Circuit module, radio frequency front-end module and communication equipment
By using the power module and isolation components in the RF front-end module, the cost problem caused by the independent power supply of each functional device in the traditional RF front-end module is solved, and the effect of reducing costs and improving isolation performance is achieved.
Patent Information
- Application Number
- CN202422220444.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-11
AI Technical Summary
In traditional RF front-end modules, each functional device uses a separate power chip independently, resulting in high production costs.
Design a circuit module in which functional devices (such as radio frequency devices, analog devices and digital devices) are powered by a shared power module and are isolated from the power terminals of each functional device through isolation components such as isolation inductors and filter capacitors to reduce power coupling and improve isolation performance.
By sharing power modules and isolation components, manufacturing costs are reduced, device redundancy is reduced, and isolation performance between functional devices is improved without affecting the performance of functional devices.
Smart Images
Figure CN223024422U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of mobile communication technologies, and particularly to a circuit module, a radio frequency front-end module, and a communication device. Background Art
[0002] With the development of technology and the continuous progress of society, the trend of miniaturization and high performance of radio frequency communication devices is accelerating, posing higher requirements for radio frequency front-end design. In mobile communication applications, due to the diverse radio frequency bands in different countries and regions, as well as different application scenarios, radio frequency front-end modules that support carrier aggregation and multiple-input multiple-output have emerged. In traditional radio frequency front-end modules, each functional device is powered by a separate power chip, which has the disadvantage of high manufacturing cost. Summary of the Utility Model
[0003] Based on this, in view of the above problems, it is necessary to provide a circuit module, a radio frequency front-end module, and a communication device that can reduce manufacturing costs.
[0004] A first aspect of this application provides a circuit module, including:
[0005] A power supply module;
[0006] Two or more functional devices, the input ends of each of the functional devices are connected to corresponding input ports, and the output ends of each of the functional devices are connected to corresponding output ports; the functional devices include at least one of radio frequency devices, analog devices, and digital devices;
[0007] Two or more isolation components, after being connected in sequence, each of the isolation components is connected to the output end of the power supply module, and the power supply ends of each of the functional devices are connected through a corresponding one of the isolation components.
[0008] In one embodiment, the radio frequency device includes at least one of a radio frequency amplifier, a mixer, and a phase shifter, and / or the power supply module is a PMU.
[0009] In one embodiment, the isolation component includes an isolation inductor, the isolation inductors in each of the isolation components are connected in series in sequence and then connected to the output end of the power supply module, and the power supply ends of each of the functional devices are connected through a corresponding one of the isolation inductors.
[0010] In one embodiment, the isolation component further includes a filter capacitor. In each of the isolation components, the first end of the isolation inductor is connected to the second end of the isolation inductor in the previous-stage isolation component or the output end of the power supply module, the first end of the filter capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filter capacitor is grounded; the capacitance value of the filter capacitor is the capacitance value within the allowable error range of the difference between the key performance set for the corresponding functional device and that in the case of a common power supply.
[0011] In one embodiment, the functional device is a radio frequency amplifier; the capacitance value of the filter capacitor is the capacitance value within the allowable error range of the difference between the gain and output return loss of the radio frequency amplifier connected to the second end of the corresponding isolation inductor and that in the case of a common power supply.
[0012] In one embodiment, the filter capacitor is an on-chip capacitor or a surface mount capacitor.
[0013] In one embodiment, the isolation inductor is an on-chip inductor, a substrate-wound inductor or a surface mount inductor.
[0014] In one embodiment, the circuit module further includes an output filter capacitor, the first end of the output filter capacitor is connected to the output end of the power supply module, and the second end of the output filter capacitor is grounded.
[0015] A second aspect of the present application provides a radio frequency front-end module, including the above-mentioned circuit module.
[0016] A third aspect of the present application provides a communication device, including a radio frequency antenna and the above-mentioned radio frequency front-end module.
