Microwave assembly stacking structure
By adopting a stacking structure and limiting steps in the microwave RF module, the existing module structure has solved the problems of insufficient installation space, poor heat dissipation and large weight under the trend of high power and miniaturization, and achieved higher density circuit board installation and better heat dissipation effects.
Patent Information
- Application Number
- CN202422120891.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-30
AI Technical Summary
Under the trend of high power, multifunctional and miniaturization, the existing microwave RF module structure has problems such as insufficient installation space, poor device heat dissipation, and large module weight, which cannot meet the needs of modern industries.
A microwave component stacking structure is adopted, and the top module, the middle module and the bottom heat dissipation module are arranged in sequence from top to bottom. The bottom heat dissipation module includes a cavity, and the inner side wall of the cavity is equipped with a limiting step to fix the module and add a circuit board mounting surface.
Through this structure, the module size and weight are reduced, the heat dissipation is improved, the structural parts processing costs are reduced, and the circuit board installation is supported with higher density.
Smart Images

Figure CN223040370U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of microwave, in particular to a stacked structure of microwave components. Background Technique
[0002] At present, the main structure in the industry is to use a scheme of milling cavities and installing cover plates on both the front and back sides, so that the two printed circuit boards share a bottom surface. During use, it is necessary to make concessions for the screws on the printed circuit boards on both the front and back sides, resulting in the need to consider screw interference problems during hardware design, with many limitations; and because the printed circuit board with cavities milled on both sides cannot be placed at the bottom of the radio frequency microwave module, the heat dissipation of the devices with high heat consumption on the printed circuit board is poor, affecting the module performance. Therefore, a microwave radio frequency module structure that can reduce design limitations and ensure heat dissipation is needed.
[0003] Under the current industry trends of high power, multi-function and miniaturization, the traditional structure is increasingly unable to meet the requirements of installation space, heat dissipation and weight. Because the two printed circuit boards on the front and back share a bottom surface, it is necessary to consider avoiding the installation and avoidance of screws on both sides during the design of the printed circuit board, and concessions have to be made in the module performance indicators. At the same time, as the device power gradually increases, and the whole machine uses water cooling or air cooling at the bottom of the module, the traditional structure can no longer meet the heat dissipation requirements of the microwave radio frequency module and reduce the reliability of the microwave radio frequency module. Content of the Utility Model
[0004] To overcome the deficiencies of the prior art, the utility model provides a stacked structure of microwave components, which solves the shortcomings of the prior art such as insufficient installation space for module components, poor heat dissipation of devices, and high module weight.
[0005] The technical solution adopted by the utility model to solve the above problems is:
[0006] A stacked structure of microwave components, including a top module, a middle module, and a bottom heat dissipation module arranged in sequence from top to bottom. The bottom heat dissipation module includes a cavity, and a limiting step is provided on the inner side wall of the cavity.
[0007] As a preferred technical solution, the position of the limiting step in the height direction is adjustable.
[0008] As a preferred technical solution, the top module includes a first circuit board, the middle module includes a second circuit board, a partition, and a third circuit board, the bottom heat dissipation module includes a fourth circuit board, and the first circuit board, the second circuit board, the partition, the third circuit board, the fourth circuit board, and the cavity are arranged in sequence from top to bottom.
[0009] As a preferred technical solution, it includes a cover plate arranged above the first circuit board.
[0010] As a preferred technical solution, the cover plate and the first circuit board are installed by screw mounting or welding.
[0011] As a preferred technical solution, the cover plate is provided with first screw holes, and the first circuit board is provided with second screw holes, and the first screw holes cooperate with the second screw holes.
[0012] As a preferred technical solution, the second circuit board is installed on one side of the partition by screw mounting or welding, and the third circuit board is installed on the other side of the partition by screw mounting or welding.
[0013] As a preferred technical solution, the fourth circuit board and the cavity are installed by screw mounting or welding.
[0014] As a preferred technical solution, the partition is provided with third screw holes, and the cavity is provided with fifth screw holes, and the third screw holes cooperate with the fifth screw holes.
[0015] As a preferred technical solution, the cover plate is provided with first screw holes, and the cavity is provided with sixth screw holes.
[0016] Compared with the prior art, the utility model has the following beneficial effects:
[0017] (1) Originally, two cover plates were required for the structural parts, and both sides of the cavity needed to be processed, resulting in a relatively high cost. After replacing with the new structure, only one side of the cavity needs to be processed, reducing the processing cost of the structural parts.
[0018] (2) The traditional cavity can only install two circuit boards. After using the new structure, four circuit boards can be installed, which can reduce the external dimensions and weight of the module, facilitating the trend of miniaturization and light weight.
