Vapor chamber structure

Abstract

The utility model discloses a vapor chamber structure which comprises an upper cover plate, a lower cover plate, at least one capillary structure layer and at least one carbon element unit. The upper cover plate and the lower cover plate are correspondingly covered to define a vacuum chamber, and the vacuum chamber is filled with a working fluid; the capillary structure layer is arranged on the inner side surface of the lower cover plate; the carbon element unit can be arranged between the capillary structure layer and the lower cover plate or on the outer side surface of the lower cover plate; therefore, the vapor chamber structure can greatly improve the temperature uniformity through the carbon element units so as to achieve more efficient heat conduction and circulation efficiency.

Description

Technical Field

[0001] The utility model relates to a heat dissipation structure, in particular to a heat pipe structure. Background Art

[0002] The development of wafer production and manufacturing technology has continuously driven the progress of the computer and computing fields. However, the improvement of wafer performance is also accompanied by the generation of a large amount of heat energy, resulting in high temperatures on the wafer and the formation of local hot spots. If the heat energy on the wafer cannot be effectively and quickly removed, the wafer performance and service life will be greatly affected.

[0003] The heat pipe is one of the existing technologies for dissipating heat from electronic components (such as wafers), which is filled with a working fluid. The working fluid circulates and disperses therein to conduct heat energy to achieve the required temperature uniformity. In the existing heat pipe structure, the upper and lower covers and the capillary structure layer are all made of the same material, such as made of copper or aluminum alone. In some heat pipes, the working fluid can also undergo a phase change (such as vapor-liquid) during circulation, also known as a two-phase flow heat pipe, to improve the heat dissipation ability and temperature uniformity by the phase change. However, if the temperature uniformity of the heat pipe needs to be further improved, it is still limited by the material characteristics of the heat pipe itself.

[0004] In addition, there is a method of directly growing different materials on the wafer during wafer manufacturing, such as materials with good thermal conductivity, to improve the heat dissipation of the wafer. However, growing different materials on the wafer, such as a silicon carbide (SiC)-based gallium nitride (GaN) wafer, will instead cause a thermal stress problem; that is, when the wafer generates high temperature during operation, the different thermal expansion coefficients between different materials cause stress accumulation at the material interface, which may ultimately lead to the bending or even cracking of the wafer. Thus, not only does the use of different materials increase the difficulty of wafer manufacturing, but also the reliability of the wafer is reduced due to thermal stress.

[0005] In addition, referring to the case of Taiwan Patent Publication No. TW201350781 A in China, there is already a heat pipe structure in which a material with good thermal conductivity (such as diamond) is laminated with the capillary structure layer 111. Please see Figure 1, the lower cover plate 12 (i.e., the evaporation area) contacts and conducts the heat energy generated by the electronic component 14 into the vacuum chamber 13; on the inner wall surface of the vacuum chamber 13 between the upper cover plate 11 and the lower cover plate 12, a capillary structure layer 111 is sequentially arranged first, and then a diamond structure thin film layer 112 is arranged on its inner side surface, so that the working fluid therein contacts and evaporates on the surface of the diamond structure thin film layer 112, and the condensed working fluid then covers the capillary structure layer 111 under the diamond structure thin film layer 112 along both sides of the edge of the vacuum chamber 13 and circulates back to the bottom layer of the vacuum chamber 13. However, in this utility model, the heat energy is first absorbed by the evaporation area of the lower cover plate 12 and then sequentially transferred to the capillary structure layer 111 and the diamond structure thin film layer 112 of the vacuum chamber 13. The heat conduction efficiency of the capillary structure layer 111 is much lower than that of the diamond structure thin film layer 112, so the heat transfer efficiency is poor, resulting in that the heat pipe structure cannot quickly absorb heat energy to generate a phase change to achieve the temperature equalization effect. In this way, not only the heat conduction efficiency of the working fluid is affected, but also the circulation efficiency of the condensed working fluid is limited, so the temperature uniformity still needs to be improved.

[0006] Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the utility model person of this case and the relevant manufacturers in this industry urgently want to research and improve. Summary of the Utility Model

[0007] Therefore, to effectively solve the above problems, the purpose of the present utility model is to provide a heat pipe structure for improving temperature uniformity.

[0008] To achieve the above purpose, the present utility model provides a heat pipe structure, including: an upper cover plate, a lower cover plate, at least one capillary structure layer and at least one carbon element unit.

