Corrosion cage suitable for acid corrosion of ultrathin monocrystalline silicon wafer
By adopting a bar support structure and a roller-type limit structure in the semi-automatic acid corrosion machine, the problem of dropping and edge wear of the silicon wafer during the acid corrosion process is solved, and the stable positioning and rapid installation of the silicon wafer is achieved.
Patent Information
- Application Number
- CN202421673458.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-07-15
AI Technical Summary
The existing semi-automatic acid corrosion machines are prone to the problem of silicon wafer dropping during the process of silicon wafer acid corrosion, and the rollers wear the edges of the silicon wafer.
The light rod support structure is used instead of the traditional U-shaped groove support, and combined with the roller-type limit structure, the silicon wafer is limited and spaced to avoid dropping and edge wear.
It effectively avoids silicon wafer dropping and edge wear problems. At the same time, the silicon wafer is quickly reinstalled and positioned by the arc-shaped track setting, with a simple structure and easy use.
Smart Images
Figure CN223038899U_ABST
Abstract
Description
Technical Field
[0001] The utility model is applicable to the field of acid etching of semiconductor silicon wafers, mainly relates to the field of semi-automatic acid etching machines, and particularly relates to an etching cage applicable to acid etching of ultra-thin single-crystal silicon wafers. Background Art
[0002] The manufacturing process of semiconductor silicon wafers is a multi-stage manufacturing process. The main processing procedures from ingots to silicon wafers include cutting, slicing and cleaning, chamfering, chamfering and cleaning, grinding, grinding and cleaning, etching, etching and cleaning, polishing, polishing and cleaning, etc. Grinding can effectively improve the surface flatness of the silicon wafer. However, after surface grinding, the surface will be damaged and deformed due to mechanical processing wear. Before polishing, these damaged layers need to be completely removed. The semiconductor industry generally uses the acid etching process to completely remove the damaged layers. At the same time, acid etching can also provide a flatness and geometry beneficial to quality output for polishing. The existing acid etching processes in China are basically divided into two categories, one is a fully automatic acid etching machine and the other is a semi-automatic acid etching machine to complete the acid etching of silicon wafers.
[0003] Among them, the main processing route of semi-automatic acid etching is: cleaning → loading → pickling → acid etching → cleaning → unloading. When the silicon wafer is processed by acid etching, it mainly relies on an etching rack + rollers as carriers to perform pickling, etching, cleaning and other processes on the silicon wafer. During the etching process, it is necessary to drive the silicon wafer to rotate in the etching solution through the interconnection of a driving motor, a gear set and the rollers to ensure uniform contact reaction between the silicon wafer surface and the etching solution. The existing etching rack only has a pair of roller grooves to load two rollers to carry and drive the silicon wafer. This structure has the problem that the silicon wafer is prone to dropping during the etching process (the main reasons for dropping are: the thickness becomes thinner during the acid etching process, resulting in poor load-bearing performance of the rollers, interference of the etching solution flow, shaking during manual lifting and placing, etc.), and the bottom roller belongs to a U-shaped structure groove. The silicon wafer is mainly fixed on the roller by its own gravity on the U-shaped groove. Therefore, the roller will cause a certain degree of wear on the edge of the silicon wafer during etching. Summary of the Invention
[0004] To solve the above problems, the utility model provides an etching cage with a new structure applicable to acid etching of ultra-thin single-crystal silicon wafers, which adopts a smooth rod support structure to avoid the wear of the silicon wafer's own weight and the U-shaped groove, and combines a roller-type limiting structure to limit and partition the silicon wafer to solve the problem of wafer dropping.
[0005] The object of the present utility model and the technical problems to be solved are achieved by the following technical solutions. A corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers according to the present utility model includes a support frame, the support frame includes a first support and a second support arranged oppositely, an active large gear is rotatably arranged outside the first support and five driven small gears are arranged around the large gear; two support rods for surface light tubes are also rotatably arranged between the first support and the second support, the two support rods are arranged in parallel and the plane where the axes of the two support rods are located is perpendicular to the first support; three limiting rods are also rotatably arranged between the first support and the second support, and a plurality of grooves extending in the circumferential direction are uniformly arranged along the axial direction on the limiting rods; the above-mentioned limiting rods and support rods are respectively connected to a small gear, and the two small gears connected to the support rods are located below the large gear, the three small gears connected to the limiting rods are uniformly arranged along the outer circumference of the large gear, and one of them is located directly above the large gear; arc-shaped tracks are arranged on both the first support and the second support, and both ends of the limiting rod connected to the small gear located directly above the large gear are located in the arc-shaped tracks, and can be held in the first position for limiting the top of the silicon wafer or the second position where the silicon wafer can be freely taken and placed by a limiting member detachably inserted into the arc-shaped track.
