CPCIe extensible device with liquid cooling active heat dissipation function

Abstract

The utility model discloses a CPCIe extensible device with liquid cooling active heat dissipation, which comprises a box body, a back plate connector arranged on the rear side in the box body, an upper liquid cooling channel arranged in a box cover, an upper water diversion channel and a lower water diversion channel respectively arranged at the top and the bottom in the box cover, and a plurality of rows of first slot positions arranged in the box body, the top of each first slot position is provided with a first quick connector communicated with the upper water diversion channel, and the bottom of each first slot position is provided with a second quick connector communicated with the lower water diversion channel; the lower water diversion channel is communicated with the water tank water return port through an upper liquid cooling channel; the plurality of CPU board cards are arranged in the corresponding first slot positions in a pluggable manner and are connected with the backboard connector; the CPU board card is provided with a liquid cooling heat dissipation piece, and a third quick connector and a fourth quick connector which are connected with a water inlet and a water outlet of the liquid cooling heat dissipation piece; and the third and fourth quick connectors are respectively communicated with the first and second quick connectors. According to the utility model, the reliability and durability of equipment in a severe environment and the processing capability and function expansibility of a system are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of CPCIe expansion, and particularly relates to a CPCIe expandable device with liquid-cooled active heat dissipation. Background Art

[0002] In applications in advanced technical fields such as aerospace, ships, image and video processing, and industrial control, CPCIe devices are highly favored due to their excellent communication and control performance. However, most current CPCIe devices adopt a single CPU board structure. Although this design is simple, it lacks necessary scalability. When encountering complex engineering situations, this limitation becomes particularly obvious, often requiring the deployment of multiple devices to work together, which not only increases the floor area and economic cost of the devices, but also increases the complexity of maintenance and management. Especially in scenarios with limited space height, these devices are difficult to meet the installation and operation requirements.

[0003] On the other hand, since a single CPU board relies on built-in fans or heat sinks for cooling, the device cannot be fully enclosed. Although this open heat dissipation solution is effective, it makes the device extremely sensitive to harsh external conditions such as dust and salt spray. The intrusion of external particulate matter may cause the device to restart frequently, crash, or even cause hardware damage, severely restricting its application range and reliability in harsh environments.

[0004] Therefore, there is an urgent need for a CPCIe expandable device with liquid-cooled active heat dissipation. Summary of the Utility Model

[0005] Aiming at the deficiencies existing in the prior art, the utility model provides a CPCIe expandable device with liquid-cooled active heat dissipation.

[0006] The utility model discloses a CPCIe expandable device with liquid-cooled active heat dissipation, including:

[0007] A box body, a backplane connector is installed at the rear side inside the box body, a box cover is installed on the top of the box body, an upper liquid-cooling channel is installed inside the box cover, a water distribution tank is installed on the top and the bottom inside the box body respectively, and multiple rows of first slot positions and second slot positions are also arranged inside the box body. A first quick connector communicating with the upper water distribution tank is arranged at the top of each row of the first slot positions, and a second quick connector communicating with the lower water distribution tank is arranged at the bottom of each row of the first slot positions; the upper water distribution tank is communicated with the water outlet of the water tank through a water pump, and the lower water distribution tank is communicated with the water return port of the water tank through the upper liquid-cooling channel;

[0008] CPU boards, multiple of the CPU boards are respectively and removably installed in corresponding first slot positions and are respectively connected to corresponding insertion interfaces of the backplane connector; a liquid cooling radiator, a third quick connector connected to the water inlet interface of the liquid cooling radiator, and a fourth quick connector connected to the water outlet interface of the liquid cooling radiator are installed on each of the CPU boards; the third quick connector and the fourth quick connector are respectively communicated with the first quick connector and the second quick connector of the corresponding first slot position;

[0009] Other functional boards, multiple of the other functional boards are respectively and removably installed in corresponding second slot positions and are respectively connected to corresponding insertion interfaces of the backplane connector.

