Chemical nickel plating device for ceramic packaging shell

Abstract

The utility model discloses a chemical nickel-plating device for a ceramic packaging shell, which relates to the field of ceramic nickel-plating device structures and comprises a driving mechanism and a moving platform, and the driving mechanism is used for driving the moving platform to move; the motion platform comprises a horizontal moving platform and a vibration platform, the vibration platform is provided with a packaging mechanism, and the packaging mechanism is used for packaging the ceramic packaging shell; one end of the horizontal moving platform is hinged to one end of the vibration platform, the driving mechanism is arranged to drive the horizontal moving platform to move horizontally and drive the vibration platform to rotate around the horizontal moving platform, and the horizontal moving platform can drive the vibration platform to move horizontally. The packaging mechanism is arranged on the moving platform, the driving mechanism accurately drives the horizontal moving platform and the vibration platform of the moving platform, and the vibration strength and direction of a ceramic tool are controlled in the nickel plating process, so that the purpose of reducing damage to a ceramic packaging shell is achieved.

Description

Technical Field

[0001] The utility model relates to the field of the structure of a nickel plating device for ceramics, in particular to a chemical nickel plating device for a ceramic packaging shell. Background Art

[0002] The ceramic packaging shell has the characteristics of high mechanical strength, strong heat dissipation capacity, excellent microwave performance, good sealing performance, etc., and has extremely high application value in the aerospace field. As a ceramic packaging shell that plays a role in sealing and protecting the internal chip, it is necessary to weld the chip to the chip bonding area of the ceramic packaging shell, and at the same time perform gold wire bonding with the bonding area, and conduct circuit connection with the outside through the internal circuit, pad and lead. Therefore, it is required that the chip bonding area, bonding area and pad have good welding performance. The above parts are mainly composed of tungsten, but due to the poor welding performance of tungsten, the internal chip and lead cannot be welded to the bonding area and pad, and thus a path cannot be formed. Therefore, it is necessary to nickel plate on the metal pattern on the surface of the ceramic packaging shell.

[0003] Traditional chemical nickel plating tooling, such as drums, hanging baskets, etc., cannot provide good protection for the internal products. During the rolling or vibration of the tooling, the ceramic packaging shells collide and rub against each other, and it is easy to cause relatively serious scratches and abrasions in their metallized areas. At the same time, the ceramic body itself is also prone to defects. There are strict standards for the above phenomena. Using traditional chemical nickel plating tooling to perform chemical plating on the metallized area of the ceramic packaging shell cannot well guarantee its yield rate. Therefore, there is an urgent need for a nickel plating device that can control the vibration force of the tooling.

[0004] In view of this, this application is specifically proposed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a chemical nickel plating device for a ceramic packaging shell. By arranging the packaging mechanism on the moving platform and precisely driving the horizontal moving platform and the vibrating platform of the moving platform through the driving mechanism, the problem that the vibration force is poorly controlled during the nickel plating process of the ceramic tooling in the prior art, and the ceramic packaging shells collide and rub against each other, damaging the ceramic packaging shells, is solved.

[0006] The embodiment of the utility model realizes through the following technical solutions: The embodiment of the utility model provides a chemical nickel plating device for a ceramic packaging shell, including a driving mechanism and a moving platform. The driving mechanism is used to drive the moving platform to move; the moving platform includes a horizontal moving platform and a vibrating platform, and a packaging mechanism is arranged on the vibrating platform. The packaging mechanism is used to package the ceramic packaging shell.

[0007] One end of the horizontal moving platform is hinged to one end of the vibrating platform. The driving mechanism is configured to drive the horizontal moving platform to move horizontally and drive the vibrating platform to rotate around the horizontal moving platform. The horizontal moving platform can drive the vibrating platform to move horizontally.

[0008] Preferably, the nickel plating device further includes a support mechanism. The support mechanism includes a horizontal support frame. The horizontal moving platform is movably connected to the horizontal support frame. At least two limiting mechanisms are provided on the horizontal support frame. Each limiting mechanism jointly restricts the horizontal movement direction of the horizontal moving platform.

[0009] Preferably, each limiting mechanism includes a first limiting pin and a second limiting pin arranged longitudinally. The horizontal moving platform is arranged between the first limiting pin and the second limiting pin and can move horizontally between the first limiting pin and the second limiting pin.

