Heat dissipation device
By designing a heat pipe group with R angle in the heat dissipation device, the problem of poor heat dissipation efficiency of the high-power processor is solved, the structural stress and heat dissipation performance of the heat pipe are improved, and it can adapt to the display card with limited space.
Patent Information
- Application Number
- CN202421833679.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-31
AI Technical Summary
When facing high-power processors, existing heat dissipation devices have poor heat dissipation efficiency and the heat pipe cannot bend to adapt to graphics cards with limited space.
A heat dissipation device is designed in which the heat pipe group has an R angle, and the heat pipe part is arranged in the recessed area of the fin unit, and is connected by a first through-fitting part, a first bending part, a flat part, a second bending part and a second through-fitting part to form a flat part with an R angle to enhance structural stress.
It effectively increases the structural stress of the heat pipe, improves its long-term stability and reliability, allows the heat pipe to bend to adapt to the compact space, increases the surface area in contact with the air, and improves heat dissipation performance.
Smart Images
Figure CN223038369U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of heat dissipation, and particularly to a heat dissipation device in which a heat pipe has an R corner. Background Art
[0002] According to modern requirements, computers and various electronic devices have developed rapidly and their performance has been continuously improved. However, in this process, the heat dissipation problems brought by high-performance hardware have also followed. Generally speaking, computers and various electronic devices usually use heat dissipation components for heat dissipation. For example, heat dissipation paste or heat sinks are used to attach to the electronic components to be cooled, so as to suck out and dissipate heat.
[0003] However, the foregoing heat dissipation methods have limited effects. Therefore, the industry has developed heat dissipation components using heat pipes and fins. Such heat dissipation components mainly achieve the purpose of heat dissipation by increasing the contact area between the fins and the heat pipes and the air. However, when facing a large amount of heat generated by a high-power processor (such as a GPU), such heat dissipation components still cannot maintain effective and consistent heat dissipation, resulting in poor overall heat dissipation efficiency. In addition, the heat pipes cannot be bent as required, so they cannot be adapted to display cards with limited space.
[0004] Therefore, how to provide a heat dissipation device that can solve the above problems is one of the urgent problems to be overcome in the current industry. Summary of the Utility Model
[0005] The purpose of the present disclosure is to provide a heat dissipation device to solve at least one of the above problems.
[0006] The present disclosure provides a heat dissipation device, including: a fin unit having a recessed area; and a heat pipe group, part of which is disposed in the recessed area and part of which penetrates the fin unit; wherein, the heat pipe group disposed in the recessed area has an R corner.
[0007] In the heat dissipation device as described above, the heat pipe group has three heat pipes, and the three heat pipes respectively have a first penetrating portion, a first bending portion, a flat portion, a second bending portion, and a second penetrating portion that are sequentially connected. The first penetrating portion and the second penetrating portion penetrate the fin unit, the first bending portion and the second bending portion are exposed outside the fin unit, and the flat portion is accommodated in the recessed area.
[0008] In the heat dissipation device as described above, the flat portions are attached to each other and are accommodated in the recessed area side by side.
[0009] In the heat dissipation device as described above, the cross section of the flat portion is a square with the R corner, and the first penetrating portion and the second penetrating portion are in a circular tube shape.
[0010] In the heat dissipation device as described above, the fin unit includes a first fin group and a second fin group spaced apart from each other. The first through portion penetrates the first fin group, the first bent portion is exposed outside the first fin group, the second through portion penetrates the second fin group, and the second bent portion is exposed between the first fin group and the second fin group.
[0011] In the heat dissipation device as described above, the fin arrangement directions of the first fin group and the second fin group are the same as the heat pipe extension direction of the heat pipe group.
[0012] In the heat dissipation device as described above, it further includes two fin brackets, and the two fin brackets are fixedly connected to the first fin group and the second fin group at intervals.
[0013] In the heat dissipation device as described above, it further includes a plurality of module brackets for fixing the flat portion in the recessed area.
[0014] In the heat dissipation device as described above, it further includes a copper sheet, and opposite sides of the copper sheet are respectively in contact with the flat portion and a heat source.