[0017] For the above-mentioned circuit module, radio frequency front-end module and communication device, after connecting the isolation components in sequence and connecting them to the output end of the power supply module, and the power supply ends of each functional device are connected through a corresponding isolation component. By supplying power to each functional device through a shared power supply module, the problems of device redundancy and excessively high manufacturing cost caused by independent power supply for each functional device are reduced. Isolation components are also provided between the power supply ends of each functional device, improving the isolation performance between each functional device without affecting the performance of the functional device. Description of the Drawings
[0018] Figure 1 It is a structural block diagram of the circuit module in one embodiment;
[0019] Figure 2 It is a structural schematic diagram of the circuit module in one embodiment;
[0020] Figure 3 It is a structural example diagram of the circuit module in one embodiment;
[0021] Figure 4It is a comparison diagram of the output signal isolation degree curve of the circuit module in an embodiment. Detailed implementation manners
[0022] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0024] It can be understood that the terms "first", "second", etc. used in this application can be used herein to describe various components, but these components are not limited by these terms. These terms are only used to distinguish the first component from another component. For example, without departing from the scope of this application, the first resistor can be called the second resistor, and similarly, the second resistor can be called the first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.
[0025] It can be understood that in the following embodiments, "connection", if there is an electrical signal or data transfer between the connected circuits, modules, units, etc., should be understood as "electrical connection", "communication connection", etc.
[0026] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprises / include" or "has" etc. specify the presence of the stated features, wholes, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, operations, components, parts, or combinations thereof.
[0027] In one embodiment, as Figure 1 shown, a circuit module is provided, which includes a power supply module 110, more than two functional devices 120, and more than two isolation components 130. The input ends of the functional devices 120 are connected to corresponding input ports, and the output ends of the functional devices 120 are connected to corresponding output ports; after the isolation components 130 are connected in sequence, they are connected to the output end of the power supply module 110, and the power supply ends of the functional devices 120 are all connected through a corresponding isolation component 130.
[0028] Among them, the power supply module 110 can be an energy storage element such as a battery, which supplies power to each functional device 120 through the stored electric energy; the power supply module 110 can also be a power conversion circuit, which accesses an external power supply, converts it, and then supplies power to each functional device 120. The type of the power supply module 110 can be flexibly planned according to the environmental power supply and the performance requirements of the functional devices, so as to optimize the circuit performance and cost. In this embodiment, as Figure 2 shown, the power supply module 110 can specifically adopt a PMU (Power Management Unit), which supplies power to each functional device 120 after accessing the voltage VDD. The PMU integrates several types of power management chips, such as low dropout linear regulators (LDOs), DC / DC converters, etc., which can achieve higher power conversion efficiency, lower power consumption, and fewer components to adapt to the reduced board-level space, with lower cost. Further, the PMU can be a through-switch (SW), a low dropout linear regulator (LDO), or a buck-boost DC-DC converter, and will not be limited by the power supply voltage value during application. The voltage value can be flexibly configured according to the functional device 120 to optimize the performance. For example, when the voltage value is appropriate, a through-switch can be selected; when the voltage is too high, a low dropout linear regulator or a buck-boost DC-DC converter can be selected to step down the voltage; when the voltage is too low, a buck-boost DC-DC converter can be selected to step up the voltage.
[0029] The number and type of the functional devices 120 are not unique. Specifically, it can include at least one of radio frequency devices, analog devices, and digital devices. The isolation component 130 is applicable to the power isolation between different radio frequency devices, the power isolation between different analog devices, and the power isolation between different digital devices. In addition, the isolation component 130 is also applicable to the power isolation between any two of radio frequency devices, analog devices, and digital devices. The radio frequency device can specifically include at least one of a radio frequency amplifier, a mixer, and a phase shifter. For the convenience of understanding, the following will be explained by taking the functional device 120 as a radio frequency amplifier. Correspondingly, a circuit module including multiple radio frequency amplifiers is a radio frequency amplification circuit.
