Multilayer circuit board for display module
By designing the structure of toggle slots and limit blocks on the multi-layer circuit board, the cumbersome problem of radiator disassembly in the prior art is solved, and a more convenient maintenance process is achieved.
Patent Information
- Application Number
- CN202422094487.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-28
AI Technical Summary
The existing multi-layer circuit boards are cumbersome when dismantling and maintaining the radiator, which is inconvenient to operate.
A multi-layer circuit board for display modules is designed. By setting multiple sets of toggle slots and limit blocks on the outside of the rotating sleeve, the arc-shaped rod in the toggle slot drives the limit block to break away from the limit of the heat-dissipating copper plate, and the lever is pushed up the heat-dissipating copper plate through the inclined groove, so as to facilitate the separation of the radiator.
Simplifies the disassembly and installation process of the radiator and improves the convenience and efficiency of maintenance.
Smart Images

Figure CN223024652U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board for a display module. Background Art
[0002] The multi-layer circuit board of the display module refers to a printed circuit board with multiple conductive layers made according to certain design requirements on a single-layer substrate. This multi-layer circuit board achieves high-speed transmission and efficient processing of circuit signals by stacking multiple functional layers together. The multi-layer circuit board of the display module is widely used in smart phones, automotive electronics, medical equipment, aerospace and other fields.
[0003] For example, publication number CN216291558U discloses a composite multi-layer circuit board with a heat dissipation structure. This solution can effectively improve the heat dissipation performance of the circuit board body by setting a heat dissipation structure on the top of the circuit board body, thereby solving the problem of poor heat dissipation in the original device, thereby ensuring the stable operation of the multi-layer circuit board. At the same time, the heat dissipation plate in the heat dissipation structure is easy to remove for cleaning and maintenance, which brings convenience to subsequent operators in maintaining the heat dissipation structure.
[0004] The multi-layer circuit board in the above patent needs to dissipate heat through the heat sink fins when in use. However, when the heat sink fins are disassembled and maintained, the four sets of clips need to be moved separately to disengage the heat sink fins from the limit, and then the heat sink fins are separated from the circuit board. This method of disassembling and maintaining the radiator is relatively cumbersome and inconvenient to disassemble the radiator on the multi-layer circuit board. Summary of the invention
[0005] The utility model aims to provide a multilayer circuit board for a display module, so as to solve the problem that the existing multilayer circuit board is not convenient for disassembly and maintenance of the heat sink as mentioned in the background art.
[0006] To achieve the above object, the utility model provides the following technical solution: a multilayer circuit board for a display module, comprising: a substrate and an arc rod, both sides of the substrate are provided with epoxy resin glass cloth boards, one side of the epoxy resin glass cloth board is connected to a copper foil board,
[0007] A heat dissipation copper plate is arranged on one side of the copper foil plate, a heat dissipation fin is fixed on the inner side of the heat dissipation copper plate, a fixed sleeve is arranged on the outer side of the heat dissipation copper plate, one side of the fixed sleeve is fixedly connected to the copper foil plate, a rotating sleeve is movably connected to the outer side of the copper foil plate, a toggle groove is arranged on one side of the rotating sleeve, and an arc rod is arranged on the inner side of the toggle groove, one side of the arc rod is fixedly connected to a limit block, and one side of the limit block is movably connected to the fixed sleeve through a rotating shaft.
[0008] Preferably, a tension spring is fixed to one side of the limit block, and one end of the tension spring is fixedly connected to the fixing sleeve.
[0009] Preferably, a movable groove is provided inside the fixing sleeve, and the movable groove is slidably connected to the shifting rod.
[0010] Preferably, one end of the shifting rod is fixedly connected to the inner side of the rotating sleeve, and an oblique groove matching the shifting rod is provided inside the heat dissipation copper plate.
[0011] Preferably, positioning blocks are fixed on both sides of the base plate, a connecting ring is fixed on one end of the positioning block, and open grooves are formed inside the connecting ring and the positioning block.