[0015] In the heat dissipation device as described above, the heat pipe group is made of copper.
[0016] In summary, due to the design with an R corner in the heat pipe group of the heat dissipation device disclosed herein, the structural stress that the heat pipe can withstand can be effectively increased, especially in applications with high wattage or high pound-force. Accordingly, the long-term stability and reliability of the heat pipe can be improved. Furthermore, the above design can also enable the flat heat pipe to better adapt to a compact or irregular space and allow the heat pipe to be bent as required to fit the surrounding components, thereby increasing the surface area in contact with air and effectively enhancing the heat dissipation performance. Brief Description of the Drawings
[0017] Figure 1 is an overall schematic diagram of the heat dissipation device disclosed herein.
[0018] Figure 2 and Figure 3 is an exploded schematic diagram of the heat dissipation device disclosed herein from different perspectives.
[0019] Figure 4 is Figure 1 a partial enlarged view of the A-A section line in
[0020] The reference numerals are as follows:
[0021] 100 Heat dissipation device
[0022] 1 Fin unit
[0023] 11 First fin group
[0024] 111 First through hole
[0025] 112 Concave area
[0026] 12 Second fin group
[0027] 121 Second through-hole
[0028] 2 Heat pipe group
[0029] 21 Heat pipe
[0030] 211 First penetrating part
[0031] 212 First bending part
[0032] 213 Flat part
[0033] 214 Second bending part
[0034] 215 Second penetrating part
[0035] 3 Fin support
[0036] 4 Module support
[0037] 5 Copper sheet
[0038] R R corner Detailed implementation manner
[0039] The following illustrates the implementation manners of the present disclosure through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the content disclosed in this specification, and can also be implemented or applied through other different specific examples.
[0040] Please refer to Figure 1 、 Figure 2 and Figure 3 , the heat dissipation device 100 of the present disclosure includes a fin unit 1, a heat pipe group 2, two fin supports 3, a plurality of module supports 4 and a copper sheet 5.
[0041] The fin unit 1 includes a first fin group 11 and a second fin group 12 that are spaced apart from each other. The first fin group 11 is a structure formed by arranging a plurality of fins at intervals, and has a concave area 112 that is recessed from the top surface, and has three first through-holes 111 that penetrate through both sides thereof. The concave area 112 may be stepped, but the present disclosure is not limited thereto. The three first through-holes 111 are spaced apart from each other and may specifically have a circular cross-section. The second fin group 12 is a structure formed by arranging a plurality of fins at intervals, and has three second through-holes 121 that penetrate through both sides thereof. The three second through-holes 121 are spaced apart from each other and may specifically have a circular cross-section.
[0042] Part of the heat pipe group 2 is disposed in the recessed area 112 and part of it penetrates through the fin unit 1. Specifically, the heat pipe group 2 has three heat pipes 21, and each heat pipe 21 has a first penetrating portion 211, a first bending portion 212, a flat portion 213, a second bending portion 214, and a second penetrating portion 215 that are connected in sequence. One end of the flat portion 213 is connected to the first penetrating portion 211 via the first bending portion 212, so that the flat portion 213, the first bending portion 212, and the first penetrating portion 211 are generally U-shaped as a whole. The other end of the flat portion 213 is connected to the second penetrating portion 215 via the second bending portion 214, so that the flat portion 213, the second bending portion 214, and the second penetrating portion 215 are generally S-shaped as a whole. The extending directions of the flat portion 213, the first penetrating portion 211, and the second penetrating portion 215 are parallel to each other.
[0043] The first penetrating portion 211 penetrates through the first through hole 111 and is generally circular tube-shaped. The first bending portion 212 is exposed outside the first fin group 11. The second penetrating portion 215 penetrates through the second through hole 121 and is generally circular tube-shaped. The second bending portion 214 is exposed between the first fin group 11 and the second fin group 12.
