Radiator and server

Abstract

The utility model provides a radiator and a server. The radiator comprises a substrate and a plurality of radiating fins fixed on the substrate; the radiator is provided with a supporting part, the supporting part is located on the side, provided with the cooling fins, of the substrate in the thickness direction, and the supporting part is arranged to be matched with the supporting piece so as to support the radiator. Thus, when the server is assembled and stands up, the radiator can be supported through the fixed connection of the substrate and the circuit board, and can also be supported through the cooperation of the supporting part and the supporting piece. As the supporting part and the radiating fins are positioned on the same side in the thickness direction of the substrate, the supporting part and the supporting piece are matched to support the suspended part of the radiator, so that the radiator is prevented from forming a cantilever beam structure, the structural stability of the radiator can be improved when the radiator resists gravity or vibration, and the service life of the radiator is prolonged. The situation that the heat dissipation performance is reduced due to the fact that the buckling force on the chip is reduced due to the gravity effect of the radiator is improved.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of servers, and particularly refers to a radiator and a server. Background Art

[0002] Currently, as the power consumption of server circuit boards increases, the size of the radiator also continuously increases, which in turn leads to an increase in the weight of the radiator. In some server usage scenarios, the server is in a standing state, so the circuit board is in a standing state and the radiator is in a horizontally placed state. In this way, the gravity of the radiator will exert a pulling force on the circuit board, thereby reducing the clamping force of the radiator on the circuit board and causing a decrease in heat dissipation performance. Summary of the Utility Model

[0003] This application provides a radiator and a server, which can improve the stability of the radiator of a server used in a standing state and reduce the adverse impact of gravity on the performance degradation of the radiator.

[0004] To this end, an embodiment of this application provides a radiator, including: a substrate and a plurality of heat dissipation fins fixed to the substrate; the radiator is provided with a support portion, the support portion is located on one side of the substrate in the thickness direction where the heat dissipation fins are provided, and the support portion is configured to cooperate with a support member to support the radiator.

[0005] In an exemplary embodiment, the radiator further includes: a support plate, which is disposed at a relatively spaced interval from the substrate, the plurality of heat dissipation fins are spaced between the substrate and the support plate and are connected to the substrate and the support plate; the support plate is provided with the support portion.

[0006] In an exemplary embodiment, the support plate is provided with a channel, and the support portion is disposed in the channel; and / or, the support plate is provided with a positioning boss, and the support portions are disposed on both sides of the positioning boss.

[0007] In an exemplary embodiment, the heat dissipation fin is provided with the support portion.

[0008] In an exemplary embodiment, the support portion is disposed at one end of the heat dissipation fin away from the substrate.

[0009] In an exemplary embodiment, the support portion includes a support protrusion and / or a support groove, and the support portion is configured to be in concave-convex fit and fixedly connected with the support member to support the radiator.

[0010] An embodiment of the present application also provides a server, including: a chassis, the chassis is provided with a support; a circuit board, arranged in the chassis; and a heat dissipation device, arranged in the chassis and corresponding to the circuit board, configured to dissipate heat from the circuit board, the heat dissipation device includes at least one first radiator, the first radiator is configured as a radiator as described in any one of the above embodiments, and the substrate is connected to the circuit board.

[0011] In an exemplary embodiment, the chassis includes a case shell and a cover plate, wherein the cover plate is disposed on a side of the substrate away from the circuit board and connected to the case shell; wherein the support member and the cover plate are an integral structure; or, the support member and the cover plate are a split structure, the support member is located between the radiator and the cover plate, and the support member is fixedly connected to the case shell and / or the cover plate.

[0012] In an exemplary embodiment, the support member is provided with a support protrusion and / or a support recess matched with the support portion.

[0013] In an exemplary embodiment, the heat dissipation device includes a plurality of radiators arranged side by side, and at least a portion of the plurality of radiators is configured as the first radiator.

[0014] Compared with the related art, this application has the following beneficial effects:

[0015] By adding a support part to the radiator, when the server is assembled and erected, the radiator can be supported not only by the fixed connection between the substrate and the circuit board, but also by the cooperation between the support part and the support member. Based on the thickness direction of the substrate, the circuit board, the substrate, and the heat dissipation fins are arranged in sequence along the thickness direction of the substrate. The support part and the heat dissipation fins are located on the same side of the substrate, that is, the support part is located on the side of the substrate away from the circuit board. Therefore, the cooperation between the support part and the support member can support the suspended part of the radiator, thereby preventing the radiator from forming a cantilever beam structure. This can improve the structural stability of the radiator when resisting gravity or vibration, and is conducive to improving the situation where the radiator is affected by gravity, resulting in a decrease in the chip buckling force and a decrease in heat dissipation performance.

