Antenna and electronic equipment

By setting the glue holes and grooves on the signal transmitting and receiving part of the antenna, the position deviation or deformation caused by impact force during the injection molding process is solved, and higher production yield and signal quality are achieved.

CN223023582UActive Publication Date: 2025-06-24LENOVO (BEIJING) LTD
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Patent Information

Application Number
CN202421919216.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-08
Publication Date
2025-06-24
Estimated Expiration
2034-08-08

AI Technical Summary

Technical Problem

During the injection molding process, existing antennas are susceptible to injection molding impact forces, causing position deviation or deformation, affecting the production yield of the whole machine and the signal transmission and reception quality.

Method used

Several pass-through holes and grooves are provided on the signal transmitting and receiving portion of the antenna. The pass-through holes penetrate along the thickness direction of the signal transmitting and receiving portion, and the grooves are recessed along the first side of the thickness direction toward the second side facing away from each other. Through these structures, colloids can pass through the pass-through holes and flow in the grooves during injection molding, reducing impact force and increasing colloid flow space.

Benefits of technology

Effectively prevent positional deviation or deformation caused by impact during the injection molding process of the antenna, improve the yield of the whole machine production, and ensure the quality of signal transmission and reception.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model discloses an antenna and electronic equipment, and relates to the technical field of electronic equipment. An antenna comprises a signal transmitting and receiving part, and the signal transmitting and receiving part is used for being arranged in the side wall of a frame body of electronic equipment in an injection molding mode. Wherein the signal receiving and transmitting part is provided with a plurality of glue passing holes, the glue passing holes penetrate through the signal receiving and transmitting part along the thickness direction of the signal receiving and transmitting part, and a first side, along the thickness direction, of the signal receiving and transmitting part is provided with a groove which is recessed towards a second side deviating from the first side.
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Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to an antenna and an electronic device. Background Art

[0002] Antenna structures are provided in terminal devices such as mobile phones and tablet computers.

[0003] Existing antennas are usually arranged inside the side walls of the device. The antenna is formed by die casting and then placed in a mold together with the device middle frame for injection molding to form an integral structure.

[0004] However, the antenna is not fixed in the mold. During the injection molding process, the colloid is injected and flows from the inside to the outside of the mold, and it is easy to generate an impact force to squeeze the antenna towards the edge of the mold, resulting in the displacement or even deformation of the antenna position, thereby affecting the production yield of the whole machine or the transceiver of the antenna signal. Utility Model Content

[0005] The first aspect of this application provides an antenna, which includes

[0006] A signal transceiver unit, which is used to be injection molded inside the side wall of the housing of the electronic device;

[0007] Wherein, a plurality of glue passing holes are provided on the signal transceiver unit. The glue passing holes penetrate the signal transceiver unit along the thickness direction of the signal transceiver unit, and a groove recessed from a first side along the thickness direction of the signal transceiver unit towards a second side is provided on the first side of the signal transceiver unit along its thickness direction.

[0008] In some alternative embodiments of the first aspect of this application, for the aforementioned antenna, a plurality of the glue passing holes are evenly distributed.

[0009] In some alternative embodiments of the first aspect of this application, for the aforementioned antenna, a plurality of the glue passing holes are connected through the groove.

[0010] In some alternative embodiments of the first aspect of this application, for the aforementioned antenna, the groove includes at least one first groove body;

[0011] The first groove body extends along the length direction of the signal transceiver unit.

[0012] In some alternative embodiments of the first aspect of this application, for the aforementioned antenna, the groove includes at least one second groove body;

[0013] The second groove body extends along the width direction of the signal transceiver unit, and the second groove body intersects with the first groove body.

[0014] In some alternative embodiments of the first aspect of this application, for the aforementioned antenna, the groove is distributed in a grid pattern.

[0015] In some modified embodiments of the first aspect of the present application, for the aforementioned antenna, one side of the signal transceiver portion is configured to face the outside of the electronic device, and the other side of the signal transceiver portion is configured to face the inside of the electronic device;

[0016] One side of the groove facing the edge of the signal transceiver portion is spaced apart from the edge of the signal transceiver portion.

[0017] In some modified embodiments of the first aspect of the present application, for the aforementioned antenna, the aperture of the glue-passing hole is 1.1 - 1.3 mm;

[0018] The depth of the groove is 0.2 - 0.3 mm.

[0019] In some modified embodiments of the first aspect of the present application, for the aforementioned antenna, the center distance between adjacent glue-passing holes is 4.4 - 4.6 mm.