[0044] Please also refer to Figure 4 , the flat portions 213 are attached to each other and are accommodated side by side in the recessed area 112 to contact the fins of the first fin group 11. If the recessed area is stepped, the flat portions 213 can also be bent to conform to the stepped structure, but the present disclosure is not limited thereto. The cross-section of the flat portion 213 is a square with an R corner R, for example, the four corners of the square are all R corners R. The size of the R corner can be designed according to requirements. As long as the interference amount of the R corner is larger, the structural stress that the flat portion 213 can withstand when contacting the fins or the copper sheet 5 of the first fin group 11 is also larger. Accordingly, the long-term stability and reliability of the heat pipe can be improved, but the present disclosure does not limit the range of the R corner R.
[0045] In one embodiment, the material of the heat pipe group 2 is copper.
[0046] In one embodiment, the extending direction of the fins of the first fin group 11 and the second fin group 12 is the same as the heat pipe extending direction of the first penetrating portion 211, the flat portion 213, and the second penetrating portion 215 in the heat pipe group 2.
[0047] Two fin brackets 3 are fixedly connected to the bottom sides of the first fin group 11 and the second fin group 12 at intervals to fix the first fin group 11 and the second fin group 12 together. A plurality of module brackets 4 are used to fix the flat portions 213 in the recessed area 112. The copper sheet 5 is embedded in a module bracket 4, and its opposite sides respectively contact the flat portion 213 and a heat source (such as a display chip) to transfer the heat energy generated by the heat source to the heat pipe group 2 and the fin unit 1 for heat dissipation operation.
[0048] In summary, due to the design of the R angle in the heat pipe group of the heat dissipation device disclosed herein, the structural stress that the heat pipe can withstand can be effectively increased. Especially in applications with high wattage or high pound force, the long-term stability and reliability of the heat pipe can be improved accordingly. Furthermore, the above design can also enable the flat heat pipe to better adapt to compact or irregular spaces, and allow the heat pipe to be bent as required to fit the surrounding components, thereby increasing the surface area in contact with air and effectively enhancing the heat dissipation performance.
[0049] The above embodiments are only illustrative of the technical principles, features and effects of the present disclosure, and are not intended to limit the scope of implementation of the present disclosure. Those skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present disclosure. However, any equivalent modifications and changes made by using the teachings of the present disclosure should still be covered by the claims. The scope of the rights protected by the present disclosure should be as listed in the claims.
Claims
1. A heat dissipation device, characterized in that: include: a fin unit having a recessed area; as well as A heat pipe group, partly arranged in the concave area and partly passing through the fin unit, the heat pipe group having three heat pipes, the three heat pipes respectively having a first passing portion, a first bending portion, a flat portion, a second bending portion and a second passing portion connected in sequence, the first passing portion and the second passing portion passing through the fin unit, the first bending portion and the second bending portion exposed outside the fin unit, and the flat portion accommodated in the concave area; Wherein, the heat pipe group arranged in the recessed area has an R angle.
2. The heat dissipation device according to claim 1, characterized in that: The flat parts are attached to each other and arranged side by side in the recessed area.
3. The heat dissipation device according to claim 1, characterized in that: The cross section of the flat portion is a square with the R angle, and the first penetration portion and the second penetration portion are in a circular tube shape.
4. The heat dissipation device according to claim 1, characterized in that: The fin unit includes a first fin group and a second fin group spaced apart from each other, the first penetration portion penetrates the first fin group, the first bending portion is exposed from the first fin group, the second penetration portion penetrates the second fin group, and the second bending portion is exposed between the first fin group and the second fin group.
5. The heat dissipation device according to claim 4, characterized in that: The fin arrangement directions of the first fin group and the second fin group are the same as the extending direction of the heat pipes of the heat pipe group.
6. The heat dissipation device according to claim 4, characterized in that: The heat dissipation device further comprises two fin brackets, and the two fin brackets are fixedly connected to the first fin group and the second fin group at intervals from each other.
7. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a plurality of module brackets for fixing the flat portion in the recessed area.
8. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a copper sheet, and two opposite sides of the copper sheet are respectively in contact with the flat portion and a heat source.
9. The heat dissipation device according to claim 1, characterized in that: The material of the heat pipe group is copper.