High-vacuum quantum chip storage box

Abstract

The utility model discloses a high-vacuum quantum chip storage box which comprises a first cavity, and a high-vacuum environment is formed in the first cavity and used for storing samples. The second chamber is communicated with the interior of the first chamber and used for transferring, storing and taking samples, and the size of the second chamber is smaller than that of the first chamber. According to the invention, the large chamber serves as a special storage area and can be used for densely stacking sample boxes, and the small chamber is wrapped in the large chamber and serves as a transfer platform and is communicated with the large chamber and isolated from the large chamber; as the space of the small chamber is small and the time for evacuating and breaking the small space is short, the time for storing and taking the chip can be greatly shortened by only frequently evacuating and breaking the small chamber, the efficiency is high, the sample boxes are stacked together in a concentrated manner, the overall storage volume can be greatly reduced, and the storage and taking operation is realized by designing the small chamber. Only one air pressure balancing device needs to be configured, and the equipment hardware cost is greatly reduced.

Description

Technical Field

[0001] The invention relates to the technical field of quantum chip preservation, and in particular to a high vacuum quantum chip storage box. Background Art

[0002] Quantum chips are the core components of quantum computers. Unlike traditional classical integrated circuit chips, quantum chips need to go through a complex system production process. Environmental temperature, cleanliness, noise, vibration, electromagnetic waves, and tiny impurity particles will have an impact on quantum chips. If the storage environment of quantum chip samples during or after tape-out does not meet the standards, superconducting quantum chips will absorb various impurities, and their key components such as Josephson junctions and superconducting capacitors will age, resulting in poor consistency of quantum bit frequency and reduced coherence time of quantum chips, and ultimately deterioration of the performance of quantum chips. High vacuum quantum chip storage boxes can provide a stable high vacuum storage environment for quantum chips to avoid affecting chip performance due to poor storage.

[0003] At present, quantum chip storage boxes are mostly designed as large cabinets similar to refrigerators, with several layers of partitions or drawers (chambers) inside, and a large number of quantum chips can be stacked in each layer of partitions or drawers (chambers). Due to the high vacuum degree required (generally the vacuum degree is required to be less than 10-3Pa), a fine pump (molecular pump) is required to cooperate with a rough pump (dry pump) for vacuuming.

[0004] Existing storage boxes are divided into two categories according to whether the chambers are independently vacuumed, namely, chambers are connected and chambers are independent.

[0005] The chamber connection is equivalent to a single-door refrigerator. The chambers are connected and have the same vacuum degree. Before each door is opened, the vacuum of each chamber is broken to normal pressure. After the door is opened and the chip sample is placed in, the vacuum is evacuated uniformly.

[0006] Disadvantages of chamber-connected storage boxes: Since the chambers are interconnected, the total volume is large. After each door is opened, all chambers will be exposed to the air, which will have unnecessary impacts on chambers that do not need to be operated. When the number of chips stored is large, the chip search speed is slow.

[0007] The chambers are independent, which is like a multi-door refrigerator. Each chamber is independent of each other. When operating a chamber (storing chips), the vacuum degree of other chambers will not be affected (or the impact is very small and can be ignored).

[0008] Disadvantages of chamber-independent storage boxes: Since the chambers are independent of each other, multiple fine pumps (molecular pumps) are required to avoid crosstalk (generally one molecular pump for each chamber). The use and maintenance costs of fine pumps (molecular pumps) are high, so the cost of the entire equipment will increase. Due to the large number of chamber doors, the overall sealing performance is poor. Summary of the invention

[0009] To solve the above technical problems, the present invention provides a high-vacuum quantum chip storage box, which includes a first chamber, in which a high-vacuum environment is formed for storing samples; a second chamber, which is internally connected to the first chamber and is used for transferring and accessing the samples, and the volume of the second chamber is smaller than that of the first chamber. Preferably: The second chamber is provided with a first chamber door and a second chamber door. The first chamber door is arranged on the outer wall of the second chamber, and the first chamber door is used to conduct or block the second chamber from the atmospheric environment;

[0010] The second chamber door is arranged on the inner wall of the second chamber, and the second chamber door is used to conduct or block the second chamber and the first chamber.

[0011] Preferably: It further includes a grasping device, which is arranged in the first chamber; when storing samples, the grasping device transfers the samples in the second chamber to the first chamber; when sampling, the grasping device transfers the samples in the first chamber to the second chamber.