[0010] Preferably, the driving mechanism includes a driving wheel, a horizontal driving frame, and a vertical driving frame. The driving wheel is configured to drive the horizontal driving frame to move horizontally and drive the vertical driving frame to move vertically;

[0011] A first driving rod is connected to the horizontal moving platform. The first driving rod is connected to the horizontal driving frame. A second driving rod is connected to the vibrating platform. The second driving rod is connected to the vertical driving frame.

[0012] Preferably, the support mechanism further includes a vertical support frame. The horizontal support frame is perpendicularly connected to the vertical support frame. The driving wheel is arranged inside the horizontal driving frame. The vertical driving frame is arranged on top of the driving wheel.

[0013] Preferably, a motor frame is provided on the vertical support frame. A motor is placed inside the motor frame. The motor can drive the wheel to rotate.

[0014] Preferably, a corner bracket is provided on the motor frame. The corner bracket includes a first side plate and a second side plate. The first side plate is connected to the motor frame. An installation hole is provided on the second side plate. A shaft hole is provided on the driving wheel. An axis member is provided through the installation hole and the shaft hole. The driving wheel can rotate around the axis member.

[0015] Preferably, the encapsulation mechanism includes a connecting frame, a plurality of connecting rods, and a plurality of loading balls. The connecting rods are connected to the connecting frame. The loading balls are connected to the connecting rods. The connecting frame is connected to the vibrating platform;

[0016] A plurality of through holes are provided on each loading ball. A single loading ball is configured to encapsulate a single ceramic encapsulation shell.

[0017] Preferably, the connection between the connecting rod and the connecting frame is a movable connection. The connection between the connecting rod and the loading ball is a movable connection. At least two connecting rods are provided on the connecting frame. At least... is provided on each connecting rod.

[0018] Preferably, a plurality of hanging rings are arranged on the connecting frame, rod hooks are arranged at the ends of each connecting rod, a single rod hook can be hung on a single hanging ring, a plurality of rod hanging rings are arranged on each connecting rod, ball hooks are arranged on each loading ball, and a single ball hook can be hung on a single rod hanging ring.

[0019] Compared with the prior art, the embodiment of the present invention has the following advantages and beneficial effects:

[0020] 1. The nickel plating device provided by the embodiment of the present invention arranges the encapsulation mechanism on the moving platform, and drives the vibration and movement of the encapsulation mechanism by driving the vibration and movement of the moving platform through the driving mechanism. Since the ceramic encapsulation shell is encapsulated in the encapsulation mechanism, the vibration nickel plating process of the ceramic encapsulation shell is realized. In the embodiment of the present invention, the moving platform includes a horizontal moving platform and a vibrating platform. One end of the horizontal moving platform and the vibrating platform is hinged, and the vibrating platform can rotate around the horizontal moving platform. That is, during the process of driving the horizontal moving platform to move horizontally by the driving mechanism, the horizontal moving platform will drive the vibrating platform to move horizontally, thereby driving the ceramic encapsulation shell in the encapsulation mechanism to vibrate horizontally. The driving mechanism of the embodiment of the present invention can also directly drive the vibrating platform to rotate, so that the included angle between the vibrating platform and the horizontal moving platform changes, thereby realizing the vertical vibration of the ceramic encapsulation shell in the encapsulation mechanism. This driving structure can accurately control the vibration amplitude and vibration direction of the ceramic encapsulation shell in the encapsulation mechanism during the nickel plating process, so as to achieve the purpose of controlling the vibration degree.

[0021] 2. By setting the driving mechanism as a driving mode of driving the driving wheel to rotate, the vibration amplitude of the encapsulation mechanism can be further limited, the reciprocating movement of the horizontal moving platform and the vibrating platform can be realized, and the vibration degree is further limited. The limit mechanism is set to limit and guide the horizontal moving platform, which improves the driving stability of the device.

[0022] 3. The embodiment of the present invention arranges the encapsulation mechanism into a structure including a connecting frame, connecting rods and loading balls. Each loading ball contains a ceramic encapsulation shell, and a single ceramic encapsulation shell can be isolated and nickel plated. At the same time, a plurality of loading balls can be arranged in a nickel plating device. That is, the nickel plating device of the embodiment of the present invention can perform batch nickel plating on a plurality of ceramic encapsulation shells. During the batch nickel plating process, no collision will occur between single loading balls, which protects the ceramic encapsulation shell while ensuring the nickel plating efficiency.

