Adapter for testing BGA (Ball Grid Array) packaged high-current power supply chip
By designing an adapter for testing a high-current power chip for BGA package, the problems of cumbersome operation, inefficient efficiency and line loss voltage in the prior art are solved, and an efficient and accurate test process is achieved.
Patent Information
- Application Number
- CN202421907249.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-08
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-08
AI Technical Summary
The prior art is cumbersome and inefficient when testing BGA packaged high-current power chips. High-current testing will lead to an increase in line loss voltage, affecting the measurement results, and the heating of the wire may cause the test to be paused.
An adapter with simple structure and easy operation is designed, including a base plate, the device under test, the first European seat, the second European seat, the standard resistor and the BNC connector. Through the layout and connection of these components, efficient testing of the BGA packaged high-current power chip is achieved.
This adapter can effectively improve the efficiency of testing, simplify the operation process, reduce the impact of line loss voltage, avoid test suspension caused by wire heating, and ensure the continuity and accuracy of the test.
Smart Images
Figure CN223038000U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to chip testing, and more specifically to an adapter for testing BGA-packaged high-current power chips. Background Art
[0002] As a highly integrated power chip, the BGA-packaged high-current power chip supports functions such as buck, buck-boost, battery charger, and isolated chamber converter, and is widely used to power various FPGA and DSP chips. Before being put into use, the BGA-packaged high-current power chip must pass tests. Currently, general adapters are commonly used for testing BGA-packaged high-current power chips. As the name implies, general adapters are common to various electronic instruments. During use, the electronic instruments used in the test process are first connected to the general adapter, and then the working states of various electronic instruments are set according to the detailed specifications of the BGA-packaged high-current power chip to be tested, completing the test of a single BGA-packaged high-current power chip. Different specifications require different settings, with repeated operations, resulting in low efficiency. Moreover, since the current is relatively large when testing the BGA-packaged high-current power chip, the line loss voltage generated by the line resistance will also increase, affecting the measurement results, and subsequent manual correction is required. In addition, during large-scale testing, it is often forced to pause due to wire heating, affecting the progress of production tasks.
[0003] In view of the above deficiencies of the prior art, the utility model proposes an adapter for testing BGA-packaged high-current power chips that is simple in structure, convenient to operate, and can effectively improve work efficiency. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an adapter for testing BGA-packaged high-current power chips that is simple in structure, convenient to operate, and can effectively improve work efficiency.
[0005] To achieve the above object, the utility model adopts the following technical solutions: An adapter for testing a large-current power chip with BGA packaging, comprising a bottom plate, a device under test fixture, a first European-style socket, a second European-style socket, a standard resistor, and a BNC connector, characterized in that: the bottom plate is a four-layer PCB board, the device under test fixture, the standard resistor, and the BNC connector are arranged on the front side of the bottom plate, the first European-style socket and the second European-style socket are arranged on the back side of the bottom plate, the first European-style socket includes a power supply area and a ground terminal area, the second European-style socket includes an output detection terminal area and an output ground terminal area, the VIN terminal of the device under test fixture is connected to the power supply area of the first European-style socket, the SGND terminal of the device under test fixture is connected to the ground terminal area of the first European-style socket, the VOUT terminal of the device under test fixture is connected to the output detection terminal area of the second European-style socket, the GND terminal of the device under test fixture is connected to the output ground terminal area of the second European-style socket, there are more than two standard resistors, and both ends of the standard resistor are respectively connected to the FB terminal of the device under test fixture and the output ground terminal area of the second European-style socket, there are more than two BNC connectors, and the center probe of the BNC connector is connected to the VOUT terminal of the device under test fixture.
[0006] Further, the device under test fixture is arranged in the middle part of the bottom plate; the BNC connectors are arranged on the left edge of the bottom plate; the first European-style socket and the second European-style socket are respectively arranged on the left and right edges of the bottom plate.
[0007] Further, the number of the standard resistors is 2 - 4.
[0008] Further, the number of the BNC connectors is 2 - 4.
[0009] Further, both the first European-style socket and the second European-style socket are 3-row 96-pin female sockets.
[0010] The working process of the utility model is as follows: Connect the large-current power chip with BGA packaging to be tested to the device under test fixture; Connect the first European-style socket and the second European-style socket to the corresponding male sockets of the test system respectively to connect the utility model to the test system; Connect the BNC connectors to a digital oscilloscope. The test system sends an input signal to the large-current power chip with BGA packaging to be tested through the utility model, and then performs parallel sampling on the output end of the large-current power chip with BGA packaging to be tested, realizing the test of the large-current power chip with BGA packaging.
[0011] The utility model cooperates with the test system and can directly call the corresponding test conditions and test indexes in its database according to the type of the large-current power chip with BGA packaging to be tested, thereby effectively improving the test work efficiency.
[0012] The utility model has a simple structure and is convenient to operate. Description of the Drawings
[0013] Figure 1 is a schematic structural view of the present utility model;
[0014] Figure 2 is Figure 1 the top view of
[0015] Figure 3 is a schematic structural view of the fixture for the device under test of the present utility model;
[0016] Figure 4 is a schematic view of the working state of the present utility model;
[0017] Figure 5 is a schematic circuit diagram for testing the BGA package high - current power chip LTM4644IY with the present utility model.