[0012] Preferably: It further includes a third chamber, which is arranged outside the second chamber. A pressure balance device is arranged in the third chamber. The pressure balance device is respectively connected to the first chamber and the second chamber through pipelines, and the pressure values in the first chamber and the second chamber are adjusted through the pressure balance device.

[0013] Preferably: The pressure balance device includes a vacuum pumping system and a vacuum breaking system.

[0014] Preferably: The first chamber is provided with an air inlet hole and an air outlet hole. The air inlet hole of the first chamber is connected to the vacuum breaking system, and a protective gas is conveyed into the first chamber through the vacuum breaking system; the air outlet hole of the first chamber is connected to the vacuum pumping system, and the gas in the first chamber is extracted through the vacuum pumping system.

[0015] Preferably: The second chamber is provided with another air inlet hole and another air outlet hole. The air inlet hole of the second chamber is connected to the vacuum breaking system, and a protective gas is conveyed into the second chamber through the vacuum breaking system; the air outlet hole of the second chamber is connected to the vacuum pumping system, and the gas in the second chamber is extracted through the vacuum pumping system.

[0016] Preferably: The vacuum pumping system includes two valve bodies, a fine vacuum pump and a rough vacuum pump connected through pipelines. The two valve bodies are respectively connected to the two air outlet holes through pipelines. During the vacuum pumping process, a corresponding valve body is opened, and the gas in the chamber communicated with the valve body first passes through the fine vacuum pump and then is discharged through the rough vacuum pump.

[0017] Preferably, the vacuum-breaking system includes two valve bodies and a protective gas source connected by pipelines. The two valve bodies are respectively connected to the two air inlets through pipelines. During the vacuum-breaking process, a corresponding valve body is opened, and the protective gas enters the chamber communicated with the valve body through the pipeline communicated with the valve body.

[0018] Preferably, the samples in the first chamber are centrally arranged in a matrix, and multiple rows and columns of storage stations are arranged in the first chamber.

[0019] Technical effects and advantages of the present invention:

[0020] 1. In the present invention, the large chamber serves as a dedicated storage area where sample boxes can be densely stacked. The small chamber is enclosed in the large chamber and serves as a transfer platform, being sometimes connected to and sometimes isolated from the large chamber. Since the space of the small chamber is small, the evacuation and vacuum-breaking time for a small space is very short. Therefore, by only frequently evacuating and breaking the vacuum in the small chamber, the chip access time can be greatly shortened, and the efficiency is high.

[0021] 2. In the present invention, by stacking the sample boxes together, the overall storage volume can be greatly reduced. Then, by designing a small small chamber to achieve the access operation, only one set of air pressure balancing devices needs to be configured, which greatly reduces the equipment hardware cost. Description of the drawings

[0022] Figure 1 is a schematic structural diagram of a high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0023] Figure 2 is a three-dimensional view of the back of the high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0024] Figure 3 is in the high-vacuum quantum chip storage box provided by an embodiment of the present application Figure 2 is an enlarged schematic view of the structure at A;

[0025] Figure 4 is a front view of the high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0026] Figure 5 is a side sectional view of the high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0027] Figure 6 is a top view of the high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0028] Figure 7 is a schematic diagram of the principle of the high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0029] Figure 8It is a schematic diagram of the evacuation process of the high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0030] Figure 9 It is a schematic diagram of the sample storage process of the high-vacuum quantum chip storage box provided by an embodiment of the present application;

[0031] Figure 10 It is a schematic diagram of the sample sampling process of the high-vacuum quantum chip storage box provided by an embodiment of the present application.

[0032] In the figure:

[0033] 1. Outer cavity; 101. First intake hole; 102. First outlet hole; 11. Display screen; 12. Sample box; 13. Manipulator; 131. X-axis; 132. Z-axis; 133. Y-axis; 134. Jaw;

[0034] 2. Inner cavity; 201. Second intake hole; 202. Second outlet hole; 21. Outer door; 22. Door lock; 23. Inner door; 24. Outer door sealing ring; 25. Inner door push rod; 26. Inner door sealing ring; 27. In-position detection sensor; 28. In-place detection sensor; 29. Positioning card slot;

[0035] 3. Control cavity; 31. First valve body; 32. Second valve body; 33. Fine vacuum pump; 34. Rough vacuum pump; 35. Third valve body; 36. Fourth valve body; 37. Inlet pipe; 38. Exhaust pipe. Specific embodiments

[0036] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for the purpose of illustration and description, and are not exhaustive or limited to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and enable those of ordinary skill in the art to understand the present invention and thus design various embodiments with various modifications suitable for specific purposes.