[0010] As a further improvement of the present utility model, the interior of the box body is divided by a vertical partition board, a plug-in installation area is formed in the left area, and a water pump installation area is formed in the right area; a water tank is installed on the back of the box body corresponding to the position of the water pump installation area;

[0011] Multiple rows of the first slot positions and the second slot positions are provided in the plug-in installation area, the backplane connector is installed at the rear side of the plug-in installation area, and an upper water distribution tank and a lower water distribution tank are respectively installed at the top and the bottom of the plug-in installation area; the water pump is installed in the water pump installation area, an inlet of the water pump is communicated with a water outlet of the water tank, and an outlet of the water pump is communicated with the upper water distribution tank.

[0012] As a further improvement of the present utility model, each row of the first slot positions and the second slot positions includes an upper slot part and a lower slot part which are arranged vertically up and down, and the upper slot part and the lower slot part both extend along the board card plug-in direction;

[0013] Cross beams and guide rails are installed on the front side and the rear side of the top and the bottom of the plug-in installation area along the board card plug-in direction, and the laying direction of the cross beams and the guide rails is perpendicular to the board card plug-in direction; multiple rows of the upper slot parts and the lower slot parts are respectively installed on the corresponding cross beams and guide rails.

[0014] As a further improvement of the present utility model, the backplane connector is provided with insertion interfaces corresponding to each row of the first slot positions and the second slot positions, and the insertion interfaces are used for inserting the corresponding CPU boards and other functional boards.

[0015] As a further improvement of the present utility model, the front side of the box body is designed to be open, a front panel is detachably installed on the front side of the box body, an annular sealing strip is arranged between the front panel and the box body, and a touch screen, a switch button and a reset button are installed on the panel.

[0016] As a further improvement of the present utility model, the liquid cooling radiator is a cold plate, which is detachably installed at the high-power components of the CPU board. The cold plate is configured with a water inlet interface and a water outlet interface, and the water inlet interface and the water outlet interface are respectively connected to the third quick connector and the fourth quick connector through liquid cooling pipelines.

[0017] As a further improvement of the present utility model, when multiple cold plates are provided, the water inlet interfaces and the water outlet interfaces of the multiple cold plates are connected in series with each other through liquid cooling pipelines to form an internal liquid cooling channel for the coolant to flow through;

[0018] The third quick connector is connected to the water inlet interface of the first-stage cold plate through the liquid cooling pipeline, and the fourth quick connector is connected to the water outlet interface of the last-stage cold plate through the liquid cooling pipeline.

[0019] As a further improvement of the present utility model, multiple rows of heat dissipation fins are provided on the top of the box cover, and handles for clamping with the box body are symmetrically installed on the left and right sides of the box cover.

[0020] As a further improvement of the present utility model, the first quick connector, the second quick connector, the third quick connector, and the fourth quick connector are all blind plug quick connectors.

[0021] As a further improvement of the present utility model, a heat dissipation fan is further included. Multiple heat dissipation fans are installed on the top of the box cover, and the multiple heat dissipation fans are used to cool the coolant in the upper liquid cooling channel.

[0022] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0023] Through the design of multiple rows of first slot positions, the present utility model can insert multiple CPU boards at the same time, and each board can work independently, thereby improving the processing capacity and functional expandability of the system. This design reduces the number of devices to be deployed, saves space and cost, and also reduces the complexity of maintenance and management.

[0024] The present utility model adopts a liquid cooling active heat dissipation method, and the heat on the CPU board is taken away by the circulating flow of the coolant, so that the device can operate stably under high load conditions. The design of the liquid cooling system allows the device to be fully enclosed, thereby effectively preventing the intrusion of external particulate matters such as dust and salt mist, improving the reliability and durability of the device in harsh environments, and reducing the noise during operation at the same time.

