Position correcting mechanism of printed circuit board collecting machine

Abstract

The utility model belongs to the technical field of circuit board collecting and position correcting, and particularly relates to a position correcting mechanism of a printed circuit board collecting machine, which comprises an X-axis linear module, a plurality of position correcting devices and a camera mechanism. The position correcting devices are arranged at the driving end of the X-axis linear module, the X-axis linear module drives the position correcting devices to slide in the direction of the X-axis linear module, and the camera shooting mechanism is arranged on the X-axis linear module. The position correcting device comprises a Y-axis linear module and a plurality of position correcting arms, one end of the Y-axis linear module is connected to the driving end of the X-axis linear module, and the Y-axis linear module is perpendicular to the X-axis linear module. The position correcting arms are arranged at the driving end of the Y-axis linear module, and the Y-axis linear module drives the position correcting arms to slide in the direction of the Y-axis linear module. The position correcting arm is used for rotating the circuit board. The position of the circuit board is adjusted before the board is collected, and the situation that the circuit board is damaged due to collision in the board collecting process due to the position deviation of the circuit board in the board collecting process is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board receiving and aligning, and particularly relates to an aligning mechanism of a printed circuit board receiving machine. Background Art

[0002] A printed circuit board, i.e., a PBC, is abbreviated as a printed board, which is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. With the development of electronic technology, various electronic devices will use circuit boards. In addition, circuit boards are widely used in electrical equipment. With the increasing usage of electrical appliances, the production of circuit boards is becoming more and more large-scale and streamlined. In the process of circuit board processing, many processes are required, such as drilling, etching, etc. In different processes, the recycling of circuit boards is an essential process. During the manufacturing process of circuit boards, according to different processes at each step, the circuit boards need to be transported from one device to another. Among them, the receiving machine is a device often used in the entire circuit board production line, which is used to neatly store a certain number of circuit boards in a receiving box for use in the next process. However, during the transportation of circuit boards, the position of the circuit boards cannot be guaranteed to be stable, and the existing receiving machines do not have an aligning mechanism, which is likely to damage the circuit boards due to misalignment during the receiving process. Even if the circuit boards are not damaged, the stacking of circuit boards in the receiving machine will cause misalignment, affecting the next process of the circuit boards. Therefore, there is an urgent need for an aligning mechanism to solve the above problems. Summary of the Utility Model

[0003] The purpose of the utility model is to provide an aligning mechanism of a printed circuit board receiving machine, aiming to solve the technical problem that during the transportation of circuit boards in the prior art, the position of the circuit boards cannot be guaranteed to be stable, and the circuit boards are easily damaged due to misalignment during the receiving process.

[0004] To achieve the above purpose, an aligning mechanism of a printed circuit board receiving machine provided by an embodiment of the utility model includes an X-axis linear module, a plurality of aligning devices, and a camera mechanism. Each aligning device is arranged on the driving end of the X-axis linear module. The X-axis linear module drives the aligning device to slide along the direction of the X-axis linear module, and the camera mechanism is arranged on the X-axis linear module. The aligning device includes a Y-axis linear module and a plurality of aligning arms. One end of the Y-axis linear module is connected to the driving end of the X-axis linear module, and the Y-axis linear module is perpendicular to the X-axis linear module. Each aligning arm is arranged on the driving end of the Y-axis linear module, and the Y-axis linear module drives the aligning arm to slide along the direction of the Y-axis linear module. The aligning arm is used to rotate the circuit board.

[0005] Furthermore, the alignment arm includes a Z-axis linear module and a rotating pickup arm. The Z-axis linear module is slidably disposed at the driving end of the Y-axis linear module, and the Z-axis linear module is perpendicular to the Y-axis linear module and the X-axis linear module pairwise. The rotating pickup arm is disposed at the driving end of the Y-axis linear module, and the Y-axis linear module drives the rotating pickup arm to slide along the direction of the Y-axis linear module.

[0006] Furthermore, the rotating pickup arm includes a rotating mechanism and a suction mechanism. The rotating mechanism is disposed at the driving end of the Z-axis linear module, and the suction mechanism is disposed at the driving end of the rotating mechanism. The rotating mechanism drives the suction mechanism to rotate. The suction mechanism includes a mounting block, a connecting block, and a plurality of suction nozzles. One end of the connecting block is connected to the driving end of the rotating mechanism, and the other end is connected to the mounting block. The suction nozzles are arranged in a rectangular array at the bottom of the mounting block, and each suction nozzle is connected to a negative pressure machine.

[0007] Furthermore, the suction mechanism further includes a buffer assembly, and the buffer assembly is disposed between the mounting block and the connecting block.