[0016] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by implementing the present application. Other advantages of the present application can be realized and obtained by the schemes described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a partial three-dimensional structure of a server provided in some embodiments of the present application;

[0018] Figure 2 Schematic assembly diagram of a heat dissipation device and a circuit board in some embodiments of the present application;

[0019] Figure 3 is Figure 2 Side view schematic diagram of the shown structure;

[0020] Figure 4 Three-dimensional structure schematic diagram of a support member provided in some embodiments of the present application;

[0021] Figure 5 Partial three-dimensional structure schematic diagram of a server provided in some other embodiments of the present application;

[0022] Figure 6 Schematic assembly diagram of a heat dissipation device and a circuit board in some other embodiments of the present application;

[0023] Figure 7 Structure schematic diagram of a support member provided in some other embodiments of the present application;

[0024] Figure 8 Schematic assembly diagram of a heat dissipation device and a circuit board in some further embodiments of the present application;

[0025] Figure 9 Three-dimensional structure schematic diagram of a support member provided in some further embodiments of the present application;

[0026] Figure 10 Front view structure schematic diagram of a cover plate and a support member provided in some further embodiments of the present application;

[0027] Figure 11 is Figure 10 Three-dimensional structure schematic diagram of the shown structure;

[0028] Figure 12 Three-dimensional structure schematic diagram of a cover plate and a support member provided in some other further embodiments of the present application;

[0029] Figure 13 is Figure 12 Right view schematic diagram of the shown structure;

[0030] Figure 14 is Figure 12 Left view schematic diagram of the shown structure;

[0031] Figure 15 Three-dimensional structure schematic diagram of a server provided in some other further embodiments of the present application.

[0032] In the drawings, the list of components represented by each reference numeral is as follows:

[0033] 1 chassis, 11 chassis housing, 12 cover plate, 13 support member, 131 support recess, 132 support protrusion, 133 limit boss, 14 connecting member;

[0034] 2 Circuit boards, 21 chips;

[0035] 3 Heat dissipation devices, 31 heat sinks, 311 substrates, 312 heat dissipation fins, 313 support plates, 3131 channels, 314 support protrusions, 315 support grooves, 316 positioning bosses, 32 spring screw assemblies, 33 thermal interface materials. Specific embodiments

[0036] To make the objectives, technical solutions, and advantages of this application clearer and more understandable, the embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined arbitrarily with each other.

[0037] An embodiment of this application provides a heat sink 31, which can be used for a server to dissipate heat from the circuit board 2 of the server. The circuit board 2 can be a PCB board.

[0038] As Figure 2 shown, the heat sink 31 includes: a substrate 311 and a plurality of heat dissipation fins 312. The plurality of heat dissipation fins 312 can be fixed on one side surface of the substrate 311. The plurality of heat dissipation fins 312 can be arranged in parallel at equal intervals. The heat dissipation fins 312 can be fixed on the substrate 311 by means such as welding. The heat dissipation fins 312 and the substrate 311 can be made of materials with good thermal conductivity such as aluminum or aluminum alloy.

[0039] The substrate 311 can be in contact with the components with higher heat generation (such as the chip 21) on the circuit board 2 of the server through the thermal interface material 33 to contact the chip 21, so as to achieve efficient heat dissipation. The substrate 311 can be fixed on the board body of the circuit board 2 by the spring screw assembly 32, as Figure 2 and Figure 3 shown. The spring screw assembly 32 can provide a certain clamping force to clamp the heat sink 31 on the circuit board 2. The spring screw assembly 32 includes a screw and a spring sleeved on the screw. The screw can be fixedly connected to the board body of the circuit board 2, and the spring is sleeved on the screw. In this way, when the server is used upright, as Figure 1 shown, the circuit board 2 is in a standing state, the heat sink 31 is in a horizontally placed state, one end of the heat sink 31 in the horizontal direction (i.e., the end where the substrate 311 is located) is fixed on the circuit board 2, and the other end of the heat sink 31 is suspended, forming a structure similar to a cantilever beam. Since the heat sink 31 is relatively heavy, affected by gravity, the heat sink 31 will generate a pulling force on the circuit board 2, reducing the clamping force of the substrate 311 on the chip 21 and causing the heat dissipation performance to decline.