[0025] Due to the good scalability and heat dissipation performance, the present utility model can better cope with complex engineering situations, meet the needs of high-performance computing and control, and adapt to the installation environment with limited space height at the same time. Description of the Drawings

[0026] Figure 1 Front axonometric view of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0027] Figure 2 Rear axonometric view of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0028] Figure 3 Front view of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0029] Figure 4 Rear view of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0030] Figure 5 Axonometric view of the front panel structure removed from a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0031] Figure 6 Front view of the front panel structure removed from a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0032] Figure 7 Schematic diagram of the internal structure of the box of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0033] Figure 8 Schematic diagram of the structure of the first slot position of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0034] Figure 9 Schematic diagram of the installation of the CPU board card of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0035] Figure 10 Side view of the installation of the CPU board card of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0036] Figure 11 Schematic diagram of the structure of the box cover of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0037] Figure 12 Schematic diagram of the layout of the upper liquid-cooling channel of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0038] Figure 13 Schematic diagram of the CPU board structure of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0039] Figure 14 Schematic diagram of the third quick connector structure of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0040] Figure 15 Side sectional view of the third quick connector structure of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model;

[0041] Figure 16 Schematic diagram of the flow direction of the coolant medium of a CPCIe expandable device with liquid-cooled active heat dissipation disclosed in an embodiment of the present utility model.

[0042] In the figure:

[0043] 1. Box body; 1-1. Plug-in installation area; 1-2. Water pump installation area; 1-3. Vertical partition; 1-4. Guide rail; 1-5. Lower slot part; 1-6. Upper slot part; 2. Box cover; 2-1. Heat dissipation fins; 2-2. Handle; 2-3. Upper liquid cooling channel; 3. Front panel; 3-1. Window panel; 4. CPU board; 4-1. Board main body; 4-2. Board panel; 4-3. Cold plate; 4-4. Liquid cooling pipeline; 4-5. Ejector; 5. Backplane connector; 5-1. Jack; 6. Upper water distribution tank; 7. Lower water distribution tank; 8. Water pump; 9. Water tank; 9-1. Water tank water outlet; 9-2. Water tank water return port; 10. First quick connector; 11. Second quick connector; 12. Third quick connector; 12-1. Brass mounting seat; 12-2. Blind plug quick connector; 12-3. Connection port; 13. Fourth quick connector; 14. Cooling fan; 15. Touch screen; 16. Button operation area; 17. Shock absorber; 18. External interface area. Detailed implementation manners

[0044] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0045] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0046] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0047] The following further describes the present utility model in detail with reference to the drawings:

[0048] As Figure 1-10 shown, a CPCI e expandable device with liquid-cooled active heat dissipation provided according to the present utility model includes a box body 1, a box cover 2, a CPU board 4 and other functional boards. Among them, a backplane connector 5 is installed at the rear side inside the box body 1, a box cover 2 is installed on the top of the box body 1, an upper liquid-cooling channel 2-3 is installed inside the box cover 2, an upper water distribution tank 6 and a lower water distribution tank 7 are respectively installed at the top and bottom inside the box body 1, and multiple rows of first slot positions and second slot positions are also provided inside the box body 1. A first quick connector 10 communicating with the upper water distribution tank 6 is provided at the top of each row of first slot positions, and a second quick connector 11 communicating with the lower water distribution tank 7 is provided at the bottom of each row of first slot positions; the upper water distribution tank 6 is connected to the water outlet 9-1 of the water tank through a water pump 8, and the lower water distribution tank 7 is connected to the water return port 9-2 of the water tank through the upper liquid-cooling channel 2-3; multiple CPU boards 4 are respectively detachably installed in the corresponding first slot positions and are respectively connected to the corresponding insertion interfaces 5-1 of the backplane connector 5; a liquid-cooling heat dissipation component, a third quick connector 12 connected to the water inlet interface of the liquid-cooling heat dissipation component, and a fourth quick connector 13 connected to the water outlet interface of the liquid-cooling heat dissipation component are installed on each CPU board 4; the third quick connector 12 and the fourth quick connector 13 are respectively communicated with the first quick connector 10 and the second quick connector 11 of the corresponding first slot position; multiple other functional boards are respectively detachably installed in the corresponding second slot positions and are respectively connected to the corresponding insertion interfaces of the backplane connector 5.