[0020] The second aspect of the present application provides an electronic device, which includes

[0021] a housing,

[0022] an antenna;

[0023] The antenna includes a signal transceiver portion, which is configured to be injection-molded inside the side wall of the housing; a plurality of glue-passing holes are provided on the signal transceiver portion, and the glue-passing holes penetrate through the signal transceiver portion along the thickness direction of the signal transceiver portion; a groove recessed from a first side along the thickness direction of the signal transceiver portion towards a second side is provided on the first side of the signal transceiver portion along its thickness direction;

[0024] Wherein, the first side of the signal transceiver portion is closer to the outside of the electronic device than the second side. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features, and advantages of the exemplary embodiments of the present application will become readily understood. In the drawings, several embodiments of the present application are shown by way of illustration and not limitation, and like or corresponding reference numerals represent like or corresponding parts, wherein:

[0026] Figure 1 Schematically shows a structural diagram of the transceiver portion of the antenna provided in this embodiment;

[0027] Figure 2 Schematically shows a second structural diagram of the transceiver portion of the antenna provided in this embodiment;

[0028] Figure 3Schematically shows a schematic diagram of the inner structure of the transceiver part of the antenna provided in this embodiment;

[0029] Figure 4 Schematically shows a schematic diagram of the cooperation between the antenna provided in this embodiment and the housing of the electronic device;

[0030] Figure 5 Schematically shows Figure 4 A schematic cross-sectional view of part A along B-B in;

[0031] Explanation of the reference numerals in the drawings:

[0032] Signal transceiver part 1, housing 2, glue-passing hole 3, groove 4, first groove body 41, second groove body 42, housing 5. Detailed implementation manners

[0033] Hereinafter, the exemplary embodiments of the present disclosure will be described in more detail with reference to the drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be completely conveyed to those skilled in the art.

[0034] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meaning understood by those skilled in the art to which this application belongs.

[0035] The technical solution of this embodiment is to solve the above technical problems, and the general idea is as follows:

[0036] Embodiment 1

[0037] Referring to the attached Figure 1 and the attached Figure 3 , the antenna provided in this embodiment includes a signal transceiver part 1, and the signal transceiver part 1 is used to be injection-molded inside the side wall of the housing 2 of the electronic device; a plurality of glue-passing holes 3 are provided on the signal transceiver part 1, and the glue-passing holes 3 penetrate through the signal transceiver part 1 along the thickness direction of the signal transceiver part 1, and a groove 4 recessed from a first side along the thickness direction of the signal transceiver part 1 to a second side opposite to the first side is provided on the first side of the signal transceiver part 1 along its thickness direction.

[0038] It can be understood that, in order to solve the problem that the existing antenna is affected by the injection molding impact during the injection molding process and its position is shifted or broken, affecting the overall user experience of the machine, the antenna provided in this embodiment is provided with glue passing holes 3 and grooves 4 on the signal transceiver part 1. Then, during injection molding, the colloid can pass through the signal transceiver part 1 through the glue passing holes 3, reducing the impact force caused by the colloid flow on the signal transceiver part 1 and playing a role in pressure relief. At the same time, the setting of the groove 4 increases the flow space of the colloid on the first side of the signal transceiver part 1, and the colloid accommodation space on the first side in the thickness direction of the signal transceiver part 1 also increases synchronously, effectively preventing the signal transceiver part 1 from being impacted by the colloid and shifting or deforming in the direction of its first side.

[0039] Among them, the antenna provided in this embodiment can be a communication antenna, a WIFI antenna, a near-field communication antenna, a navigation satellite system antenna, etc.; the antenna provided in this embodiment can be but is not limited to being applied in mobile phones, tablet computers, laptop computers, satellite phones. The antenna provided in this embodiment is mainly for the case of being set at the side wall position of the electronic device, and the frame 5 of the electronic device can be a four-sided frame or a middle frame structure including some middle support plates. The antenna provided in this embodiment can include a signal transceiver part 1, a conductive elastic sheet (not shown in the figure), a feeding point (not shown in the figure), and a radio frequency chip (not shown in the figure). The radio frequency chip is set on the main board of the electronic device and externally leads the feeding point. The signal transceiver part 1 is inside the side wall of the frame 5 of the electronic device, and it has an exposed area, that is, the part not included in the frame. The exposed area is electrically connected to the feeding point through the conductive elastic sheet to achieve electrical connection with the radio frequency chip, and cooperate with the signal source for radio frequency signal transceiver to perform signal transceiver. The above settings can be easily understood by those skilled in the art and will not be elaborated here.

