Packaging structure, light source, projection equipment, display system and vehicle

Abstract

The utility model provides a packaging structure, a light source, projection equipment, a display system and a vehicle, the packaging structure comprises a shell and M types of laser chips, the M types of laser chips are arranged in the shell, and each type of laser chip in the M types of laser chips is used for emitting one type of light beams; wherein M first bonding pad groups are arranged on the inner wall of the shell; m second bonding pad groups are arranged at the bottom of the shell and are used for connecting a printed circuit board. In the packaging structure, bonding pads are respectively arranged at the bottom and the inner wall of a packaging shell of a light source, and the bonding pads at the bottom and the bonding pads at the inner wall are correspondingly conducted. Therefore, the bonding pad at the bottom is connected with the PCB, and the bonding pad on the inner wall is connected with the laser chip. The shell serves as a transmission medium of electric signals, corresponding electric signals can be provided for each type of laser, flexible configuration of laser chips is achieved, and the purposes of miniaturization and cost reduction of laser display projection equipment are achieved.

Description

Technical Field

[0001] The present application relates to the field of projection display, and in particular to a packaging structure, a light source, a projection device, a display system, and a vehicle. Background Art

[0002] Laser display technology, that is, an image information terminal display technology using a laser as a light source, has better color expressiveness and color restoration ability compared with traditional light sources, and is widely used. With the development of laser display technology, the demand for full-color laser light sources is increasing. A full-color laser light source, also known as an RGB laser light source, emits light by directly selecting lasers in three bands of red, green, and blue to form a projection image.

[0003] Up to now, RGB laser light sources are mostly composed of combinations of multiple types among single-color lasers, two-color lasers, and three-color lasers to form a three-color light source for use. In the packaging scheme of lasers, each type of laser chip needs to be arranged and packaged in an array form according to the classification in the same housing. In this usage mode, the distribution of each type of chip is fixed, resulting in a large volume at the application end. If each type of laser is packaged separately, the cost of the structural parts used will be increased. Therefore, how to develop a packaging structure that enables each type of laser chip to be flexibly configured to achieve miniaturization and low cost of laser display projection devices is an urgent problem to be solved. Summary of the Utility Model

[0004] The present application provides a packaging structure, a light source, a projection device, a display system, and a vehicle. Solder pads are respectively arranged at the bottom and the inner wall of the packaging housing of the light source, and the solder pads at the bottom and inside are conductively connected correspondingly, so as to provide corresponding electrical signals for each type of laser in the housing and realize flexible configuration of laser chips.

[0005] In a first aspect, a packaging structure is provided, including a housing and M types of laser chips, where: the M types of laser chips are arranged in the housing, and each type of laser chip in the M types of laser chips is used to emit a type of light beam, where M is a positive integer; among them, M first solder pad groups are arranged on the inner wall of the housing, and each of the M first solder pad groups corresponds to a type of laser chip in the M types of laser chips, and each first solder pad group is electrically connected to the corresponding type of laser chip; M second solder pad groups are arranged at the bottom of the housing, and the M second solder pad groups are used to connect a printed circuit board. The first solder pad groups in the M first solder pad groups and the second solder pad groups in the M second solder pad groups correspond one by one, and each first solder pad group is conductively connected to the corresponding second solder pad group.

[0006] In the encapsulation structure, pads are respectively arranged at the bottom and the inner wall of the encapsulation housing of the light source, and the pads at the bottom and the inner wall are conductively connected correspondingly. Thus, the pad at the bottom is used to connect the PCB, and the pad on the inner wall is used to connect the laser chip. The housing serves as a transmission medium for electrical signals, can provide corresponding electrical signals for each type of laser, realizes the flexible configuration of the laser chip, and achieves the purpose of miniaturization and cost reduction of the laser display projection device.

[0007] Combined with the first aspect, in some implementation manners of the first aspect, the housing includes a frame body, a transparent cover plate and a bottom plate, where: a first opening is provided at the top of the frame body, the transparent cover plate is arranged in the first opening, a second opening is provided at the bottom of the frame body, and the bottom plate is arranged in the second opening; wherein, the inner wall of the housing includes the inner wall of the frame body, and M first pad groups are arranged on the inner wall of the frame body; the bottom of the housing includes the bottom of the frame body, and M second pad groups are arranged on the bottom of the frame body. Thus, through the cooperation of the frame body, the transparent cover plate and the bottom plate, the three separate components form the housing together.

[0008] Combined with the first aspect, in some implementation manners of the first aspect, where: a boss is provided on the inner wall of the frame body; arranging M first pad groups on the inner wall of the frame body includes: arranging M first pad groups on the surface of the boss. Combined with the first aspect, in some implementation manners of the first aspect, where: the frame body includes a plurality of ceramic sheets, and the plurality of ceramic sheets are stacked in sequence along a first direction, and the first direction is the direction from the bottom of the frame body to the top of the frame body.

[0009] Combined with the first aspect, in some implementation manners of the first aspect, where the M first pad groups and the M second pad groups are made of conductive materials.

[0010] Combined with the first aspect, in some implementation manners of the first aspect, where: a first hole is provided inside the housing, and the first hole penetrates from the position of the first pad to the position of the second pad, and the first pad and the second pad are wire-connected through the first hole; wherein, the first pad is a pad in the third pad group, the second pad is a pad in the fourth pad group, wherein, the third pad group is one of the M first pad groups, and the fourth pad group is the pad group corresponding to the third pad group among the M second pad groups. That is to say, the pads in the first pad group and the pads in the corresponding second pad group can be wire-connected through the holes provided inside the housing, so as to achieve mutual conduction.

[0011] In combination with the first aspect, in certain implementations of the first aspect, where: The M types of laser chips include the first type of laser chips, and the first type of laser chips correspond to the fifth pad group among the M first pad groups. Among them, the first type of laser chips include the first laser chip, and the fifth pad group includes the third pad and the fourth pad; among them, the positive electrode of the first laser chip is connected to the third pad, and the negative electrode of the first laser chip is connected to the fourth pad. That is, one pad in the first pad group can be connected to the positive electrode of the laser chip, and the other pad can be connected to the negative electrode of the laser chip, so as to transmit a power signal to the laser chip through the first pad group.

[0012] In combination with the first aspect, in certain implementations of the first aspect, where: The M types of laser chips include the second type of laser chips, and the second type of laser chips correspond to the sixth pad group among the M first pad groups. Among them, the second type of laser chips include the second laser chip and the third laser chip, and the sixth pad group includes the fifth pad and the sixth pad; among them, the second laser chip and the third laser chip are connected in series, the positive electrode of the second laser chip is connected to the fifth pad, the negative electrode of the third laser chip is connected to the sixth pad, the second laser chip is the laser chip adjacent to the fifth pad in the second type of laser chips, and the third laser chip is the laser chip adjacent to the sixth pad in the second type of laser chips. That is, when a type of laser chips includes multiple laser chips, the multiple laser chips can be connected in series, so as to transmit a power signal to the laser chips through the first pad group.