[0049] In this embodiment, through the design of multiple rows of first slot positions, multiple CPU boards 4 can be inserted simultaneously, and each board can work independently, thereby improving the processing capacity and functional expandability of the system. This design reduces the number of devices to be deployed, saves space and costs, and also reduces the complexity of maintenance and management; the liquid cooling active heat dissipation method is adopted, and the heat on the CPU board 4 is taken away by the circulating flow of the coolant, so that the device can operate stably under high load conditions. The design of the liquid cooling system allows the device to be fully enclosed, effectively preventing the intrusion of external particles such as dust and salt mist, improving the reliability and durability of the device in harsh environments, and reducing the noise during operation; at the same time, due to its good scalability and heat dissipation performance, it can better handle complex engineering situations, meet the needs of high-performance computing and control, and adapt to the installation environment with limited space height.

[0050] Specifically:

[0051] As Figure 5-10 shown, in the above embodiment, preferably, the interior of the box body 1 is divided into left and right two regions by a vertical partition 1-3. Among them, the left region forms a plug-in installation area 1-1 for multiple CPU boards 4 to be plugged and unplugged, and the right region forms a water pump installation area 1-2 for installing a water pump 8. A water tank 9 is installed on the back of the box body 1 corresponding to the position of the water pump installation area 1-2; the plug-in installation area 1-1 is provided with multiple rows of first slot positions and second slot positions, a backplane connector 5 is installed at the rear side of the plug-in installation area 1-1, and an upper water distribution groove 6 and a lower water distribution groove 7 are respectively installed at the top and bottom of the plug-in installation area 1-1; a water pump 9 is fixedly installed in the water pump installation area 1-2 through a mounting frame. The inlet of the water pump 9 is communicated with the water tank outlet 9-1, and the outlet of the water pump 9 is communicated with the upper water distribution groove 7.

[0052] In the above embodiment, preferably, multiple rows of first slot positions and second slot positions are arranged in parallel at intervals in the horizontal direction in the plug-in installation area 1-1. Each row of first slot positions and second slot positions includes an upper slot part 1-6 and a lower slot part 1-5 arranged vertically up and down. The upper slot part 1-6 and the lower slot part 1-5 both extend along the board plugging and unplugging direction; cross beams and guide rails 1-4 are installed on the front and rear sides along the board plugging and unplugging direction at the top and bottom of the plug-in installation area 1-1. The laying direction of the cross beams and guide rails 1-4 is perpendicular to the board plugging and unplugging direction; multiple rows of upper slot parts 1-6 and lower slot parts 1-5 are respectively installed on the corresponding cross beams and guide rails 1-4.

[0053] In the above embodiment, preferably, multiple rows of first slot positions and second slot positions can also be arranged at intervals in a cross pattern in the plug-in installation area 1-1.

[0054] In the above embodiments, preferably, in each row of the first slot positions, the upper slot part 1-6 and the lower slot part 1-5 each include a slot and a quick connector guide block arranged in parallel along the board insertion and extraction direction (as Figure 8 shown). The slot is used for inserting the CPU board 4. One end of the quick connector guide block close to the backplane connector 5 is provided with a brass mounting seat, and a first quick connector 10 or a second quick connector 11 is mounted at the end of the brass mounting seat away from the backplane connector 5. The quick connector guide block is provided with a chute at the end away from the backplane connector 5 and adapted to the corresponding third quick connector 12 and fourth quick connector 13. During actual connection, when the CPU board 4 is inserted into the upper slot part 1-6 and the lower slot part 1-5, at this time, the top and bottom of the CPU board 4 slide in the corresponding upper and lower slots, and the third quick connector 12 and fourth quick connector 13 on the CPU board 4 are connected to the corresponding first quick connector 10 or second quick connector 11 through the quick connector guide block.

[0055] In the above embodiments, preferably, in each row of the second slot positions, the upper slot part 1-6 and the lower slot part 1-5 each include a slot arranged in the board insertion and extraction direction, and the slot is used for inserting other functional boards.

[0056] In the above embodiments, preferably, the backplane connector 5 is provided with an insertion interface 5-1 corresponding to each row of the first slot positions and the second slot positions, and the insertion interface 5-1 is used for inserting the corresponding CPU board 4 and other functional boards.

