Wafer positioning table
By designing a wafer positioning table that is suitable for wafers of different sizes, the problem of frequent tabletops or fixtures in the prior art is solved, efficient positioning and fixing is achieved, processing efficiency is improved and production costs are reduced.
Patent Information
- Application Number
- CN202422227872.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-11
AI Technical Summary
In the prior art, the tabletop or fixture needs to be frequently replaced during wafer processing to accommodate wafers of different sizes, resulting in reduced processing efficiency and increased production costs.
A wafer positioning platform is designed, including a base, a first positioning platform, a second positioning platform and an adsorption mechanism. The base is provided with a plurality of mounting grooves and positioning grooves, which can adapt to wafers of different sizes; the first positioning platform is provided on the first reference, and the second positioning platform is provided on the positioning groove, which can slide on the positioning groove; the adsorption mechanism fixes the wafer through multiple suction ports.
Efficient positioning and fixing of wafers of different sizes is achieved, the frequency of replacing tabletops or fixtures is reduced, the efficiency of wafer processing is improved, and the production cost is reduced.
Smart Images
Figure CN223038926U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of wafer processing, in particular to a wafer positioning table. Background Art
[0002] A wafer, as the core material for manufacturing silicon semiconductor circuits, is a silicon wafer formed by finely processing high-purity silicon. This process begins with dissolving high-purity polysilicon and adding silicon crystal seeds, followed by slowly pulling it out to form a cylindrical single-crystal silicon. Through a series of precision processes such as grinding, polishing, and slicing, the silicon ingot is transformed into a silicon wafer, which is what we call a wafer. In China, the wafer production line mainly adopts 8-inch and 12-inch specifications.
[0003] In all aspects of semiconductor manufacturing, including fabrication, testing, and packaging, in order to effectively track wafers, marking or labeling is usually carried out on their surfaces. Currently, the main method for fixing the marking on the front side of the wafer mainly relies on clamping or back adsorption. However, in the face of wafers of different size specifications, it is often necessary to frequently replace the tabletop or fixture to meet the processing requirements. This frequent replacement of the marking fixture undoubtedly reduces the efficiency of wafer processing and increases the production cost. Summary of the Utility Model
[0004] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a wafer positioning table that can adapt to wafers of different sizes.
[0005] The wafer positioning table according to an embodiment of the utility model includes:
[0006] A base, provided with a first reference, a plurality of positioning grooves, and a plurality of mounting grooves. The plurality of mounting grooves are overlapped, and all the plurality of mounting grooves abut against the first reference. The plurality of mounting grooves are respectively arranged corresponding to the plurality of positioning grooves;
[0007] A first positioning platform, arranged on the first reference;
[0008] A second positioning platform, arranged in the positioning grooves;
[0009] An adsorption mechanism, arranged on the base.
[0010] According to some embodiments of the utility model, the first positioning platform is provided with an arc-shaped groove, and the arc-shaped groove is provided with positioning cone thorns.
[0011] According to some embodiments of the utility model, the first positioning platform is provided with a positioning plane.
[0012] According to some embodiments of the utility model, the second positioning platform is connected to the base by screws.
[0013] According to some embodiments of the present utility model, the second positioning platform is disposed in the positioning groove and can slide on the positioning groove.
[0014] According to some embodiments of the present utility model, the second positioning platform is provided with a first mounting hole in a notch shape, and the base is provided with a second mounting hole. A screw passes through the first mounting hole and is fixed to the second mounting hole.
[0015] According to some embodiments of the present utility model, the second positioning platform includes two fixed ends and a sliding end. The fixed ends are disposed on the base, and the sliding end is disposed between the fixed ends and is slidably connected to the fixed ends. The sliding end can move in a direction close to or away from the wafer.
[0016] According to some embodiments of the present utility model, the base is further provided with a material taking groove, the height of the material taking groove is lower than the height of the mounting groove, and the material taking groove is connected to a plurality of the mounting grooves.
[0017] According to some embodiments of the present utility model, the adsorption mechanism includes a first passage and a second passage. The first passage is disposed on a side close to the first reference, and the second passage is disposed on a side far from the first reference.