[0040] To this end, the embodiment of the present application improves the structure of the radiator 31: the radiator 31 is provided with a supporting portion, such as the following supporting protrusions 314 and supporting grooves 315, such as Figure 2 As shown. The support portion is located on one side of the substrate 311 in the thickness direction and on the side of the substrate 311 where the heat dissipation fins 312 are provided. The support portion is configured to cooperate with the support member 13 to support the radiator 31. The support member 13 may be made of metal, such as a sheet metal, to ensure that the support member 13 has a certain structural strength. The support member 13 may be one or more, and the multiple support members 13 may be the same or different.

[0041] By adding a support portion to the heat sink 31, when the server is assembled and erected, the heat sink 31 is supported not only by the fixed connection between the substrate 311 and the circuit board 2, but also by the cooperation between the support portion and the support member 13. Figure 1 As shown. Taking the thickness direction of the substrate 311 as a reference, the circuit board 2, the substrate 311, and the heat dissipation fins 312 are arranged in sequence along the thickness direction of the substrate 311, and the support portion and the heat dissipation fins 312 are located on the same side of the substrate 311, that is, the support portion is located on the side of the substrate 311 away from the circuit board 2, so the cooperation between the support portion and the support member 13 can support the suspended part of the heat sink 31, thereby preventing the heat sink 31 from forming a cantilever beam structure, which can improve the structural stability of the heat sink 31 when resisting gravity or vibration, and is conducive to improving the situation where the heat sink 31 is affected by gravity, resulting in a decrease in the snapping force on the chip 21 and a decrease in heat dissipation performance.

[0042] In some exemplary embodiments, the support portion includes a support protrusion 314 and / or a support groove 315, such as Figure 2 , Figure 6 and Figure 8 The support portion is configured to be concave-convexly matched with the support member 13 and fixedly connected to support the radiator 31. The support member 13 is provided with a support convex portion 132 and / or a support concave portion 131 adapted to the support portion, as shown in FIG. Figure 4 , Figure 7 and Figure 9 shown.

[0043] The support portion and the support member 13 adopt a concave-convex matching manner, which can ensure that the support member 13 can effectively support the radiator 31, thereby effectively improving the structural stability of the radiator 31.

[0044] The support portion and the support member 13 may be fixedly connected by riveting, screw connection, or the like to improve the matching reliability between the support portion and the support member 13 .

[0045] The support portion may only include the support protrusion 314 (eg Figure 6as shown); it may also only include the support groove 315 (such as Figure 8 as shown); it may also include both the support protrusion 314 and the support groove 315 (such as Figure 2 as shown), and the support protrusions 314 and the support grooves 315 may be arranged alternately. Correspondingly, the support member 13 may be provided with only the support recess 131, or only the support protrusion 132, or both the support recess 131 and the support protrusion 132.

[0046] The number and distribution form of the support protrusions 314 / support grooves 315 are not limited, and may include one or more. When there are multiple, they may be multiple in a row, or may include multiple rows. The shape of the support protrusions 314 / support grooves 315 is also not limited, and may be, but is not limited to, square (such as Figure 6 and Figure 8 as shown), triangular, racetrack-shaped (such as Figure 2 as shown), circular, oval, etc. When the number of the support protrusions 314 / support grooves 315 is multiple: the sizes of the multiple support protrusions 314 / support grooves 315 may be the same, or partially the same, or completely different; the shapes of the multiple support protrusions 314 / support grooves 315 may be the same, or partially the same, or completely different.

[0047] In some exemplary embodiments, the heat sink 31 further includes: a support plate 313, such as Figure 2 , Figure 6 and Figure 8 as shown. The thickness of the support plate 313 may be within, but is not limited to, the range of about 1 mm to 5 mm.

[0048] Wherein, the support plate 313 is arranged at a relatively spaced interval from the substrate 311. A plurality of heat dissipation fins 312 are spaced between the substrate 311 and the support plate 313 and are connected to the substrate 311 and the support plate 313. The support plate 313 is provided with a support portion. The support plate 313 and the heat dissipation fins 312 may be fixedly connected by processes such as welding. The support plate 313 may be made of a material with good thermal conductivity such as aluminum or aluminum alloy.

