the openings along the thickness direction.

3. The battery device according to claim 1, characterized in that: The plurality of insulating layers include a first insulating layer, a second insulating layer and a third insulating layer which are sequentially stacked along the thickness direction; The plurality of circuit layers include a first circuit layer and a second circuit layer, the first circuit layer is arranged between the first insulating layer and the second insulating layer, and the second circuit layer is arranged between the second insulating layer and the third insulating layer; The side of the pad of the first circuit layer facing away from the first insulating layer is not covered by the second insulating layer and the third insulating layer, and the side of the pad of the second circuit layer facing away from the first insulating layer is not covered by the third insulating layer.

4. The battery device according to claim 3, characterized in that: The second insulating layer is provided with a first opening, and the first opening is opposite to the pad of the first circuit layer along the thickness direction; The third insulating layer is provided with a second opening, and the second opening is opposite to the pad of the second circuit layer along the thickness direction.

5. The battery device according to claim 4, characterized in that: The third insulating layer is provided with a third opening, and the third opening is opposite to the first opening along the thickness direction.

6. The battery device according to claim 4, characterized in that: In the width direction of the circuit board, at least one end of the second insulating layer protrudes from the third insulating layer, and the first opening is provided at a portion of the second insulating layer protruding from the third insulating layer.

7. The battery device according to claim 4, characterized in that: The second insulating layer is provided with a plurality of the first openings, the plurality of the first openings are arranged at intervals along the length direction of the circuit board, the first circuit layer includes a plurality of the circuits, and the plurality of the pads of the first circuit layer correspond to the plurality of the first openings one by one along the thickness direction; The third insulating layer is provided with a plurality of the second openings, the plurality of the second openings are arranged at intervals along the length direction of the circuit board, and the plurality of the second openings and the plurality of the first openings are staggered along the length direction of the circuit board, the second circuit layer includes a plurality of the circuits, and the plurality of the pads of the second circuit layer correspond one-to-one to the plurality of the second openings along the thickness direction.

8. The battery device according to claim 3, characterized in that: The second insulating layer includes a film body, and an avoidance groove is provided at one end of the film body away from the pad along the length direction of the circuit board, and the avoidance groove is used to avoid the end of the wire away from the pad.

9. The battery device according to claim 8, characterized in that: The membrane body includes a first membrane body and a second membrane body arranged along the length direction, the first membrane body is connected to the second membrane body, the width of the first membrane body is smaller than the width of the second membrane body, the first membrane body is provided with a first opening, and the second membrane body is provided with the avoidance groove.

10. The battery device according to claim 9, characterized in that: The first insulating layer includes a third film body and a fourth film body arranged along the length direction, the third film body is connected to the fourth film body, and the width of the third film body is smaller than the width of the fourth film body; The width of the first film body is smaller than or equal to the width of the third film body, and the width of the second film body is smaller than the width of the fourth film body.

11. The battery device according to claim 1, characterized in that: The conductive wire includes a connecting section and a straight section, wherein the straight section is connected to an end of the connecting section and the pad, and the straight section extends along the length direction of the circuit board. The connecting sections on each circuit layer do not overlap in the thickness direction.

12. The battery device according to claim 11, characterized in that: The connecting section comprises a straight portion and a connecting portion, wherein the connecting portion is connected to the straight portion and the straight section, the straight portion extends along the length direction, and the straight portion and the straight section are not colinear, and the connecting portion is at least partially arc-shaped.

13. The battery device according to claim 11, characterized in that: The connecting sections on each of the circuit layers partially overlap in the thickness direction.

14. The battery device according to claim 1, characterized in that: The battery device further comprises a connector, which is arranged at one end of the circuit board along the length direction of the circuit board, and the connector is connected to the wire.

15. An electrical device, characterized in that: The battery device comprises a battery device as claimed in any one of claims 1 to 14, wherein the battery device is used to provide electrical energy.

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