[0012] Preferably, positioning grooves are provided inside the epoxy resin glass cloth board and the copper foil board, and the positioning grooves are slidably connected to the positioning blocks.
[0013] Compared with the prior art, the multilayer circuit board for display modules has the following beneficial effects: by toggling the rotating sleeve to rotate on the outside of the fixed sleeve, the rotating sleeve can toggle the multiple groups of limit blocks through the multiple groups of toggle grooves on the outside to disengage the limit on the heat dissipation copper plate when the rotating sleeve rotates; at the same time, when the limit blocks are disengaged from the limit on the heat dissipation copper plate, the toggle rod will contact the inclined surface of the inclined groove at the bottom of the heat dissipation copper plate, and the toggle rod can lift the heat dissipation copper plate through the inclined surface of the inclined groove, so that the staff can separate the heat dissipation copper plate, the heat dissipation fins and the copper foil plate conveniently; by docking the positioning holes in the epoxy resin glass cloth board and the copper foil board with the positioning blocks on both sides of the substrate, when the epoxy resin glass cloth board and the copper foil board contact the connecting ring, the connecting ring and the positioning block will shrink toward the middle through the open groove, and the reset connecting ring can limit the copper foil board and the heat dissipation copper plate, and at this time, the substrate, the epoxy resin glass cloth board and the copper foil board will complete the positioning splicing.
[0014] 1. The multi-layer circuit board is an important component of the display module, which is generally composed of multiple functional layers. When the radiator on the circuit board is disassembled, the rotating sleeve is rotated on the outside of the fixed sleeve by toggling. When the rotating sleeve rotates, multiple groups of limit blocks can be rotated through multiple groups of toggling grooves on the outside to make the limit blocks disengage from the limit of the heat dissipation copper plate. At the same time, the rotating sleeve will also drive the lever to rotate in the movable groove at the bottom of the fixed sleeve. When the limit block is disengaged from the limit of the heat dissipation copper plate, the lever will contact the inclined surface of the inclined groove at the bottom of the heat dissipation copper plate. Through the inclined surface of the inclined groove, the lever can lift the heat dissipation copper plate, which is convenient for the staff to separate the heat dissipation copper plate, the heat dissipation fins and the copper foil plate. In this way, the radiator on the multi-layer circuit board can be easily disassembled and maintained through the above operations.
[0015] 2. Multilayer circuit board is an important component of display module, which is generally composed of multiple functional layers. When welding multilayer boards, these boards need to be positioned and spliced to prevent dislocation. The positioning holes in the epoxy resin glass cloth board and the copper foil board are connected with the positioning blocks on both sides of the substrate. When the epoxy resin glass cloth board and the copper foil board contact the connecting ring, the connecting ring and the positioning block will shrink to the middle through the opening groove. The reset connecting ring can limit the copper foil board and the heat dissipation copper plate. At this time, the substrate, epoxy resin glass cloth board and copper foil board will complete the positioning and splicing, which can facilitate the welding work. Through the above operation, it is convenient to position and splice the multilayer circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a three-dimensional schematic diagram of the utility model;
[0017] Figure 2 It is a three-dimensional cross-sectional schematic diagram of the utility model;
[0018] Figure 3 It is a three-dimensional cross-sectional schematic diagram of the fixing sleeve of the utility model;
[0019] Figure 4 This is a three-dimensional schematic diagram of the bottom of the fixed sleeve of the utility model;
[0020] Figure 5 It is an enlarged schematic diagram of A of the utility model;
[0021] Figure 6 This is a schematic diagram of the front cross-section of the epoxy resin glass cloth board of the utility model.