[0008] Furthermore, the buffer assembly includes a guide post and an elastic member. One end of the guide post is connected to the connecting block, the mounting block is slidably connected to the other end of the guide post, one end of the elastic member abuts against the connecting block, and the other end is connected to the mounting block.

[0009] Furthermore, it further includes a transportation mechanism. The transportation mechanism is disposed on the X-axis linear module, and the X-axis linear module drives the transportation mechanism to move along the direction of the X-axis linear module.

[0010] Furthermore, the transportation mechanism includes a telescopic assembly and an adsorption assembly. One end of the telescopic assembly is connected to the X-axis linear module, the telescopic assembly is parallel to the alignment arm, the adsorption assembly is disposed at the driving end of the telescopic assembly, and the telescopic assembly drives the adsorption assembly to rise or fall along the direction of the alignment arm.

[0011] Furthermore, the adsorption assembly includes an adjustment module and two adsorption arms. The adjustment module is disposed at the driving end of the telescopic assembly and is perpendicular to the telescopic assembly. The two adsorption arms are on the same horizontal plane. The two adsorption arms are respectively disposed at one end of the adjustment module and the driving end of the adjustment module. The adjustment module is used to adjust the distance between the two adsorption arms.

[0012] One or more of the above technical solutions in the alignment mechanism of a printed circuit board receiving machine provided by the embodiments of the present utility model at least have one of the following technical effects: When a circuit board undergoes a processing operation and needs to be received by a receiving machine and then undergoes the next processing operation or blanking, the circuit board passes through an alignment mechanism of a printed circuit board receiving machine provided by the present utility model. The imaging mechanism captures the deviation of the circuit board. Subsequently, the X-axis linear module and the Y-axis linear module cooperate with each other to drive each alignment arm above the circuit board. Then, the alignment arm picks up the circuit board. According to the position deviation measured by the imaging mechanism, the X-axis linear module and the Y-axis linear module drive the alignment arm to move to a suitable position. The alignment arm rotates the circuit board to make the circuit board no longer deviate. Then, the alignment arm puts down the circuit board to perform receiving. The position of the circuit board is adjusted before receiving to avoid damage to the circuit board caused by collision during the receiving process due to the position deviation of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0014] Figure 1 It is a schematic structural diagram of an alignment mechanism of a printed circuit board receiving machine provided by an embodiment of the present utility model.

[0015] Figure 2 It is a schematic structural diagram of an alignment device of an alignment mechanism of a printed circuit board receiving machine provided by an embodiment of the present utility model.

[0016] Reference numerals: 100, X-axis linear module; 200, alignment device; 300, Y-axis linear module; 400, alignment arm; 500, Z-axis linear module; 600, rotating pickup arm; 610, rotating mechanism; 620, suction mechanism; 621, mounting block; 622, connecting block; 623, suction nozzle; 630, buffer assembly; 631, guide post; 632, elastic member; 700, transportation mechanism; 710, telescopic assembly; 720, adsorption assembly; 721, distance adjustment module; 722, adsorption arm. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] The following details the embodiments of the present utility model. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the embodiments of the present utility model and should not be construed as limiting the present utility model.

[0018] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0019] In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, "a plurality" means two or more, unless otherwise specifically defined.

[0020] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model may be understood according to specific circumstances.

[0021] In one embodiment of the present utility model, reference is made to Figures 1 to 2As shown in the figure, a position correction mechanism for a printed circuit board receiving machine is provided, which includes an X-axis linear module 100, a plurality of position correction devices 200 and a camera mechanism. Each position correction device 200 is arranged on the driving end of the X-axis linear module 100. The X-axis linear module 100 drives the position correction device 200 to slide along the direction of the X-axis linear module 100, and the camera mechanism is arranged on the X-axis linear module 100. The position correction device 200 includes a Y-axis linear module 300 and a plurality of position correction arms 400. One end of the Y-axis linear module 300 is connected to the driving end of the X-axis linear module 100, and the Y-axis linear module 300 is perpendicular to the X-axis linear module 100. Each position correction arm 400 is arranged on the driving end of the Y-axis linear module 300, and the Y-axis linear module 300 drives the position correction arm 400 to slide along the direction of the Y-axis linear module 300. The position correction arm 400 is used to rotate the circuit board. In this embodiment, when the circuit board undergoes a processing operation and needs to be received by the receiving machine and then undergoes the next processing operation or blanking, the circuit board passes through a position correction mechanism for a printed circuit board receiving machine provided by the present invention. The camera mechanism photographs the deviation of the circuit board. Subsequently, the X-axis linear module 100 and the Y-axis linear module 300 cooperate with each other to drive each position correction arm 400 above the circuit board. Subsequently, the position correction arm 400 picks up the circuit board. According to the position deviation measured by the camera mechanism, the X-axis linear module 100 and the Y-axis linear module 300 drive the position correction arm 400 to move to a suitable position. The position correction arm 400 rotates the circuit board to make the circuit board no longer deviate. Subsequently, the position correction arm 400 puts down the circuit board for receiving, and adjusts the position of the circuit board before receiving to avoid damage to the circuit board caused by collision during the receiving process due to the position deviation of the circuit board.