[0023] Generally speaking, a chemical nickel plating device for a ceramic encapsulation shell provided by the embodiment of the present invention arranges the encapsulation mechanism on the moving platform, and accurately drives the horizontal moving platform and the vibrating platform of the moving platform through the driving mechanism, and controls the vibration force and direction of the ceramic tooling during the nickel plating process, so as to achieve the purpose of reducing the damage of the ceramic encapsulation shell. Brief Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0025] Figure 1 Schematic diagram of the installation structure of the moving platform and the driving mechanism of the nickel plating device provided by the embodiment of the present utility model;

[0026] Figure 2 Schematic diagram of the partially disassembled structure of the moving platform of the nickel plating device provided by the embodiment of the present utility model;

[0027] Figure 3 Schematic diagram of the structure of the nickel plating device provided by the embodiment of the present utility model;

[0028] Figure 4 Schematic diagram of the structure of the encapsulation mechanism provided by the embodiment of the present utility model.

[0029] Labels in the drawings and corresponding component names:

[0030] 1 - Horizontal moving platform, 2 - Vibration platform, 3 - Horizontal support frame, 4 - First limit pin, 5 - Second limit pin, 6 - Limit mechanism, 7 - Driving wheel, 8 - Horizontal driving frame, 9 - Vertical driving frame, 10 - First driving rod, 11 - Second driving rod, 12 - Vertical support frame, 13 - Motor frame, 14 - First side plate, 15 - Second side plate, 16 - Mounting hole, 17 - Connecting frame, 18 - Connecting rod, 19 - Loading ball, 20 - Through hole, 21 - Hanging ring, 22 - Rod hook, 23 - Rod hanging ring, 24 - Ball hook. Detailed Embodiments

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Accordingly, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0033] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0034] In the description of the present invention, it should be noted that the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0035] Embodiment

[0036] As Figures 1 - 3 shown, an electroless nickel plating device for a ceramic package housing according to an embodiment of the present invention includes a driving mechanism and a moving platform. The driving mechanism provides power for driving the moving platform to move. The moving platform includes a horizontal moving platform 1 and a vibrating platform 2. A packaging mechanism is provided on the vibrating platform 2 for packaging the ceramic package housing. One end of the horizontal moving platform 1 is hinged to one end of the vibrating platform 2. The driving mechanism is configured to drive the horizontal moving platform 1 to move horizontally and drive the vibrating platform 2 to rotate around the horizontal moving platform 1. The horizontal moving platform 1 can drive the vibrating platform 2 to move horizontally. Specifically, before operation, the ceramic package housing is first packaged in the packaging mechanism, and the part of the packaging mechanism for packaging the ceramic package housing is placed in the nickel solution. The nickel solution will enter the inside of the packaging mechanism from the outside of the packaging mechanism to nickel plate the ceramic package housing. Driven by the driving mechanism, the horizontal moving platform 1 will be driven to move horizontally, and the horizontal moving platform 1 will drive the vibrating platform 2 to vibrate horizontally, so as to realize the horizontal vibration of the packaging mechanism in the nickel solution. At the same time, the driving mechanism will also directly drive the vibrating platform 2 to swing around the horizontal moving platform 1, so as to realize the vertical vibration of the packaging mechanism in the nickel solution. During the horizontal and vertical vibrations of the packaging mechanism, the internal ceramic package housing can achieve the purpose of uniform and comprehensive nickel plating. Through the design of the structure of the moving platform in the embodiment of the present invention, the driving mechanism can achieve the purpose of precise control of the vibration force and direction of the packaging mechanism, reduce the damage rate of the ceramic package housing, and ensure the quality of nickel plating.

[0037] In order to improve the stability of the entire driving process, further, the nickel plating device further includes a support mechanism. The support mechanism includes a horizontal support frame 3, and the horizontal support frame 3 is used to support the entire moving platform and the encapsulation mechanism. Specifically, the horizontal moving platform 1 is movably connected to the horizontal support frame 3, and at least two limiting mechanisms 6 are provided on the horizontal support frame 3. Each limiting mechanism 6 jointly limits the horizontal movement direction of the horizontal moving platform 1. That is, the horizontal moving platform 1 can move horizontally on the horizontal support frame. In addition to relying on the drive of the drive mechanism for the entire horizontal movement, at least two limiting mechanisms 6 are provided to limit the horizontal moving platform 1, so that the distance between the horizontal moving platform 1 and the horizontal support frame 3 in the longitudinal direction can always remain unchanged, ensuring that the horizontal movement of the horizontal moving platform 1 can be stable.

