High-speed optical transceiver module and frame structure

Abstract

The utility model relates to a high-speed optical transceiver module and a frame structure. The optical transceiver module comprises a housing, a PCB substrate, an optical fiber array and a laser assembly. The shell comprises an upper shell and a lower shell, and the PCB substrate is arranged between the upper shell and the lower shell; the optical fiber array and the laser assembly are installed on the side, close to the upper shell, of the substrate. An isolator is arranged on the side, close to the laser assembly, of the optical fiber array. The laser assembly comprises a ceramic substrate and a laser chip, the two sides of the ceramic substrate are connected with the side, close to the upper shell, of the PCB substrate through supporting blocks, and the laser chip is installed on the side, away from the upper shell, of the ceramic substrate. Thermal grease is arranged on one side, close to the upper shell, of the ceramic substrate, and the thermal grease is tightly attached to the upper shell; according to the utility model, the upper shell and the laser chip are directly connected through the thermal grease, so that a heat conduction path for heat dissipation of the laser chip is shortened, a large amount of heat generated by the laser chip can be effectively conducted and diffused, and the situation that local heat is too high is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of optical transceiver modules, and particularly relates to a high-speed optical transceiver module and a frame structure. Background Art

[0002] In optical communication technology, an optical module is a core device for realizing optoelectronic conversion and electro-optical conversion functions. The optical module mainly consists of an optical transmitter, an optical receiver, a functional circuit, an optical interface, and other parts.

[0003] In the existing optical emission component, a laser chip is designed to convert an electrical signal into an optical signal, and the optical signal is incident into a single-mode fiber ferrule through a coupling lens and an isolator. Moreover, a flexible circuit board is connected to the laser chip through wire bonding.

[0004] In a high-speed optical transceiver module with a transmission rate of 400 Gbps, due to the large amount of heat generated by the laser chip, it is easy to have a situation of excessive local heat; moreover, there is a size difference between the laser chip and the coupling lens, making it difficult to achieve high alignment between the laser chip and the coupling lens. Summary of the Utility Model

[0005] Based on the above description, the utility model provides a high-speed optical transceiver module and a frame structure, so as to directly connect the upper shell and the laser chip through heat-conducting paste, shorten the heat conduction path of the laser chip for heat dissipation, and effectively conduct and dissipate a large amount of heat generated by the laser chip, avoiding the situation of excessive local heat.

[0006] The technical solution for the utility model to solve the above technical problems is as follows: A high-speed optical transceiver module includes a shell, a PCB substrate, an optical fiber array, and a laser component; the shell includes an upper shell and a lower shell, the PCB substrate is disposed between the upper shell and the lower shell, and is installed on one side of the lower shell close to the upper shell; both the optical fiber array and the laser component are installed on one side of the substrate close to the upper shell, and an isolator is disposed on one side of the optical fiber array close to the laser component;

[0007] The laser component includes a ceramic substrate and a laser chip. Both sides of the ceramic substrate are connected to one side of the PCB substrate close to the upper shell through support blocks, and the laser chip is installed on one side of the ceramic substrate away from the upper shell; a heat-conducting paste is disposed on one side of the ceramic substrate close to the upper shell, and the heat-conducting paste is in close contact with the upper shell.

[0008] Based on the above technical solution, the utility model can be further improved as follows.

[0009] Further, the support block is connected to the PCB substrate through thermocompression bonding.

[0010] Furthermore, a first inclined surface is provided on one side of the PCB substrate close to the upper housing, and the support block is connected to the first inclined surface; a second inclined surface is provided on one side of the upper housing close to the lower housing, the second inclined surface is parallel to the first inclined surface, and the thermal paste is closely attached to the second inclined surface.

[0011] Furthermore, a plurality of anti-slip grooves are provided on the first inclined surface.

[0012] Furthermore, a bracket is provided on one side of the ceramic substrate close to the upper housing, and the bracket surrounds the thermal paste.

[0013] Furthermore, a focusing lens is provided on one side of the PCB substrate close to the upper housing, and the focusing lens is installed between the isolator and the laser chip.

[0014] Furthermore, the laser assembly further includes a backlight detector, the backlight detector is installed on one side of the ceramic substrate away from the upper housing, and the backlight detector is installed on one side of the laser chip away from the fiber array.

[0015] The present utility model also proposes a high-speed optical transceiver frame structure, which includes a mounting frame and the optical transceiver module described in any one of the above, one side of the optical transceiver module is inserted into the mounting frame, and a heat sink is provided on the outside of the mounting frame, and the heat sink is facing the thermal paste.