[0022] More specifically, referring to Figures 1 to 2 As shown in the figure, there are two position correction devices 200 arranged on the X-axis linear module 100, and three position correction arms 400 arranged on the Y-axis linear module 300, which can correct the positions of 6 circuit boards simultaneously, improving the working efficiency.

[0023] Specifically, referring to Figures 1 to 2As shown, the alignment arm 400 includes a Z-axis linear module 500 and a rotating pickup arm 600. The Z-axis linear module 500 is slidably disposed at the driving end of the Y-axis linear module 300, and the Z-axis linear module 500 is perpendicular to the Y-axis linear module 300 and the X-axis linear module 100 pairwise. The rotating pickup arm 600 is disposed at the driving end of the Y-axis linear module 300, and the Y-axis linear module 300 drives the rotating pickup arm 600 to slide along the direction of the Y-axis linear module 300. In this embodiment, the Z-axis linear module 500 drives the rotating pickup arm 600 to approach the circuit board, and then the rotating pickup arm 600 picks up the circuit board and rotates the circuit board. During this process, the X-axis linear module 100 and the Y-axis linear module 300 drive the rotating pickup arm 600 to move to a suitable position, so that the positions of the circuit boards are no longer offset, which is suitable for the position of the board receiving machine, and avoids damage to the circuit board caused by collision during the board receiving process due to the position deviation of the circuit board.

[0024] Specifically, referring to Figures 1 to 2 As shown, the rotating pickup arm 600 includes a rotating mechanism 610 and a suction mechanism 620. The rotating mechanism 610 is disposed at the driving end of the Z-axis linear module 500, and the suction mechanism 620 is disposed at the driving end of the rotating mechanism 610. The rotating mechanism 610 drives the suction mechanism 620 to rotate. The suction mechanism 620 includes a mounting block 621, a connecting block 622, and a plurality of suction nozzles 623. One end of the connecting block 622 is connected to the driving end of the rotating mechanism 610, and the other end is connected to the mounting block 621. The suction nozzles 623 are arranged in a rectangular array at the bottom of the mounting block 621, and each suction nozzle 623 is connected to a negative pressure machine. In this embodiment, the rotating mechanism 610 drives the suction mechanism 620 to rotate, and avoids damage to the circuit board caused by collision during the board receiving process due to the position deviation of the circuit board. The suction nozzles 623 are used to adsorb the circuit board to avoid hard collision with the circuit board, resulting in damage to the circuit board.

[0025] Specifically, referring to Figures 1 to 2 As shown, the suction mechanism 620 further includes a buffer assembly 630, and the buffer assembly 630 is disposed between the mounting block 621 and the connecting block 622. In this embodiment, the Z-axis linear module 500 drives the suction mechanism 620 to approach the circuit board. When the suction mechanism 620 sucks the circuit board, the buffer assembly 630 plays a buffering role to avoid damage to the circuit board caused by collision between the suction mechanism 620 and the circuit board.

[0026] Specifically, referring to Figures 1 to 2As shown, the buffer assembly 630 includes a guide post 631 and an elastic member 632. One end of the guide post 631 is connected to the connection block 622, and the mounting block 621 is slidably connected to the other end of the guide post 631. One end of the elastic member 632 abuts against the connection block 622, and the other end is connected to the mounting block 621. In this embodiment, when the Z-axis linear module 500 drives the suction mechanism 620 to approach the circuit board and the suction nozzle 623 abuts against the circuit board, the elastic member 632 is compressed, and the mounting block 621 slides upward to prevent damage to the circuit board caused by collision between the mounting block 621 and the circuit board.

[0027] Specifically, referring to Figures 1 to 2 As shown, it further includes a transportation mechanism 700. The transportation mechanism 700 is arranged on the X-axis linear module 100, and the X-axis linear module 100 drives the transportation mechanism 700 to move along the direction of the X-axis linear module 100. In this embodiment, after the circuit board is aligned, the transportation mechanism 700 transports the circuit board to the board collecting machine, realizing full automation.

