Adjustable semiconductor dehumidification controller circuit board

Abstract

The utility model provides an adjustable semiconductor dehumidification controller circuit board. The adjustable semiconductor dehumidification controller circuit board comprises a power board, a voltage regulating module, a power supply module, a control board, a regulation and control module, a sensor interface and a switching value input and output module. According to the adjustable semiconductor dehumidification controller circuit board provided by the utility model, the power panel and the control panel which are independent are arranged, the power panel is provided with the plurality of external interfaces, and the plurality of external interfaces comprise the power input interface, the power output interface and the first internal interface; a control panel is arranged, a regulation and control module is installed on the control panel, and the power supply part and the control part are designed on independent circuit boards respectively and are connected through a first internal interface and a second internal interface. During installation, the power panel and the control panel can be installed separately, so that the stability of control signal transmission is prevented from being interfered by a power supply and high-power signals. And the operation stability of the control system is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of dehumidification control, and particularly relates to an adjustable semiconductor dehumidification controller circuit board. Background Art

[0002] With the continuous improvement of the power grid, there are more and more relevant power distribution equipment. In the power supply system, switch cabinets, ring main units, terminal boxes, etc. work in a humid and stuffy environment for a long time, and a large amount of water vapor will accumulate inside the cabinet body to form condensation. Once the condensation adheres to the insulating surface, it will accelerate the deterioration of the insulating medium, cause the circuit breaker to trip or electrical equipment to be damaged, and even cause major power accidents. Therefore, sufficient attention must be paid to the problem of humidity condensation in the distribution cabinet. For the dehumidification of the small space inside the cabinet, the semiconductor dehumidification method is mostly used.

[0003] Semiconductor dehumidification is to locally create condensation conditions to make the humid air inside the cabinet body condense into water and discharge the water outside the cabinet through a conduit, gradually reduce the humidity inside the cabinet, inhibit the generation of condensation, and avoid the aging of electrical insulation caused by condensation.

[0004] Since the inside of the cabinet is a relatively small enclosed space, in order to meet the applications of different cabinet sizes and different humidity environments. Usually, a regulation module is installed inside the semiconductor dehumidification device, and currently, the control module and the power supply module are installed on the same circuit board. Some power supplies and high-power signals on the circuit board are likely to interfere with the stability of the control signal transmission, and ultimately affect the stability of the control module. Summary of the Utility Model

[0005] The embodiment of the utility model provides an adjustable semiconductor dehumidification controller circuit board, aiming to solve the problem that the power supply module inside the semiconductor dehumidification device in the prior art is likely to interfere with the stability of the control signal transmission.

[0006] To achieve the above object, the technical solution adopted by the utility model is: to provide an adjustable semiconductor dehumidification controller circuit board, including:

[0007] A power supply board, on which a plurality of external interfaces are installed, and the external interfaces include a power input interface, a power output interface and a first internal interface;

[0008] A voltage regulation module, installed on the power supply board, and the first internal interface is electrically connected to the output end of the voltage regulation module;

[0009] A power supply module, arranged between the voltage regulation module and the power output interface, and electrically connected to the voltage regulation module and the power output interface respectively;

[0010] A control board, on which a second internal interface that can be electrically connected to the first internal interface is provided;

[0011] A regulation module, installed on the control board and electrically connected to the second internal interface;

[0012] A sensor interface, installed on the control board and electrically connected to the regulation module;

[0013] A digital input / output module, installed on the control board for information interaction with external devices.

[0014] In a possible implementation, the regulation module includes a voltage transformation module, a voltage regulation circuit, a setting module, and a main control chip disposed on the same side of the voltage transformation module. The voltage regulation circuit, the setting module, and the main control chip are sequentially arranged from top to bottom on the control board.

[0015] In a possible implementation, a fan interface and a sensor interface for electrically connecting to an external fan and a sensor are installed below the main control chip.

[0016] In a possible implementation, the second internal interface and the regulation module are respectively disposed on two sides of the control board.

[0017] In a possible implementation, a DO circuit module and a communication circuit module are also installed on the control board. The DO circuit module and the communication circuit module are on the same side of the control board as the second internal interface.

[0018] In a possible implementation, a temperature and humidity sensor for detecting the surrounding environment is also installed on the control board. The temperature and humidity sensor is on the same side of the control board as the second internal interface.

[0019] In a possible implementation, the power supply module includes a flyback power module, a rectification and filtering module, and an EMI circuit located on one side of the flyback power module.

[0020] In a possible implementation, a power interface for connecting to an external thermoelectric cooler is also installed inside the voltage regulation module.