[0057] In the above embodiments, preferably, both the first quick connector 10 and the second quick connector 11 are blind-mating quick connectors. In this embodiment, both the first quick connector 10 and the second quick connector 11 are blind-mating quick connector female connectors.

[0058] In the above embodiments, preferably, the front side of the box body 1 is designed to be open, and a front panel 3 is detachably mounted on the front side of the box body 1. A key operation area 16 is mounted at the bottom of the front panel 3, and the key operation area 16 includes a power switch button and a reset button. The front panel 3 is provided with a through hole corresponding to the position of the insertion and extraction installation area 1-1, and a window panel 3-1 is detachably mounted at the through hole. An annular sealing strip is additionally provided between the window panel 3-1 and the front panel 3 and between the front panel 3 and the box body 1 to increase the sealing performance of the box body 1. A touch screen 15 is embedded and mounted on the window panel 3-1, and the touch screen 15 is electrically connected to one of the CPU boards 4.

[0059] In the above embodiments, preferably, shock absorbers 17 are provided at the bottom of the box body 1, and an external interface area 18 is provided at the back of the box body 1. A plurality of external interfaces for connecting to external devices are provided in the external interface area 18.

[0060] As Figure 11-12As shown in the above embodiments, preferably, the box cover 2 is an aluminum heat dissipation cover plate. Multiple rows of heat dissipation fins 2-1 are provided on the top of the aluminum heat dissipation cover plate. Handles 2-2 for clamping with the box body 1 are symmetrically installed on the left and right sides of the aluminum heat dissipation cover plate. An upper liquid cooling channel 2-3 is arranged inside the aluminum heat dissipation cover plate. Among them, the upper liquid cooling channel 2-3 is a serpentine tube. The water inlet of the serpentine tube is communicated with the lower water distribution tank 7 through a liquid cooling return pipeline, and the water outlet of the serpentine tube is communicated with the water tank return port 9-2 through a liquid cooling return pipeline.

[0061] In the above embodiments, preferably, a heat dissipation fan 14 is further included. Multiple heat dissipation fans 14 are installed on the top of the box cover 2, and the multiple heat dissipation fans 14 are used to cool the coolant in the upper liquid cooling channel 2-3.

[0062] As Figure 13-15 shown in the above embodiments, preferably, the liquid cooling heat dissipation component is a cold plate 4-3. The cold plate is detachably installed at the high-power components of the CPU board 4. The cold plate 4-3 is configured with a water inlet interface and a water outlet interface. The water inlet interface and the water outlet interface are respectively connected to the third quick connector 12 and the fourth quick connector 13 through a liquid cooling pipeline 4-4. When multiple cold plates 4-3 are provided, the water inlet interfaces and the water outlet interfaces of the multiple cold plates 4-3 are connected in series with each other through a liquid cooling pipeline 4-4 to form an internal liquid cooling channel for the coolant to flow through; the third quick connector 12 is connected to the water inlet interface of the first-stage cold plate through a liquid cooling pipeline 4-4, and the fourth quick connector 13 is connected to the water outlet interface of the last-stage cold plate through a liquid cooling pipeline 4-4.

[0063] In the above embodiments, preferably, the CPU board 4 includes a board main body 4-1 and a board panel 4-2. Among them, the board panel 4-2 is arranged on one side of the board main body 4-1. Input / output interfaces, USB interfaces and indicator lights are arranged on the board panel 4-2. During actual installation, the third quick connector 12 and the fourth quick connector 13 are respectively placed on the left and right sides of the board main body 4-1 and are detachably fixedly connected to the board panel 4-2. The detachable fixed connection in this embodiment includes bolt connection.

[0064] In the above embodiments, preferably, the apertures of the water inlet interface and the water outlet interface on the cold plate 4-3 are the same and are both smaller than the apertures of the third quick connector 12 and the fourth quick connector 13 to ensure sufficient flow rate and pressure to meet the heat dissipation requirements. The apertures of the water inlet interface and the water outlet interface on the cold plate 4-3 in this embodiment are 4-10 mm.