[0013] In combination with the first aspect, in certain implementations of the first aspect, where: The M types of laser chips include the third type of laser chips and the fourth type of laser chips, the third type of laser chips correspond to the seventh pad group among the M first pad groups, and the fourth type of laser chips correspond to the eighth pad group among the M first pad groups. Among them, the seventh pad group includes the seventh pad, and the eighth pad group includes the eighth pad; among them, the third type of laser chips include the fourth laser chip, the fourth type of laser chips include the fifth laser chip, the negative electrode of the fourth laser chip is connected to the seventh pad, the negative electrode of the fifth laser chip is connected to the eighth pad, and the seventh pad and the eighth pad are the same pad. That is, the negative electrodes of multiple types of laser chips can be connected to the same pad, thus saving the space of the packaging structure.

[0014] In connection with the first aspect, in some implementations of the first aspect, where: The M first pad groups include a ninth pad group, and the ninth pad group corresponds to a tenth pad group among the M second pad groups; wherein, the ninth pad group includes a ninth pad, the ninth pad is electrically connected to the tenth pad, and further, the ninth pad is electrically connected to an eleventh pad; wherein, the tenth pad and the eleventh pad are pads in the tenth pad group, and the tenth pad and the eleventh pad are respectively disposed on opposite sides of the bottom of the housing. That is to say, the pads in the M first pad groups can be electrically connected to two oppositely disposed pads in the M second pad groups, so as to reduce the transmission voltage and save power consumption when the M second pad groups transmit electrical signals to the M first pad groups.

[0015] In connection with the first aspect, in some implementations of the first aspect, where: The M second pad groups are disposed on the same side of the bottom of the housing, and this distribution can reduce the overall volume of the package structure. Alternatively, the M second pad groups are disposed on opposite sides of the bottom of the housing, and this distribution can reduce the overall power consumption of the package structure.

[0016] In a second aspect, a light source is provided, including the package structure of the first aspect and any of its possible implementations and a printed circuit board, where: M connectors are provided on the printed circuit board, and the connectors in the M connectors correspond one-to-one to the second pad groups in the M second pad groups, and the connectors are used to transmit power signals to the corresponding second pad groups; the package structure is used to output a first light beam after receiving the M power signals transmitted by the M connectors.

[0017] In a third aspect, a projection device is provided, including a power supply, the light source, a modulator, and a lens of the second aspect, where: The power supply is connected to the light source, and the power supply is used to send M power signals to the light source; the light source is used to emit a first light beam; the modulator is used to modulate the first light beam to obtain an optical signal; the lens is used to project the optical signal to display a projection image.

[0018] In a fourth aspect, a vehicle-mounted display system is provided, including the projection device of the third aspect.

[0019] In a fifth aspect, a vehicle is provided, including the vehicle-mounted display system of the fourth aspect. Description of the Drawings

[0020] Figure 1 is a schematic diagram of a package structure provided by an embodiment of the present application.

[0021] Figure 2 is a schematic diagram of the structure of a frame provided by an embodiment of the present application.

[0022] Figure 3 is a schematic diagram of a lead connection structure between M laser chips and M first pad groups provided by an embodiment of the present application.

[0023] Figure 4 It is a schematic diagram showing the conduction relationship between M first pad groups and M second pad groups provided by an embodiment of the present application.

[0024] Figure 5 It is a schematic diagram of a light source structure provided by an embodiment of the present application.

[0025] Figure 6 It is a schematic diagram of a light source structure provided by an embodiment of the present application.

[0026] Figure 7 It is a schematic diagram of a light source structure provided by an embodiment of the present application.

[0027] Figure 8 It is a schematic diagram of a light source structure provided by an embodiment of the present application.

[0028] Figure 9 It is a schematic diagram of the structure of a projection device provided by an embodiment of the present application.

[0029] Figure 10 It is a schematic diagram of a vehicle-mounted display system provided by an embodiment of the present application.

[0030] Figure 11 It is a vehicle provided by an embodiment of the present application. Detailed implementation manners

[0031] Next, the technical solutions in the present application will be described with reference to the accompanying drawings.

[0032] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0033] Describing with reference to "one embodiment" or "some embodiments" etc. in this specification means that in one or more embodiments of the present application, specific features, structures or characteristics described in combination with the embodiment are included. Thus, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" etc. that appear in different places in this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all of the embodiments", unless otherwise specifically emphasized in other ways. The terms "comprising", "including", "having" and their variants all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0034] In the description of the embodiments of the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", "vertical", "horizontal", etc. is defined relative to the orientation or position in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. It can change accordingly with the change of the orientation in which the components in the drawings are placed. Therefore, it should not be construed as a limitation to the present application.

[0035] As used in the embodiments of the present application below, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0036] In the embodiments of the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations, or explanations. An embodiment or design described as "exemplary" or "for example" should not be construed as being more preferred or having more advantages than other embodiments or designs. The use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific way for easy understanding.

[0037] In the embodiments of the present application, the same reference numeral is used to represent the same component or the same part. Additionally, the components in the drawings are not drawn to scale. The dimensions and sizes of the components shown in the drawings are only exemplary and should not be construed as a limitation to the present application.

[0038] It should be understood that in the present application, "electrically connected" can be understood as physical contact and electrical conduction between components, or can also be understood as a form of connection between different components in a circuit structure through physical lines such as substrate lines, pads, or wires that can transmit electrical signals. In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "configured", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, or can be indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0039] It should be understood that in the present application, "circuit" can also be understood as "line" according to the actual situation. "Pad" can also refer to "bump", "bump point", etc. for electrical connection paths according to the actual situation. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0040] Laser display technology, that is, an image information terminal display technology using a laser as a light source, has better color expressiveness and color restoration ability compared with traditional light sources, and is thus widely used. With the development of laser display technology, the demand for full-color laser light sources is increasing. A full-color laser light source, also known as an RGB laser light source, emits light by directly selecting lasers in three bands of red, green, and blue to form a projection image.

[0041] Up to now, RGB laser light sources are mostly composed of combinations of multiple types among single-color lasers, two-color lasers, and three-color lasers to form a three-color light source for use. In the laser packaging solution, each type of laser chip needs to be arranged and packaged in an array form according to the classification in the same housing. In this usage mode, the distribution of each type of chip is fixed, resulting in a large volume at the application end. And if each type of laser is packaged separately, the cost of the structural parts used will become high. Therefore, how to develop a packaging structure that enables each type of laser chip to be flexibly configured to achieve miniaturization and low cost of laser display projection devices is an urgent problem to be solved.