[0016] Furthermore, a socket is provided on one side of the housing inserted into the mounting frame, and a gold finger is provided on one side of the PCB substrate extending from the socket.

[0017] Furthermore, an MPO connector is provided between the upper housing and the lower housing and on one side away from the socket, and the MPO connector is connected to the fiber array through an internal optical fiber.

[0018] Compared with the prior art, the technical solution of the present application has the following beneficial technical effects:

[0019] 1. In the present utility model, the upper housing and the laser chip are directly connected through the thermal paste, shortening the heat conduction path of the laser chip for heat dissipation, and being able to effectively conduct and dissipate a large amount of heat generated by the laser chip, avoiding the situation of excessive local heat.

[0020] 2. By providing the first inclined surface and the second inclined surface, the height of the laser chip can be adjusted when installing the ceramic substrate, ensuring the height alignment of the laser chip and the coupling lens. Description of the Drawings

[0021] Figure 1Structural schematic diagram of a high-speed optical transceiver module provided by an embodiment of the present utility model;

[0022] Figure 2 is Figure 1 structural schematic diagram after omitting the upper housing;

[0023] Figure 3 Structural schematic diagram of a laser component in an embodiment of the present utility model;

[0024] Figure 4 Cross-sectional view of the optical transceiver module inserted into the mounting frame in an embodiment of the present utility model;

[0025] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0026] 1. Mounting frame; 11. Heat sink; 2. Housing; 21. Lower housing; 22. Upper housing; 221. Second inclined surface; 23. Socket; 3. PCB substrate; 31. Gold finger; 32. First inclined surface; 4. Laser component; 41. Ceramic substrate; 42. Support block; 43. Laser chip; 44. Backlight detector; 45. Bracket; 46. Thermal paste; 5. Fiber optic array; 51. Isolator; 6. Focusing lens; 7. MPO connector; 8. Internal optical fiber. Detailed implementation manners

[0027] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant attached drawings. Embodiments of the present application are shown in the attached drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the specification of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0029] It will be appreciated that spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. may be used herein to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relationship terms also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, an element or feature described as "under other elements" or "beneath them" or "underneath them" will be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "beneath" can include both an upper and a lower orientation. Additionally, the device may also include other orientations (such as rotating 90 degrees or other orientations), and the spatial descriptors used herein are to be interpreted accordingly.

[0030] A high-speed optical transceiver frame structure includes a mounting frame 1 and an optical transceiver module. Among them, the optical transceiver module includes a housing 2, a PCB substrate 3, an optical fiber array 5, a focusing lens 6, a laser assembly 4, and an MPO connector 7.

[0031] The housing 2 includes an upper housing 22 and a lower housing 212. The PCB substrate 3 is disposed between the upper housing 22 and the lower housing 212 and is mounted on one side of the lower housing 212 close to the upper housing 22. The optical fiber array 5, the focusing lens 6, and the laser assembly 4 are all mounted on one side of the substrate close to the upper housing 22.

[0032] The laser assembly 4 includes a ceramic substrate 41, a laser chip 43, and a backlight detector 44. Both sides of the ceramic substrate 41 are connected to one side of the PCB substrate 3 close to the upper housing 22 through support blocks 42. In this embodiment, the support blocks 42 are connected to the PCB substrate 3 by thermocompression bonding.

[0033] The laser chip 43 and the backlight detector 44 are mounted on one side of the ceramic substrate 41 away from the upper housing 22, and the backlight detector 44 is mounted on one side of the laser chip 43 away from the optical fiber array 5. A bracket 45 and a heat sink paste 46 are provided on one side of the ceramic substrate 41 close to the upper housing 22. The bracket 45 is supported by an insulating material, and the bracket 45 surrounds the heat sink paste 46 to prevent the heat sink paste 46 from leaking out. The heat sink paste 46 is in close contact with the upper housing 22.

[0034] In this embodiment, the heat sink paste 46 directly connects the upper housing 22 and the laser chip 43, shortening the heat conduction path for the laser chip 43 to dissipate heat, and can effectively conduct and diffuse a large amount of heat generated by the laser chip 43, avoiding the situation of excessive local heat.