[0018] According to some embodiments of the present utility model, both the first passage and the second passage are provided with a plurality of air suction ports.
[0019] The embodiments of the present utility model have at least the following beneficial effects: The mounting groove is used for mounting the wafer. A plurality of mounting grooves with different sizes correspond to wafers with different sizes. The plurality of mounting grooves are all connected to the first reference. The first positioning platform is disposed on the first reference, so that wafers with different sizes are all in contact with the first positioning platform. The plurality of mounting grooves are respectively arranged corresponding to the plurality of positioning grooves. When a wafer of a certain size is determined, first place the wafer on the corresponding mounting groove, and the wafer is in contact with the first positioning platform. At this time, there is one or two corresponding positioning grooves. Place one or two second positioning platforms on the corresponding positioning grooves to fix both ends of the wafer, realizing positioning in two or three directions, so that the wafer can be positioned on the base. After positioning, the wafer is fixed on the base through the adsorption mechanism.
[0020] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:
[0022] Figure 1Schematic diagram of the overall structure of the wafer positioning stage according to an embodiment of the present utility model;
[0023] Figure 2 Schematic diagram of the top view structure of the wafer positioning stage according to an embodiment of the present utility model;
[0024] Figure 3 Schematic diagram of the internal frame structure of the wafer positioning stage according to an embodiment of the present utility model;
[0025] Figure 4 Schematic diagram of the structures of two embodiments of the first positioning platform according to an embodiment of the present utility model;
[0026] Figure 5 Schematic diagram of the structures of two embodiments of the second positioning platform according to an embodiment of the present utility model.
[0027] Reference numerals:
[0028] name mark name mark Base 100 Positioning plane 230 Positioning groove 110 Second positioning platform 300 Mounting slot 120 First mounting hole 310 Feed chute 130 Fixed end 320 Inlet 140 Sliding end 330 The first positioning platform 200 First access 410 Arc groove 210 Second Path 420 Positioning cone 220 Detailed implementation manners
[0029] The following content will describe several embodiments of the present utility model, including the embodiments corresponding to the drawings. It can be understood that the drawings are used to assist in understanding the technical features and technical solutions of the present utility model, and should not be construed as a limitation on the protection scope of the present utility model.
[0030] The following will clearly and completely describe the concept, specific structure and technical effects generated by the present utility model in combination with the embodiments and the drawings, so as to fully understand the purpose, solution and effects of the present utility model. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
[0031] It should be noted that unless otherwise clearly defined, when a feature is referred to as "fixed", "connected", "installed" to another feature, it can be directly fixed, connected to another feature, or indirectly fixed, connected to another feature. The words such as "fixed", "connected", "installed" should be understood in a broad sense, and those skilled in the technical field can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.
[0032] It should be noted that the descriptions of the orientation or positional relationships indicated by up, down, left, right, top, bottom, front, back, inside, outside, etc. in the present utility model are based on the orientation or positional relationships in the drawings or embodiments, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present utility model.
[0033] It should be noted that the term "and / or" used in the present utility model includes any combination of one or more of the related listed items. The meaning of "several" is one or more, the meaning of "multiple" is two or more, and understandings such as "greater than", "less than", and "exceeding" do not include the present number, while understandings such as "above", "below", and "within" include the present number.
[0034] It should be noted that in the present utility model, if the first and the second are described, it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.
[0035] It should be noted that unless otherwise clearly defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art of this technology. The terms used in the description of this specification are only for describing specific embodiments and are not intended to limit the present utility model.
[0036] Referring to Figure 1-Figure 5 , the basic embodiment of the present utility model provides a wafer positioning table, including:
[0037] A base 100, provided with a first reference, a plurality of positioning grooves 110 and a plurality of mounting grooves 120. The plurality of mounting grooves 120 are arranged in an overlapping manner. The plurality of mounting grooves 120 are all in contact with the first reference, and the plurality of mounting grooves 120 are respectively arranged corresponding to the plurality of positioning grooves 110;
[0038] A first positioning platform 200, arranged on the first reference;
[0039] A second positioning platform 300, arranged in the positioning grooves 110;
[0040] An adsorption mechanism, arranged on the base 100.