[0037] In this embodiment, a high-vacuum quantum chip storage box is provided, which includes a first chamber. The first chamber is a large chamber, and a high-vacuum environment is formed in the first chamber for storing samples. A second chamber is internally communicated with the first chamber. The second chamber is a small chamber and is used for transferring and accessing samples. When accessing samples, after adjusting the pressure value in the second chamber to be the same as the expected pressure value, the second chamber is opened to access the samples.

[0038] In this embodiment, the volume of the second chamber is smaller than that of the first chamber. The second chamber is arranged inside the first chamber. By adjusting the pressure value in the second chamber with a smaller volume, the time for pressure adjustment can be shortened. Through the second chamber for transfer storage and the first chamber for long-term storage, the storage and retrieval efficiency can be greatly improved.

[0039] Furthermore, the second chamber is provided with a first chamber door and a second chamber door. The first chamber door is arranged on the outer wall of the second chamber. When the first chamber door is opened, the second chamber is in communication with the atmospheric environment. When the first chamber door is closed, the second chamber is blocked from the atmospheric environment. Samples can be conveniently stored and retrieved by opening and closing the first chamber door.

[0040] The second chamber door is arranged on the inner wall of the second chamber and is used to connect the second chamber and the first chamber. When the second chamber door is opened, the second chamber is in communication with the first chamber. When the second chamber door is closed, the second chamber is blocked from the first chamber.

[0041] In specific implementation, open the first chamber door and close the second chamber door. The second chamber is in communication with the atmosphere. After storing and retrieving samples from the second chamber, close the first chamber door again.

[0042] Open the second chamber door and close the first chamber door. The second chamber is in communication with the first chamber. Transfer the sample from the first chamber to the second chamber for material retrieval or transfer the sample from the second chamber to the first chamber for material storage.

[0043] It should be noted that when storing and retrieving samples, the first chamber door and the second chamber door cannot be opened simultaneously. Each time the first chamber door and the second chamber door are opened, the pressure value in the second chamber needs to be adjusted to the same expected pressure value after opening the door before opening the first chamber door. Otherwise, it will damage the high-vacuum environment of the first chamber or cause the components in the second chamber to be damaged by excessive pressure drop.

[0044] Furthermore, multiple rows and columns of storage stations are arranged inside the first chamber. The samples in the first chamber are centrally placed in a matrix for long-term storage. A grasping device is also arranged inside the first chamber. When storing samples, after the sample is placed in the second chamber, the grasping device transfers the sample to the first chamber for storage. When retrieving samples, the grasping device transfers the sample stored in the first chamber to the second chamber and then retrieves the sample from the second chamber.

[0045] When storing and retrieving samples, it is only necessary for an operator to place the sample in the second chamber, and then the grasping device transfers the sample, making the operation more convenient.

[0046] Furthermore, a third chamber is also included, which is arranged outside the second chamber. A pressure balancing device is arranged inside the third chamber. The pressure balancing device includes a vacuum pumping system and a vacuum breaking system. The pressure balancing device is respectively connected to the first chamber and the second chamber through pipelines to adjust the pressure values in the first chamber and the second chamber.

[0047] Further, an air inlet hole and an air outlet hole are provided in the first chamber. The air inlet hole of the first chamber is connected to a vacuum breaking system, and a protective gas is conveyed into the first chamber through the vacuum breaking system to adjust the pressure value in the first chamber to be the same as the atmospheric pressure value. The air outlet hole of the first chamber is connected to a vacuum pumping system, and the gas in the first chamber is extracted through the vacuum pumping system to adjust the pressure value in the first chamber to be the same as the pressure value in the second chamber;

[0048] Moreover, another air inlet hole and another air outlet hole are provided in the second chamber. The air inlet hole of the second chamber is connected to the vacuum breaking system, and a protective gas is conveyed into the second chamber through the vacuum breaking system to clean the gas in the second chamber and ensure the purity and quality of the gas in the second chamber. The air outlet hole of the second chamber is connected to the vacuum pumping system, and the gas in the second chamber is extracted through the vacuum pumping system to form a high-vacuum environment in the second chamber for storing samples.