[0042] In view of this, the present application provides a packaging structure, a light source, a projection device, a display system, and a vehicle. Solder pads are respectively arranged at the bottom and inner wall of the packaging housing of the light source, and the solder pads at the bottom and inside are conductively connected correspondingly, so as to provide corresponding electrical signals for each type of laser in the housing and realize flexible configuration of the laser chips.

[0043] Figure 1 It is a schematic diagram of a packaging structure provided by an embodiment of the present application. As Figure 1 shown, the packaging structure includes a housing 110 and M types of laser chips 120.

[0044] Among them, M types of laser chips 120 are arranged in the housing 110, and M is a positive integer. Each type of laser chip in the M types of laser chips 120 includes one or more laser chips. Each type of laser chip is used to emit a type of light beam, so that the light beams emitted by the M types of laser chips 120 are aggregated to form a first light beam. Among them, aggregating to form a first light beam can also be understood as converging or collimating. The first light beam can be understood as a collimated light beam or a parallel light beam. The first light beam includes at least one of the following: a blue light beam, a red light beam, or a green light beam. Among them, the wavelength band of the blue light beam can be greater than or equal to 420 nm and less than or equal to 480 nm. The wavelength band of the red light beam can be greater than or equal to 615 nm and less than or equal to 665 nm. The wavelength band of the green light beam can be greater than or equal to 500 nm and less than or equal to 560 nm.

[0045] Among them, the specific type of the M - type laser chip 120 is determined according to the actual situation. For example, the M - type laser chip 120 can include any one or more of the red, blue, and green monochromatic laser chips. Or, the M - type laser chip 120 can include one or more monochromatic laser chips and one or more dichromatic laser chips. Or, the M - type laser chip 120 can also only include the red, blue, and green tricolor laser chips. In addition, the beam colors emitted by the multiple types of laser chips in the M - type laser can also overlap. For example, the M - type laser chip 120 can include two dichromatic laser chips, namely red - blue and blue - green. Or the M - type laser chip 120 can include a red monochromatic laser chip and a red - blue - green tricolor laser chip, etc. It is specifically determined according to the actual situation.

[0046] In some implementation manners, the first beam includes at least two of the following: blue beam, red beam, or green beam. In some implementation manners, the first beam includes: blue beam, red beam, and green beam.

[0047] Among them, M first pad groups are provided on the inner wall of the housing 110. Each of the M first pad groups corresponds to one type of laser chip in the M - type laser chip 120, and each first pad group is electrically connected to the corresponding type of laser chip. Among them, each first pad group can include one or more pads, which is determined according to the specific lead connection relationship with the laser chip.

[0048] M second pad groups are provided at the bottom of the housing 110, and the M second pad groups are used to connect to a printed circuit board (PCB) 130. The first pad group in the M first pad groups corresponds to the second pad group in the M second pad groups one by one, and each first pad group is electrically connected to the corresponding second pad group. Similarly, each second pad group can include one or more pads, which is determined according to the specific electrical connection relationship with the first pad group.

[0049] In Figure 1 In the packaging structure as shown, by providing pads on the bottom and inner wall of the packaging housing of the light source respectively, and the pads on the bottom and inner wall are conductively connected correspondingly. Thus, the pads on the bottom are used to connect to the PCB, and the pads on the inner wall are used to connect to the laser chips. The housing serves as a transmission medium for electrical signals, and can provide corresponding electrical signals for each type of laser, realizing flexible configuration of the laser chips, and achieving the purpose of miniaturization and cost reduction of the laser display projection device.

[0050] In Figure 1In the encapsulated structure shown, the housing 110 may include a frame 112, a transparent cover plate 111, and a bottom plate 113. The bottom plate 113 may be connected to the frame 112 by solder, and the transparent cover plate 111 and the bottom plate 113 are eutectically welded to form a hermetic package. Thus, the frame, the transparent cover plate, and the bottom plate cooperate with each other among the three separate components to form the housing together. In some implementation manners, the bottom plate 113 may be used for heat conduction.

[0051] In addition, an optical element, such as a mirror, may be disposed in the housing 110. In addition, a lens array may be disposed on the transparent cover plate 111. Specifically, it is determined according to the optical design in the actual encapsulated structure.

[0052] Figure 2 It is a schematic structural diagram of a frame provided by an embodiment of the present application. Figure 2 Among them, (a) and (b) respectively show the three-dimensional views of the top and bottom of the frame. Figure 2 Among them, (c) and (d) respectively show the two-dimensional views of the top and bottom of the frame. As Figure 2 As shown in (a) therein, a first opening 210 is provided at the top of the frame, and the first opening 210 is used to configure the transparent cover plate. As Figure 2 As shown in (b) therein, a second opening 240 is provided at the bottom of the frame, and the second opening 240 is used to configure the bottom plate.

[0053] Among them, the inner wall of the housing includes the inner wall of the frame, and M first pad groups 230 are disposed on the inner wall of the frame. In some implementation manners, a boss 220 is provided on the inner wall of the frame. The M first pad groups 230 being disposed on the inner wall of the frame includes: the M first pad groups 230 are disposed on the surface of the boss 220. The bottom of the housing includes the bottom of the frame, and M second pad groups 250 are disposed on the bottom of the frame. Among them, the setting situation of the boss 220 is determined according to the actual situation. For example, one or more bosses may be provided on the inner wall of the frame. The boss 220 may extend from the inner wall of the frame towards the center of the frame.

[0054] Figure 2 (c) therein shows a schematic diagram of the pad distribution of one of the M first pad groups. Among them, the M first pad groups include one or more first pad groups, and each first pad group includes one or more pads. As Figure 2 As shown in (c) therein, the M first pad groups may include pads 231, 232, 233, 234, 235, 236, and 237. The specific grouping of the above pads and the connection manner with the laser chip are described in conjunction with the attached Figure 3 for explanation.

[0055] Figure 2Figure (d) shows a schematic diagram of the pad distribution in one of the M second pad groups. Among them, the M second pad groups include one or more second pad groups, and each second pad group includes one or more pads. As Figure 2 shown in Figure (d), the M second pad groups may include pad 251, pad 252, pad 253, pad 254, pad 255, pad 256, pad 257, and pad 258. The specific grouping of the above pads and the conduction relationship with the M first pad groups will be described in conjunction with the appendix Figure 4 for illustration. Figure 2 Figure (d) specifically shows the situation where the M second pad groups are arranged on the opposite sides of the bottom of the housing. This distribution can reduce the overall power consumption of the packaging structure. In some implementation manners, the M second pad groups are arranged on one side of the bottom of the housing, and this distribution can reduce the overall volume of the packaging structure.