[0006] The object of the present utility model and the technical problems to be solved can also be further realized by the following technical measures.
[0007] For the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers described above, the limiting member is a positioning pin, and the positioning pin can be inserted into the arc-shaped track to circumferentially limit the limiting rod.
[0008] For the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers described above, the groove on the limiting rod is a V-groove.
[0009] For the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers described above, a reinforcing plate is also arranged at the middle position between the first support and the second support, and the support rods and the limiting rods pass through the reinforcing plate and the reinforcing plate provides support for them.
[0010] For the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers described above, the first support, the second support, the support rods, the limiting rods and the reinforcing plate are all made of hard plastic materials.
[0011] For the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers described above, through holes for the fluid on both sides to pass through are also opened at the middle position of the reinforcing plate.
[0012] For the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers described above, arc-shaped tracks are also arranged at the positions corresponding to the uppermost limiting rod on the reinforcing plate, and limiting members for keeping the limiting rod in the first position or the second position are also detachably arranged in the arc-shaped tracks.
[0013] The aforementioned corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers, with no limit member provided in the arc-shaped track on the first support.
[0014] The aforementioned corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers, and a U-shaped groove for placing a driving device is further provided at the upper end of the first support.
[0015] The aforementioned corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers, the driving device is an external motor, a circular strong magnet is provided inside the large gear, and this circular strong magnet can cooperate with the strong magnetic gear of the external motor to drive the large gear to rotate.
[0016] Compared with the prior art, the present utility model has obvious advantages and beneficial effects. By means of the above technical solution, the present utility model can achieve quite high technological progressiveness and practicability, and has wide utilization value in the industry. It has at least the following advantages: The present utility model adopts a smooth rod support structure for the bottom of the silicon wafer to avoid wear of the silicon wafer's own weight and the grooves on the support round bar. At the same time, the structure has a roller-type limit round bar with grooves to limit and partition the silicon wafer, solving the problem of wafer dropping. At the same time, the rapid loading and positioning of the silicon wafer are realized through the setting of the arc-shaped track, and it has the characteristics of simple structure and convenient use. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic structural diagram of the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers of the present utility model;
[0018] Figure 2 It is a front view of the structure of the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers of the present utility model;
[0019] Figure 3 It is a left view of the structure of the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers of the present utility model;
[0020] Figure 4 It is a right view of the structure of the corrosion cage applicable to acid corrosion of ultra-thin single-crystal silicon wafers of the present utility model.
[0021]
MAIN SYMBOL DESCRIPTION OF COMPONENTS
[0022] 1: First support
[0023] 2: Second support
[0024] 3: Large gear
[0025] 4: Small gear
[0026] 5: Limit round bar
[0027] 51: Groove
[0028] 6: Support round bar
[0029] 7: Locating pin
[0030] 8: Reinforcing plate
[0031] 9: Pin hole
[0032] 10: Arc-shaped track
[0033] 11: U-shaped groove
[0034] 12: Handle
[0035] 13: Connecting rod
[0036] 14: Circular strong magnet Specific implementation manner
[0037] To further elaborate on the technical means and effects adopted by the present utility model to achieve the predetermined invention purpose, the following combines the drawings and preferred embodiments to detail the specific implementation manner, structure, features and effects of the corrosion cage applicable to the acid corrosion of ultra-thin single-crystal silicon wafers proposed according to the present utility model as follows.
[0038] Please refer to Figures 1-4 , which is a schematic diagram of the structures of various parts of the corrosion cage applicable to the acid corrosion of ultra-thin single-crystal silicon wafers of the present utility model. The corrosion cage includes a support frame, and the support frame includes a first bracket 1 and a second bracket 2 arranged oppositely, and the first bracket 1 and the second bracket 2 are connected by a connecting rod 13. A large gear 3 serving as a driving wheel is also rotatably provided on the first bracket, and 5 driven small gears 4 are distributed and engaged on the outer periphery of the large gear 3. Two smooth support round bars 6 are rotatably provided between the first bracket 1 and the second bracket 2, and the two support round bars 6 are arranged in parallel, and the distance between them is less than the outer diameter of the large gear 3, and the plane where the axes of the two support round bars 6 are located is perpendicular to the first bracket 1 and the second bracket 2, so as to provide horizontal support for the bottom of the silicon wafer.