[0041] According to the embodiment of the present utility model, by setting like this, at least the following effects can be achieved. The mounting grooves 120 are used for mounting wafers. The plurality of mounting grooves 120 with different sizes correspond to wafers with different sizes. The plurality of mounting grooves 120 are all connected to the first reference. The first positioning platform 200 is arranged on the first reference, so that wafers with different sizes are all in contact with the first positioning platform 200. The plurality of mounting grooves 120 are respectively arranged corresponding to the plurality of positioning grooves 110; when determining a wafer of a certain size, first place the wafer on the corresponding mounting groove 120, and the wafer is in contact with the first positioning platform 200. At this time, there is one or two corresponding positioning grooves 110. Place one or two second positioning platforms 300 on the corresponding positioning grooves 110 to fix both ends of the wafer, realizing positioning in two or three directions, so that the wafer can be positioned on the base 100; after positioning, the wafer is fixed on the base 100 through the adsorption mechanism.
[0042] It can be understood that the positioning of the wafer can be achieved as long as two directions of the wafer are realized, and three directions are beneficial to further position the wafer.
[0043] Reference Figure 4 , it can be understood that there are mainly two positioning structures for the wafer. One is that a plane is provided at the end of the wafer, and the other is that a tapered groove is provided at the edge of the wafer.
[0044] Furthermore, the first reference can be a straight line or an arc, corresponding to the above-mentioned structure of the wafer.
[0045] In some embodiments, the first positioning platform 200 is provided with an arc groove 210, and the arc groove 210 is provided with positioning cone thorns 220. The arc groove 210 is adapted to the circular contour of the wafer. A tapered groove is provided on the wafer, and the tapered groove cooperates with the positioning cone thorns 220 to enable the wafer to be positioned in the angular direction.
[0046] In some embodiments, the first positioning platform 200 is provided with a positioning plane 230. A plane is provided on the wafer, and the plane on the wafer abuts against the positioning plane 230 of the first positioning platform 200, which can prevent the wafer from rotating and enable the wafer to be positioned in the angular direction.
[0047] In some embodiments, the second positioning platform 300 is connected to the base 100 by screws. Through the screw connection, the second positioning platform 300 can be detachably installed on the base 100, and according to wafers of different sizes, the second positioning platform 300 is installed on the corresponding positioning groove 110.
[0048] In some embodiments, the second positioning platform 300 is disposed in the positioning groove 110 and can slide on the positioning groove 110. There are slight differences in the size of each batch of wafers. By sliding the second positioning platform 300, the position of the second positioning platform 300 can be finely adjusted so that the position of the second positioning platform 300 can adapt to the size of the wafer.
[0049] In some embodiments, the second positioning platform 300 is provided with a slot-shaped first mounting hole 310, and the base 100 is provided with a second mounting hole. The screw passes through the first mounting hole 310 and is fixed to the second mounting hole. The slot shape means that after a circle is bisected, the two semi-circles are separated from each other. The screw can move within the slot, enabling the second positioning platform 300 to be fixed at different positions. By sliding the second positioning platform 300, the position of the second positioning platform 300 can be finely adjusted so that the position of the second positioning platform 300 can adapt to the size of the wafer.
[0050] In some embodiments, the second positioning platform 300 includes two fixed ends 320 and a sliding end 330. The fixed ends 320 are provided on the base 100, and the sliding end is provided between the fixed ends 320 and is slidably connected to the fixed ends 320. The sliding end can move in a direction closer to or farther from the wafer. The fixed ends 320 are fixedly provided on the base 100, and the sliding end 330 can move on the fixed ends 320. By adjusting the position of the sliding end 330, the position of the second positioning platform 300 can be finely adjusted so that the position of the second positioning platform 300 can adapt to the size of the wafer.