[0056] In some implementation manners, a first hole is provided inside the housing body, and the first hole penetrates from the position of the first pad to the position of the second pad. The first pad and the second pad are connected by wiring through the first hole. Among them, the first pad is a pad in the third pad group, and the second pad is a pad in the fourth pad group. Among them, the third pad group is one of the M first pad groups 230, and the fourth pad group is the pad group corresponding to the third pad group in the M second pad groups 250. That is, the pads in the first pad group and the pads in its corresponding second pad group can be connected by leads through the holes provided inside the housing, so as to achieve mutual conduction. In addition, when there is a boss 220 provided on the inner wall of the housing body, the first hole can be specifically provided inside the boss 220 to accommodate the leads. In addition, the pads in the first pad group and the pads in its corresponding second pad group can also be conducted through external wiring or other means, and the present application does not limit this. It should be understood that since the housing includes the housing body, the inside of the housing body and the inside of the boss 220 can also be understood as the inside of the housing.

[0057] In some implementation manners, the housing body includes a plurality of ceramic sheets, and the plurality of ceramic sheets are stacked in sequence along a first direction, and the first direction is the direction from the bottom of the housing body to the top of the housing body.

[0058] In some implementation manners, the M first pad groups 230 and the M second pad groups 250 are made of a conductive material, so as to achieve electrical connection when the housing body is entirely made of an insulating material (such as the above-mentioned ceramic). Among them, the conductive coating can be a metal, such as gold, copper, etc.

[0059] Figure 3 This is a schematic diagram of the lead connection structure between M laser chips and M first pad groups provided by an embodiment of the present application.

[0060] AsFigure 3 As shown in (a), the M-class laser chip may include a first-class laser chip, and the first-class laser chip corresponds to the fifth pad group among the M first pad groups. Among them, the first-class laser chip includes a first laser chip 310. The fifth pad group includes a third pad 321 and a fourth pad 322. The positive electrode of the first laser chip 310 is connected to the third pad 321, and the negative electrode of the first laser chip 310 is connected to the fourth pad 322. That is, one pad in the first pad group can be connected to the positive electrode of the laser chip, and the other pad can be connected to the negative electrode of the laser chip, so as to transmit a power signal to the laser chip through the first pad group.

[0061] As Figure 3 As shown in (b), the M-class laser chip includes a second-class laser chip, and the second-class laser chip corresponds to the sixth pad group among the M first pad groups. Among them, the second-class laser chip includes a second laser chip 331 and a third laser chip 332, and the sixth pad group includes a fifth pad 341 and a sixth pad 342. Among them, the second laser chip 331 and the third laser chip 332 are connected in series. The positive electrode of the third laser chip 332 is connected to the fifth pad 341, and the negative electrode of the second laser chip 331 is connected to the sixth pad 342. The second laser chip 331 is the chip adjacent to the sixth pad 342 in the second-class laser chip, and the third laser chip 332 is the chip adjacent to the fifth pad 341 in the second-class laser chip. That is, when a class of laser chips includes multiple laser chips, the multiple laser chips can be connected in series, so as to transmit a power signal to the laser chips through the first pad group.

[0062] As Figure 3 As shown in (c), the M-class laser chip includes a third-class laser chip and a fourth-class laser chip. The third-class laser chip corresponds to the seventh pad group among the M first pad groups, and the fourth-class laser chip corresponds to the eighth pad group among the M first pad groups. Among them, the seventh pad group includes a seventh pad 371, and the eighth pad group includes an eighth pad 372. Among them, the third-class laser chip includes a fourth laser chip 350, the fourth-class laser chip includes a fifth laser chip 360, the negative electrode of the fourth laser chip 350 is connected to the seventh pad 371, the negative electrode of the fifth laser chip 360 is connected to the eighth pad 372, and the seventh pad 371 and the eighth pad 372 are the same pad. That is, the negative electrodes of multiple classes of laser chips can be connected to the same pad, so as to save the space of the packaging structure.

[0063] In addition, the first pad group may also include three pads, four pads, etc. In addition, when a class of laser chips includes multiple laser chips, the multiple laser chips can also be connected in parallel, and this application does not limit this.

[0064] Figure 4 This is a schematic diagram of the conduction relationship between M first pad groups and M second pad groups provided by an embodiment of the present application. As shown in Figure 4 (a), the ninth pad group included in the M first pad groups is shown. As shown in Figure 4 (b), the tenth pad group in the M second pad groups is shown.

[0065] Among them, the ninth pad group in the M first pad groups corresponds to the tenth pad group in the M second pad groups. The ninth pad group includes the ninth pad 410. For the remaining pads, such as pad 411, pad 412, pad 413, pad 414, pad 415, pad 416, they are similar to Figure 2 (c) and will not be elaborated here. The tenth pad group includes the tenth pad 422 and the eleventh pad 428. For the remaining pads, such as pad 421, pad 423, pad 424, pad 425, pad 426, pad 427, they are similar to Figure 2 (d) and will not be elaborated here.

[0066] As shown in Figure 4 (a) and (b), the ninth pad group includes the ninth pad 410. The ninth pad 410 is conductively connected to the tenth pad 422 and the ninth pad 410 is also conductively connected to the eleventh pad 428. Among them, the tenth pad 422 and the eleventh pad 428 are pads in the tenth pad group. The tenth pad 422 and the eleventh pad 428 are respectively arranged on opposite sides of the bottom of the housing. That is to say, the pads in the M first pad groups can be conductively connected to two relatively arranged pads in the M second pad groups, so as to reduce the transmission voltage and save power consumption when the M second pad groups transmit electrical signals to the M first pad groups. In addition, the pads in the M first pad groups can also be conductively connected to the pads in the M second pad groups in other ways, and the present application does not limit this.

[0067] Figure 5 This is a schematic diagram of a light source structure provided by an embodiment of the present application. The light source may include a packaging structure 520 and a printed circuit board 510 as described in Figures 1 to 4 . M connectors are arranged on the printed circuit board 510. The connectors in the M connectors correspond one by one to the second pad groups in the M second pad groups. The connectors are used to transmit electrical signals to the corresponding second pad groups. The packaging structure 520 is used to output optical signals according to the M paths of electrical signals transmitted by the M connectors. In addition, the connector may specifically refer to a power cord.

[0068] Among them, the PCB may include a substrate and a circuit. The substrate of the PCB is a high thermal conductivity material, or it can also be understood that the surface of the PCB is a high thermal conductivity material. For example, the PCB may include a copper substrate with bosses. There is an insulating material layer between the circuit and the substrate in the PCB.