[0049] In this way, the support plate 313 can fix one end of the heat dissipation fins 312 away from the substrate 311, which is beneficial to improving the position stability of the plurality of heat dissipation fins 312. And by providing the support portion on the support plate 313, both opposite ends of the heat sink 31 can be effectively supported, which is beneficial to significantly improving the structural stability of the heat sink 31 against gravity or vibration, and is beneficial to significantly improving the situation where the heat dissipation performance decreases due to the decrease in the clamping force between the heat sink 31 and the chip 21 caused by the influence of gravity.

[0050] On the other hand, this also facilitates the processing and forming of the support part, which is beneficial to improving the position stability of the support part, and further beneficial to the stability after the assembly of the support part and the support member 13.

[0051] In some embodiments, the support plate 313 is provided with a channel 3131, as Figure 2 shown, and a support part is provided in the channel 3131. This is beneficial to reducing the thickness after the cooperation between the support plate 313 and the support member 13, thereby being beneficial to reducing the volume of the server. Moreover, the channel 3131 itself can also be used as a part of the support part for the corresponding structure (such as the following limiting boss 133) of the support member 13 to be embedded, thereby being beneficial to further improving the support effect. Of course, the support plate 313 may not be provided with the channel 3131, and the support part may be directly provided on the plate surface of the support plate 313.

[0052] In some other embodiments, the support plate 313 is provided with a positioning boss 316, as Figure 6 shown, and support parts are provided on both sides of the positioning boss 316.

[0053] The positioning boss 316 can position the support member 13, which is beneficial to improving the assembly efficiency of the support part and the support member 13. Providing support parts on both sides of the positioning boss 316 is beneficial to the balanced force of the radiator 31 and the support member 13, thereby being beneficial to further improving the structural stability of the radiator 31. In addition, the side wall of the positioning boss 316 can also be in a stop fit with the support member 13, thereby being beneficial to further improving the support effect.

[0054] In some other exemplary embodiments (not shown in the figure), the heat dissipation fins 312 are provided with support parts. This can eliminate the support plate 313 and also eliminate the connection process between the support plate 313 and the heat dissipation fins 312, thereby being beneficial to improving the production efficiency and reducing the production cost.

[0055] In some embodiments, the support part is provided at one end of the heat dissipation fins 312 away from the substrate 311. This can enable both opposite ends of the radiator 31 to be effectively supported, thereby being beneficial to significantly improving the structural stability of the radiator 31 when resisting gravity or vibration, and being beneficial to significantly improving the situation where the heat dissipation performance decreases due to the decrease in the clamping force between the radiator 31 and the chip 21 caused by the influence of gravity.

[0056] In other embodiments, the support part can also be provided at other parts of the radiator 31, such as in the middle part of the heat dissipation fins 312, as long as it can support the radiator 31 and weaken the adverse influence of gravity on the heat dissipation performance of the radiator 31.

[0057] Such as Figure 1 、 Figure 5 、 Figure 15As shown, an embodiment of the present application further provides a server, including: a chassis 1, a circuit board 2 and a heat dissipation device 3.

[0058] The chassis 1 is provided with a support member 13 , and the support member 13 is used to support the radiator 31 .

[0059] The circuit board 2 is arranged in the chassis 1. The circuit board 2 may include a board body and a chip 21 (such as Figure 3 As shown in FIG. 1 , the chip 21 is a component of the circuit board 2 that consumes a large amount of power and generates a large amount of heat. As the power consumption of the chip 21 increases, the size of the heat sink 31 increases, and the weight increases accordingly.

[0060] The heat dissipation device 3 is arranged in the chassis 1 and is arranged corresponding to the circuit board 2, and is arranged to dissipate heat for the circuit board 2. The heat dissipation device 3 includes at least one first heat sink, and the first heat sink is arranged as the heat sink 31 of any one of the above embodiments, and the substrate 311 is connected to the circuit board 2, so it has all the above beneficial effects, which will not be repeated here.

[0061] In this way, at least the first radiator will not have its heat dissipation performance reduced due to the influence of gravity, which is beneficial to improving the heat dissipation effect of the circuit board 2 and the reliability of the server.

[0062] In some exemplary embodiments, the chassis 1 includes a housing 11 (eg Figure 5 and Figure 15 As shown) and cover plate 12 (as Figure 10 and Figure 15 The cover plate 12 is disposed on a side of the base plate 311 away from the circuit board 2 and is connected to the box shell 11 and can be fixedly connected by a plurality of screws.

[0063] In some embodiments, the support member 13 and the cover plate 12 are an integrated structure. Figures 10 to 15 In this way, the chassis 1 does not need to be equipped with other components, which is beneficial to reducing the number of components of the server and further beneficial to improving the assembly efficiency of the server.