[0022] In the figure: 1, substrate; 2, epoxy resin glass cloth board; 3, copper foil board; 4, heat dissipation copper plate; 5, heat dissipation fins; 6, rotating sleeve; 7, toggle groove; 8, arc rod; 9, limit block; 10, tension spring; 11, toggle rod; 12, fixed sleeve; 13, movable groove; 14, inclined groove; 15, positioning block; 16, connecting ring; 17, open groove. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] See also Figures 1-4The utility model provides a technical solution: a multilayer circuit board for a display module, comprising: a substrate 1 and an arc rod 8, both sides of the substrate 1 are provided with an epoxy resin glass cloth board 2, one side of the epoxy resin glass cloth board 2 is connected with a copper foil board 3,
[0025] A heat dissipation copper plate 4 is arranged on one side of the copper foil plate 3, a heat dissipation fin 5 is fixed on the inner side of the heat dissipation copper plate 4, a fixed sleeve 12 is arranged on the outer side of the heat dissipation copper plate 4, one side of the fixed sleeve 12 is fixedly connected to the copper foil plate 3, a rotating sleeve 6 is movably connected to the outer side of the copper foil plate 3, a toggle groove 7 is provided on one side of the rotating sleeve 6, and an arc rod 8 is provided on the inner side of the toggle groove 7, one side of the arc rod 8 is fixedly connected to a limiting block 9, and one side of the limiting block 9 is movably connected to the fixed sleeve 12 through a rotating shaft; a tension spring 10 is fixed on one side of the limiting block 9, and one end of the tension spring 10 is fixedly connected to the fixed sleeve 12; a movable groove 13 is provided inside the fixed sleeve 12, and the movable groove 13 is slidably connected to the lever 11; one end of the lever 11 is fixedly connected to the inner side of the rotating sleeve 6, an oblique groove 14 matching the lever 11 is provided inside the heat dissipation copper plate 4, the lever 11, the fixed sleeve 12 and the movable groove 13 constitute a sliding structure, and the limiting block 9 constitutes a rotating structure with the fixed sleeve 12 through a rotating shaft.
[0026] In specific implementation, the multi-layer circuit board is an important component of the display module, and is generally composed of multiple functional layers stacked together. When the radiator on the circuit board is disassembled, the rotating sleeve 6 is rotated on the outside of the fixed sleeve 12 by toggling. When the rotating sleeve 6 rotates, the multiple groups of arc rods 8 can be rotated through the multiple groups of toggling grooves 7 on the outside. The arc rods 8 will drive the limit blocks 9 to rotate together, so that the limit blocks 9 are separated from the limit of the heat dissipation copper plate 4. When the limit blocks 9 rotate, the tension spring 10 will be stretched. At the same time, the rotating sleeve 6 will also drive the toggling rod 11 to rotate in the movable groove 13 at the bottom of the fixed sleeve 12. When the limit blocks 9 are separated from the heat dissipation copper plate 4, the limit blocks 9 will be pulled to extend. After the limit is reached, the lever 11 will contact the inclined surface of the inclined groove 14 at the bottom of the heat dissipation copper plate 4. Through the inclined surface of the inclined groove 14, the lever 11 can lift the heat dissipation copper plate 4, making it convenient for the staff to separate the heat dissipation copper plate 4, the heat dissipation fins 5 and the copper foil plate 3. When installing the radiator, the rotating sleeve 6 can be turned to drive the limit block 9 to rotate and stretch the tension spring 10. When the heat dissipation copper plate 4 and the heat dissipation fins 5 enter the interior of the fixed sleeve 12, the rotating sleeve 6 can be released. At this time, the tension spring 10 will be reset, pulling the limit block 9 to rotate to limit the heat dissipation copper plate 4. In this way, the above operation can facilitate the disassembly and maintenance of the radiator on the multi-layer circuit board.
[0027] See also Figure 1 , Figure 2 , Figure 5 and Figure 6, positioning blocks 15 are fixed on both sides of the substrate 1. One end of the positioning block 15 is fixed with a connecting ring 16, and opening grooves 17 are formed inside both the connecting ring 16 and the positioning block 15; positioning grooves are formed inside both the epoxy glass cloth board 2 and the copper foil board 3, and the positioning grooves are slidably connected to the positioning blocks 15. The positioning blocks 15 and the epoxy glass cloth board 2 form a sliding structure.