[0069] Among them, the encapsulation structure can be soldered on the PCB through the surface mount technology. Thus, the M second pad groups of the encapsulation structure can be correspondingly connected to the circuit in the PCB.

[0070] Next, in combination with the attached Figure 6 to the attached Figure 8 describe the light source embodiments provided by this application.

[0071] Figure 6 is a schematic diagram of a light source structure provided by an embodiment of this application. Among them, Figure 6 Figure (a) shows a schematic diagram of the overall structure of the light source. Figure 6 Figure (b) shows a schematic diagram of the internal structure of the encapsulation structure included in the light source. Figure 6 Figure (c) shows a schematic diagram of the bottom structure of the encapsulation structure.

[0072] In the case of Figure 6 as shown, the encapsulation structure includes three types of laser chips, namely a blue laser chip 641, a green laser chip 642, and a red laser chip 643.

[0073] As Figure 6 shown in Figure (a), the PCB includes a positive electrode 611, a positive electrode 612, a positive electrode 613, and a negative electrode 614. Among them, the positive electrode 611 and the negative electrode 614 are used to transmit electrical signals to the blue laser chip 641. The positive electrode 612 and the negative electrode 614 are used to transmit electrical signals to multiple green laser chips 642. The positive electrode 613 and the negative electrode 614 are used to transmit electrical signals to multiple red laser chips 643.

[0074] As Figure 6 shown in Figure (b), three first pad groups are provided inside the housing of the encapsulation structure. Among them, the first first pad group includes a positive electrode pad 621 and a negative electrode pad 622. This pad group corresponds to the blue laser chip 641. The positive electrode pad 621 is connected to the positive electrode lead of the blue laser chip 641, and the negative electrode pad 622 is connected to the negative electrode lead of the blue laser chip 641.

[0075] The second first pad group includes a positive electrode pad 623 and a negative electrode pad 622. This pad group corresponds to the green laser chip 642. The positive electrode pad 623 is connected to the positive electrode lead of the green laser chip 642, and the negative electrode pad 622 is connected to the negative electrode lead of the green laser chip 642. Multiple green laser chips 642 are connected in series in sequence.

[0076] The third first pad group includes a positive electrode pad 624 and a negative electrode pad 625. This pad group corresponds to the red laser chip 643. The positive electrode pad 624 is connected to the positive electrode lead of the red laser chip 643, and the negative electrode pad 625 is connected to the negative electrode lead of the red laser chip 643. Multiple red laser chips 643 are connected in series in sequence.

[0077] As Figure 6 As shown in (c) therein, three second pad groups are provided at the bottom of the housing of the packaging structure. Among them, the first second pad group includes a positive electrode pad 638 and a negative electrode pad 635. The first second pad group corresponds to the second first pad group. The positive electrode pad 638 in the first second pad group is electrically connected to the positive electrode pad 621 in the first first pad group. The negative electrode pad 634 in the first second pad group is electrically connected to the negative electrode pad 622 in the first first pad group.

[0078] The second second pad group includes a positive electrode pad 636 and a negative electrode pad 635. The second second pad group corresponds to the second first pad group. The positive electrode pad 636 in the second second pad group is electrically connected to the positive electrode pad 623 in the second first pad group. The negative electrode pad 635 in the second second pad group is electrically connected to the negative electrode pad 622 in the second first pad group.

[0079] The third second pad group includes a positive electrode pad 637 and a negative electrode pad 635. The third second pad group corresponds to the third first pad group. The positive electrode pad 637 in the third second pad group is electrically connected to the positive electrode pad 624 in the third first pad group. The negative electrode pad 635 in the third second pad group is electrically connected to the negative electrode pad 625 in the third first pad group.

[0080] The three second pad groups at the bottom of the housing are connected to the PCB. Among them, the positive electrode pad 638 in the first second pad group is connected to the positive electrode 611 in the PCB, and the negative electrode pad 635 in the first second pad group is connected to the negative electrode 614 in the PCB. The positive electrode pad 636 in the second second pad group is connected to the positive electrode 612 in the PCB, and the negative electrode pad 635 in the second second pad group is connected to the negative electrode 614 in the PCB. The positive electrode pad 637 in the third second pad group is connected to the positive electrode 613 in the PCB, and the negative electrode pad 635 in the third second pad group is connected to the negative electrode 614 in the PCB.

[0081] In addition, the pads 631, 632, 633, and 634 at the bottom of the housing can be used as spares or designed to be connected to the functional circuits of other parts of the PCB, which is determined according to the actual situation.

[0082] Figure 7It is a schematic diagram of a light source structure provided by an embodiment of the present application. Among them, Figure 7 Figure (a) shows a schematic diagram of the overall structure of the light source. Figure 7 Figure (b) shows a schematic diagram of the internal structure of the packaging structure included in the light source. Figure 7 Figure (c) shows a schematic diagram of the bottom structure of the packaging structure.

[0083] In the case of Figure 7 the packaging structure includes a type 1 laser chip, and this type of laser chip is a monochromatic laser chip 741.

[0084] As Figure 7 shown in Figure (a), the PCB includes a positive electrode 711 and a negative electrode 712. Among them, the positive electrode 711 and the negative electrode 712 are used to transmit electrical signals to the monochromatic laser chip 741.

[0085] As Figure 7 shown in Figure (b), one first pad group is provided inside the housing of the packaging structure. This pad group includes a negative pad 721 and a positive pad 722. This pad group corresponds to the monochromatic laser chip, the negative pad 721 is connected to the negative lead of the monochromatic laser chip, and the positive pad 722 is connected to the positive lead of the monochromatic laser chip. Multiple monochromatic laser chips are connected in series in sequence.

[0086] As Figure 7 shown in Figure (c), one second pad group is provided at the bottom of the housing of the packaging structure. This second pad group includes a negative pad 733 and a positive pad 737. This second pad group corresponds to the above-mentioned first pad group, the negative pad 733 in the second pad group is conducted with the negative pad 721 in the first pad group. The positive pad 737 in the second pad group is conducted with the positive pad 722 in the first pad group.

[0087] The second pad group at the bottom of the housing is connected to the PCB. Among them, the positive pad 737 in the second pad group is connected to the positive electrode 711 in the PCB, and the negative pad 733 in the second pad group is connected to the negative electrode 712 in the PCB.

[0088] In addition, the pads 732, 731, 734, 735, 736, and 738 at the bottom of the housing can be used as spares, or designed to be connected to the functional circuits of other parts of the PCB, which is determined according to the actual situation.