[0021] The solution shown in the embodiments of the present application, compared with the prior art, by providing a separate power board and a control board, a plurality of external interfaces are installed on the power board, and the external interfaces include a power input interface, a power output interface, and a first internal interface; and a voltage regulation module electrically connected to the power input interface is installed to convert high voltage into low voltage to meet the use of the power output interface, the regulation module and the sensor interface on the control board. And by providing a control board, a regulation module is installed on the control board, the regulation module is electrically connected to a sensor interface, an external sensor can be connected, and the signal fed back by the sensor is transmitted to the regulation module. After the regulation module identifies the signal, it processes the information and feeds back the signal to the voltage regulation module. The voltage regulation module converts the voltage according to the information fed back by the regulation module and is externally connected to a thermoelectric cooler through a thermoelectric cooler interface. In the present application, the power supply part and the control part are respectively designed on separate circuit boards and are connected through the first internal interface and the second internal interface. During installation, the power board and the control board can be installed separately, avoiding the interference of power supply and high-power signals on the stability of control signal transmission and ensuring the stability of the control system operation. Description of the Drawings

[0022] Figure 1 Schematic diagram of the structure of the power board provided by the embodiment of the present utility model;

[0023] Figure 2 Schematic diagram of the front structure of the control board provided by the embodiment of the present utility model;

[0024] Figure 3 Schematic diagram of the back structure of the control board provided by the embodiment of the present utility model;

[0025] Figure 4 Working flow chart of the adjustable semiconductor dehumidification controller provided by the embodiment of the present utility model.

[0026] Description of the reference numerals:

[0027] 1. Power board; 11. Voltage regulation module; 2. External interface; 21. Power input interface; 22. Power output interface; 23. First internal interface; 24. Power interface; 3. Power supply module; 30. Second internal interface; 31. Flyback power module; 32. Rectification and filtering module; 33. EMI circuit; 4. Regulation module; 41. Voltage transformation module; 42. Voltage regulation circuit; 43. Setting module; 44. Main control chip; 45. DO circuit module; 46. Communication circuit module; 5. Sensor interface; 6. Fan interface; 7. Temperature and humidity sensor; 8. Control board. Detailed Embodiments

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model more clear and understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0029] Please refer to Figures 1 to 4 , and now the adjustable semiconductor dehumidification controller circuit board provided by the present utility model will be described. The adjustable semiconductor dehumidification controller circuit board includes a power supply board 1, a voltage regulating module 11, a power supply module 3, a control board 8, a regulation module 4, a sensor interface 5 and a digital input / output module. A plurality of external interfaces 2 are installed on the power supply board 1. The external interfaces 2 include a power input interface 21, a power output interface 22 and a first internal interface 23. The voltage regulating module 11 is installed on the power supply board 1, and the first internal interface 23 is electrically connected to the output end of the voltage regulating module 11. The power supply module 3 is arranged between the voltage regulating module 11 and the power output interface 22 and is electrically connected to the voltage regulating module 11 and the power output interface 22 respectively. A second internal interface 30 that can be electrically connected to the first internal interface 23 is arranged on the control board 8. The regulation module 4 is installed on the control board 8 and is electrically connected to the second internal interface 30. The sensor interface 5 is installed on the control board 8 and is electrically connected to the regulation module 4. The digital input / output module is installed on the control board 8 for information interaction with external devices.

[0030] Compared with the prior art, the adjustable semiconductor dehumidification controller circuit board provided in this embodiment is provided with a separate power supply board 1 and a control board 8. A plurality of external interfaces 2 are installed on the power supply board 1. The external interfaces include a power input interface 21, a power output interface 22 and a first internal interface 23. And a voltage regulating module 11 electrically connected to the power input interface 21 is installed to convert high voltage into low voltage to meet the use of the power output interface 22, the regulation module 4 and the sensor interface 5 on the control board 8. And by providing a control board 8, a regulation module 4 is installed on the control board 8. The regulation module 4 is electrically connected to a sensor interface 5, and an external sensor can be connected. The signal fed back by the sensor is transmitted to the regulation module 4. After the regulation module 4 identifies the signal, it processes the information and feeds back the signal to the voltage regulating module 11. The voltage regulating module 11 converts the voltage according to the information fed back by the regulation module 4 and is externally connected to a thermoelectric cooler through a thermoelectric cooler interface. In this application, the power supply part and the control part are separately designed on separate circuit boards and are connected through the first internal interface 23 and the second internal interface 30. During installation, the power supply board 1 and the control board 8 can be separately installed to avoid the interference of power supply and high-power signals on the stability of the control signal transmission. Ensure the stability of the control system operation.