[0040] Among them, the signal transceiver part 1 is the radiation structure of the antenna, which needs to have good electrical conductivity to ensure that the antenna can effectively perform the conversion between electromagnetic waves and electrical signals; the signal transceiver part 1 also needs to have good properties for interacting with electromagnetic waves and can quickly perform the conversion between electromagnetic waves and electrical signals; in this embodiment, an aluminum alloy material can be selected to prepare the signal transceiver part 1, and it can be directly formed by die casting. The shape and size of the signal transceiver part 1 are not limited here, as long as it can be adapted to the side wall of the frame 5 of the electronic device, for example Figures 1 to 3 the long strip plate-like structure shown, and its thickness can be 0.5 mm. In this embodiment, the signal transceiver part 1 is used to be set inside the side wall of the frame 5 of the electronic device to perform signal transceiver. For example, the signal transceiver part 1 and the frame 5 can be integrally formed by injection molding.

[0041] Among them, the shape of the glue-passing hole 3 is not limited here and can be designed and adjusted according to actual needs. For example: circular opening, rectangular opening, etc. Compared with irregular shapes and shapes with small included angles (triangles, pentagrams), in this embodiment, the glue-passing hole 3 can be set as a regular figure or a figure without corners or included angles, such as a circle, thereby effectively improving the glue-passing rate of the glue-passing hole 3 and preventing the glue-passing pressure at the corners or included angles from being too large and affecting the pressure relief effect. The size of the glue-passing hole 3 is not limited here and can be designed and adjusted according to actual needs. If the overall size of the signal transceiver unit 1 is relatively large, the glue-passing hole 3 can be designed to be large-sized. Correspondingly, if the overall size of the signal transceiver unit 1 is relatively small, the glue-passing hole 3 can be designed to be small-sized. For example, the more appropriate size of the glue-passing hole 3 can be tested and determined through simulation experiments. In this embodiment, for a flat mobile phone, the aperture of the glue-passing hole 3 can be set to 1.1 - 1.3 mm, such as 1.2 mm. With this size setting, it can not only ensure the glue-passing and pressure relief effect but also prevent the surface from shrinking and denting after the frame 5 is injection-molded, which affects the appearance of the product. The distribution form of several glue-passing holes 3 in this embodiment is not limited here. It can be distributed according to a specified rule. For example: matrix arrangement, equally spaced linear arrangement, serpentine arrangement, etc.; it can also be disorderly distributed as long as the pressure relief effect is satisfied.

[0042] Among them, the shape, size and distribution of the groove 4 are not limited here and can be designed and adjusted according to actual needs. For example, the groove 4 itself can be a semi-circular groove, a U-shaped groove, an open groove, a closed groove, etc. The groove 4 can be in the form of a strip, a ring, a grid, etc. The groove 4 can be formed by die casting. The groove depth and groove width of the groove 4 can be designed and adjusted according to actual needs. For example, the thickness of the signal transceiver part 1 in this embodiment can be 0.5 mm, then the groove depth of the groove 4 can be 0.2 - 0.3 mm, for example, 0.25 mm, to avoid affecting the overall thickness and strength of the signal transceiver part 1 while ensuring the glue-containing space; the groove width can be 0.4 - 0.6 mm, for example, 0.5 mm, to avoid occupying too much area of the signal transceiver part and even reducing the strength of the signal transceiver part 1 and its signal transceiver function while ensuring the glue-containing different space; the groove 4 is recessed from the first side of the signal transceiver part 1 to the second side, so that when injecting glue, it can apply force to the second side along the thickness direction of the signal transceiver part 1, avoiding unnecessary impact or deviation in direction; in this embodiment, when the signal transceiver part 1 is injection-molded with the cooperation of the frame 5, its first side is used to face the outside of the electronic device, and the second side is used to face the inside of the electronic device; in this embodiment, the groove 4 can be connected or not connected to the glue-passing hole 3. The setting of the groove 4 can provide more accommodation space for the glue by thinning the signal transceiver part 1, increasing the glue volume between the first side and the outer wall of the side wall of the frame 5, or in other words, the thickness of the glue between the first side and the outer wall of the side wall of the frame after injection molding, thereby effectively avoiding the impact of the glue on the second side on the signal transceiver part 1. Even when the glue on the second side impacts the signal transceiver part 1 and causes it to shift to the first side to a certain extent, the glue passing through the glue-passing hole 3 and entering the groove 4 will push the signal transceiver part 1 back to the second side again, thereby effectively preventing the shift. Of course, grooves 4 can also be synchronously provided on the second side of the signal transceiver part 1 to buffer the flow impact of the glue, further reducing the impact on the signal transceiver part 1 and avoiding the movement or deformation of the signal transceiver part 1.