[0039] Three limit round bars 5 are also rotatably provided between the first bracket 1 and the second bracket 2. The above-mentioned limit round bars 5 are used to limit the two sides and the upper end of the silicon wafer to prevent the silicon wafer from falling. A plurality of grooves 51 extending in the circumferential direction are uniformly distributed along the axial direction on the limit round bars 5. Preferably, the grooves 51 are V-shaped grooves with a narrow bottom and a wide opening.
[0040] The above-mentioned limiting round bar 5 and the supporting round bar 6 are respectively connected to a small gear 4. Thus, the rotation of the small gear 4 can be driven by the large gear 3 to realize the synchronous rotation of the limiting round bar 5 and the supporting round bar 6. In this embodiment, the small gears 4 connected to the three limiting round bars 5 are evenly distributed on the outer periphery of the large gear 3, and the small gear 4 connected to the supporting round bar 6 is located between the two small gears 4 connected to the limiting round bar 5, that is, one small gear connected to the limiting round bar 5 is distributed directly above the large gear 3, two small gears connected to the supporting round bar 6 are distributed directly below, and the other two small gears connected to the limiting round bar are distributed on both sides of the lower part.
[0041] Tests have shown that when the silicon wafer rotates, the grinding of its edge is mainly caused by the grooves on the round bar that plays a supporting role. Therefore, it is determined that the grinding of the silicon wafer is caused by its own weight. The present utility model designs the round bar (supporting round bar 6) that plays a supporting role at the bottom as a smooth rod structure and cancels the groove design, thereby avoiding the grinding phenomenon of the edge and the groove caused by the self-weight of the silicon wafer, and effectively improving the abnormal problem of the edge tip shape. Grooves are provided on the other round bars (limiting round bars 5) that play a limiting role, so that the silicon wafers can be placed and distributed correspondingly, effectively avoiding problems such as silicon wafer dropping and silicon wafer slipping out. Since the limiting of the three grooved limiting round bars on the silicon wafer is not affected by the gravity of the silicon wafer, the edge wear problem of the silicon wafer can be effectively avoided.
[0042] The first bracket 1 and the second bracket 2 are also provided with arc-shaped tracks 10. The two ends of the limiting round bar 5 for limiting the top of the silicon wafer are located in the arc-shaped tracks 10, and there are a first position for limiting the top of the silicon wafer and a second position for freely loading and unloading the silicon wafer in the tracks; a limiting member for keeping the limiting round bar 5 in the first position or the second position is detachably provided in the arc-shaped track 10. After removing the limiting member, the movement of the limiting round bar between the first position and the second position in the arc-shaped track 10 can be realized. In this embodiment, the limiting member is a positioning pin 7. Corresponding pin holes are provided on both the first bracket 1 and the second bracket 2. The pin hole 9 located above the arc-shaped track 10 is a through hole, and the pin hole located below the arc-shaped track 10 is a blind hole. The positioning pin 7 passes through the through hole and is stuck in the blind hole below the arc-shaped track 10. The first position and the second position are respectively located at both ends of the arc-shaped track 10, so that only a set of pin holes are respectively provided at positions close to both ends of the arc-shaped track 10 to cooperate with the positioning pin 7 to enable the limiting round bar 5 located in the arc-shaped track 10 to be kept in the first position or the second position. In other embodiments of the present utility model, only a set of pin holes can be provided at a position close to the first position on the arc-shaped track 10 to realize the limiting of the outer periphery of the limiting round bar and keep it in the first position and rotate with the small gear. In other embodiments of the present utility model, the limiting member can also be a limiting block, a telescopic limiting rod, etc. that can be detachably installed in the arc-shaped track.
[0043] In the embodiment of the present utility model, the first bracket 1, the second bracket 2, the support round bar 6 and the limit round bar 5 are all made of hard plastic materials. To enhance the horizontal consistency of the above-mentioned support round bar 6 and limit round bar 5, a reinforcement plate 8 is further provided at the middle position between the first bracket 1 and the second bracket 2. The bottom of the reinforcement plate 8 is flush with the first bracket 1 and the second bracket 2, which can provide support for the corrosion cage. Both the support round bar 6 and the limit round bar 5 pass through the reinforcement plate 8, and the reinforcement plate 8 provides support for them to prevent deformation due to excessive length and affect the horizontal consistency.