[0038] Exemplarily, the horizontal support frame 3, the horizontal moving platform 1, and the vibration platform 2 are all rectangular. In other embodiments, the shapes of the horizontal support frame 3, the horizontal moving platform 1, and the vibration platform 2 are not limited, and the number of the limiting mechanisms 6 is not limited here either. Specifically, it can be set according to actual needs as long as the purpose of limiting and guiding the horizontal movement of the horizontal moving platform 1 can be achieved. Returning to the embodiment of the present invention, four limiting mechanisms 6 are provided, which are respectively arranged beside the four right angles of the horizontal support frame 3. Each limiting mechanism 6 includes a first limiting pin 4 and a second limiting pin 5 arranged longitudinally. The horizontal moving platform 1 is arranged between the first limiting pin 4 and the second limiting pin 5. In this structure, the horizontal moving platform 1 is supported by the limiting mechanism 6 and is indirectly connected to the horizontal support frame 3, and will not contact the horizontal support frame 3 during the movement. That is, the horizontal moving platform 1 will not generate friction with the horizontal support frame 3 during the horizontal movement, reducing the wear during the frequent movement in the embodiment of the present invention. At the same time, the horizontal moving platform 1 is jointly limited by a plurality of first limiting pins 4 and second limiting pins 5, so that the horizontal moving platform 1 can only move in the gap between the plurality of first limiting pins 4 and second limiting pins 5, that is, it can only move horizontally. Since one end of the vibration platform 2 is hinged to the horizontal moving platform 1, the vibration platform 2 can perform stable horizontal vibration under the drive of the horizontal moving platform 1. The setting of the limiting mechanism 6 improves the driving stability of the entire device.

[0039] Further, the driving mechanism includes a driving wheel 7, a horizontal driving frame 8, and a vertical driving frame 9. The driving wheel 7 is configured to drive the horizontal driving frame 8 to move horizontally and drive the vertical driving frame 9 to move vertically. A first driving rod 10 is connected to the horizontal moving platform 1, and the first driving rod 10 is connected to the horizontal driving frame 8. A second driving rod 11 is connected to the vibrating platform 2, and the second driving rod 11 is connected to the vertical driving frame 9. Specifically, the horizontal moving platform 1 is indirectly connected to the horizontal driving frame 8 through the first driving rod 10, and the vibrating platform 2 is indirectly connected to the vertical driving frame 9 through the second driving rod 11. The driving wheel 7 indirectly drives the vibrating platform 2 and the horizontal moving platform 1 to move by directly driving the horizontal driving frame 8 and the vertical driving frame 9. Exemplarily, the supporting mechanism further includes a vertical support frame 12. The horizontal support frame 3 is perpendicularly connected to the vertical support frame 12. The driving wheel 7 is disposed within the horizontal driving frame 8, and the vertical driving frame 9 is disposed on top of the driving wheel 7.

[0040] It should be noted that the driving wheel 7 here can be circular, oval, or other shapes, which is not limited here. In the embodiment of the present invention, the driving wheel 7 is circular, and the rotation center is eccentrically arranged, that is, the driving wheel 7 does not rotate around the center of the circle. This structure can drive the horizontal driving frame 8 and the vertical driving frame 9 through one driving wheel 7. Specifically, during the rotation of the driving wheel 7, due to its eccentric arrangement, the side of the driving wheel 7 farther from the rotation base point will reciprocally contact the left and right sides of the horizontal driving frame 8 and generate a thrust, thereby causing the horizontal driving frame 8 to move horizontally back and forth. The horizontal driving frame 8 will drive the moving platform to move horizontally back and forth, thereby realizing the horizontal vibration of the encapsulation mechanism. Similarly, for the vertical driving frame 9, since the vertical driving frame 9 is disposed on top of the driving wheel 7, the driving wheel 7 will provide a certain vertical support for the vertical driving frame 9. When the side of the driving wheel 7 farther from the rotation base point contacts the vertical driving frame 9, the vertical driving frame 9 will be in a state of being lifted, which will drive one side of the vibrating platform 2 to be lifted and increase the angle between the vibrating platform 2 and the horizontal moving platform 1. When the side of the driving wheel 7 closer to the rotation base point contacts the vertical driving frame 9, the height of the vertical driving frame 9 decreases, and at the same time, it also drives the angle between the vibrating platform 2 and the horizontal moving platform 1 to decrease. The encapsulation mechanism will be reciprocally lifted and lowered throughout the process, achieving the purpose of vertical vibration.