[0028] Specifically, referring to Figures 1 to 2 As shown, the transportation mechanism 700 includes a telescopic assembly 710 and a suction assembly 720. One end of the telescopic assembly 710 is connected to the X-axis linear module 100. The telescopic assembly 710 is parallel to the alignment arm 400. The suction assembly 720 is arranged at the driving end of the telescopic assembly 710, and the telescopic assembly 710 drives the suction assembly 720 to rise or fall along the direction of the alignment arm 400. In this embodiment, the telescopic assembly 710 drives the suction assembly 720 to descend to suck the circuit board, and then resets. The X-axis linear module 100 drives the transportation mechanism 700 to the board collecting machine, and then releases the circuit board, and the board collecting machine collects the board.

[0029] Specifically, referring to Figures 1 to 2 As shown, the suction assembly 720 includes a distance adjustment module 721 and two suction arms 722. The distance adjustment module 721 is arranged at the driving end of the telescopic assembly 710 and is perpendicular to the telescopic assembly 710. The two suction arms 722 are on the same horizontal plane. The two suction arms 722 are respectively arranged at one end of the distance adjustment module 721 and the driving end of the distance adjustment module 721. The distance adjustment module 721 is used to adjust the distance between the two suction arms 722. In this embodiment, according to circuit boards of different specifications, the distance adjustment module 721 is used to adjust the distance between the two suction arms 722 to correspond to circuit boards of different specifications, with wider applicability.

[0030] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A printed circuit board receiving machine position correction mechanism, characterized in that: It includes an X-axis linear module, a plurality of positioning devices and a camera mechanism; each positioning device is arranged on the driving end of the X-axis linear module, the X-axis linear module drives the positioning device to slide along the direction of the X-axis linear module, and the camera mechanism is arranged on the X-axis linear module; the positioning device includes a Y-axis linear module and a plurality of positioning arms, one end of the Y-axis linear module is connected to the driving end of the X-axis linear module, and the Y-axis linear module is perpendicular to the X-axis linear module; each positioning arm is arranged at the driving end of the Y-axis linear module, and the Y-axis linear module drives the positioning arm to slide along the direction of the Y-axis linear module; the positioning arm is used to rotate the circuit board.

2. A printed circuit board receiving machine position correction mechanism according to claim 1, characterized in that: The correction arm includes a Z-axis linear module and a rotating pickup arm; the Z-axis linear module is slidingly arranged at the driving end of the Y-axis linear module and the Z-axis linear module is perpendicular to the Y-axis linear module and the X-axis linear module; the rotating pickup arm is arranged at the driving end of the Y-axis linear module, and the Y-axis linear module drives the rotating pickup arm to slide along the direction of the Y-axis linear module.

3. A printed circuit board receiving machine position correction mechanism according to claim 2, characterized in that: The rotating picking arm includes a rotating mechanism and a suction mechanism; the rotating mechanism is arranged at the driving end of the Z-axis linear module, and the suction mechanism is arranged at the driving end of the rotating mechanism, and the rotating mechanism drives the suction mechanism to rotate; the suction mechanism includes a mounting block, a connecting block and a plurality of suction nozzles, one end of the connecting block is connected to the driving end of the rotating mechanism, and the other end is connected to the mounting block, each of the suction nozzles is arranged in a rectangular array at the bottom of the mounting block, and each of the suction nozzles is connected to a negative pressure machine.

4. A printed circuit board receiving machine position correction mechanism according to claim 3, characterized in that: The suction mechanism further includes a buffer component, and the buffer component is arranged between the mounting block and the connecting block.

5. A printed circuit board receiving machine position correction mechanism according to claim 4, characterized in that: The buffer assembly includes a guide column and an elastic member; one end of the guide column is connected to the connecting block, the mounting block is slidably connected to the other end of the guide column, one end of the elastic member abuts against the connecting block, and the other end is connected to the mounting block.

6. A printed circuit board receiving machine position correction mechanism according to any one of claims 1 to 5, characterized in that: It also includes a transport mechanism, which is arranged on the X-axis linear module, and the X-axis linear module drives the transport mechanism to move along the direction of the X-axis linear module.

7. A printed circuit board receiving machine position correction mechanism according to claim 6, characterized in that: The transport mechanism includes a telescopic component and an adsorption component. One end of the telescopic component is connected to the X-axis linear module. The telescopic component and the position correction arm are parallel to each other. The adsorption component is arranged at the driving end of the telescopic component. The telescopic component drives the adsorption component to rise or fall along the direction of the position correction arm.

8. A printed circuit board receiving machine position correction mechanism according to claim 7, characterized in that: The adsorption assembly includes a distance-adjusting module and two adsorption arms. The distance-adjusting module is arranged at the driving end of the telescopic assembly and is perpendicular to the telescopic assembly. The two adsorption arms are located on the same horizontal plane. The two adsorption arms are respectively arranged at one end of the distance-adjusting module and the driving end of the distance-adjusting module. The distance-adjusting module is used to adjust the distance between the two adsorption arms.

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