[0030] The number of RF amplifiers can be two or more. For example, the RF amplifiers may include RF amplifier AMP1, RF amplifier AMP2, RF amplifier AMPn, etc., and the specific number can be set according to actual needs. The amount of data of the isolation component 130 can be less than the number of RF amplifiers, the same as the number of RF amplifiers, or more than the number of RF amplifiers. In this embodiment, the number of isolation components 130 is one less than the number of RF amplifiers. One isolation component 130 is correspondingly provided between the power supply terminals of every two RF amplifiers. The power supply terminals of each RF amplifier are isolated by the isolation component 130, and without affecting the performance of each RF amplifier, the isolation deterioration between the RF amplifiers caused by power supply coupling is reduced.
[0031] In one embodiment, the isolation component 130 includes isolation inductors. The isolation inductors in each isolation component 130 are connected in series in sequence and then connected to the output terminal of the power supply module 110. The power supply terminals between each functional device 120 are connected through a corresponding isolation inductor. As Figure 2 shown, still taking the functional device 120 as an RF amplifier as an example, the RF amplifiers include RF amplifier AMP1 to RF amplifier AMPn. The input terminal of RF amplifier AMP1 is connected to the input port RFIN1, the output terminal of RF amplifier AMP1 is connected to the output port RFOUT1,..., the input terminal of RF amplifier AMPn is connected to the input port RFINn, and the output terminal of RF amplifier AMPn is connected to the output port RFOUTn. The number of isolation components 130 can be n - 1. The first isolation component 130 includes isolation inductor L1,..., the (n - 1)th isolation component 130 includes isolation inductor Ln - 1. After the isolation inductors L1 to Ln - 1 are connected in series in sequence, the other end of isolation inductor L1 is connected to the output terminal of the power supply module 110 and the power supply terminal of RF amplifier AMP1. Each common terminal between the isolation inductors L1 to Ln - 1 is respectively connected to the power supply terminal of a corresponding RF amplifier among RF amplifiers AMP2 - RF amplifier AMPn - 1. The other end of isolation inductor Ln - 1 is connected to the power supply terminal of RF amplifier AMPn.
[0032] In this embodiment, by sharing one power supply module 110 for all RF amplifiers, the problems of device redundancy and excessively high manufacturing cost caused by independent power supply for each RF amplifier are reduced. On this basis, the power supply terminals of each RF amplifier are isolated by the isolation inductors, and without affecting the performance of the RF amplifiers, the isolation performance between each RF amplifier is greatly improved.
[0033] Among them, the isolation inductor can be an on-chip inductor, a substrate-wound inductor, or a surface-mount inductor. The type of isolation inductor can be correspondingly selected according to the different setting methods of each functional device 120. Whether each functional device 120 is arranged on the same chip or on multiple chips, the isolation inductor can adopt an on-chip inductor, a substrate-wound inductor, or a surface-mount inductor to achieve the isolation of the internal power supply of the chip or the isolation of the power supply between chips, so as to be suitable for different application scenarios.