[0051] In some embodiments, the base 100 is further provided with a pick-up groove 130. The height of the pick-up groove 130 is lower than the height of the mounting groove 120, and the pick-up groove 130 is connected to a plurality of mounting grooves 120. The user can extend into the mounting groove 120 through the pick-up groove 130, and the wafer can be taken out from bottom to top through the pick-up groove 130.
[0052] In some embodiments, the adsorption mechanism includes a first passage 410 and a second passage 420. The first passage 410 is provided on the side close to the first reference, and the second passage 420 is provided on the side far from the first reference. The two-way vacuum adsorption mechanism can be freely switched. The first passage 410 is used for adsorbing small wafers, and the first passage 410 and the second passage 420 are used for adsorbing large wafers simultaneously.
[0053] In some embodiments, a plurality of air suction ports 140 are provided in both the first passage 410 and the second passage 420. The plurality of air suction ports 140 are beneficial for fixing the wafer at multiple points, so that the wafer can be fixed on the base 100.
[0054] It should be noted that in this specification, several embodiments of the present invention can be described by terms such as "one embodiment", "some embodiments", "basic embodiment", "extended embodiment", etc. The specific features, structures, materials or characteristics in several embodiments can be combined under the premise of conforming to the principles and purposes of the present invention.
[0055] Although some embodiments of the present invention have been shown and described in this specification, the present invention should not be limited to the above embodiments. As long as it achieves the technical effects of the present invention by the same or equivalent means, within the spirit and principles disclosed in the present invention, without departing from the principles and purposes of the present invention, any changes, modifications, equivalent replacements and equivalent variations made to these embodiments should be included within the scope of protection disclosed by the present invention and should be considered to be within the scope of protection of the present invention.
Claims
1. A wafer positioning platform, characterized in that: include: A base (100) is provided with a first reference, a plurality of positioning grooves (110) and a plurality of mounting grooves (120), wherein the plurality of mounting grooves (120) are arranged in an overlapping manner, the plurality of mounting grooves (120) are all in contact with the first reference, and the plurality of mounting grooves (120) are respectively arranged corresponding to the plurality of positioning grooves (110); A first positioning platform (200), arranged at the first reference; A second positioning platform (300) is disposed in the positioning groove (110); The adsorption mechanism is arranged on the base (100).
2. The wafer positioning stage according to claim 1, characterized in that: The first positioning platform (200) is provided with an arc-shaped groove (210), and the arc-shaped groove (210) is provided with a positioning cone thorn (220).
3. The wafer positioning stage according to claim 1, characterized in that: The first positioning platform (200) is provided with a positioning plane (230).
4. The wafer positioning stage according to claim 1, characterized in that: The second positioning platform (300) is connected to the base (100) via screws.
5. The wafer positioning stage according to claim 1, characterized in that: The second positioning platform (300) is disposed in the positioning groove (110) and is capable of sliding on the positioning groove (110).
6. The wafer positioning stage according to claim 1, characterized in that: The second positioning platform (300) is provided with a notch-shaped first mounting hole (310), the base (100) is provided with a second mounting hole, and a screw passes through the first mounting hole (310) and is fixed to the second mounting hole.
7. The wafer positioning stage according to claim 1, characterized in that: The second positioning platform (300) comprises two fixed ends (320) and a sliding end (330), wherein the fixed ends (320) are arranged on the base (100), and the sliding end is arranged between the fixed ends (320) and is slidably connected to the fixed ends (320), and the sliding end can move in a direction close to or away from the wafer.
8. The wafer positioning stage according to claim 1, characterized in that: The base (100) is further provided with a material taking trough (130), the height of the material taking trough (130) being lower than the height of the installation trough (120), and the material taking trough (130) is connected to a plurality of the installation troughs (120).
9. The wafer positioning stage according to claim 1, characterized in that: The adsorption mechanism comprises a first passage (410) and a second passage (420), wherein the first passage (410) is arranged on a side close to the first reference, and the second passage (420) is arranged on a side far from the first reference.
10. The wafer positioning stage according to claim 9, characterized in that: The first passage (410) and the second passage (420) are both provided with a plurality of air intake ports (140).