[0031] Specifically, in this embodiment, the power input interface 21 and the power output interface 22 are installed on one side of the power board 1. The power input interface 21 is connected to the external 220V power supply, and after passing through the voltage regulation module 11, it is converted into DC12V and transmitted to the second internal interface 30 on the control board 8 through the first internal interface 23. At the same time, the 220V power supply is converted into a DC24V power supply through the voltage regulation module 11 and transmitted to the power supply module 3 to supply power to the power supply module 3. The power supply module 3 is electrically connected to the power output interface 22 and is used to supply power to the DO circuit and the communication circuit.

[0032] Preferably, in this embodiment, a thermoelectric cooler interface is also installed on the power board 1, and the thermoelectric cooler interface is electrically connected to the output end of the voltage regulation module 11.

[0033] Specifically, in this embodiment, the digital input / output module is electrically connected to the main control chip 44, and can transmit fault signals and electric auxiliary heating signals to implement hard shutdown protection of the device, such as heating start and fault alarm.

[0034] Specifically, in this embodiment, the first internal interface 23 and the second internal interface 30 are connected by a cable to enable the control board 8 to communicate with the power supply and signals on the power board.

[0035] In some embodiments, the above-mentioned regulation module 4 can adopt a structure such as Figure 2 、 Figure 4 shown. Referring together to Figure 2 、 Figure 4 , the regulation module 4 includes a voltage transformation module 41 and a voltage regulation circuit 42, a setting module 43 and a main control chip 44 arranged on the same side of the voltage transformation module 41. The voltage regulation circuit 42, the setting module 43 and the main control chip 44 are sequentially arranged on the control board 8 from top to bottom. The voltage regulation circuit 42 is electrically connected to the main control chip 44 and the voltage regulation module 11, and is used to amplify the signal sent by the main control chip 44 and send it to the voltage regulation module 11, so that the voltage regulation module 11 can regulate the voltage output to the thermoelectric cooler. The setting module 43 is electrically connected to the main control chip 44 and is used to adjust the set value. The main control chip 44 is located below the setting module 43. On the one hand, it can make better use of the space on the control board 8. At the same time, on the control board 8, all are low-voltage circuits, avoiding the influence of the control signal by the power supply and high-power signals.

[0036] Preferably, in this embodiment, the voltage regulation circuit 42 is located on one side of the second internal interface 30.

[0037] In some embodiments, the above-mentioned main control chip 44 can adopt a structure such as Figure 2 、 Figure 3 shown. Referring together to Figure 2 、 Figure 3, below the main control chip 44, a fan interface 6 and a sensor interface 5 for electrically connecting with an external fan and sensors are installed. The voltage conversion module 41 is used to receive the voltage transmitted by the second internal interface 30 and convert the voltage into a rated voltage for the main control chip 44, the external fan, and the sensors. It can further convert the low voltage transmitted by the voltage regulation module 11 to meet the usage of different electrical devices. The fan interface 6 and the sensor interface 5 are both located below the main control chip 44 and on the same side of the main control chip 44 as the voltage conversion module 41, facilitating the electrical connection between the voltage conversion module 41, the main control chip 44, the fan interface 6, and the sensor interface 5.

[0038] Specifically, in this embodiment, the main control chip 44 sends a signal to the voltage conversion module 41 and controls the output voltage at the fan interface 6 to control the working state of the external fan.

[0039] In some embodiments, the above-mentioned second internal interface 30 can adopt a structure such as Figure 2 , Figure 3 shown. Referring together to Figure 2 , Figure 3 , the second internal interface 30 and the regulation module 4 are respectively arranged on both sides of the control board 8. The second internal interface 30 and the regulation module 4 are located on both sides of the control board 8. When installing the control board 8 and the power supply board 1, the first internal interface 23 and the second internal interface 30 can be arranged opposite to each other, and the regulation module 4 on the control board 8 can be located on the outside, facilitating the operator to set and control.

[0040] In some embodiments, the above-mentioned control board 8 can adopt a structure such as Figure 3 shown. Referring to Figure 3 , a DO circuit module 45 and a communication circuit module 46 are also installed on the control board 8. The DO circuit module 45 and the communication circuit module 46 are on the same side of the control board 8 as the second internal interface 30. Arranging the electronic components of the DO circuit module 45 and the communication circuit module on the same side of the control board 8 as the second internal interface 30 can save the installation space of the control board 8, enabling electronic components to be arranged on both sides of the control board 8. At the same time, the DO circuit module 45 is electrically connected to the external interface 2 on the power supply board 1. The communication circuit module 46 consists of a power isolation and a 485 communication chip. The power isolation chip is used to isolate from the controller power supply to ensure that the 485 communication signal is not interfered; the 485 communication chip converts the serial communication signal into a 485 communication signal for communication with the upper computer.