[0044] To ensure the fluid flowability on both sides of the reinforcement plate 8, a through hole 81 for fluid passage is further opened at the middle position of the reinforcement plate 8. An arc track 10 adapted to the uppermost limit round bar 5 is further provided on the reinforcement plate 8. The arc track 10 corresponds to the arc tracks on the first bracket 1 and the second bracket 2, and a limiting member for circumferentially limiting the limit round bar to keep it in the first position and the second position is further provided on the arc track 10. In this embodiment, the limiting member is only provided at the arc track 10 on the second bracket 2 and the reinforcement plate 8, and the limiting member includes a positioning pin 7 and two groups of pin holes adapted to the positioning pin 7.
[0045] In the embodiment of the present utility model, when the limit round bar 5 rotates along the arc track, the small gear 4 connected to the limit round bar 5 always remains meshed with the large gear 3.
[0046] A U-shaped groove 11 is further provided at the upper end of the first bracket 1, which is used to place the driving device to realize the fixation of the driving device at the top of the first bracket 1. In this embodiment, a circular strong magnet 14 is provided inside the large gear 3, and the strong magnetic gear of the external motor drives the large gear 3 to rotate through the circular strong magnet 14. The large gear 3 drives five driven small gears 4 to perform rotational work. The five small gears 4 correspondingly drive the limit round bar and the support round bar to perform rotational work. The support round bar drives the silicon wafer to rotate, and the limit round bar makes a synchronous circular motion with the silicon wafer to limit the silicon wafer.
[0047] A handle 12 is further connected to the upper ends of the first bracket 1 and the second bracket 2 to facilitate the operator to lift and place the corrosion cage.
[0048] The above are only the preferred embodiments of the present utility model, and do not impose any form of limitation on the present utility model. Although the present utility model has been disclosed above with the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the relevant art can make some changes or modifications to form equivalent embodiments by using the technical content disclosed above within the scope of the technical solution of the present utility model. However, as long as it does not depart from the technical solution of the present utility model, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.
Claims
1. A corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers, characterized by: The invention comprises a support frame, which comprises a first support and a second support arranged relatively to each other, wherein an active large gear and five driven small gears arranged around the large gear are rotatably arranged on the outer side of the first support; a support round rod with two surface light tubes is also rotatably arranged between the first support and the second support, the two support round rods are arranged in parallel and the plane where the axes of the two support round rods are located is perpendicular to the first support; three limiting round rods are also rotatably arranged between the first support and the second support, and a plurality of grooves extending in the circumferential direction are evenly distributed along the axial direction on the limiting round rod; the above-mentioned limiting round rod and the supporting round rod are respectively connected to a small gear, and the two small gears connected to the supporting round rod are located below the large gear, and the three small gears connected to the limiting round rod are evenly distributed along the outer circumference of the large gear, and one of them is located directly above the large gear; an arc track is provided on the first support and the second support, and the two ends of the limiting round rod connected to the small gear located directly above the large gear are located in the arc track, and can be maintained in the first position of limiting the top of the silicon wafer or the second position of allowing the silicon wafer to be freely taken and placed through a limiting member that can be detachably installed in the arc track.
2. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 1, characterized in that: The limiting member is a positioning pin, which can be inserted into the arc track to limit the circumferential position of the limiting round rod.
3. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 2, characterized in that: The groove on the limiting round rod is a V groove.
4. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 1, characterized in that: A reinforcing plate is also provided between the first bracket and the second bracket, and the reinforcing plate allows the supporting round rod and the limiting round rod to pass through and provide support for them.
5. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 4, characterized in that: The first bracket, the second bracket, the supporting round rod, the limiting round rod and the reinforcing plate are all made of hard plastic material.
6. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 4, characterized in that: A through hole is also provided in the middle of the reinforcing plate for fluids on both sides to pass through.
7. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 4, characterized in that: The position on the reinforcing plate corresponding to the uppermost limiting round rod is also provided with an arc track, and a limiting member for keeping the limiting round rod at the first position or the second position can also be detachably provided in the arc track.
8. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 7, characterized in that: There is no limit piece in the arc track on the first bracket.
9. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 1, characterized in that: The upper end of the first bracket is also provided with a U-shaped groove for placing the driving device.
10. The corrosion cage suitable for acid corrosion of ultra-thin single crystal silicon wafers according to claim 9, characterized in that: The driving device is an external motor, and a circular strong magnet is arranged inside the large gear. The circular strong magnet can cooperate with the strong magnetic gear of the external motor to drive the large gear to rotate.