[0034] Further, the isolation component 130 further includes a filter capacitor. In each isolation component 130, the first end of the isolation inductor is connected to the second end of the isolation inductor in the previous-stage isolation component 130 or the output end of the power supply module 110, the first end of the filter capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filter capacitor is grounded. The filter capacitor can be an on-chip capacitor or a surface-mount capacitor, such as Figure 2As shown, taking the number of isolation components 130 being n - 1 as an example, the first isolation component 130 includes a filtering capacitor C2, …, the (n - 1)-th isolation component 130 includes a filtering capacitor Cn. The first end of the isolation inductor L1 in the first isolation component 130 is connected to the output end of the power supply module 110, and the first end of the isolation inductor in the subsequent isolation component 130 is connected to the second end of the isolation inductor in the previous isolation component 130. In each isolation component 130, the first end of the filtering capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filtering capacitor is grounded. The capacitance values of the filtering capacitors are not unique and can be set according to the performance requirements of the corresponding RF amplifier. In this embodiment, the capacitance value of the filtering capacitor is the capacitance value within the allowable error range of the difference between the key performance set for the corresponding functional device 120 and the case of a common power supply. It can be understood that according to the different types of the functional device 120, the specific type of the key performance will also be correspondingly different. Taking the functional device 120 as an RF amplifier as an example, the capacitance value of the filtering capacitor is the capacitance value within the allowable error range of the difference between the gain and output return loss of the RF amplifier connected to the second end of the corresponding isolation inductor and the case of a common power supply. This capacitance value needs to be large enough to cause the power supply terminal of the RF amplifier to have an AC short circuit to ground within the operating frequency range. Among them, the difference between the gain and output return loss of the RF amplifier and the case of a common power supply being within the allowable error range means that the RF amplifier shares the power supply module 110, and the difference in the gain of the RF amplifier before and after adding the isolation component 130, as well as the difference in the output return loss of the RF amplifier before and after adding the isolation component 130, are both within the corresponding allowable error ranges. In an n-channel input and n-channel output RF amplification circuit, n RF amplifiers share a power supply module 110. n output nodes VDD_AMP are obtained by connecting (n - 1) isolation inductors in series to supply power to the n RF amplifiers in sequence. At the same time, a suitable filtering capacitor to ground is connected to each node to ensure that the performance of the RF amplifier does not deteriorate. In addition, if the functional device 120 is other types of devices, the capacitance value of the filtering capacitor can be the capacitance value within the allowable error range of the difference between the key performance of the functional device 120 other than the isolation degree and the case of a common power supply.
[0035] In this embodiment, the power supply terminals of each RF amplifier are isolated by isolation inductors, and the filtering capacitors are reasonably distributed. Without affecting the performance of each RF amplifier, the isolation deterioration between RF amplifiers caused by power coupling is reduced, and at the same time, the stability of each RF amplifier and the entire circuit can also be improved.
[0036] In addition, the circuit module may further include an output filter capacitor C1. The first end of the output filter capacitor C1 is connected to the output end of the power supply module 110, and the second end of the output filter capacitor C1 is grounded. The specific capacitance value of the output filter capacitor C1 can be selected according to the output index requirements of the power supply module 110. By setting an output filter capacitor from the output end of the power supply module 110 to the ground, the output voltage can be stabilized.
[0037] As Figure 3 shown, taking a 2x2 RF amplification circuit as an example, the RF amplifier includes an RF amplifier AMP1 and an RF amplifier AMP2. The first end of the output filter capacitor C1 is connected to the output end of the power supply module 110, and the second end of the output filter capacitor C1 is grounded. The number of isolation components 130 is one, including an isolation inductor L1 and a filter capacitor C2. The first end of the isolation inductor L1 is connected to the output end of the power supply module 110 and the power supply end of the RF amplifier AMP1. The second end of the isolation inductor L1 is connected to the power supply end of the RF amplifier AMP2 and is grounded through the filter capacitor C2. The input port RFIN1 serves as the test point PORT1, the input port RFIN2 is the test point PORT2, the output port RFOUT1 is the test point PORT3, and the output port RFOUT2 is the test point PORT4. The RF amplifier AMP1 / RF amplifier AMP2 simultaneously operates in the B7 / B40 / B41 (2.3 - 2.7G) frequency band. The output signal of the RF amplifier AMP1 is output from the output port RFOUT1, and the output signal of the RF amplifier AMP2 is output from the output port RFOUT2. Figure 4 It is a comparison diagram of the output signal isolation curves of a scheme where two RF amplifiers share one power supply module (dashed line) and a scheme where two RF amplifiers share one power supply module and an isolation component is added (solid line). The isolation performance between the RF amplifier AMP1 and the RF amplifier AMP2 is measured by means of the isolation degree of the output port. As can be seen from Figure 4 this, the present application has an improvement in output isolation degree of 8 - 16 dB, and the effect is remarkable.