[0043] According to the above, for the antenna provided by the present application, the glue-passing hole 3 and the groove 4 are provided on the signal transceiver part 1, so that when injection molding is carried out in cooperation with the electronic device, the glue-passing pressure can be balanced, playing a role in pressure relief and preventing the signal transceiver part 1 from being impacted and displaced or deformed during the injection molding process; at the same time, the groove 4 is provided on the first side of the signal transceiver part 1, so that during the injection molding process, the flow space of the glue can be increased on the first side, and the thickness of the glue on the first side of the signal transceiver part 1 can be increased, preventing the signal transceiver part 1 from being impacted in the direction of the first side and displaced. Thus, the problem that the existing antenna is displaced or broken due to the injection molding impact during the injection molding process and affects the overall use experience of the machine is solved.

[0044] As used herein, the term "and / or" is merely a description of the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B is specifically understood as follows: It can include both A and B simultaneously, A can exist alone, or B can exist alone, and it can have any one of the above three situations.

[0045] Further, referring to the appendix Figure 1 , in the antenna provided in this embodiment, in a specific implementation, several of the glue-passing holes 3 are evenly distributed.

[0046] It can be understood that, in order to ensure uniform pressure relief and prevent local impact from causing deviation or deformation, in this embodiment, several glue-passing holes 3 are arranged in a uniformly distributed form, that is, at equal intervals and relatively evenly distributed according to the area of the first side or the second side of the signal transceiver unit 1. For example Figure 1 as shown in the figure, an in-line arrangement method or a matrix arrangement method is adopted to ensure that the impact force of the glue on the signal transceiver unit 1 at each position is basically the same when the glue on the second side passes through the glue-passing holes 3, and to ensure the overall stability of the signal transceiver unit 1; in this embodiment, the center distance between adjacent glue-passing holes 3 can be 4.4 - 4.6 mm, such as 4.5 mm, to avoid shrinkage marks while ensuring the glue-passing flow rate.

[0047] Further, referring to the appendix Figure 1 , in the antenna provided in this embodiment, in a specific implementation, several of the glue-passing holes 3 are connected through the groove 4.

[0048] It can be understood that, in order to improve the flow rate of the glue on the first side of the signal transceiver unit 1, in this embodiment, several of the glue-passing holes 4 are arranged to be connected to each other through the groove 4. Then, after the glue passes through the glue-passing holes 4, it can directly enter the groove, fill the groove 4 in the first time, shorten the glue-holding time of the groove 4, and improve its anti-impact rate. Of course, it can be understood that in this setting method, some of the glue-passing holes 3 can be connected to each other through some of the grooves 4, and the other glue-passing holes 3 can be connected to each other through other grooves 4, or all the glue-passing holes 3 can be connected to each other through the groove 4, and it can be designed and adjusted according to actual needs, space limitations, and process requirements, which is not limited here.

[0049] Further, referring to the appendix Figure 1 and the appendix Figure 2 , in the antenna provided in this embodiment, in a specific implementation, the groove 4 includes at least one first groove body 41; the first groove body 41 extends along the length direction of the signal transceiver unit 1.

[0050] It can be understood that in order to ensure the glue holding and pressure relief functions of the groove 4, the groove 4 in this embodiment can be set to include at least one first groove body 41, and the number of the first groove bodies 41 can be designed and adjusted according to actual needs. When the width of the signal transceiver part 1 is large, multiple first groove bodies 41 can be arranged in parallel, for example: Figure 5 , as shown in the cross-sectional view of the signal transceiver unit 1 in the side wall of the frame 5; the first groove body 41 extends along the length direction of the signal transceiver unit 1, thereby evenly distributing the adhesive pressure to various locations along the length direction of the signal transceiver unit 1, thereby preventing the uneven adhesive pressure from causing local deformation or displacement of the signal transceiver unit 1.

[0051] Further, see Attachment Figure 1 and attached Figure 2 In the antenna provided in this embodiment, in a specific implementation, the groove 4 includes at least one second groove body 42; the second groove body 42 extends along the width direction of the signal transceiver part 1, and the second groove body 42 intersects with the first groove body 41.

[0052] It can be understood that in order to maximize the adhesive space on the first side of the signal transceiver unit 1, a second slot body 42 can be further provided in this embodiment. The second slot body 42 and the first slot body 41 are arranged to intersect and form a Figure 1 The grid-like distribution of grooves 4 shown can also form Figure 2 The groove 4 is distributed in a T-shape or a U-shape as shown; the number of the second groove bodies 42 and the size of the second groove bodies 42 can be designed and adjusted according to actual needs, and can be the same as the first groove body 41 or different from the first groove body 41. No further details will be given here, and it can be understood that a third groove body obliquely connected between the first groove body 41 and the second groove body 42 can also be provided to further increase the area of ​​the groove 4 and increase the flow space of the colloid on the first side of the signal transceiver unit 1.