[0065] In the above embodiments, preferably, the cold plate 4-3 is made of copper or aluminum; the shape and size of the cold plate 4-3 are adapted to the position and shape of the high-power consumption components on the board body 4-1, so as to cover the heat generation area of the high-power consumption components to the greatest extent and improve the heat dissipation effect. In this embodiment, the high-power consumption components include but are not limited to the CPU and the MXM graphics card.

[0066] In the above embodiments, preferably, a plurality of internal flow channels for the coolant to flow through are provided in the cold plate 4-3, and the plurality of internal flow channels are respectively communicated with the water inlet interface and the water outlet interface. The number, position and shape of the internal flow channels in this embodiment are adapted to the shape of the cold plate 4-3 and the area to be cooled. In this embodiment, the cold plate 4-3 can be fixedly installed on the board body 4-1 by bolts.

[0067] As Figure 14-15 shown, in the above embodiments, preferably, the third quick connector 12 and the fourth quick connector 13 have the same structure, and both include a brass mounting seat 12-1 and a blind plug quick connector 12-2. Among them, the two brass mounting seats 12-1 are respectively placed on the left and right sides of the board body 4-1 and are detachably and fixedly connected to the board panel 4-2. Blind plug quick connectors 12-2 are installed at the ends of the two brass mounting seats 12-1 away from the board panel 4-2. Inner cavity rooms communicating with the blind plug quick connectors 12-2 are provided in the two brass mounting seats 12-1, and a connection port 12-3 communicating with the inner cavity room is provided on one side of the two brass mounting seats 12-1. The connection port 12-3 is used to connect the water inlet interface or the water outlet interface of the cold plate 4-3.

[0068] In the above embodiments, preferably, assist extractors 4-5 are installed at both ends of the board panel 4-2. The assist extractors 4-5 can fix the board panel 4-2 on the corresponding guide rail 1-4 and facilitate the extraction of the board panel 4-2 from the box body 1.

[0069] In the above embodiments, preferably, both the third quick connector 12 and the fourth quick connector 13 are male blind plug quick connectors.

[0070] In the above embodiments, preferably, the pipe diameter of the liquid cooling pipeline 4-4 is adapted to the aperture of the water inlet interface, the water outlet interface and the connection port 12-3.

[0071] In the above embodiments, preferably, the liquid cooling pipeline 4-4 is fixed to the water inlet interface, the water outlet interface and the connection port 12-3 by pipe clamps and is sealed with the water inlet interface, the water outlet interface and the connection port 12-3 by sealant.

[0072] As Figure 16 shown, the medium flow direction of the coolant in this embodiment is as follows:

[0073] 1), The coolant flows out from the water outlet 9-1 of the water tank 9, and after being pressurized by the water pump 8, it enters the upper water distribution tank 6;

[0074] 2), The coolant flowing out from the upper water distribution tank 6 enters the cold plate 4-3 of the CPU board 4 in the first slot position through the first quick connector 10 and the third quick connector 12 respectively for heat exchange. After absorbing the heat of the high-power components on the CPU board 4, it flows back to the lower water distribution tank 7 through the fourth quick connector 13 and the second quick connector 11;

[0075] 3), The coolant in the lower water distribution tank 7 flows through the liquid cooling return pipeline to the upper liquid cooling channel 2-3 inside the box cover 1, and returns to the water tank return port 9-2 of the water tank 9 through the upper liquid cooling channel 2-3 to complete a cycle of the coolant.

