Integrated structure for supporting and heat conduction of upper layer and lower layer

Abstract

The utility model relates to the technical field of heat dissipation of electrical components, in particular to an integrated structure for upper and lower layer support and heat conduction, which comprises three coamings, the three coamings are connected into a U-shaped structure, a placing area for placing electrical components is formed among the three coamings, the upper end and the lower end of each coaming are respectively provided with a connecting structure, and the connecting structures are arranged in the U-shaped structure. The upper layer structure and the lower layer structure are connected through the surrounding plates, each surrounding plate is made of an aluminum material, a heat dissipation copper pipe is embedded in each surrounding plate, and the heat dissipation copper pipes are used for being matched with the aluminum surrounding plates so as to dissipate heat of the wrapped electrical components; the heat dissipation copper pipe is utilized to dissipate heat of the electric appliance element, and meanwhile, the coaming plate made of the aluminum material can also promote the heat conduction efficiency between the electric appliance element and the heat dissipation copper pipe, so that the heat dissipation effect is greatly improved; the whole integrated structure integrates supporting and heat dissipation, and effectively solves the technical problem of poor heat dissipation effect of heat dissipation equipment caused by limited internal space of electrical components in the prior art.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electrical components, and particularly relates to an integrated structure for upper and lower layer support and heat conduction. Background Art

[0002] The hierarchical arrangement of electrical components is an important link in the design of electronic products, which directly affects the performance, reliability, maintainability and manufacturing cost of the products. For example, according to the functions of electrical components and the connection relationships between them, the components are divided into different functional areas, such as a power supply area, a signal processing area, a control area, etc. The components within each functional area should be as close as possible to reduce the length and complexity of the connecting wires and improve the efficiency and reliability of signal transmission. Components with large heat generation (such as power transistors, resistors, etc.) should be arranged at positions where heat dissipation is easy, such as the edge or top of a printed circuit board, and heat dissipation devices such as heat sinks or fans should be considered. Try to avoid placing heat-generating components close to heat-sensitive components (such as temperature sensors, thermal relays, etc.) to prevent thermal interference.

[0003] For the hierarchically arranged electrical components, the heat dissipation of each electrical component is very crucial. The existing heat dissipation structures usually include heat dissipation pipes, which are arranged between electrical components to absorb the heat emitted by the electrical components, or heat dissipation ventilation is carried out through air extraction devices. No matter which method is used, what is considered is how to achieve heat dissipation itself. The installation space of the heat dissipation devices (heat dissipation pipes and air extraction devices) is limited, and it does not consider the combination with the support between the upper and lower layer structures. Therefore, how to set up an integrated structure that can both support the upper and lower layer structures and assist in heat dissipation, thereby expanding the installation space of the heat dissipation devices, has become a technical problem that those skilled in the art need to consider. Summary of the Utility Model

[0004] The utility model provides an integrated structure for upper and lower layer support and heat conduction to solve the technical problem that the heat dissipation effect of heat dissipation devices is poor due to the limited internal space of electrical components in the prior art.

[0005] To solve the above problems, the integrated structure for upper and lower layer support and heat conduction provided by the utility model adopts the following technical solutions:

[0006] An integrated structure for upper and lower layer support and heat conduction includes three enclosing plates, which are connected into a U-shaped structure. A placement area for placing electrical components is formed between the three enclosing plates. Both the upper and lower ends of each enclosing plate have connection structures for connecting the upper and lower layer structures;

[0007] Each enclosing plate is made of aluminum material, and a heat dissipation copper pipe is embedded in each enclosing plate. The heat dissipation copper pipe is used to cooperate with the aluminum enclosing plate to dissipate heat from the electrical components it covers.

[0008] The beneficial effects of the integrated structure for upper and lower layer support and heat conduction provided by the present utility model are as follows: The three enclosing plates are used to support the upper and lower layer structures. Heat dissipation copper tubes are embedded in each enclosing plate instead of occupying the space between the three enclosing plates. The enclosing plates and electrical components can be arranged more compactly. The heat dissipation copper tubes are used to dissipate heat from the electrical components. At the same time, the enclosing plates made of aluminum material can also promote the heat conduction efficiency between the electrical components and the heat dissipation copper tubes, greatly improving the heat dissipation effect.

[0009] The entire integrated structure integrates support and heat dissipation. The heat dissipation copper tubes are installed in an embedded manner, greatly improving the compactness between the integrated structure and the electrical components, and effectively solving the technical problem in the prior art that the internal space of the electrical components is limited, resulting in poor heat dissipation effect of the heat dissipation equipment.

[0010] Further, the three enclosing plates are defined as the first enclosing plate, the second enclosing plate, and the third enclosing plate respectively. The first enclosing plate and the second enclosing plate are adjacent, and a plurality of annular grooves are arranged on both the first enclosing plate and the second enclosing plate. The annular heat dissipation copper tubes are embedded in each annular groove.

[0011] Further, the number of the annular heat dissipation copper tubes is three. The height of each annular heat dissipation copper tube is adapted to the height of the enclosing plate, and the cumulative length of the three annular heat dissipation copper tubes is adapted to the length of the enclosing plate.