[0041] In some embodiments, the above-mentioned control board 8 can adopt a structure such as Figure 3 shown. Referring to Figure 3, a temperature and humidity sensor 7 for detecting the surrounding environment is also installed on the control board 8. The temperature and humidity sensor 7 and the second internal interface 30 are located on the same side of the control board 8. The temperature and humidity sensor 7 is fixedly installed on the control board 8 and is electrically connected to the main control chip 44. It is used to detect the environmental parameters around the semiconductor dehumidification device and feedback them to the main control chip 44, so that the main control chip 44 makes corresponding adjustments to the output.

[0042] In some embodiments, the above power supply module 3 can adopt the structure as Figure 1 , Figure 4 shown. Referring together to Figure 1 , Figure 4 , the power supply module 3 includes a flyback power module 31, a rectifying and filtering module 32 and an EMI circuit 33 located on one side of the flyback power module 31. The flyback power module 31 is used to adjust the voltage to convert the external 220V voltage into the required voltage. The rectifying and filtering module 32 is used to eliminate the noise and clutter interference in the signal. The setting of the EMI circuit 33 can filter out electromagnetic interference, which is sufficient to ensure the interference caused by high-voltage electricity and high-power signals. Improve the stability of the control signal transmission on the control board 8.

[0043] In some embodiments, the above voltage regulating module 11 can adopt the structure as Figure 1 shown. Referring to Figure 1 , a power interface 24 for connecting to an external thermoelectric cooler is also installed inside the voltage regulating module 11. The power interface 24 connected to the thermoelectric cooler is located at the voltage regulating module 11. An electrical signal is sent to the voltage regulating module 11 through the main control chip 44, and the output voltage is changed through the voltage regulating module 11 and directly transmitted to the power interface 24. Ensure the stable output of the power supply.

[0044] Preferably, in this embodiment, a current acquisition circuit for monitoring the output current is also provided between the voltage regulating module 11 and the power interface 24. The current acquisition circuit is electrically connected to the main control chip 44 and is used to detect the stability of the output current and feedback information to the main control chip 44 to ensure the stability of the output power supply.

[0045] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An adjustable semiconductor dehumidification controller circuit board, characterized in that: include: A power board (1), wherein a plurality of external interfaces (2) are installed on the power board (1), wherein the external interfaces (2) include a power input interface (21), a power output interface (22) and a first internal interface (23); A voltage regulating module (11) is installed on the power board (1), and the first internal interface (23) is electrically connected to the output end of the voltage regulating module (11); A power supply module (3) is arranged between the voltage regulating module (11) and the power output interface (22), and is electrically connected to the voltage regulating module (11) and the power output interface (22) respectively; A control panel (8), wherein the control panel (8) is provided with a second internal interface (30) electrically connectable to the first internal interface (23); A control module (4) is mounted on the control board (8) and is electrically connected to the second internal interface (30); A sensor interface (5) is mounted on the control board (8) and is electrically connected to the control module (4); A switch quantity input and output module is installed on the control panel (8) and is used for information exchange with external equipment.

2. The adjustable semiconductor dehumidification controller circuit board according to claim 1, characterized in that: The control module (4) comprises a voltage transformation module (41) and a voltage regulation circuit (42), a setting module (43) and a main control chip (44) arranged on the same side of the voltage transformation module (41); the voltage regulation circuit (42), the setting module (43) and the main control chip (44) are arranged on the control board (8) in order from top to bottom.

3. The adjustable semiconductor dehumidification controller circuit board as claimed in claim 2, characterized in that: A fan interface (6) and the sensor interface (5) for electrically connecting to an external fan and a sensor are installed below the main control chip (44).

4. The adjustable semiconductor dehumidification controller circuit board according to claim 1, characterized in that: The second internal interface (30) and the regulating module (4) are respectively arranged on two sides of the control board (8).

5. The adjustable semiconductor dehumidification controller circuit board as claimed in claim 4, characterized in that: A DO circuit module (45) and a communication circuit module (46) are also installed on the control board (8); the DO circuit module (45), the communication circuit module (46) and the second internal interface (30) are located on the same side of the control board (8).

6. The adjustable semiconductor dehumidification controller circuit board according to claim 4 or 5, characterized in that: The control board (8) is also equipped with a temperature and humidity sensor (7) for detecting the surrounding environment. The temperature and humidity sensor (7) and the second internal interface (30) are located on the same side of the control board (8).

7. The adjustable semiconductor dehumidification controller circuit board according to claim 1, characterized in that: The power supply module (3) comprises a flyback power supply module (31), a rectifier filter module (32) and an EMI circuit (33) located on one side of the flyback power supply module (31).

8. The adjustable semiconductor dehumidification controller circuit board as claimed in claim 1, characterized in that: The voltage regulating module (11) is also internally provided with a power supply interface (24) for connecting to an external cooling plate.

Images