[0049] Further, the vacuum pumping system includes two valve bodies, a fine vacuum pump, and a rough vacuum pump connected by pipelines. The two valve bodies are respectively connected to the two air outlet holes through pipelines. During the vacuum pumping process, a corresponding valve body is opened, and the gas in the chamber communicated with the valve body first passes through the fine vacuum pump and then is discharged through the rough vacuum pump.

[0050] Further, the vacuum breaking system includes two valve bodies and a protective gas source connected by pipelines. The two valve bodies are respectively connected to the two air inlet holes through pipelines. During the vacuum breaking process, a corresponding valve body is opened, and the protective gas enters the chamber communicated with the valve body through the pipeline communicated with the valve body.

[0051] In the present invention, the large chamber serves as a dedicated storage area where sample boxes can be densely stacked. The small chamber is wrapped in the large chamber and serves as a transfer platform, being sometimes connected to and sometimes isolated from the large chamber. Since the space of the small chamber is small and the evacuation and vacuum breaking times for a small space are very short, by only frequently evacuating and breaking the vacuum of the small chamber, the chip access time can be greatly shortened, and the efficiency is high.

[0052] Stacking the sample boxes together can greatly reduce the overall storage volume. Then, by designing a small small chamber to implement the access operation, and the first chamber, the second chamber, and the third chamber are independently designed. Only one air pressure balancing device needs to be configured to adjust the pressure values in the first chamber and the second chamber, greatly reducing the equipment hardware cost.

[0053] Refer to Figure 1As shown, in a specific embodiment, a high-vacuum quantum chip storage box is provided. In this embodiment, the first chamber is the outer chamber 1, the second chamber is the inner chamber 2, and the third chamber is the control chamber 3. The inner chamber 2 is placed inside the outer chamber 1 and is located at the bottom of the outer chamber 1. The volume of the inner chamber 2 is smaller than that of the outer chamber 1. Due to the small volume of the inner chamber 2, the time required to evacuate or break the vacuum in the inner chamber 2 is very short when accessing the sample. Through the inner chamber 2 for transfer access and the outer chamber 1 for long-term storage, the access efficiency can be greatly improved.

[0054] Refer to Figure 2 and Figure 4 As shown, the outer chamber 1 includes a display screen 11 and a sample box 12. The display screen 11 is installed on the outer surface of the outer chamber 1 and is used to display storage information and perform operation actions. The sample boxes 12 are arranged in an array in the middle of the outer chamber 1 and are used for long-term storage of chips.

[0055] It can be understood that a support framework (not shown in the figure) is also provided inside the sample box 12 to support the sample box 12.

[0056] In this embodiment, the grasping device is a manipulator 13. The manipulator 13 is installed inside the outer chamber 1. The manipulator 13 includes an X-axis 131, a Z-axis 132, a Y-axis 133, and a gripper 134. The three axes formed by the X-axis 131, the Z-axis 132, and the Y-axis 133 are perpendicular to each other and can position and grasp the sample box 12 inside the outer chamber 1, with a high degree of automation.

[0057] It can be understood that the structure of the manipulator 13 is simple and belongs to the commonly used three-axis manipulator in the prior art, so it is not described in detail in this application.

[0058] In another embodiment, the grasping device can also be other mechanisms that can achieve automatic grasping, such as a robotic arm, for positioning and grasping the sample box 12.

[0059] Refer to Figure 3 As shown, in this embodiment, the first chamber door includes an outer door 21, and the second chamber door includes an inner door 23. The inner chamber 2 includes an outer door 21, a door lock 22, an inner door 23, an outer door sealing ring 24, an inner door push rod 25, an inner door sealing ring 26, an in-position detection sensor 27, an in-place detection sensor 28, and a positioning slot 29. The outer door 21 is provided on the outer wall of the inner chamber 2. The door lock 22 is provided on the outer door 21. The outer door 21 is hinged to the inner chamber 2. The outer door sealing ring 24 is provided at the connection between the inner chamber 2 and the outer door 21. When the outer door 21 is locked by the door lock 22, the outer door 21 abuts against the outer door sealing ring 24, and the sealing performance of the inner chamber 2 is improved through the outer door sealing ring 24.

