Suction nozzle replacing device and semiconductor processing equipment

Abstract

The utility model discloses a suction nozzle replacing device and semiconductor processing equipment, and relates to the technical field of semiconductor processing, and the suction nozzle replacing device comprises a swing arm mechanism, a suction nozzle taking mechanism arranged at one side of the swing arm mechanism, and a suction nozzle installing mechanism arranged at the other side of the swing arm mechanism. The swing arm mechanism has a detachable state and an installation state which can be switched. The suction nozzle taking mechanism comprises a first driving piece and a clamping assembly used for clamping a suction nozzle. When the swing arm mechanism is in the dismounting state, the clamping assembly can clamp the suction nozzle and move under the driving of the first driving part so as to dismount the suction nozzle from the swing arm mechanism, and the suction nozzle mounting mechanism comprises a second driving part and a mounting block with a first mounting position; when the swing arm mechanism is in the installation state, the second driving piece can drive the installation block to move so that the suction nozzle at the first installation position can be installed on the swing arm mechanism. According to the technical scheme provided by the utility model, the technical problem of low production efficiency caused by manual replacement of the suction nozzle can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a nozzle replacement device and a semiconductor processing equipment. Background Art

[0002] In the process of semiconductor production, the swing arm mechanism of semiconductor processing equipment is required to adsorb and transport materials, and the adsorption of materials is mainly completed by the nozzles of the swing arm mechanism. However, nozzles usually have a certain service life and need to be replaced regularly. At present, manual replacement of nozzles is mainly adopted, which will affect production efficiency.

[0003] Therefore, it is necessary to provide a new nozzle replacement device and semiconductor processing equipment to solve the above technical problems. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide a nozzle replacement device and a semiconductor processing equipment, aiming at solving the technical problem of low production efficiency caused by manual replacement of nozzles in the prior art.

[0005] To achieve the above purpose, a nozzle replacement device proposed by the utility model includes:

[0006] A swing arm mechanism, which has a disassembly state and an installation state, and the swing arm mechanism can switch between the disassembly state and the installation state;

[0007] A nozzle picking mechanism, which is arranged on one side of the swing arm mechanism. The nozzle picking mechanism includes a first driving member and a clamping assembly for clamping the nozzle. When the swing arm mechanism is in the disassembly state, the clamping assembly can clamp the nozzle and move under the drive of the first driving member to remove the nozzle from the swing arm mechanism;

[0008] A nozzle installing mechanism, which is arranged on the other side of the swing arm mechanism. The nozzle installing mechanism includes a second driving member and an installation block, and the installation block has a first installation position for installing the nozzle. When the swing arm mechanism is in the installation state, the second driving member can drive the installation block to move so as to install the nozzle at the first installation position on the swing arm mechanism.

[0009] In an embodiment, the nozzle picking mechanism further includes a base and a mounting plate. The mounting plate is slidably arranged on the base. The clamping assembly is arranged on the mounting plate, and the first driving member is arranged on the base;

[0010] When the swing arm mechanism is in the disassembly state, the first driving member can drive the mounting plate to slide along a first direction, and further drive the clamping assembly to move along the first direction.

[0011] In one embodiment, the clamping assembly includes a driving body and two clamping blocks spaced apart from each other on the driving body. The driving body is disposed on the mounting plate, and the driving body can drive the two clamping blocks to move towards or away from each other.

[0012] In one embodiment, the clamping assembly further includes a waste box, and the waste box is disposed below the clamping blocks.

[0013] In one embodiment, the first driving member is connected to the mounting plate through a floating joint.

[0014] In one embodiment, the nozzle mounting and sucking mechanism further includes a mounting seat. The second driving member is disposed on the mounting seat, and the mounting block is connected to the second driving member;

[0015] When the swing arm mechanism is in the installed state, the second driving member can drive the mounting block to move along a second direction.

[0016] In one embodiment, the mounting positions include a plurality of mounting grooves, and the plurality of mounting grooves are arranged in a rectangular array on the mounting block;

[0017] The mounting seat includes a first seat body and a second seat body. The first seat body includes a first slide rail, a first slider slidably disposed along a first direction on the first slide rail, and a first driving unit capable of driving the first slider to slide. The second seat body includes a second slide rail disposed on the first slider, a second slider slidably disposed along a third direction on the second slide rail, and a second driving unit capable of driving the second slider to slide. The second driving member is disposed on the second slider.