[0089] Figure 8 It is a schematic diagram of a light source structure provided by an embodiment of the present application. Among them, Figure 8 Figure (a) shows a schematic diagram of the overall structure of the light source. Figure 8 Figure (b) shows a schematic diagram of the internal structure of the packaging structure included in the light source. Figure 8Figure (c) shows a schematic diagram of the bottom structure of the package structure.

[0090] In the case of Figure 8 the package structure includes two types of laser chips, which can be a blue laser chip 841 and a green laser chip 842 respectively. In addition, the two types of laser chips can also be laser chips of other colors.

[0091] As Figure 8 shown in Figure (a), the PCB includes positive electrodes 811, 812 and a negative electrode 813. Among them, the positive electrode 811 and the negative electrode 813 are used to transmit electrical signals to the blue laser chip 841. The positive electrode 812 and the negative electrode 813 are used to transmit electrical signals to the green laser chip 842.

[0092] As Figure 8 shown in Figure (b), two first pad groups are provided inside the housing of the package structure. The first first pad group includes a negative pad 821 and a positive pad 822. This pad group corresponds to the blue laser chip 841, the positive pad 822 is connected to the positive lead of the blue laser chip 841, and the negative pad 821 is connected to the negative lead of the blue laser chip 841.

[0093] The second first pad group includes a positive pad 824 and a negative pad 823. This pad group corresponds to the green laser chip 842, the positive pad 824 is connected to the positive lead of the green laser chip 842, and the negative pad 823 is connected to the negative lead of the green laser chip 842.

[0094] As Figure 8 shown in Figure (c), two second pad groups are provided at the bottom of the housing of the package structure. The first second pad group includes a positive pad 836 and a negative pad 834. The first second pad group corresponds to the first first pad group, the positive pad 836 in the first second pad group is electrically connected to the positive pad 822 in the first first pad group, and the negative pad 834 in the first second pad group is electrically connected to the negative pad 821 in the first first pad group.

[0095] The second second pad group includes a positive pad 837 and a negative pad 834. The second second pad group corresponds to the second first pad group, the positive pad 837 in the second second pad group is electrically connected to the positive pad 824 in the second first pad group, and the negative pad 834 in the second second pad group is electrically connected to the negative pad 823 in the second first pad group.

[0096] The two second pad groups at the bottom of the housing are connected to the PCB. Among them, the positive pad 836 in the first second pad group is connected to the positive electrode 811 in the PCB, and the negative pad 834 in the first second pad group is connected to the negative electrode 813 in the PCB. The positive pad 837 in the second second pad group is connected to the positive electrode 812 in the PCB, and the negative pad 834 in the second second pad group is connected to the negative electrode 813 in the PCB.

[0097] In addition, the pads 832, 831, 835, 833, and 838 at the bottom of the housing can be used as spares or designed to be connected to the functional circuits of other parts of the PCB, which is determined according to the actual situation.

[0098] Figure 9 It is a schematic structural diagram of a projection device provided by an embodiment of the present application. As Figure 9 shown, the projection device includes a power supply 910, a light source 920, a modulator 930, and a lens 940. Among them, the power supply 910 is connected to the light source 920, and the power supply 910 is used to send M power supply 910 signals to the light source 920. The light source 920 is used to emit a first light beam. The modulator 930 is used to modulate the first light beam to obtain an optical signal. The lens 940 is used to project the optical signal to display a projection image.

[0099] In addition, the present application also provides a vehicle-mounted display system and a vehicle.

[0100] Figure 10 It is a schematic diagram of a vehicle-mounted display system provided by an embodiment of the present application. As Figure 10 shown, the vehicle-mounted display system mainly includes a main processor (host CPU) 1001, an external memory interface 1002, an internal memory 1003, an audio module 1004, a video module 1005, a power module 1006, a wireless communication module 1007, an I / O interface 1008, a video interface 10010, and a projection device 1010. Among them, the main processor 1001 and its peripheral components, such as the external memory interface 1002, the internal memory 1003, the audio module 1004, the video module 1005, the power module 1006, the wireless communication module 1007, the I / O interface 1008, the video interface 10010, and the projection device 1010, can be connected through a bus. The main processor 1001 can be called a front-end processor.

[0101] Among them, the main processor 1001 includes one or more processing units. For example, the main processor 1001 may include an Application Processor (AP), a modem processor, a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a controller, a video codec, a Digital Signal Processor (DSP), a baseband processor, and / or a Neural-Network Processing Unit (NPU), etc. Among them, different processing units may be independent devices or integrated in one or more processors.

[0102] A memory may also be provided in the main processor 1001 for storing instructions and data. In some embodiments, the memory in the main processor 1001 is a cache memory. This memory can save the instructions or data that the main processor 1001 has just used or recycled. If the main processor 1001 needs to use the instruction or data again, it can directly call it from the memory. This avoids repeated accesses, reduces the waiting time of the main processor 1001, and thus improves the efficiency of the system.

[0103] Among them, the projection device 1010 can be the projection device provided in any of the above embodiments. In some embodiments, the projection device 1010 may further include a plurality of input / output (I / O) interfaces 1008 connected to the main processor 1001. The interfaces 1008 may include an Inter-Integrated Circuit (I2C) interface, an Inter-Integrated Circuit Sound (I2S) interface, a Pulse Code Modulation (PCM) interface, a Universal Asynchronous Receiver / Transmitter (UART) interface, a Mobile Industry Processor Interface (MIPI), a General-Purpose Input / Output (GPIO) interface, a Subscriber Identity Module (SIM) interface, and / or a Universal Serial Bus (USB) interface, etc. The above I / O interfaces 1008 can be connected to devices such as a mouse, a touchpad, a keyboard, a camera, a speaker / speaker, a microphone, etc., and can also be connected to physical buttons on the projection device (such as volume buttons, brightness adjustment buttons, power on / off buttons, etc.).

[0104] The external memory interface 1002 can be used to connect an external memory card, such as a Micro SD card, to implement the storage capacity expansion of the projection device. The external memory card communicates with the main processor 1001 through the external memory interface 1002 to implement the data storage function.

[0105] The internal memory 1003 can be used to store computer-executable program codes, and the executable program codes include instructions. The internal memory 1003 may include a program storage area and a data storage area. Among them, the program storage area can store an operating system, applications required for at least one function (such as a call function, a time setting function, etc.). The data storage area can store data created during the use of the projection device (such as a phone book, world time, etc.). In addition, the internal memory 1003 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a Universal Flash Storage (UFS), etc. The main processor 1001 executes various functional applications and data processing of the projection device by running the instructions stored in the internal memory 1003, and / or the instructions stored in the memory provided in the main processor 1001.

[0106] The projection device can implement audio functions through the audio module 1004 and the application processor, etc. For example, music playback, calls, etc.