[0041] In the above structure, the driving wheel 7 needs to be stably installed on the vertical bracket and then rotate around its rotation base point. As a preferred embodiment of the present invention, a motor frame 13 is provided on the vertical support frame 12, and a motor is placed inside the motor frame 13. The motor can drive the wheel 7 to rotate. Placing the motor inside the motor frame 13 can facilitate the motor to provide kinetic energy for the driving wheel 7. In the embodiment of the present invention, a corner bracket is provided on the motor frame 13. The corner bracket includes a first side plate 14 and a second side plate 15. The first side plate 14 is connected to the motor frame 13, and an installation hole 16 is provided on the second side plate 15. A shaft hole is provided on the driving wheel 7, and a shaft center member is provided through the installation hole 16 and the shaft hole. The driving wheel 7 can rotate around the shaft center member. Specifically, the driving wheel 7 is connected to the motor frame 13 through the corner bracket, so as to indirectly and stably install the driving wheel 7 on the vertical bracket. At the same time, the stable rotation of the driving wheel 7 is realized through the cooperation of the installation hole 16, the shaft hole and the shaft center member. Here, for the driving wheel 7 with a circular shape, the installation hole 16 deviates from the circle, and the specific deviation degree can be determined according to the actually required vibration amplitude, which is not limited here.

[0042] Further, as Figure 4 shown, the encapsulation mechanism includes a connecting frame 17, a plurality of connecting rods 18 and a plurality of loading balls 19. The connecting rods 18 are connected to the connecting frame 17, the loading balls 19 are connected to the connecting rods 18, and the connecting frame 17 is connected to the vibration platform 2; a plurality of through holes 20 are provided on each loading ball 19, and a single loading ball 19 is configured to encapsulate a single ceramic encapsulation shell. It should be noted that the number of the connecting rods 18 is not limited here, and the distance between two adjacent connecting rods 18 is not limited here either, and can be specifically set according to actual needs. Similarly, the number of loading balls 19 on a single connecting rod 18 and the distance between two adjacent loading balls 19 are not limited here either, as long as the purpose that the loading balls 19 do not collide with each other during the nickel plating vibration can be satisfied. The purpose of providing the through holes 20 is to ensure the stable encapsulation of a single ceramic encapsulation shell by the loading ball 19, and at the same time ensure that the nickel solution can enter the inside of the loading ball 19 through the through holes 20 and flow out from the inside of the loading ball 19, so as to achieve the purpose of efficient nickel plating. To improve the efficiency of batch nickel plating of multiple ceramic encapsulation shells, preferably, the connection between the connecting rod 18 and the connecting frame 17 is a movable connection, the connection between the connecting rod 18 and the loading ball 19 is a movable connection, at least two connecting rods 18 are provided on the connecting frame 17, and at least two loading balls 19 are provided on each connecting rod 18. The movable connection method can improve the flexibility of the device in use, such as encapsulation and subsequent cleaning, maintenance and other operations. The setting of at least two connecting rods 18 and at least two loading balls 19 on each connecting rod 18 improves the efficiency of batch nickel plating of multiple ceramic encapsulation shells.

[0043] Exemplarily, a plurality of hanging rings 21 are provided on the connecting frame 17, and rod hooks 22 are provided at the ends of each connecting rod 18. A single rod hook 22 can be hooked on a single hanging ring 21. A plurality of rod hanging rings 23 are provided on each connecting rod 18, and ball hooks 24 are provided on each loading ball 19. A single ball hook 24 can be hooked on a single rod hanging ring 23. It should also be noted that the materials of the driving mechanism, the moving platform, and the connecting frame 17 in the embodiments of the present invention can preferably be 316L stainless steel material resistant to acid and alkali corrosion and high temperature. The processing method of the nickel plating device can be carried out by means of a lathe, a CNC machine tool, etc. The material of the loading ball 19 can be selected as polypropylene PP material resistant to acid and alkali corrosion and with a continuous service temperature up to 110-120 °C.

[0044] Generally speaking, the nickel plating device provided by the embodiments of the present invention can deposit a nickel layer on the metallized area of the ceramic package shell while forming a good protective effect on the ceramic package shell inside the product loading ball 19. After the chemical plating pretreatment, the product is immediately loaded into the loading ball 19 for chemical plating, so that the products will not collide and rub against each other, thereby reducing the proportion of notches and scratches on the ceramic package shell caused thereby, and effectively improving the production qualification rate of the electroless nickel plating process of the ceramic package shell.

[0045] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. It should be noted that the structures or components illustrated in the drawings are not necessarily drawn to scale, and the present invention omits the description of well-known components and processing techniques and processes to avoid unnecessarily limiting the present invention.