[0012] Further, a weight reduction hole is also opened on the inner side of each annular groove to reduce the weight of the entire integrated structure.

[0013] Further, a main pipe arranged horizontally and upward is embedded in the third enclosing plate, and a plurality of branch pipes extending downward are connected to the main pipe. The main pipe and the branch pipes are both the heat dissipation copper tubes.

[0014] Further, a strip-shaped weight reduction hole is opened between adjacent two branch pipes to further reduce the weight of the entire integrated structure.

[0015] Further, a refrigerant is arranged in each heat dissipation copper tube to further improve the heat conduction efficiency.

[0016] Further, the bottom of the third enclosing plate has a base for supporting the electrical components.

[0017] Further, threaded holes are opened on both the upper side and the lower side of the first enclosing plate, the second enclosing plate, and the third enclosing plate for threaded connection with the upper and lower layer structures. The threaded holes constitute the connection structure. Description of the Drawings

[0018] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features, and advantages of the exemplary embodiments of the present utility model will become readily understandable. In the drawings, several embodiments of the present utility model are shown in an exemplary rather than restrictive manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0019] Figure 1 It is a schematic diagram of the integrated structure for upper and lower layer support and heat conduction provided by the present utility model.

[0020] Description of reference numerals:

[0021] 1. First enclosing plate; 2. Second enclosing plate; 3. Third enclosing plate; 4. Placing area; 5. Heat dissipation copper pipe; 6. Annular groove; 7. Weight reduction hole; 8. Main pipe; 9. Branch pipe; 10. Strip-shaped weight reduction hole; 11. Base; 12. Threaded hole. Detailed implementation manners

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Those skilled in the art should know that the embodiments described below are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present utility model.

[0023] It should be noted that the main concept of the present utility model is to combine upper and lower layer support and heat dissipation. The heat dissipation structure is embedded in the upper and lower layer support structure. While playing a supporting role, the whole structure is more compact and the heat dissipation effect is better, so as to solve the technical problem that the heat dissipation effect of the heat dissipation equipment is poor due to the limited internal space of the electrical components in the prior art.

[0024] After introducing the basic principle of the present utility model, the various non-restrictive embodiments of the present utility model will be specifically introduced below. The number of any element in the drawings is for illustration rather than limitation, and any naming is only for distinction and does not have any restrictive meaning.

[0025] Next, with reference to several representative embodiments of the present utility model, the principle and spirit of the present utility model will be elaborated in detail.

[0026] Embodiment of the integrated structure for upper and lower layer support and heat conduction provided by the present utility model:

[0027] As Figure 1 shown, the integrated structure for upper and lower layer support and heat conduction includes three enclosing plates. The three enclosing plates are connected into a U-shaped structure. A placing area 4 for placing electrical components is formed between the three enclosing plates. Both the upper and lower ends of each enclosing plate have connection structures to connect the upper and lower layer structures.

[0028] On this basis, each enclosure panel is made of aluminum material, which has excellent thermal conductivity and can transfer the heat dissipated by electrical components in a timely manner. At the same time, each enclosure panel is embedded with a heat dissipation copper tube 5, and the heat dissipation copper tube 5 is used to cooperate with the aluminum enclosure panel to dissipate heat from the electrical components it covers.

[0029] For the convenience of introduction, the three enclosure panels are first distinguished. Define the three enclosure panels as the first enclosure panel 1, the second enclosure panel 2, and the third enclosure panel 3 respectively. The first enclosure panel 1 and the second enclosure panel 2 are adjacent, and a plurality of annular grooves 6 are arranged on both the first enclosure panel 1 and the second enclosure panel 2. Each annular groove 6 is embedded with an annular heat dissipation copper tube 5.

[0030] In this embodiment, the number of heat dissipation copper tubes 5 is three. The height of each annular heat dissipation copper tube 5 is adapted to the height of the enclosure panel, and the cumulative length of the three annular heat dissipation copper tubes 5 is adapted to the length of the enclosure panel. To ensure that continuous and sufficient heat dissipation can be carried out in both the length direction and the height direction of the enclosure panel.

[0031] In addition, a weight reduction hole 7 is also opened on the inner side of each annular groove 6 to reduce the weight of the entire integrated structure. In addition to weight reduction, the weight reduction hole 7 also plays a role in communicating with the outside air. In fact, it also further improves the heat dissipation effect.

[0032] Regarding the third enclosure panel 3. A main pipe 8 that is arranged upward and extends horizontally is embedded in the third enclosure panel 3. A plurality of branch pipes 9 that extend downward are connected to the main pipe 8. Both the main pipe 8 and the branch pipes 9 are the heat dissipation copper tubes 5.

[0033] Similar to the above-mentioned weight reduction hole 7, a strip-shaped weight reduction hole 10 is opened between adjacent two branch pipes 9 to further reduce the weight of the entire integrated structure. The strip-shaped weight reduction hole 10 also further improves the heat dissipation effect. In other embodiments, the shape of the strip-shaped weight reduction hole 10 can also be adjusted to a rectangle.