[0064] The support member 13 can be formed by stamping (such as Figures 12 to 15 As shown), casting, welding (as Figure 10 and Figure 11 ) and other methods to form an integrated structure with the cover plate 12.

[0065] In other embodiments, the support member 13 and the cover plate 12 are split structures, such as Figure 1 and Figure 5 As shown. Figure 1 and Figure 5The cover plate 12 is omitted. The support member 13 is located between the radiator 31 and the cover plate 12, and the support member 13 is fixedly connected to the box shell 11 and / or the cover plate 12 (it can be directly connected or indirectly connected through the connecting member 14, which can be, for example, an L-shaped folding plate).

[0066] This makes it easy to reasonably set the structure and size of the support member 13 according to needs, and is also beneficial to simplifying the structure of the cover plate 12, so that the cover plate 12 remains flat, and is convenient for processing and forming the cover plate 12. The support member 13 can also strengthen the chassis 1 of the server, which is beneficial to improving the structural strength of the chassis 1.

[0067] The support member 13 may be fixedly connected to the cover plate 12 , may be fixedly connected to the box shell 11 , or may be fixedly connected to both the cover plate 12 and the box shell 11 .

[0068] In some exemplary embodiments, the heat dissipation device 3 includes a plurality of heat sinks 31 arranged side by side, such as Figure 2 , Figure 6 and Figure 8 At least a portion of the plurality of heat sinks 31 is configured as a first heat sink.

[0069] For example, at least the heat sinks 31 at the two ends are configured as first heat sinks.

[0070] When the number of the heat sinks 31 is greater than or equal to three, the heat sink 31 located between the heat sinks 31 at both ends may be referred to as a second heat sink. The second heat sink may not be provided with a support portion and may be in the form of an ordinary heat sink 31. When the heat sinks 31 at both ends are effectively supported, the entire heat sink 3 may have relatively good heat dissipation performance.

[0071] Alternatively, the second radiator may also be configured as the first radiator, that is, a supporting portion is provided to ensure that each radiator 31 is effectively supported.

[0072] Of course, the number of the heat sink 31 may also be one or two.

[0073] Some embodiments are described below.

[0074] Example 1 (such as Figures 1 to 4 (shown)

[0075] The heat dissipation device 3 includes three radiators 31 arranged side by side. The three radiators 31 are all provided with a support plate 313, a groove 3131 is provided in the middle of the support plate 313, and a support portion is provided in the groove 3131. A support protrusion 314 and a support groove 315 are provided in each groove 3131. The support protrusion 314 and the support groove 315 are in a racetrack shape.

[0076] The support member 13 and the cover plate 12 of the chassis 1 (Figure 1 The cover plate 12 is omitted and is of an integral structure or a split structure. The number of the support members 13 is one. The plate surface of the support member 13 facing the radiator 31 is provided with a limit boss 133 adapted to the channel 3131, as Figure 3 and Figure 4 shown. The limit boss 133 is provided with a support recess 131 adapted to the support protrusion 314 and a support protrusion 132 adapted to the support groove 315.

[0077] After assembly, the limit boss 133 of the cover plate 12 is embedded in the channel 3131 of the heat dissipation device 3. The support protrusion 314 of the radiator 31 is embedded in the support recess 131 of the support member 13, and the support protrusion 132 of the support member 13 is embedded in the support groove 315 of the radiator 31. The outer plate surface of the cover plate 12 remains flat.

[0078] Embodiment 2 (as Figures 5 to 7 shown)

[0079] The difference from Embodiment 1 is that: a positioning boss 316 is provided in the middle of the support plate 313 of the radiator 31, and support portions are provided on both sides of the positioning boss 316. Each support plate 313 is provided with two symmetrically arranged support protrusions 314. The support protrusions 314 are rectangular. The support member 13 and the cover plate 12 of the chassis 1 are of a split structure. The number of the support members 13 is two, and the two support members 13 are respectively located on both sides of the positioning boss 316 and are substantially flush with the positioning boss 316. Each support member 13 is provided with three support recesses 131 adapted to the support protrusions 314. The box shell 11 is fixedly connected with a connecting member 14, and both ends of each support member 13 are fixed on the connecting member 14 by screws to realize indirect fixed connection with the box shell 11.