[0009] The upper cover plate and the lower cover plate are correspondingly covered to define a vacuum chamber, and a working fluid is filled in the vacuum chamber; the capillary structure layer is at least arranged on the inner surface of the lower cover plate; the carbon element unit is at least arranged on any one of between the capillary structure layer and the lower cover plate and the outer surface of the lower cover plate.

[0010] For the heat pipe structure described above, wherein: the vacuum chamber has an evaporation side corresponding to the inner surface of the lower cover plate and a condensation side corresponding to the inner surface of the upper cover plate.

[0011] For the heat pipe structure described above, wherein: the carbon element unit is arranged between the capillary structure layer and the lower cover plate, the carbon element unit is formed with a plurality of through holes, the capillary structure layer has a plurality of extending parts corresponding to the plurality of through holes, and the plurality of extending parts are directly combined with the inner surface of the lower cover plate through the plurality of through holes.

[0012] The described heat pipe structure, wherein: the carbon element units are respectively arranged between the inner surface of the upper cover plate and the inner surface of the lower cover plate and the capillary structure layer.

[0013] The described heat pipe structure, wherein: the capillary structure layers are respectively arranged on the inner surfaces of the upper cover plate and the lower cover plate, and the carbon element units are respectively arranged between the upper cover plate and the lower cover plate and the capillary structure layer.

[0014] The described heat pipe structure, wherein: an electronic component is further arranged on the outer surface of the lower cover plate.

[0015] The described heat pipe structure, wherein: it further includes a plurality of support columns arranged in the vacuum chamber and abutting between the upper cover plate and the lower cover plate.

[0016] The described heat pipe structure, wherein: the carbon element unit is amorphous carbon, carbon nanofoam, diamond, lonsdaleite, pyrophyllite, polycrystalline diamond nanorod, cyclocarbon graphene, graphite or fullerene.

[0017] Thereby, the present utility model provides a heat pipe structure capable of improving the temperature uniformity, achieving more efficient heat conduction and circulation efficiency. Description of the Drawings

[0018] Figure 1 It is a schematic cross-sectional view of a conventional heat pipe structure;

[0019] Figure 2 It is a three-dimensional exploded schematic view of the heat pipe structure of the present utility model;

[0020] Figure 3 It is a three-dimensional cross-sectional schematic view of the heat pipe structure of the present utility model;

[0021] Figure 4 It is a schematic cross-sectional view of an embodiment of the heat pipe structure of the present utility model;

[0022] Figure 5 It is a schematic cross-sectional view of an embodiment of the heat pipe structure of the present utility model;

[0023] Figure 6 It is a schematic cross-sectional view of an embodiment of the heat pipe structure of the present utility model;

[0024] Figure 7 It is a schematic cross-sectional view of an embodiment of the heat pipe structure of the present utility model.

[0025] Description of reference numerals: upper cover plate 11; capillary structure layer 111; diamond structure thin film layer 112; lower cover plate 12; vacuum chamber 13; electronic component 14; upper cover plate 21; lower cover plate 22; carbon element unit 23; through hole 23A; capillary structure layer 24; extension part 24B; support column 25; vacuum chamber 3; evaporation side 31; condensation side 32; electronic component 4. Detailed implementation manners

[0026] The above objects, structures and functional characteristics of the present utility model will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0027] Please refer to the accompanying drawings, Figure 2 which is a three-dimensional exploded view of the heat pipe structure of the present utility model; Figure 3 which is a three-dimensional sectional view of the heat pipe structure of the present utility model; Figure 4 which is a sectional view of an embodiment of the heat pipe structure of the present utility model; Figure 5 which is a sectional view of an embodiment of the heat pipe structure of the present utility model; Figure 6 which is a sectional view of an embodiment of the heat pipe structure of the present utility model; and, Figure 7 which is a sectional view of an embodiment of the heat pipe structure of the present utility model.

[0028] As Figures 2 to 4 shown, the present utility model provides a heat pipe structure, including: an upper cover plate 21 and a lower cover plate 22. The upper cover plate 21 and the lower cover plate 22 are correspondingly covered, so that a vacuum chamber 3 is defined by common sealing between the upper cover plate 21 and the lower cover plate 22. For example, the outer edges of the upper cover plate 21 and the lower cover plate 22 can both be quadrilateral, having four sides, and the four sides of the two correspond to each other to jointly form a vertically surrounding wall surface, and then the outer edges of the two are welded to complete the definition.