[0028] During specific implementation, the multi-layer circuit board is an important component in the display module, generally composed of multiple functional layers stacked together. When welding the multi-layer boards, it is necessary to position and splice these boards to prevent misalignment. By docking the positioning holes in the epoxy glass cloth board 2 and the copper foil board 3 with the positioning blocks 15 on both sides of the substrate 1, the conical surface at the top of the positioning block 15 can facilitate the docking operation. When the epoxy glass cloth board 2 and the copper foil board 3 come into contact with the connecting ring 16, the connecting ring 16 and the positioning block 15 will contract towards the middle through the opening groove 17. When the epoxy glass cloth board 2 and the copper foil board 3 pass through the positioning block 15 and the connecting ring 16, the positioning block 15 and the connecting ring 16 will reset. The reset connecting ring 16 can limit the copper foil board 3 and the heat dissipation copper plate 4. At this time, the substrate 1, the epoxy glass cloth board 2, and the copper foil board 3 will complete the positioning and splicing, which can facilitate the welding operation. Thus, through the above operations, it is convenient to position and splice the multi-layer circuit board.
[0029] In summary: When using the multi-layer circuit board for the display module, first, the epoxy glass cloth board 2 is an insulating layer, and the copper foil board 3 is a conductive layer. Conductive wires and components of the circuit are arranged on the outer side of the copper foil board 3 to achieve the transmission and processing of circuit signals. This is the characteristic of the multi-layer circuit board for the display module. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.
[0030] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. A multilayer circuit board for a display module, comprising: A substrate (1) and an arc-shaped rod (8), wherein both sides of the substrate (1) are provided with epoxy resin glass cloth plates (2), and one side of the epoxy resin glass cloth plate (2) is connected to a copper foil plate (3), characterized in that: A heat dissipation copper plate (4) is arranged on one side of the copper foil plate (3), a heat dissipation fin (5) is fixed on the inner side of the heat dissipation copper plate (4), a fixed sleeve (12) is arranged on the outer side of the heat dissipation copper plate (4), one side of the fixed sleeve (12) is fixedly connected to the copper foil plate (3), a rotating sleeve (6) is movably connected to the outer side of the copper foil plate (3), a toggle groove (7) is provided on one side of the rotating sleeve (6), an arc rod (8) is arranged on the inner side of the toggle groove (7), one side of the arc rod (8) is fixedly connected to a limit block (9), and one side of the limit block (9) is movably connected to the fixed sleeve (12) via a rotating shaft.
2. A multilayer circuit board for a display module according to claim 1, characterized in that: A tension spring (10) is fixed to one side of the limit block (9), and one end of the tension spring (10) is fixedly connected to the fixing sleeve (12).
3. A multilayer circuit board for a display module according to claim 2, characterized in that: A movable groove (13) is provided inside the fixing sleeve (12), and the movable groove (13) is slidably connected to the shifting rod (11).
4. A multilayer circuit board for a display module according to claim 3, characterized in that: One end of the shifting rod (11) is fixedly connected to the inner side of the rotating sleeve (6), and an inclined groove (14) matching the shifting rod (11) is provided inside the heat dissipation copper plate (4).
5. The multilayer circuit board for a display module according to claim 1, characterized in that: Positioning blocks (15) are fixed on both sides of the base plate (1), a connecting ring (16) is fixed on one end of the positioning block (15), and an opening groove (17) is provided inside the connecting ring (16) and the positioning block (15).
6. A multilayer circuit board for a display module according to claim 5, characterized in that: The epoxy resin glass cloth plate (2) and the copper foil plate (3) are both provided with positioning grooves inside, and the positioning grooves are slidably connected to the positioning blocks (15).
Citation Information
Patent Citations
Composite multilayer circuit board with heat dissipation structure
CN216291558U