[0060] Further, the inner door 23 is arranged on the inner wall of the inner cavity 2, at the connection between the inner cavity 2 and the outer cavity 1. The inner door 23 is hinged to the inner cavity 2. One end of the inner door push rod 25 is hinged to the inner door 23, and the other end of the inner door push rod 25 is hinged to the inner cavity 2. The inner door 23 is driven by the inner door push rod 25 to open and close.

[0061] In another embodiment, the inner door 23 can also be driven by a cylinder or an electric cylinder to open and close the inner door 23 in a hinge manner, and can also be opened in other ways, such as being pushed and pulled horizontally or being opened by an automatic folding door mechanism.

[0062] Further, an inner door sealing ring 26 is arranged at the connection between the inner cavity 2 and the inner door 23. When the inner door 23 is closed, the inner door 23 abuts against the inner door sealing ring 26, and the sealing performance of the inner cavity 2 is improved through the inner door sealing ring 26.

[0063] Further, a positioning card slot 29 is also arranged on the bottom surface of the inner cavity 2. The positioning card slot 29 is U-shaped, which is convenient for quickly guiding the sample box 12 into place when storing the sample box 12. A presence detection sensor 27 is arranged on one side of the positioning card slot 29 for detecting whether the sample box 12 is in place, and a position detection sensor 28 is arranged on one side of the positioning card slot 29 for detecting whether the sample box 12 is pushed to the position. If it is not pushed in place, an alarm and abnormal reminder will be triggered.

[0064] In this embodiment, preferably, the position detection sensor 28 is arranged above the rear side of the positioning card slot 29, and the presence detection sensor 27 and the position detection sensor 28 are located on both sides of the positioning card slot 29 to position the sample box 12, avoiding positioning deviation, so that the manipulator can accurately grasp the correct position.

[0065] Refer to Figure 5 、 6 As shown in FIGS. 7, in this embodiment, the third chamber includes a control chamber 3. A pneumatic balance device is arranged in the control chamber 3. The pneumatic balance device includes a vacuum pumping system and a vacuum breaking system. The pneumatic balance device includes a first valve body 31, a second valve body 32, a fine vacuum pump 33, a rough vacuum pump 34, a third valve body 35, a fourth valve body 36, an air inlet pipe 37 and an air extraction pipe 38.

[0066] Specifically, the vacuum breaking system includes the first valve body 31 and the third valve body 35 connected in parallel through pipelines, and both the first valve body 31 and the third valve body 35 are connected to the air inlet pipe 37 through pipelines. The air inlet pipe 37 is externally connected to a nitrogen source, and the on-off of the corresponding pipelines is controlled through the first valve body 31 and the third valve body 35.

[0067] Specifically, the vacuum pumping system includes a second valve body 32 and a fourth valve body 36 connected in parallel through pipelines. Both the second valve body 32 and the fourth valve body 36 are connected to the intake port of a fine vacuum pump 33 through pipelines. The outlet port of the fine vacuum pump 33 is connected to the intake port of a rough vacuum pump 34 through a pipeline. The outlet port of the rough vacuum pump 34 is connected to a suction pipe 38. The on / off of the corresponding pipelines is controlled by the second valve body 32 and the fourth valve body 36.

[0068] It can be understood that a check valve and a silencer can also be connected at the suction pipe 38 to prevent air flow from flowing back and reduce noise.

[0069] To cooperate with the use of the vacuum breaking system and the vacuum pumping system, two holes are respectively opened at the bottoms of the outer cavity 1 and the inner cavity 2. Among them, a first intake hole 101 and a first outlet hole 102 are provided at the bottom of the outer cavity 1. The first intake hole 101 is connected to a first valve body 31 through a pipeline, and the first outlet hole 102 is connected to the second valve body 32 through a pipeline.

[0070] A second intake hole 201 and a second outlet hole 202 are provided at the bottom of the inner cavity 2. The second intake hole 201 is connected to a third valve body 35 through a pipeline, and the second outlet hole 202 is connected to the fourth valve body 36 through a pipeline.

[0071] Preferably, the fine vacuum pump 33 can be a molecular pump. When pumping vacuum, a relatively high vacuum degree can be achieved in the outer cavity 1 and the inner cavity 2.