[0107] The audio module 1004 is used to convert digital audio information into an analog audio signal for output, and is also used to convert analog audio input into a digital audio signal. The audio module 1004 can also be used for encoding and decoding audio signals, such as for playing sound or recording. In some embodiments, the audio module 1004 can be disposed in the main processor 1001, or some functional modules of the audio module 1004 can be disposed in the main processor 1001.

[0108] The video interface 10010 can receive externally input audio and video signals, which can specifically be a High Definition Multimedia Interface (HDMI), a Digital Visual Interface (DVI), a Video Graphics Array (VGA), a Display Port (DP), etc. The video interface 10010 can also output video externally. When the projection device is used as an in-vehicle display, the video interface 10010 can receive speed signals and power signals input by peripheral devices, and can also receive externally input VR video signals. When the projection device is in use, the video interface 10010 can receive video signals input by an external computer or terminal device.

[0109] The video module 1005 can decode the video input by the video interface 10010, such as performing H.264 decoding. The video module can also encode the video captured by the projection device, such as performing H.264 encoding on the video captured by an external camera. In addition, the main processor 1001 can also decode the video input by the video interface 10010, and then output the decoded image signal to the projection device 1010.

[0110] The projection device 1010 is used to display the corresponding image. In this embodiment, the video interface 10010 receives an externally input video source signal. After the video module 1005 performs decoding and / or digitization processing, one or more image signals are output to the projection device 1010. The projection device 1010 forms an image of the incident light source according to the input image signal, and then outputs image light. In addition, the main processor 1001 can also output one or more image signals to the projection device 1010.

[0111] The wireless communication module 1007 enables the projection device to communicate wirelessly with the outside world. It can provide solutions for wireless communication such as Wireless Local Area Networks (WLAN) (such as Wireless Fidelity (Wi-Fi) networks), Bluetooth (BT), Global Navigation Satellite System (GNSS), Frequency Modulation (FM), Near Field Communication (NFC), and Infrared (IR). The wireless communication module 1007 can be one or more devices integrating at least one communication processing module. The wireless communication module 1007 receives electromagnetic waves via an antenna, performs frequency modulation and filtering processing on the electromagnetic wave signals, and sends the processed signals to the main processor 1001. The wireless communication module 1007 can also receive the signals to be sent from the main processor 1001, perform frequency modulation and amplification on them, and convert them into electromagnetic waves through the antenna for radiation.

[0112] In addition, the video data decoded by the video module 1005 can be received wirelessly through the wireless communication module 1007 or read from an external memory in addition to being input through the video interface 10010. For example, the projection device can receive video data from a terminal device or an in-vehicle entertainment system through the wireless local area network in the vehicle. The projection device can also read the audio and video data stored in the external memory.

[0113] In addition, as Figure 10 described, the in-vehicle display system can be installed on a vehicle.

[0114] Figure 11 This is a vehicle provided by an embodiment of the present application. The functional framework of the vehicle may include various subsystems, such as the sensor system 12, control system 14, one or more peripheral devices 16 (illustrated by one example), power supply 18, computer system 20, and in-vehicle display system 22 shown in the figure. Optionally, the vehicle may further include other functional systems, such as an engine system that provides power for the vehicle, etc. This application does not make any limitations here.

[0115] Among them, the sensor system 12 may include several detection devices that can sense the information to be measured and convert the sensed information into electrical signals or other required forms of information output according to certain rules. As shown in the figure, these detection devices may include a global positioning system (GPS), a vehicle speed sensor, an inertial measurement unit (IMU), a radar unit, a laser rangefinder, a camera device, a wheel speed sensor, a steering sensor, a gear sensor, or other elements for automatic detection, etc., which are not limited in this application.

[0116] The control system 14 may include several elements, such as the steering unit, the braking unit, the lighting system, the automatic driving system, the map navigation system, the network time synchronization system, and the obstacle avoidance system shown in the figure. Optionally, the control system 14 may also include elements such as a throttle controller and an engine controller for controlling the vehicle driving speed, which are not limited in this application.

[0117] The peripheral device 16 may include several elements, such as the communication system, the touch screen, the user interface, the microphone, and the speaker shown in the figure, etc. Among them, the communication system is used to realize network communication between the vehicle and other devices except the vehicle. In practical applications, the communication system may use wireless communication technology or wired communication technology to realize network communication between the vehicle and other devices. The wired communication technology may refer to communication between the vehicle and other devices through a network cable or optical fiber, etc.

[0118] The power supply 18 represents a system that provides power or energy for the vehicle, which may include but is not limited to rechargeable lithium batteries or lead-acid batteries, etc. In practical applications, one or more battery components in the power supply are used to provide electrical energy or energy for vehicle startup, and the type and material of the power supply are not limited in this application.

[0119] Several functions of the vehicle are controlled and realized by the computer system 20. The computer system 20 may include one or more processors 2001 (illustrated with one processor as an example) and a memory 2002 (also referred to as a storage device). In practical applications, the memory 2002 may also be inside the computer system 20 or outside the computer system 20, such as a cache in the vehicle, etc., which is not limited in this application. Among them,

[0120] The processor 2001 may include one or more general-purpose processors, such as a graphic processing unit (GPU). The processor 2001 may be used to run the relevant programs or instructions corresponding to the programs stored in the memory 2002 to realize the corresponding functions of the vehicle.

[0121] The memory 2002 may include volatile memory, such as RAM; the memory may also include non-volatile memory, such as ROM, flash memory, HDD or solid state drive SSD; the memory 2002 may further include a combination of the above types of memories. The memory 2002 can be used to store a set of program codes or instructions corresponding to the program codes, so that the processor 2001 can call the program codes or instructions stored in the memory 2002 to implement the corresponding functions of the vehicle. In this application, a set of program codes for vehicle control can be stored in the memory 2002, and the processor 2001 can call the program codes to control the vehicle to drive safely. How to implement safe vehicle driving will be described in detail in the following text of this application.

[0122] Optionally, in addition to storing program codes or instructions, the memory 2002 can also store information such as road maps, driving routes, sensor data, etc. The computer system 20 can combine with other elements in the vehicle function framework schematic diagram, such as sensors, GPS, etc. in the sensor system, to implement the relevant functions of the vehicle. For example, the computer system 20 can control the driving direction or driving speed of the vehicle based on the data input of the sensor system 12, which is not limited in this application.

[0123] The in-vehicle display system 22 may include several elements, such as a controller and an in-vehicle display system. The controller 222 is used to generate an image (such as an image of VR content) according to a user instruction, and send the image to the in-vehicle display system for display; the in-vehicle display system may include an image generation unit, a window unit and an image magnification unit, and passengers can view the target image presented by the in-vehicle display system through the window unit. Among them, the functions of some elements in the in-vehicle display system can also be implemented by other subsystems of the vehicle. For example, the controller can also be an element in the control system.