Claims

1. A ceramic package shell chemical nickel plating device, comprising a driving mechanism and a motion platform, characterized in that: The driving mechanism is used to drive the motion platform to move; the motion platform comprises a horizontal moving platform (1) and a vibration platform (2); a packaging mechanism is provided on the vibration platform (2), and the packaging mechanism is used to package the ceramic packaging shell; One end of the horizontal moving platform (1) is hinged to one end of the vibration platform (2); the driving mechanism is configured to drive the horizontal moving platform (1) to move horizontally and to drive the vibration platform (2) to rotate around the horizontal moving platform (1); the horizontal moving platform (1) can drive the vibration platform (2) to move horizontally.

2. The ceramic package shell chemical nickel plating device according to claim 1, characterized in that: The nickel plating device also includes a supporting mechanism, the supporting mechanism including a horizontal supporting frame (3), the horizontal movable platform (1) being movably connected to the horizontal supporting frame (3), at least two limiting mechanisms (6) being arranged on the horizontal supporting frame (3), each of the limiting mechanisms (6) jointly limiting the horizontal movement direction of the horizontal movable platform (1).

3. The ceramic package shell chemical nickel plating device according to claim 2, characterized in that: Each of the limit mechanisms (6) comprises a first limit pin (4) and a second limit pin (5) which are arranged in a longitudinal direction, and the horizontal movable platform (1) is arranged between the first limit pin (4) and the second limit pin (5), and can move horizontally between the first limit pin (4) and the second limit pin (5).

4. The ceramic package shell chemical nickel plating device according to claim 2, characterized in that: The driving mechanism comprises a driving wheel (7), a horizontal driving frame (8) and a vertical driving frame (9), wherein the driving wheel (7) is configured to drive the horizontal driving frame (8) to move horizontally and to drive the vertical driving frame (9) to move vertically; The horizontal moving platform (1) is connected to a first driving rod (10), and the first driving rod (10) is connected to the horizontal driving frame (8); the vibration platform (2) is connected to a second driving rod (11), and the second driving rod (11) is connected to the vertical driving frame (9).

5. The ceramic package shell chemical nickel plating device according to claim 4, characterized in that: The support mechanism further comprises a vertical support frame (12), the horizontal support frame (3) is vertically connected to the vertical support frame (12), the driving wheel (7) is arranged in the horizontal driving frame (8), and the vertical driving frame (9) is arranged on the top of the driving wheel (7).

6. The ceramic package shell chemical nickel plating device according to claim 5, characterized in that: A motor frame (13) is arranged on the vertical support frame (12), and a motor is placed in the motor frame (13), and the motor can drive the driving wheel (7) to rotate.

7. The ceramic package shell chemical nickel plating device according to claim 6, characterized in that: The motor frame (13) is provided with an angle frame, the angle frame comprising a first side plate (14) and a second side plate (15), the first side plate (14) being connected to the motor frame (13), the second side plate (15) being provided with a mounting hole (16), the driving wheel (7) being provided with an axial hole, the mounting hole (16) and the axial hole being provided with an axial core member penetrating therethrough, and the driving wheel (7) being capable of rotating around the axial core member.

8. The ceramic package shell chemical nickel plating device according to claim 1, characterized in that: The packaging mechanism comprises a connecting frame (17), a plurality of connecting rods (18) and a plurality of loading balls (19), wherein the connecting rods (18) are connected to the connecting frame (17), the loading balls (19) are connected to the connecting rods (18), and the connecting frame (17) is connected to the vibration platform (2); Each of the loading balls (19) is provided with a plurality of through holes (20), and a single loading ball (19) is configured to encapsulate a single ceramic packaging shell.

9. The ceramic package shell chemical nickel plating device according to claim 8, characterized in that: The connection between the connecting rod (18) and the connecting frame (17) is a movable connection, and the connection between the connecting rod (18) and the loading ball (19) is a movable connection. At least two connecting rods (18) are arranged on the connecting frame (17), and at least two loading balls (19) are arranged on each connecting rod (18).

10. The ceramic package shell chemical nickel plating device according to claim 8, characterized in that: The connecting frame (17) is provided with a plurality of frame hanging rings (21), the end of each connecting rod (18) is provided with a rod hook (22), and a single rod hook (22) can be hung on a single frame hanging ring (21), each connecting rod (18) is provided with a plurality of rod hanging rings (23), and each loading ball (19) is provided with a ball hook (24), and a single ball hook (24) can be hung on a single rod hanging ring (23).

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