[0076] The above is only the preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A CPCIe scalable device with liquid cooling active heat dissipation, characterized in that: include: A box body, a backplane connector is installed on the rear side of the box body, a box cover is installed on the top of the box body, an upper liquid cooling channel is installed inside the box cover, an upper water tank and a lower water tank are installed on the top and bottom of the box body respectively, and a plurality of rows of first slot positions and second slot positions are also provided inside the box body, a first quick connector connected to the upper water tank is provided on the top of each row of the first slot positions, and a second quick connector connected to the lower water tank is provided on the bottom of each row of the first slot positions; the upper water tank is connected to the water outlet of the water tank through a water pump, and the lower water tank is connected to the water return port of the water tank through the upper liquid cooling channel; CPU board, multiple CPU boards are respectively installed in the corresponding first slots in a pluggable manner and are respectively connected to the corresponding plug interfaces of the backplane connector; each CPU board is installed with a liquid cooling heat sink, a third quick connector connected to the water inlet interface of the liquid cooling heat sink, and a fourth quick connector connected to the water outlet interface of the liquid cooling heat sink; the third quick connector and the fourth quick connector are respectively connected to the first quick connector and the second quick connector of the corresponding first slot; Other functional boards, a plurality of said other functional boards are respectively installed in the corresponding second slots in a pluggable manner and are respectively connected to the corresponding plug interfaces of the backplane connector.

2. The CPCIe scalable device according to claim 1, characterized in that: The interior of the box is divided by a vertical partition, the left area forms a plug-in installation area, and the right area forms a water pump installation area; a water tank is installed at the back of the box corresponding to the water pump installation area; The plug-in installation area is provided with multiple rows of the first slot positions and the second slot positions, the backplane connector is installed on the rear side of the plug-in installation area, and the upper water tank and the lower water tank are installed on the top and bottom of the plug-in installation area respectively; the water pump is installed in the water pump installation area, the inlet of the water pump is connected to the water outlet of the water tank, and the outlet of the water pump is connected to the upper water tank.

3. The CPCIe scalable device according to claim 2, characterized in that: Each row of the first slot positions and the second slot positions includes an upper slot portion and a lower slot portion arranged vertically up and down, and the upper slot portion and the lower slot portion both extend along the board plugging and unplugging direction; The top and bottom of the plug-in installation area are equipped with beams and guide rails on the front and rear sides along the board plug-in direction, and the laying direction of the beams and guide rails is perpendicular to the board plug-in direction; multiple rows of upper slot parts and lower slot parts are respectively installed on the corresponding beams and guide rails.

4. The CPCIe scalable device according to claim 2, characterized in that: The backplane connector is provided with a plug-in interface corresponding to each row of the first slot positions and the second slot positions, and the plug-in interface is used to plug in the corresponding CPU board and other functional boards.

5. The CPCIe scalable device according to claim 2, characterized in that: The front side of the box body is designed to be open, and a front panel is detachably installed on the front side of the box body. An annular sealing strip is provided between the front panel and the box body, and a touch screen, a switch button and a reset button are installed on the panel.

6. The CPCIe scalable device according to claim 2, characterized in that: The liquid-cooled heat sink is a cold plate, which is detachably mounted at the high-power consumption components of the CPU board. The cold plate is provided with a water inlet interface and a water outlet interface, and the water inlet interface and the water outlet interface are respectively connected to the third quick connector and the fourth quick connector through liquid cooling pipelines.

7. The CPCIe scalable device according to claim 6, characterized in that: When a plurality of the cold plates are provided, the water inlet interfaces and the water outlet interfaces of the plurality of the cold plates are connected in series through a liquid cooling pipeline to form an internal liquid cooling channel for the circulation of the cooling liquid; The third quick connector is connected to the water inlet interface of the first-stage cold plate through the liquid cooling pipeline, and the fourth quick connector is connected to the water outlet interface of the last-stage cold plate through the liquid cooling pipeline.

8. The CPCIe scalable device according to claim 1, characterized in that: The top of the box cover is provided with a plurality of rows of heat dissipation fins, and handles for clamping with the box body are symmetrically installed on the left and right sides of the box cover.

9. The CPCIe scalable device according to claim 1, characterized in that: The first quick connector, the second quick connector, the third quick connector, and the fourth quick connector are all blind-plug quick connectors.

10. The CPCIe scalable device according to claim 1, characterized in that: It also includes a cooling fan, a plurality of which are installed on the top of the box cover, and the plurality of cooling fans are used to cool the coolant in the upper liquid cooling channel.

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