[0124] Among them, this application Figure 11 shows that including four subsystems, the sensor system 12, the control system 14, the computer system 20 and the in-vehicle display system 22 are only examples and do not constitute a limitation. In practical applications, the vehicle can combine several elements in the vehicle according to different functions to obtain corresponding subsystems with different functions. In practical applications, the vehicle may include more or fewer systems or elements, which is not limited in this application.

[0125] The above-mentioned vehicle can be a car, a truck, a bus, a ship, an airplane, a helicopter, a recreational vehicle, a train, etc., and the embodiments of this application do not make special limitations.

[0126] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0127] Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0128] In several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division, and there can be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed mutual coupling, direct coupling, or communication connection can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be in an electrical, mechanical, or other form.

[0129] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0130] In addition, the functional units in each embodiment of this application can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0131] When the above-mentioned functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of this application. The foregoing storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks, or optical discs.

[0132] As described above, the above are only specific implementation manners of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this application can easily think of changes or substitutions, which should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A packaging structure, characterized in that: It includes a housing and a class M laser chip, wherein: The M-type laser chips are arranged in the housing, and each type of laser chip in the M-type laser chips is used to emit a type of light beam, wherein M is a positive integer; Wherein, the inner wall of the shell is provided with M first pad groups, each of the M first pad groups corresponds to a type of laser chip among the M types of laser chips, and each first pad group is electrically connected to the corresponding type of laser chip; M second pad groups are arranged at the bottom of the shell, and the M second pad groups are used to connect the printed circuit board. The first pad groups in the M first pad groups correspond one to one with the second pad groups in the M second pad groups, and each first pad group is electrically connected to the corresponding second pad group.

2. The packaging structure according to claim 1, characterized in that: The housing comprises a frame, a transparent cover plate and a bottom plate, wherein: The top of the frame is provided with a first opening, the transparent cover is arranged in the first opening, the bottom of the frame is provided with a second opening, the bottom plate is arranged in the second opening; Wherein, the inner wall of the shell includes the inner wall of the frame, and the M first pad groups are arranged on the inner wall of the frame; The bottom of the shell includes the bottom of the frame, and the M second pad groups are arranged on the bottom of the frame.

3. The packaging structure according to claim 2, characterized in that: in: The inner wall of the frame is provided with a boss; The M first pad groups are arranged on the inner wall of the frame body, including: the M first pad groups are arranged on the surface of the boss.

4. The packaging structure according to claim 2 or 3, characterized in that: in: The frame includes a plurality of ceramic sheets, which are stacked in sequence along a first direction, where the first direction is a direction from a bottom of the frame to a top of the frame.

5. The packaging structure according to claim 4, characterized in that: in, The M first pad groups and the M second pad groups are made of conductive material.

6. The packaging structure according to any one of claims 1 to 3, characterized in that: in: A first hole is provided inside the housing, the first hole passes through from the position of the first pad to the position of the second pad, and the first pad and the second pad are connected by wires through the first hole; Among them, the first pad is a pad in the third pad group, and the second pad is a pad in the fourth pad group, wherein the third pad group is one of the M first pad groups, and the fourth pad group is a pad group among the M second pad groups corresponding to the third pad group.

7. The packaging structure according to any one of claims 1 to 3, characterized in that: in: The M-type laser chips include a first-type laser chip, and the first-type laser chip corresponds to a fifth pad group in the M first pad groups, wherein the first-type laser chip includes a first laser chip, and the fifth pad group includes a third pad and a fourth pad; The positive electrode of the first laser chip is connected to the third pad, and the negative electrode of the first laser chip is connected to the fourth pad.

8. The packaging structure according to any one of claims 1 to 3, characterized in that: in: The M-type laser chips include a second-type laser chip, and the second-type laser chip corresponds to the sixth pad group in the M first pad groups, wherein the second-type laser chip includes a second laser chip and a third laser chip, and the sixth pad group includes a fifth pad and a sixth pad; The second laser chip and the third laser chip are connected in series, the positive electrode of the second laser chip is connected to the fifth pad, the negative electrode of the third laser chip is connected to the sixth pad, the second laser chip is the laser chip adjacent to the fifth pad in the second type of laser chips, and the third laser chip is the laser chip adjacent to the sixth pad in the second type of laser chips.

9. The packaging structure according to any one of claims 1 to 3, characterized in that: in: The M-type laser chip includes a third-type laser chip and a fourth-type laser chip, the third-type laser chip corresponds to the seventh pad group of the M first pad groups, and the fourth-type laser chip corresponds to the eighth pad group of the M first pad groups, wherein the seventh pad group includes a seventh pad, and the eighth pad group includes an eighth pad; Among them, the third type of laser chip includes a fourth laser chip, the fourth type of laser chip includes a fifth laser chip, the cathode of the fourth laser chip is connected to the seventh pad, the cathode of the fifth laser chip is connected to the eighth pad, and the seventh pad and the eighth pad are the same pad.

10. The packaging structure according to any one of claims 1 to 3, characterized in that: in: The M first pad groups include a ninth pad group, and the ninth pad group corresponds to the tenth pad group in the M second pad groups; The ninth pad group includes a ninth pad, the ninth pad is electrically connected to a tenth pad, and the ninth pad is electrically connected to an eleventh pad; The tenth soldering pad and the eleventh soldering pad are soldering pads in the tenth soldering pad group, and the tenth soldering pad and the eleventh soldering pad are respectively arranged on two opposite sides of the bottom of the shell.

11. The packaging structure according to any one of claims 1 to 3, characterized in that: in: The M second pad groups are arranged on the same side of the bottom of the housing; or The M second pad groups are arranged on two opposite sides of the bottom of the housing.

12. A light source, characterized in that: The invention comprises a packaging structure and a printed circuit board as claimed in any one of claims 1 to 11, wherein: The printed circuit board is provided with M connectors, the connectors in the M connectors correspond one-to-one to the second pad groups in the M second pad groups, and the connectors are used to transmit power signals to the corresponding second pad groups; The packaging structure is used to output a first light beam after receiving M power supply signals transmitted by the M connectors.

13. A projection device, characterized in that: comprising a power supply, a light source, a modulator and a lens as claimed in claim 12, wherein: The power supply is connected to the light source, and the power supply is used to send the M power supply signals to the light source; The light source is used to emit the first light beam; The modulator is used to modulate the first light beam to obtain an optical signal; The lens is used to project the optical signal to display a projection picture.

14. A display system, characterized in that: Comprising the projection device as claimed in claim 13.

15. A means of transport, characterized in that: Comprising the display system as claimed in claim 14.

Images