[0029] A working fluid (not shown) is filled in the vacuum chamber 3. For example, the working fluid is, for example, water, refrigerant, methanol, acetone, liquid ammonia, etc., that is, a two-phase flow heat dissipation scheme is adopted, and the uniform temperature effect is achieved through the evaporation steam cycle and the condensation reflux.

[0030] Among them, as Figure 3 shown, the heat pipe structure of the present utility model is further provided with at least one capillary structure layer 24, which is at least arranged on the inner surface of the lower cover plate 22. The capillary structure layer 24 can be a porous or woven mesh structure made of metal (for example, copper, aluminum) or non-metal materials such as rubber and plastic, and is combined on the inner surface of the lower cover plate 22.

[0031] And, at least one carbon element unit 23, which at least has allotropes of carbon including but not limited to amorphous carbon, carbon nanofoam, diamond, lonsdaleite, waxy stone, polymeric diamond nanorod, cyclocarbon graphene, graphite, and fullerene. The carbon element unit 23 is at least disposed on either one of between the capillary structure layer 24 and the lower cover plate 22 and the outer surface of the lower cover plate 22. For example, when the carbon element unit 23 is disposed between the capillary structure layer 24 and the lower cover plate 22, the above-mentioned capillary structure layer 24 will be indirectly bonded to the inner surface of the lower cover plate 22 through the carbon element unit 23. Specifically, in the present utility model, the carbon element unit 23 can be formed by combining particles of allotropes of carbon through surface metallization. It not only combines the good heat conduction characteristics of allotropes of carbon (for example, the thermal conductivity of diamond is about five times that of copper), but also enables the carbon element unit 23 to be stably bonded to the metal interface of other components (for example, the capillary structure layer 24).

[0032] During actual use, an electronic component 4 (i.e., a heat source) will be in contact with the outer surface of the lower cover plate 22. Then, as Figure 3 or Figure 4 shown, the vacuum chamber 3 has an evaporation side 31 corresponding to the inner surface of the lower cover plate 22 and a condensation side 32 corresponding to the inner surface of the upper cover plate 21. Wherein, the working fluid in the vacuum chamber 3 will respectively pass through the evaporation side 31 and the condensation side 32 to perform the above-mentioned repeated evaporation and condensation two-phase flow cycle, and transfer the thermal energy from the electronic component 4 via the lower cover plate 22.

[0033] In detail, the thermal energy generated by the electronic component 4 will be conducted from the outer surface of the lower cover plate 22 to the inner surface. At this time, regardless of whether the carbon element unit 23 is disposed between the capillary structure layer 24 and the lower cover plate 22 or on the outer surface of the lower cover plate 22, the thermal energy generated by the electronic component 4 can be quickly transferred outward through the lower cover plate 22 and the carbon element unit 23 without heat resistance problems, thereby greatly improving the heat conduction efficiency and heat exchange efficiency. In addition, by directly contacting the carbon element unit 23 with the electronic component 4 and utilizing the high thermal conductivity characteristics of allotropes of carbon such as diamond, a high-speed heat diffusion and high isothermal thermal conduction layer is formed at the bottom of the heat pipe structure of the present utility model; the thermal energy of the electronic component 4 can be quickly conducted to the capillary structure layer 24, and a phase change space is formed through the porous structure of the capillary structure layer 24. The heat from the carbon element unit 23 is quickly transferred (i.e., phase change) and conducted to the surroundings through the phase change of the working fluid, so as to achieve thermal equilibrium or thermal balance and avoid the possibility of heat accumulation in the electronic component 4.

[0034] In another embodiment, as Figure 5As shown, the carbon element unit 23 can also be respectively disposed on the inner surface of the upper cover plate 21, and between the inner surface of the lower cover plate 22 and the capillary structure layer 24. At this time, the capillary structure layer 24 can be only disposed on the inner surface of the lower cover plate 22 and indirectly bonded to the lower cover plate 22 through the carbon element unit 23; or, as Figure 5 shown, it can be respectively disposed on the inner surface of the upper cover plate 21 and the inner surface of the lower cover plate 22, and the carbon element unit 23 is respectively disposed between the upper cover plate 21 and the lower cover plate 22 and the capillary structure layer 24, so that the capillary structure layer 24 is respectively indirectly bonded to the upper cover plate 21 and the lower cover plate 22 through the carbon element unit 23. It should be noted that in the present invention, the carbon element unit 23 and the capillary structure layer 24 between the upper cover plate 21 and the lower cover plate 22 may not be in contact with each other at all. For example, they are completely separated at the outer edges of the upper cover plate 21 and the lower cover plate 22, which does not affect the implementation of the present invention.