[0018] In the figure: 1 - bottom plate; 2 - fixture for the device under test; 3 - first European - type socket; 3.1 - power supply area; 3.2 - ground terminal area; 4 - second European - type socket; 4.1 - output detection terminal area; 4.2 - output ground terminal area; 5 - standard resistor; 6 - BNC connector; 7 - oscilloscope; 8 - multi - channel electronic load; 9 - test system; 10 - system power supply. Specific embodiments
[0019] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments, but the embodiments should not be construed as limiting the present utility model.
[0020] An adapter for testing a BGA package high - current power chip as shown in the figure, comprising a bottom plate 1, a fixture 2 for the device under test, a first European - type socket 3, a second European - type socket 4, a standard resistor 5 and a BNC connector 6. The bottom plate 1 is a four - layer PCB board. The fixture 2 for the device under test, the standard resistor 5 and the BNC connector 6 are arranged on the front surface of the bottom plate 1, and the first European - type socket 3 and the second European - type socket 4 are arranged on the back surface of the bottom plate 1. The first European - type socket 3 includes a power supply area 3.1 and a ground terminal area 3.2, and the second European - type socket 4 includes an output detection terminal area 4.1 and an output ground terminal area 4.2. The VIN terminal of the fixture 2 for the device under test is connected to the power supply area 3.1 of the first European - type socket 3, the SGND terminal of the fixture 2 for the device under test is connected to the ground terminal area 3.2 of the first European - type socket 3, the VOUT terminal of the fixture 2 for the device under test is connected to the output detection terminal area 4.1 of the second European - type socket 4, the GND terminal of the fixture 2 for the device under test is connected to the output ground terminal area 4.2 of the second European - type socket 4. There are two or more standard resistors 5, and both ends of the standard resistor 5 are respectively connected to the FB terminal of the fixture 2 for the device under test and the output ground terminal area 4.2 of the second European - type socket 4. There are two or more BNC connectors 6, and the center probe of the BNC connector 6 is connected to the VOUT terminal of the fixture 2 for the device under test.
[0021] The preferred embodiment is: in the above solution, the device under test fixture 2 is arranged in the middle part of the bottom plate 1; the BNC connector 6 is arranged on the left edge of the bottom plate 1; the first European-style socket 3 and the second European-style socket 4 are respectively arranged on the left and right edges of the bottom plate 1.
[0022] The preferred embodiment is: in the above solution, the number of the standard resistors 5 is 2 - 4.
[0023] The preferred embodiment is: in the above solution, the number of the BNC connectors 6 is 2 - 4.
[0024] The preferred embodiment is: in the above solution, both the first European-style socket 3 and the second European-style socket 4 are 3-row 96-pin female sockets.
[0025] The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.
Claims
1. An adapter for testing a BGA packaged high current power chip, comprising a base plate (1), a device under test fixture (2), a first European socket (3), a second European socket (4), a standard resistor (5) and a BNC connector (6), characterized in that: The base plate (1) is a four-layer PCB board. The device under test fixture (2), the standard resistor (5) and the BNC connector (6) are arranged on the front side of the base plate (1). The first European-style socket (3) and the second European-style socket (4) are arranged on the back side of the base plate (1). The first European-style socket (3) includes a power supply area (3.1) and a ground terminal area (3.2). The second European-style socket (4) includes an output detection terminal area (4.1) and an output ground terminal area (4.2). The VIN terminal of the device under test fixture (2) is connected to the power supply area (3.1) of the first European-style socket (3). The SGND terminal of the device under test fixture (2) is connected to the SGND terminal of the first European-style socket (4). 3), the VOUT end of the device under test fixture (2) is connected to the output detection end area (4.1) of the second European socket (4), the GND end of the device under test fixture (2) is connected to the output ground end area (4.2) of the second European socket (4), there are more than two standard resistors (5), the two ends of the standard resistor (5) are respectively connected to the FB end of the device under test fixture (2) and the output ground end area (4.2) of the second European socket (4), there are more than two BNC connectors (6), and the center probe of the BNC connector (6) is connected to the VOUT end of the device under test fixture (2).
2. The adapter for testing BGA packaged high current power chip according to claim 1, characterized in that: The device under test fixture (2) is arranged at the middle part of the base plate (1); the BNC connector (6) is arranged at the left edge of the base plate (1); and the first European socket (3) and the second European socket (4) are arranged at the left and right edges of the base plate (1), respectively.
3. The adapter for testing a BGA packaged high current power chip according to claim 1 or 2, characterized in that: The number of the standard resistors (5) is 2-4.
4. The adapter for testing a BGA packaged high current power chip according to claim 1 or 2, characterized in that: The number of the BNC connectors (6) is 2-4.
5. The adapter for testing BGA packaged high current power chip according to claim 3, characterized in that: The number of the BNC connectors (6) is 2-4.
6. The adapter for testing a BGA packaged high current power chip according to claim 1 or 2, characterized in that: The first European socket (3) and the second European socket (4) are both 3-row 96-pin female sockets.
7. The adapter for testing BGA packaged high current power chip according to claim 3, characterized in that: The first European socket (3) and the second European socket (4) are both 3-row 96-pin female sockets.
8. The adapter for testing BGA packaged high current power chip according to claim 4, characterized in that: The first European socket (3) and the second European socket (4) are both 3-row 96-pin female sockets.
9. The adapter for testing a BGA packaged high current power chip according to claim 5, characterized in that: The first European socket (3) and the second European socket (4) are both 3-row 96-pin female sockets.