[0018] In one embodiment, the swing arm mechanism includes a base, a third driving member disposed on the base, and a swing arm body disposed on the third driving member. The swing arm body is provided with a second mounting position for mounting a nozzle; the third driving member can drive the swing arm body to rotate so that the second mounting position faces the nozzle removing and mounting mechanism, realizing the switching of the swing arm mechanism between the disassembled state and the installed state.

[0019] In one embodiment, a detection sensor for detecting the position of the swing arm body is disposed on the base.

[0020] In addition, the present invention further provides a semiconductor processing apparatus, and the semiconductor processing apparatus includes the nozzle replacement device as described above.

[0021] The technical solution of the present utility model disassembles the suction nozzle from the swing arm mechanism when the swing arm mechanism is in the disassembly state through the suction nozzle removal mechanism, and installs the suction nozzle on the swing arm mechanism when the swing arm mechanism is in the installation state through the suction nozzle installation mechanism, which can complete the replacement of the suction nozzle, thereby improving the production efficiency and the automation degree of the semiconductor processing equipment. In this embodiment, the clamping assembly can clamp the suction nozzle when the swing arm mechanism is in the disassembly state and move under the drive of the first driving member to remove the suction nozzle to be replaced on the swing arm mechanism; the mounting block has a first mounting block for installing the suction nozzle, and the second driving member can drive the mounting block to move to install the suction nozzle to be installed at the first mounting position (which refers to a new suction nozzle in this embodiment) on the swing arm mechanism. Among them, the process of the suction nozzle removal mechanism removing the suction nozzle is as follows: when the swing arm mechanism switches to the disassembly state, the first driving member drives the clamping assembly to move towards the swing arm mechanism to the clamping position, then the clamping assembly clamps the suction nozzle, and finally the first driving member drives the clamping assembly to move away from the swing arm mechanism. Thus, the suction nozzle to be replaced on the swing arm mechanism can be removed; the process of the suction nozzle installation mechanism installing the suction nozzle is as follows: when the swing arm mechanism switches to the installation state, the second driving member drives the mounting block to move towards the swing arm mechanism until the suction nozzle to be installed at the first mounting position of the mounting block is installed on the swing arm mechanism. Thus, the suction nozzle to be installed can be installed on the swing arm mechanism. By adopting the suction nozzle removal mechanism and the suction nozzle installation mechanism, the suction nozzle replacement device can complete the replacement of the suction nozzle on the swing arm mechanism. It can replace manual labor to complete the replacement of the suction nozzle, and when replacing the suction nozzle, there is no need to shut down the semiconductor processing equipment, which can improve the production efficiency. At the same time, using a machine to replace manual labor to complete the suction nozzle replacement work can improve the automation degree of the semiconductor processing equipment. This suction nozzle replacement device is applied to the field of semiconductor processing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0023] Figure 1 It is a schematic structural diagram of the suction nozzle replacement device in the embodiment provided by the present utility model when the swing arm mechanism is in the disassembly state;

[0024] Figure 2 It is a schematic structural diagram of the suction nozzle replacement device in the embodiment provided by the present utility model when the swing arm mechanism is in the installation state;

[0025] Figure 3Structural schematic diagram of the pick-up nozzle mechanism in the embodiment provided by the present utility model;

[0026] Figure 4 Structural schematic diagram of the nozzle loading mechanism in the embodiment provided by the present utility model;

[0027] Figure 5 Structural schematic diagram of the swing arm mechanism in the embodiment provided by the present utility model.

[0028] Explanation of the reference numerals in the drawings:

[0029] 100, swing arm mechanism; 110, base; 111, detection sensor; 120, third driving member; 130, swing arm body; 131, second mounting position; 200, pick-up nozzle mechanism; 210, first driving member; 211, floating joint; 220, clamping assembly; 221, driving body; 222, clamping block; 223, waste box; 230, base; 240, mounting plate; 250, control assembly; 251, first solenoid valve; 252, second solenoid valve; 300, nozzle loading mechanism; 310, second driving member; 320, mounting block; 321, first mounting position; 322, mounting groove; 330, mounting seat; 331, first seat body; 3311, first slide rail; 3312, first slider; 332, second seat body; 3321, second slide rail; 3322, second slider.

[0030] The realization of the object, functional features and advantages of the present utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0032] It should be noted that all the directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0033] In addition, if the embodiments of the present utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where both A and B are satisfied simultaneously.