[0035] Further, as Figure 6 shown, in another embodiment, the carbon element unit 23 is disposed between the capillary structure layer 24 and the lower cover plate 22, and the carbon element unit 23 may further be formed with a plurality of through holes 23A, so that a part of the inner surface of the lower cover plate 22 is exposed at the plurality of through holes 23A and is not bonded to any of the carbon element units 23. At the same time, the capillary structure layer 24 corresponding to the evaporation side 31 has a plurality of extension parts 24B corresponding to the plurality of through holes 23A. The plurality of extension parts 24B protrude from the lower side surface of the capillary structure layer 24, so that they can be filled into and pass through the plurality of through holes 23A, so that the extension parts 24B are directly bonded to the part of the inner surface of the lower cover plate 22 exposed through the plurality of through holes 23A. Thereby, the working fluid can enter the plurality of through holes 23A through the plurality of extension parts 24B by capillary adsorption and guidance of the capillary structure layer 24 and directly contact the inner surface of the lower cover plate 22. This not only increases the contact area but also reduces the heat exchange distance between the working fluid and the heat source, so that the heat conduction efficiency and even temperature performance are further improved.

[0036] As Figure 7As shown, in other embodiments, it further includes a plurality of support columns 25 disposed in the vacuum chamber 3 and abutted between the upper cover plate 21 and the lower cover plate 22. Specifically, the plurality of support columns 25 can be made of the same material as the upper cover plate 21 and the lower cover plate 22, pass through the capillary structure layer 24 and the carbon element unit 23, and are respectively formed on the inner surface between the upper cover plate 21 and the lower cover plate 22 at both ends in a direct connection or an integral manner to provide the strength of the structure and directly guide the condensed working fluid to quickly flow back. In addition, a support column capillary structure (not shown) can also be provided on the plurality of support columns 25 to guide the flow back, but the present invention is not limited thereto.

[0037] The above has described the present invention in detail. However, what has been described above is only a preferred embodiment of the present invention, and it should not be used to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the concept of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. A temperature equalizing plate structure, characterized in that: include: an upper cover plate; A lower cover plate, correspondingly covering the upper cover plate to define a vacuum chamber, wherein the vacuum chamber is filled with a working fluid; At least one capillary structure layer is at least disposed on the inner surface of the lower cover plate; At least one carbon element unit is at least arranged between the capillary structure layer and the lower cover plate and on the outer surface of the lower cover plate.

2. The temperature homogenizing plate structure according to claim 1, characterized in that: The vacuum chamber has an evaporation side corresponding to the inner surface of the lower cover plate and a condensation side corresponding to the inner surface of the upper cover plate.

3. The temperature homogenizing plate structure according to claim 2, characterized in that: The carbon element unit is arranged between the capillary structure layer and the lower cover plate, the carbon element unit is formed with a plurality of through holes, the capillary structure layer has a plurality of extension parts corresponding to the plurality of through holes, and the plurality of extension parts are directly combined with the inner surface of the lower cover plate through the plurality of through holes.

4. The temperature homogenizing plate structure according to claim 1, characterized in that: The carbon element units are respectively arranged on the inner surface of the upper cover plate and between the inner surface of the lower cover plate and the capillary structure layer.

5. The temperature homogenizing plate structure according to claim 4, characterized in that: The capillary structure layer is respectively arranged on the inner surface of the upper cover plate and the inner surface of the lower cover plate, and the carbon element unit is respectively arranged between the upper cover plate, the lower cover plate and the capillary structure layer.

6. The temperature homogenizing plate structure according to claim 2, characterized in that: An electronic component is also arranged on the outer surface of the lower cover plate.

7. The temperature homogenizing plate structure according to claim 1, characterized in that: The invention also comprises a plurality of supporting columns which are arranged in the vacuum chamber and abut against the upper cover plate and the lower cover plate.

8. The temperature homogenizing plate structure according to claim 1, characterized in that: The carbon element unit is amorphous carbon, carbon nano foam, diamond, lonsdaleite, wax stone, polymerized diamond nanorod, cyclocarbon graphene, graphite or fullerene.

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