[0053] Further, see Attachment Figure 1 and attached Figure 2 In the antenna provided in this embodiment, in a specific implementation, the groove 4 is arranged at a distance from the edge of the signal transceiver part 1 on one side facing the edge of the signal transceiver part 1 .

[0054] It can be understood that in order to ensure the signal receiving and sending efficiency of the signal transceiver part 1, the groove 4 is spaced apart from the edge of the signal transceiver part 1 on one side facing the edge of the signal transceiver part 1, that is, the groove 4 is set in the form of a first side surface of the signal transceiver part 1, and is prohibited from extending or connecting to the outside of the first side surface. The spacing distance between the edge of the groove 4 and the edge of the first side surface can be but is not limited to 0.5mm, and can be designed and adjusted according to actual needs and actual simulation experiments.

[0055] Embodiment 2

[0056] Reference appendix Figure 4 And appendix Figure 5 In this embodiment, an electronic device is provided, which includes a housing 5 and an antenna; the antenna includes a signal transceiver 1, and the signal transceiver 1 is used to be injection-molded inside the side wall of the housing 5; a plurality of glue-passing holes 3 are provided on the signal transceiver 1, and the glue-passing holes 3 penetrate through the signal transceiver 1 along the thickness direction of the signal transceiver 1; a groove 4 recessed from a first side of the signal transceiver 1 in the thickness direction towards a second side is provided on the first side of the signal transceiver 1 along its thickness direction; wherein, the first side of the signal transceiver 1 is closer to the outside of the electronic device than the second side.

[0057] It can be understood that the antenna in this embodiment is the same as the antenna in Embodiment 1. For its specific structure and working principle, please refer to the detailed description of Embodiment 1 and will not be elaborated here. The provision of the glue-passing holes 3 and the groove 4 on the signal transceiver 1 enables the balancing of the glue-passing pressure when cooperating with the housing 5 for injection molding, plays a role in pressure relief, and prevents the signal transceiver 1 from being impacted and displaced or deformed during the injection molding process; at the same time, the provision of the groove 4 on the first side of the signal transceiver 1 enables an increase in the flow space of the colloid on the first side during the injection molding process, and increases the thickness of the colloid on the first side of the signal transceiver 1, preventing the signal transceiver 1 from being impacted and displaced in the direction of the first side.

[0058] As mentioned above, the above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An antenna, characterized in that: It includes: A signal transceiver unit, the signal transceiver unit is used to be injection-molded in a side wall of a frame of an electronic device; The signal transceiver part is provided with a plurality of glue holes, which penetrate the signal transceiver part along the thickness direction of the signal transceiver part. The signal transceiver part is provided with a groove on a first side along the thickness direction thereof, which is recessed toward a second side away from the first side.

2. The antenna according to claim 1, characterized in that: The plurality of glue holes are evenly distributed.

3. The antenna according to claim 1, characterized in that: A plurality of the glue holes are connected through the groove.

4. The antenna according to claim 1, characterized in that: The groove includes at least one first groove body; The first slot body extends along the length direction of the signal transceiver portion.

5. The antenna according to claim 4, characterized in that: The groove includes at least one second groove body; The second slot body extends along a width direction of the signal transceiver portion, and the second slot body intersects with the first slot body.

6. The antenna according to claim 1, characterized in that: The grooves are distributed in a grid shape.

7. The antenna according to claim 1, characterized in that: The first side of the signal transceiver portion is used to face the outside of the electronic device, and the second side of the signal transceiver portion is used to face the inside of the electronic device; The groove is arranged at a distance from the edge of the signal transceiver portion on one side thereof facing the edge of the signal transceiver portion.

8. The antenna according to claim 1, characterized in that: The diameter of the glue hole is 1.1-1.3mm; The groove depth of the groove is 0.2-0.3 mm.

9. The antenna according to claim 2, characterized in that: The center distance between adjacent glue holes is 4.4-4.6 mm.

10. An electronic device, characterized in that: It includes: Frame, antenna; The antenna comprises a signal transceiver part, the signal transceiver part is used to be injection-molded in the side wall of the frame; the signal transceiver part is provided with a plurality of glue holes, the glue holes penetrate the signal transceiver part along the thickness direction of the signal transceiver part; the signal transceiver part is provided with a groove on a first side along the thickness direction thereof, which is recessed toward a second side away from the first side; Wherein, the first side of the signal transceiver unit is closer to the outside of the electronic device than the second side.