[0019] (3) The current structure can directly place the device at the bottom of the module, enabling it to directly dissipate heat to the whole machine's cold plate, enhancing its heat dissipation performance. Description of the Drawings
[0020] Figure 1 is a schematic structural diagram of the utility model;
[0021] Figure 2 is a schematic use diagram of the utility model.
[0022] Marks in the drawings and their corresponding names:
[0023] 1. Cover plate, 2. First circuit board, 3. Second circuit board, 4. Partition, 5. Third circuit board, 6. Fourth circuit board, 7. Cavity, 101. First screw hole, 201. Second screw hole, 301. Through hole, 401. Third screw hole, 402. Fourth screw hole, 701. Limiting step, 702. Fifth screw hole, 703. Sixth screw hole. Detailed implementation manners
[0024] The present utility model will be further described in detail below in conjunction with embodiments and the accompanying drawings. However, the implementation manners of the present utility model are not limited thereto.
[0025] In the description of the present utility model, it is worth noting that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present utility model.
[0026] In the description of the present utility model, it is worth noting that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features.
[0027] Embodiment 1
[0028] As shown in Figures 1 to 2 , a stacked structure of a microwave component includes a top module, an intermediate module, and a bottom heat dissipation module arranged in sequence from top to bottom. The bottom heat dissipation module includes a cavity 7, and a limiting step 701 is provided on the inner side wall of the cavity 7.
[0029] The present utility model fixes the top module, the intermediate module, or the bottom heat dissipation module at a specified height inside the cavity 7 through the limiting step 701, so that the structural member forms four or more circuit board mounting surfaces, and iterates the microwave radio frequency module from a traditional structure to a stackable structure.
[0030] As a preferred technical solution, the position of the limiting step 701 is adjustable in the height direction.
[0031] This is more convenient for installation and expanding the number of circuit boards to be installed.
[0032] As a preferred technical solution, the top module includes a first circuit board 2, the intermediate module includes a second circuit board 3, a partition 4, and a third circuit board 5, the bottom heat dissipation module includes a fourth circuit board 6, and the first circuit board 2, the second circuit board 3, the partition 4, the third circuit board 5, the fourth circuit board 6, and the cavity 7 are arranged in sequence from top to bottom.
[0033] After using such a structure, four circuit boards can be installed, which can reduce the size and weight of the module, facilitating the trend of miniaturization and light weight.
[0034] As a preferred technical solution, it includes a cover plate 1 disposed above the first circuit board 2.
[0035] After using such a structure, the cavity 7 only needs to be machined on one side, reducing the machining cost of the structural parts.
[0036] As a preferred technical solution, the cover plate 1 and the first circuit board 2 are installed by screw mounting or welding.
[0037] This facilitates the installation of the cover plate 1 and the first circuit board 2.
[0038] As a preferred technical solution, the cover plate 1 is provided with a first screw hole 101, and the first circuit board 2 is provided with a second screw hole 201, and the first screw hole 101 cooperates with the second screw hole 201.
[0039] This facilitates the installation of the cover plate 1 and the first circuit board 2 by screw mounting.
[0040] As a preferred technical solution, the second circuit board 3 is installed on one side of the partition 4 by screw mounting or welding, and the third circuit board 5 is installed on the other side of the partition 4 by screw mounting or welding.
[0041] This facilitates the installation of the second circuit board 3, the partition 4, and the third circuit board 5.
[0042] As a preferred technical solution, the fourth circuit board 6 and the cavity 7 are installed by screw mounting or welding.
[0043] This facilitates the installation of the fourth circuit board 6 and the cavity 7.
[0044] As a preferred technical solution, the partition 4 is provided with a third screw hole 401, and the cavity 7 is provided with a fifth screw hole 702, and the third screw hole 401 cooperates with the fifth screw hole 702.
[0045] This facilitates the installation of the partition 4 and the cavity 7.
[0046] As a preferred technical solution, the cover plate 1 is provided with a first screw hole 101, and the cavity 7 is provided with a sixth screw hole 703.
[0047] This facilitates the installation of the cover plate 1 and the cavity 7.
[0048] Embodiment 2
[0049] Such as Figures 1 to 2As shown in the figure, as a further optimization of Embodiment 1, on the basis of Embodiment 1, this embodiment further includes the following technical features:
[0050] This utility model mainly divides the microwave radio frequency module into three parts:
[0051] The first part is the top module composed of a cover plate 1 and a first circuit board 2. The first circuit board 2 is fastened to the cover plate 1, and the fastening method can be fastening by screw holes (the second screw hole 201 and the first screw hole 101) or welding;
[0052] The second part is the middle module composed of a partition 4, a second circuit board 3 and a third circuit board 5. Among them, the second circuit board 3 and the third circuit board 5 are respectively fixed on both sides of the partition 4 by screws or welding. The second circuit board 3 and the partition 4 can be fastened on the partition 4 through through holes 301 and the third screw hole 401. There is also a fourth screw hole 402, whose function is to fix the third circuit board 5.