[0035] An isolator 51 is provided on one side of the fiber optic array 5 close to the laser component 4, and the focusing lens 6 is installed between the isolator 51 and the laser chip 43. The laser chip 43 converts an electrical signal into an optical signal, and the optical signal is incident into the fiber optic array 5 through the coupling lens and the isolator 51 to realize the emission of the optical signal.

[0036] In addition, a first inclined surface 32 is provided on one side of the PCB substrate 3 close to the upper housing 22, and the support block 42 is connected to the first inclined surface 32. A second inclined surface 221 is provided on one side of the upper housing 22 close to the lower housing 212. The second inclined surface 221 is parallel to the first inclined surface 32, and the thermal paste 46 is closely attached to the second inclined surface 221.

[0037] In this embodiment, by providing the first inclined surface 32 and the second inclined surface 221, the height of the laser chip 43 can be adjusted when installing the ceramic substrate 41, ensuring the height alignment of the laser chip 43 and the coupling lens.

[0038] A number of anti-slip grooves are also provided on the first inclined surface 32 to prevent the ceramic substrate 41 from sliding during thermocompression bonding.

[0039] A socket 23 is provided on one side of the housing 2. One side of the PCB substrate 3 extends out from the socket 23 and is provided with a gold finger 31. The MPO connector 7 is arranged between the upper housing 22 and the lower housing 212 and on the side far from the socket 23. The MPO connector 7 is connected to the fiber optic array 5 through the internal optical fiber 8.

[0040] The side of the optical transceiver module provided with the socket 23 is inserted into the mounting frame 1. A heat sink 11 is provided on the outside of the mounting frame 1, and the heat sink 11 faces the thermal paste 46. The heat sink 11 can further disperse a large amount of heat generated by the laser chip 43.

[0041] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A high-speed optical transceiver module, characterized in that: The invention comprises a housing, a PCB substrate, an optical fiber array and a laser assembly; the housing comprises an upper housing and a lower housing, the PCB substrate is arranged between the upper housing and the lower housing, and is installed on a side of the lower housing close to the upper housing; the optical fiber array and the laser assembly are both installed on a side of the substrate close to the upper housing, and an isolator is arranged on a side of the optical fiber array close to the laser assembly; The laser assembly includes a ceramic substrate and a laser chip. The two sides of the ceramic substrate are connected to the side of the PCB substrate close to the upper shell through support blocks, and the laser chip is installed on the side of the ceramic substrate away from the upper shell. The side of the ceramic substrate close to the upper shell is provided with heat dissipation paste, and the heat dissipation paste is closely attached to the upper shell.

2. A high-speed optical transceiver module according to claim 1, characterized in that: The support block is connected to the PCB substrate by thermal compression welding.

3. A high-speed optical transceiver module according to claim 1, characterized in that: A first inclined surface is arranged on one side of the PCB substrate close to the upper shell, and the support block is connected to the first inclined surface; a second inclined surface is arranged on one side of the upper shell close to the lower shell, and the second inclined surface is parallel to the first inclined surface, and the heat dissipation paste is closely attached to the second inclined surface.

4. A high-speed optical transceiver module according to claim 3, characterized in that: The first inclined surface is provided with a plurality of anti-slip grooves.

5. The high-speed optical transceiver module according to claim 1, characterized in that: A bracket is arranged on one side of the ceramic substrate close to the upper shell, and the bracket surrounds the heat dissipation paste.

6. The high-speed optical transceiver module according to claim 1, characterized in that: A focusing lens is arranged on one side of the PCB substrate close to the upper shell, and the focusing lens is installed between the isolator and the laser chip.

7. The high-speed optical transceiver module according to claim 1, characterized in that: The laser assembly further comprises a backlight detector, which is mounted on a side of the ceramic substrate away from the upper housing, and the backlight detector is mounted on a side of the laser chip away from the optical fiber array.

8. A high-speed optical transceiver frame structure, characterized in that: It comprises a mounting frame and the optical transceiver module according to any one of claims 1 to 7, one side of the optical transceiver module is inserted into the mounting frame, a heat sink is arranged on the outer side of the mounting frame, and the heat sink faces the heat dissipation paste.

9. The high-speed optical transceiver frame structure according to claim 8, characterized in that: A socket is arranged on one side of the shell body inserted into the installation frame, and a gold finger is arranged on one side of the PCB substrate extending from the socket.

10. A high-speed optical transceiver frame structure according to claim 9, characterized in that: An MPO connector is arranged between the upper shell and the lower shell and on a side away from the socket, and the MPO connector is connected to the optical fiber array through an internal optical fiber.

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