[0080] Embodiment 3 (as Figures 8 to 11 shown)

[0081] The difference from Embodiment 1 is that: the support plate 313 is not provided with the channel 3131, and a rectangular support groove 315 is provided in the middle of each support plate 313, and the sizes of the three support grooves 315 are the same or different. The number of the support members 13 is three, and the plate surfaces of the three support members 13 facing the radiator 31 are provided with support protrusions 132 respectively adapted to the three support grooves 315, as Figure 9 shown, and the three support members 13 correspond to the three support grooves 315 one by one. The three support members 13 are welded on the inner plate surface of the cover plate 12, as Figure 10 shown. After assembly, the outer plate surface of the cover plate 12 remains flat, as Figure 11 shown.

[0082] Embodiment 4 (as Figures 12 to 15 shown)

[0083] The difference from the third embodiment is that the sizes of the three support grooves 315 are the same or different, and the sizes of the three support protrusions 132 are different. The three support members 13 are integrally formed on the cover plate 12 by stamping, as Figures 12 to 14 shown. After assembly, the outer plate surface of the cover plate 12 has a recessed portion, as Figure 15 shown.

[0084] Embodiment Five (not shown in the figure)

[0085] The difference from the foregoing first to fourth embodiments is that the radiator 31 is not provided with a support plate 313, and the support portion is provided on the heat dissipation fins 312.

[0086] Embodiment Six (not shown in the figure)

[0087] The difference from the foregoing first to fifth embodiments is that not all of the multiple radiators 31 are provided with support portions, but only some of the radiators 31 are provided with support portions.

[0088] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "opposite", "four corners", "periphery", "mouth-shaped structure", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the structure referred to has a specific orientation, is constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0089] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connection", "direct connection", "indirect connection", "fixed connection", "installation", "assembly" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; the terms "installation", "connection", "fixed connection" can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0090] Although the disclosed embodiments of the present application are as above, the content described above is only an embodiment for facilitating the understanding of the present application, and is not used to limit the present application. It should be noted that the above embodiments or embodiments are only exemplary and not restrictive. Therefore, the present application is not limited to the content specifically shown and described herein. Various modifications, substitutions or omissions can be made to the form and details of the implementation without departing from the scope of the present application.

Claims

1. A radiator, characterized in that, include: A base plate and a plurality of heat dissipation fins fixed to the base plate; The heat sink is provided with a support portion, the support portion is located at a side of the substrate in the thickness direction where the heat dissipation fins are provided, and the support portion is configured to cooperate with a support member to support the heat sink.

2. The radiator according to claim 1, characterized in that, The radiator further comprises: A support plate is arranged relative to the base plate and spaced apart from each other, wherein the plurality of heat dissipation fins are spaced apart between the base plate and the support plate and connected to the base plate and the support plate; The supporting plate is provided with the supporting portion.

3. The radiator according to claim 2, wherein The support plate is provided with a groove, and the support portion is provided in the groove; and / or The support plate is provided with a positioning boss, and the supporting parts are provided on both sides of the positioning boss.

4. The radiator according to claim 1, wherein The heat dissipation fin is provided with the supporting portion.

5. The radiator according to claim 4, wherein, The supporting portion is arranged at an end of the heat dissipating fin away from the base plate.

6. The radiator according to any one of claims 1 to 5, characterized in that, The support portion includes a support protrusion and / or a support groove, and the support portion is configured to be concave-convexly matched with the support member and fixedly connected to support the radiator.

7. A server, characterized in that, include: A chassis, wherein the chassis is provided with a support member; A circuit board is arranged in the chassis; and A heat dissipation device is arranged in the chassis and corresponds to the circuit board, and is configured to dissipate heat from the circuit board. The heat dissipation device includes at least one first heat sink, and the first heat sink is configured as a heat sink as described in any one of claims 1 to 6. The substrate is connected to the circuit board.

8. The server according to claim 7, characterized in that, The chassis comprises a box shell and a cover plate, wherein the cover plate is arranged on a side of the base plate away from the circuit board and connected to the box shell; The support member and the cover plate are an integrated structure; or, the support member and the cover plate are a split structure, the support member is located between the radiator and the cover plate, and the support member is fixedly connected to the box shell and / or the cover plate.

9. The server according to claim 7, wherein The support member is provided with a support protrusion and / or a support recess matched with the support portion.

10. The server according to any one of claims 7 to 9, characterized in that The heat dissipation device includes a plurality of radiators arranged side by side, and at least a portion of the plurality of radiators is configured as the first radiator.

Images