[0053] The third part is the bottom heat dissipation module composed of a cavity 7, a fourth circuit board 6 and devices with relatively high heat consumption. Among them, the fourth circuit board 6 and the devices on it are fastened to the bottom of the cavity 7 by screws or welding. The cavity 7 is mainly composed of a limit step 701, a fifth screw hole 702 (partition installation screw hole) and a sixth screw hole 703 (cover plate installation screw hole).
[0054] Among them, the four circuit boards are connected through connectors, and the structural parts are installed by screws.
[0055] Usage method:
[0056] 1. Install the first circuit board 2 to the cover plate 1 by screws or welding to form the top module;
[0057] 2. Install the second circuit board 3 and the third circuit board 5 to both sides of the partition 4 by screws or welding respectively to form the middle module;
[0058] 3. Install the fourth circuit board 6 and the devices to the cavity 7 by screws or welding to form the heat dissipation module;
[0059] 4. Install the third screw hole 401 on the middle module to the fifth screw hole 702 on the heat dissipation module by screws;
[0060] 5. Install the first screw hole 101 on the top module to the sixth screw hole 703 on the heat dissipation module by screws.
[0061] This utility model fixes the partition at a specified height inside the cavity through the limit step 701, so that the structural parts form four or more circuit board mounting surfaces, and iterates the microwave radio frequency module from the traditional structure to a stackable structure;
[0062] The utility model changes the original fixed partition into an independent partition, and a limiting platform and screw holes are arranged at the middle position of the cavity for installing the partition.
[0063] The implementation of the technical solution of the utility model will produce the following beneficial effects:
[0064] (1) Originally, two cover plates were required for the structural parts, and both sides of the cavity were processed, resulting in a relatively high cost. After replacing with the new structure, only one side of the cavity needs to be processed, and the processing cost of the structural parts is reduced;
[0065] (2) Only two circuit boards could be installed in the traditional cavity. After using the new structure, four circuit boards can be installed, which can reduce the size and weight of the module, and is beneficial to the trend of miniaturization and light weight;
[0066] (3) In the current structure, the device can be directly placed at the bottom of the module, so that it can directly dissipate heat to the whole machine's cold plate, increasing its heat dissipation performance.
[0067] As described above, the utility model can be preferably realized.
[0068] The above are only the preferred embodiments of the utility model, and do not impose any form of limitation on the utility model. Based on the technical essence of the utility model, any simple modification, equivalent replacement, and improvement made to the above embodiments within the spirit and principle of the utility model still fall within the protection scope of the technical solution of the utility model.
Claims
1. A microwave component stacking structure, characterized in that: A top module, a middle module, and a bottom heat dissipation module are arranged in sequence from top to bottom. The bottom heat dissipation module comprises a cavity (7), and an inner side wall of the cavity (7) is provided with a limiting step (701).
2. A microwave component stacking structure according to claim 1, characterized in that: The position of the limiting step (701) in the height direction is adjustable.
3. A microwave component stacking structure according to claim 1 or 2, characterized in that: The top module comprises a first circuit board (2), the middle module comprises a second circuit board (3), a partition (4), and a third circuit board (5), and the bottom heat dissipation module comprises a fourth circuit board (6). The first circuit board (2), the second circuit board (3), the partition (4), the third circuit board (5), the fourth circuit board (6), and the cavity (7) are arranged in sequence from top to bottom.
4. A microwave component stacking structure according to claim 3, characterized in that: It comprises a cover plate (1) arranged above a first circuit board (2).
5. The microwave component stacking structure according to claim 4, characterized in that: The cover plate (1) and the first circuit board (2) are mounted by screws or welding.
6. The microwave component stacking structure according to claim 5, characterized in that: The cover plate (1) is provided with a first screw hole (101), the first circuit board (2) is provided with a second screw hole (201), and the first screw hole (101) matches the second screw hole (201).
7. The microwave component stacking structure according to claim 4, characterized in that: The second circuit board (3) is mounted on one side of the partition (4) by means of screws or welding, and the third circuit board (5) is mounted on the other side of the partition (4) by means of screws or welding.
8. The microwave component stacking structure according to claim 4, characterized in that: The fourth circuit board (6) and the cavity (7) are mounted by screw mounting or welding.
9. The microwave component stacking structure according to claim 4, characterized in that: The partition (4) is provided with a third screw hole (401), the cavity (7) is provided with a fifth screw hole (702), and the third screw hole (401) matches with the fifth screw hole (702).
10. The microwave component stacking structure according to claim 4, characterized in that: The cover plate (1) is provided with a first screw hole (101), and the cavity (7) is provided with a sixth screw hole (703).