[0072] Preferably, the rough vacuum pump 34 can be a vacuum pump.

[0073] In specific implementation, when the vacuum pumping system is in use, first start the vacuum pump for rough pumping. After reaching the predetermined pressure value, then start the molecular pump for fine pumping.

[0074] It should be noted that the fine pumping cannot be directly performed on the outer cavity 1 and the inner cavity 2 at normal pressure (which is equivalent to high pressure for high vacuum). In this way, the pressure difference is too large and it is easy to impact the blades of the fine vacuum pump 33, causing damage to the blades.

[0075] Furthermore, vacuum gauges (not shown in the figure) can be respectively installed inside the outer cavity 1 and the inner cavity 2 to monitor the vacuum degree values of the outer cavity 1 and the inner cavity 2 in real time.

[0076] Refer to Figure 7 As shown, in the specific implementation manner, there are four working conditions: evacuation, sample storage, sample extraction, and cleaning.

[0077] 1. Evacuation process

[0078] Refer to Figure 8 As shown, the evacuation process is the vacuum pumping process when the equipment reaches the normal working state.

[0079] First, the initial state is confirmed to ensure that the outer door 21 and the inner door 23 are both closed, and the first valve body 31 and the third valve body 35 are both closed;

[0080] Then, the second valve body 32 and the fourth valve body 36 are opened, the roughing pump 34 is turned on, and roughing begins. After the outer chamber 1 reaches a predetermined pressure value, the fine pump 33 is turned on to reach a predetermined pressure value, and the fourth valve body 36 is closed. At the same time, the second valve body 32 is in an open state, and the outer chamber 1 is kept in an evacuated state. The outer chamber 1 is maintained in a high vacuum state, and the third valve body 35 is opened. After nitrogen is filled into the inner chamber 2 to atmospheric pressure, the third valve body 35 is closed and enters a working standby state.

[0081] During the evacuation process, nitrogen is used as a protective gas to isolate the air and ensure that the inner cavity 2 is in normal working condition and is filled with nitrogen, providing conditions for rapid sample storage later.

[0082] 2. Sample storage process

[0083] See also Figure 9 As shown, the sample storage process corresponds to the operation process when storing chip samples. First, manually open the outer door 21, manually take out the sample box 12, put in the chip, and push the sample box 12 into place. If the sample box 12 is not placed in place, it will be detected by the in-place detection sensor 28 and output an alarm reminder. Then manually close the outer door 21 and lock the door lock 22 to complete the sample storage operation.

[0084] The second valve body 32 is closed, and the fine pump 33 is closed, cutting off the connection between the outer chamber 1 and the inner chamber 2. Since the volume of the inner chamber 2 is very small, it will be roughly pumped out very quickly. Therefore, the closing time of the second valve body 32 is very short, and the influence on the vacuum degree of the outer chamber 1 can be ignored. In addition, the molecular pump cannot be used directly to pump nitrogen under atmospheric pressure, which will damage the molecular pump blades, so it needs to be closed briefly.

[0085] The fourth valve body 36 is opened, and rough pumping is performed to a predetermined pressure value. The rough pump 34 is always in working state and is not shut down. The fine pump 33 can be turned on only after rough pumping reaches a certain vacuum value.

[0086] The second valve body 32 is opened. At this time, although the vacuum values ​​of the inner cavity 2 and the outer cavity 1 are inconsistent, the inner cavity 2 is at a low vacuum and the outer cavity 1 is at a high vacuum. After the second valve body 32 is opened, the inner cavity 2 and the outer cavity 1 are connected. Since the inner cavity 2 is very small, the trace gas of the low vacuum inside the inner cavity 2 will be diluted into the outer cavity 1. With the fine pump 33 immediately turned on, it can quickly return to a high vacuum state, so the influence on the high vacuum of the outer cavity 1 can be ignored.