[0038] In one embodiment, a RF front - end module is provided, including the above - mentioned circuit module. The RF front - end module may further include a matching circuit and a filter. Each RF amplifier is connected to a corresponding filter through a corresponding input port, and each filter is connected to a corresponding matching circuit. Among them, the matching circuit can adopt an LC (inductor - capacitor) type matching topology structure or an L - type double - inductor matching topology structure. The filtering frequency band of each filter can be set according to actual needs. In addition, the number of circuit modules can be more than two, and isolation components can be provided between each circuit module, as well as between the matching circuit, the filter, and the circuit module.
[0039] Further, the RF front-end module may further include an RF switch. The RF switch is connected to each matching circuit and may also be connected to the RF antenna. Specifically, the RF switch includes a stationary contact and multiple movable contacts. The stationary contact is connected to the RF antenna, and each movable contact is connected to a corresponding matching circuit. It is possible to control the RF switch to open a single switch to enable each frequency band to operate independently; or it is also possible to control the RF switch to open two or more switches simultaneously to enable several frequency bands to operate simultaneously during carrier aggregation.
[0040] In one embodiment, a communication device is further provided, which includes an RF antenna and the above-mentioned RF front-end module. Further, the communication device may further include a controller, and the controller is connected to the RF switch to control the on / off of the RF switch. The type of the controller is not unique. For example, it may be a CPU (Central Processing Unit), an MCU (Microcontroller Unit), an FPGA (Field-Programmable Gate Array), or other devices.
[0041] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.
[0042] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.
Claims
1. A circuit module, characterized in that: include: Power module; More than two functional devices, the input end of each functional device is connected to the corresponding input port, and the output end of each functional device is connected to the corresponding output port; the functional device includes at least one of a radio frequency device, an analog device and a digital device; There are more than two isolation components, each of which is connected in sequence to the output end of the power module, and the power ends of each functional device are connected through a corresponding isolation component.
2. The circuit module according to claim 1, characterized in that: The radio frequency device includes at least one of a radio frequency amplifier, a mixer and a phase shifter, and / or the power supply module is a PMU.
3. The circuit module according to claim 1, characterized in that: The isolation component includes an isolation inductor. The isolation inductors in each isolation component are connected in series in sequence and then connected to the output end of the power module. The power ends of each functional device are connected through a corresponding isolation inductor.
4. The circuit module according to claim 3, characterized in that: The isolation component also includes a filter capacitor. In each of the isolation components, the first end of the isolation inductor is connected to the second end of the isolation inductor in the previous isolation component or the output end of the power module, the first end of the filter capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filter capacitor is grounded; the capacitance value of the filter capacitor is a capacitance value within an allowable error range for the difference between the key performance set for the corresponding functional device and the common power supply condition.
5. The circuit module according to claim 4, characterized in that: The functional device is a radio frequency amplifier; the capacitance value of the filter capacitor is a capacitance value that keeps the difference between the gain and output return loss of the radio frequency amplifier connected to the second end of the corresponding isolation inductor and the common power supply condition within the allowable error range.
6. The circuit module according to claim 4, characterized in that: The filter capacitor is an on-chip capacitor or a chip capacitor.
7. The circuit module according to claim 3, characterized in that: The isolation inductor is an on-chip inductor, a substrate winding inductor or a chip inductor.
8. The circuit module according to any one of claims 1 to 7, characterized in that: It also includes an output filter capacitor, a first end of the output filter capacitor is connected to the output end of the power module, and a second end of the output filter capacitor is grounded.
9. A radio frequency front-end module, characterized in that: A circuit module comprising any one of claims 1 to 8.
10. A communication device, characterized in that: It comprises a radio frequency antenna and the radio frequency front-end module as claimed in claim 9.