[0034] In this embodiment, a refrigerant is arranged in each heat dissipation copper tube 5 to further improve the heat conduction efficiency. The refrigerant is a substance that can effectively transfer heat during the processes of heat absorption and heat release, and usually has a relatively low boiling point and a relatively high heat of vaporization, so it can quickly absorb and transfer heat.

[0035] By adding the refrigerant, the heat conduction efficiency of the heat dissipation copper tube 5 can be significantly improved. When the equipment generates heat, the refrigerant can quickly absorb this heat and turn it into a gas state, and then release the heat in the cooling system and re-condense into a liquid state, thus forming an efficient heat cycle and effectively reducing the temperature of the equipment.

[0036] Different from the first enclosing panel 1 and the second enclosing panel 2, the bottom of the third enclosing panel 3 also has a base 11 for supporting electrical components for the placement of electrical components.

[0037] Regarding the connection structure. In this embodiment, threaded holes 12 are provided on both the upper and lower sides of the first enclosing panel 1, the second enclosing panel 2, and the third enclosing panel 3 for threaded connection of the upper and lower layer structures, and the threaded holes 12 constitute the connection structure.

[0038] The working principle of the integrated structure for upper and lower layer support and heat conduction provided by the present utility model is as follows: The electrical components are placed in the placement area 4, and the base 11 is used to assist in supporting the electrical components. While the three enclosing panels support the upper and lower layer structures, the heat dissipation copper tubes 5 are embedded in the enclosing panels and cooperate with the aluminum enclosing panels, greatly improving the heat dissipation effect of the entire integrated structure, and the heat dissipation copper tubes 5 do not squeeze the layout space of the electrical components, and the whole device has good compactness, solving the technical problem in the prior art that the heat dissipation effect of the heat dissipation device is poor due to the limited internal space of the electrical components.

[0039] Based on the above description of this specification, those skilled in the art can also understand the following terms used, such as terms indicating orientation or positional relationships, such as "upper", "lower", "front", "rear", "left", "right", "width", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings of this specification. It is only for the purpose of facilitating the description of the solution of the present utility model and simplifying the description, rather than explicitly or implicitly indicating that the device or component involved must have the specific orientation, be constructed and operate in the specific orientation. Therefore, the above orientation or positional relationship terms cannot be understood or interpreted as a limitation to the solution of the present utility model.

[0040] In addition, in the description of this specification, the meaning of "a plurality" is at least two, such as two, three or more, etc., unless otherwise specifically defined.

Claims

1. An integrated structure for upper and lower layer support and heat conduction, characterized in that: It includes three panels connected to form a U-shaped structure, a placement area for placing electrical components is formed between the three panels, and each panel has a connecting structure at both ends to connect the upper and lower structures; Each enclosure is made of aluminum material, and a heat dissipation copper tube is embedded in each enclosure. The heat dissipation copper tube is used to cooperate with the aluminum enclosure to dissipate heat for the enclosed electrical components.

2. The integrated structure for upper and lower layer support and heat conduction according to claim 1, characterized in that: The three enclosures are defined as the first enclosure, the second enclosure and the third enclosure. The first enclosure is adjacent to the second enclosure, and a plurality of annular grooves are arranged on the first enclosure and the second enclosure. An annular heat dissipation copper tube is embedded in each annular groove.

3. The integrated structure for upper and lower layer support and heat conduction according to claim 2, characterized in that: There are three annular heat dissipation copper tubes, the height of each annular heat dissipation copper tube is adapted to the height of the enclosure, and the cumulative length of the three annular heat dissipation copper tubes is adapted to the length of the enclosure.

4. The integrated structure for upper and lower layer support and heat conduction according to claim 2 or 3, characterized in that: A weight-reducing hole is also provided on the inner side of each annular groove to reduce the weight of the entire integrated structure.

5. The integrated structure for upper and lower layer support and heat conduction according to claim 2 or 3, characterized in that: The third enclosure is embedded with a main pipeline arranged upward and extending horizontally, and the main pipeline is connected to a plurality of branch pipelines extending downward, and the main pipeline and the branch pipelines are both the heat dissipation copper tubes.

6. The integrated structure for upper and lower layer support and heat conduction according to claim 5, characterized in that: Strip-shaped weight-reducing holes are provided between two adjacent branch pipes to further reduce the weight of the entire integrated structure.

7. The integrated structure for upper and lower layer support and heat conduction according to claim 6, characterized in that: Refrigerant is arranged in each heat dissipation copper tube to further improve the heat conduction efficiency.

8. The integrated structure for upper and lower layer support and heat conduction according to claim 5, characterized in that: The bottom of the third enclosure is provided with a base for supporting electrical components.

9. The integrated structure for upper and lower layer support and heat conduction according to claim 2 or 3, characterized in that: The upper and lower sides of the first enclosure, the second enclosure and the third enclosure are all provided with threaded holes for threaded connection of the upper and lower structures, and the threaded holes constitute the connection structure.

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