[0087] The fine pumping pump 33 is turned on, and fine pumping is carried out until the predetermined pressure value. First, the second valve body 32 is turned on and then mixed for fine pumping. Otherwise, if only the inner cavity 2 is fine pumped first and then the second valve body 32 is opened, it will cause the outer cavity 1 to stop pumping for too long. If the seal of the outer cavity 1 is poor, it will cause air leakage into the outer cavity 1. If the time is long, it may damage the high vacuum state of the outer cavity 1 and affect the storage effect;

[0088] The inner door 23 is opened, and the fourth valve body 36 is closed. Driven by a push rod, a cylinder or an electric cylinder, the inner door 23 is pushed open, and the evacuation process of the inner cavity 2 is ended;

[0089] The manipulator 13 moves from the standby position to above the inner cavity 2, grabs the sample box 12 and moves it to the target storage position. The manipulator 13 returns to the standby position. It can be specified manually on the display screen 11 or automatically selected by the device to store in the vacant position;

[0090] The inner door 23 is closed, the third valve body 35 is opened, and the inner cavity 2 enters nitrogen to break the vacuum. After reaching the atmospheric pressure value, the third valve body 35 is closed, and the inner cavity 2 returns to the initial state, that is, it is filled with nitrogen inside, waiting for the next sample storage instruction, and the sample storage process is completed.

[0091] 3. Sampling process

[0092] Refer to Figure 10 As shown, contrary to the sample storage process, the sampling process corresponds to the operation process when taking out a certain chip sample. When the device is in a normal working state, when a certain chip sample needs to be taken out, first click on the number of the sample box 12 where the target sample is located on the display screen 11. The storage information of each chip deposited needs to be recordable and traceable, such as the chip storage time, the number of the sample box 12 deposited, the address location of the sample box 12 deposited, etc.;

[0093] The second valve body 31 is closed, the fine pumping pump 33 is closed, the fourth valve body 36 is opened, and the inner cavity 2 is roughly pumped to the predetermined pressure value; the second valve body 32 is opened, the fine pumping pump 33 is opened, and fine pumping starts. The inner door 23 is opened, the manipulator 13 automatically addresses, grabs the target sample box 12 into the inner cavity 2 and then returns to the standby position. The inner door 23 is closed, the fourth valve body 36 is closed, the third valve body 35 is opened, and the inner cavity 2 enters nitrogen to break the vacuum. After the pressure value in the inner cavity 2 reaches the atmospheric pressure value, the third valve body 35 is closed, the outer door 21 is opened, the sample box 12 is manually taken out and the chip is taken out, then the sample box 12 is pushed in place, the outer door 21 is closed, and the sampling operation is completed.

[0094] 4. Cleaning process

[0095] The outer cavity 1 and the inner cavity 2 are gas-cleaned. First, the initial state is confirmed. The outer door 21 and the inner door 23 are closed. The first valve body 31, the second valve body 32, the third valve body 35 and the fourth valve body 36 are opened. The nitrogen in the nitrogen source enters the outer cavity 1 and the inner cavity 2 through the air inlet pipe 37. The air in the outer cavity 1 and the inner cavity 2 is discharged through the exhaust pipe 38. After a preset time, the first valve body 31, the second valve body 32, the third valve body 35 and the fourth valve body 36 are closed, and nitrogen is introduced to perform gas cleaning on the outer cavity 1 and the inner cavity 2 to reduce the air and impurities in the outer cavity 1 and the inner cavity 2.

[0096] It can be understood that the present invention is not limited to the outer cavity 1 and the inner cavity 2 being at the upper part and the control cavity 3 being at the lower part, but other layouts can also be adopted, as long as the inner cavity 2 is inside the outer cavity 1 and the inner cavity 2 is provided with two doors to realize the connection and disconnection between the inner cavity 2 and the atmospheric environment, and the connection and disconnection between the inner cavity 2 and the outer cavity 1.

[0097] In addition, a U-shaped card slot is set at the bottom of the inner cavity 2 to facilitate manual pulling out and pushing in of the sample box 12, and an in-place detection sensor 27 and an in-place detection sensor 28 are set to determine whether it is placed in place. It can also be achieved through other positioning structures and methods, such as multi-point ejector positioning or more complex and costly visual camera image comparison positioning and automatic compensation after robot grasping.

[0098] In the present invention, the sample boxes 12 in the outer cavity 1 are arranged in an array, so as to reduce the volume of the outer cavity 1 as much as possible.

[0099] One or more chips can be placed in the sample box 12 depending on the size of the chips, and the chips and the corresponding sample boxes 12 can be marked.

[0100] The sample box 12 is in the shape of an open rectangular box, and may also be in other shapes as long as it can be placed in a matrix.

[0101] In the present invention, the display screen 11 is located on the outer surface of the outer cavity 1 and can be controlled by PLC or PC to achieve access to the sample box 12 .

[0102] In the present invention, the initial state is to keep the inner cavity in a standby state filled with nitrogen, and is designed based on the speed of sample storage. However, the sampling operation may take a relatively long time. Alternatively, in the initial state, the inner door 23 is normally open, the outer door 21 is normally closed, and both the inner cavity 2 and the outer cavity 1 are in a high vacuum state. This makes sampling faster, but the sample storage time may be relatively longer. A variety of different initial states and access strategies can be preset for users to choose from, such as a quick storage mode and a quick retrieval mode.

[0103] The outer door 21 in the present invention is designed to be opened manually, which is economical and reliable. It can also be designed to be opened automatically by a button, not limited to a physical button or a touch button.

[0104] Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art and related fields based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention. Structures, devices, and operation methods not specifically described and explained in the present invention shall be implemented by conventional means in the art unless otherwise specified and limited.

Claims

1. A high vacuum quantum chip storage box, characterized in that: comprising a first chamber, in which a high vacuum environment is formed for storing a sample; The second chamber is communicated with the interior of the first chamber and is used for transferring and storing the sample. The volume of the second chamber is smaller than that of the first chamber.

2. The high vacuum quantum chip storage box according to claim 1, characterized in that: The second chamber is provided with a first chamber door and a second chamber door, wherein the first chamber door is provided on the outer wall of the second chamber, and the first chamber door is used to connect or block the second chamber from the atmospheric environment; The second cavity door is arranged on the inner wall of the second cavity, and the second cavity door is used for connecting or blocking the second cavity and the first cavity.

3. The high vacuum quantum chip storage box according to claim 2, characterized in that: Also included is a grasping device, disposed in the first chamber; When storing the sample, the grabbing device transfers the sample in the second chamber to the first chamber; During sampling, the grabbing device transfers the sample in the first chamber to the second chamber.

4. The high vacuum quantum chip storage box according to any one of claims 1 to 3, characterized in that: It also includes a third chamber, which is arranged outside the second chamber, and an air pressure balancing device is arranged in the third chamber; The air pressure balancing device is connected to the first chamber and the second chamber respectively through pipelines, and the pressure values ​​in the first chamber and the second chamber are adjusted by the air pressure balancing device.

5. The high vacuum quantum chip storage box according to claim 4, characterized in that: The air pressure balancing device comprises a vacuum pumping system and a vacuum breaking system.

6. The high vacuum quantum chip storage box according to claim 5, characterized in that: The first chamber is provided with an air inlet and an air outlet, the air inlet of the first chamber is connected to the vacuum breaking system, and the protective gas is transported into the first chamber through the vacuum breaking system; The gas outlet of the first chamber is connected to the vacuum pumping system, and the gas in the first chamber is extracted through the vacuum pumping system.

7. The high vacuum quantum chip storage box according to claim 5, characterized in that: The second chamber is provided with another air inlet and another air outlet, the air inlet of the second chamber is connected to the vacuum breaking system, and the protective gas is transported into the second chamber through the vacuum breaking system; The gas outlet of the second chamber is connected to the vacuum pumping system, and the gas in the second chamber is extracted through the vacuum pumping system.

8. The high vacuum quantum chip storage box according to claim 6, characterized in that: The vacuum pumping system includes two valve bodies, a fine pump and a rough pump connected by pipelines. The two valve bodies are respectively connected to the two air outlets through pipelines. During the vacuum pumping process, the corresponding valve body is opened, and the gas in the chamber connected to the valve body is first discharged through the fine pump and then through the rough pump.

9. The high vacuum quantum chip storage box according to claim 7, characterized in that: The vacuum breaking system includes two valve bodies and a protective gas source connected by pipelines. The two valve bodies are respectively connected to the two air inlet holes through pipelines. During the vacuum breaking process, the corresponding valve body is opened, and the protective gas enters the chamber connected to the valve body through the pipeline connected to the valve body.

10. The high vacuum quantum chip storage box according to claim 1, characterized in that: The samples in the first chamber are arranged in a matrix, and a plurality of rows and columns of storage stations are arranged in the first chamber.

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