[0034] In addition, the technical solutions between the various embodiments of the present utility model can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0035] In the semiconductor production process, it is necessary for the swing arm mechanism of semiconductor processing equipment to adsorb and transport materials. Among them, the adsorption of materials is mainly completed by the suction nozzle of the swing arm mechanism. However, since the suction nozzle has a certain service life, after the suction nozzle adsorbs materials a certain number of times, it is necessary to manually replace the suction nozzle. When replacing the suction nozzle, the researchers found that when manually replacing the suction nozzle, in order to ensure the safety of construction personnel, the semiconductor processing equipment needs to be shut down each time, and then the suction nozzle of the swing arm mechanism is replaced. After the replacement is completed, the semiconductor processing equipment is restarted. This will affect production efficiency and is not conducive to the automated production of semiconductors.

[0036] The present utility model provides a suction nozzle replacement device and a semiconductor processing equipment, aiming to solve the technical problem of low production efficiency caused by manually replacing the suction nozzle in the prior art.

[0037] Please refer to Figure 1 and Figure 2, in an embodiment of the present utility model, the nozzle replacement device includes a swing arm mechanism 100, a nozzle picking mechanism 200, and a nozzle installing mechanism 300. The swing arm mechanism 100 has a disassembly state and an installation state, and the swing arm mechanism 100 can switch between the disassembly state and the installation state. The nozzle picking mechanism 200 is arranged on one side of the swing arm mechanism 100. The nozzle picking mechanism 200 includes a first driving member 210 and a clamping assembly 220 for clamping the nozzle. When the swing arm mechanism 100 is in the disassembly state, the clamping assembly 220 can clamp the nozzle and move under the drive of the first driving member 210 to remove the nozzle from the swing arm mechanism 100. The nozzle installing mechanism 300 is arranged on the other side of the swing arm mechanism 100. The nozzle installing mechanism 300 includes a second driving member 310 and an installation block 320. The installation block 320 has a first installation position 321 for installing the nozzle. When the swing arm mechanism 100 is in the installation state, the second driving member 310 can drive the installation block 320 to move to install the nozzle at the first installation position 321 on the swing arm mechanism 100.

[0038] The technical solution of the present utility model disassembles the suction nozzle from the swing arm mechanism 100 by the suction nozzle removal mechanism 200 when the swing arm mechanism 100 is in the disassembly state, and installs the suction nozzle on the swing arm mechanism 100 by the suction nozzle installation mechanism 300 when the swing arm mechanism 100 is in the installation state, so as to complete the replacement of the suction nozzle, thereby improving the production efficiency and the automation degree of the semiconductor processing equipment. In this embodiment, the clamping assembly 220 can clamp the suction nozzle when the swing arm mechanism 100 is in the disassembly state and move under the drive of the first driving member 210 to remove the suction nozzle to be replaced on the swing arm mechanism 100; the mounting block 320 has a first mounting block 320 for installing the suction nozzle, and the second driving member 310 can drive the mounting block 320 to move so as to install the suction nozzle to be installed at the first mounting position 321 (which refers to a new suction nozzle in this embodiment) on the swing arm mechanism 100. Among them, the process of the suction nozzle removal mechanism 200 removing the suction nozzle is as follows: when the swing arm mechanism 100 switches to the disassembly state, the first driving member 210 drives the clamping assembly 220 to move towards the swing arm mechanism 100 to the clamping position, then the clamping assembly 220 clamps the suction nozzle, and finally the first driving member 210 drives the clamping assembly 220 to move away from the swing arm mechanism 100. Thus, the suction nozzle to be replaced on the swing arm mechanism 100 can be removed; the process of the suction nozzle installation mechanism 300 installing the suction nozzle is as follows: when the swing arm mechanism 100 switches to the installation state, the second driving member 310 drives the mounting block 320 to move towards the swing arm mechanism 100 until the suction nozzle to be installed at the first mounting position 321 of the mounting block 320 is installed on the swing arm mechanism 100. Thus, the suction nozzle to be installed can be installed on the swing arm mechanism 100. By adopting the suction nozzle removal mechanism 200 and the suction nozzle installation mechanism 300, the suction nozzle replacement device can complete the replacement of the suction nozzle on the swing arm mechanism 100. It can replace manual work to complete the replacement of the suction nozzle, and when replacing the suction nozzle, there is no need to turn off the semiconductor processing equipment, which can improve the production efficiency. At the same time, using a machine to replace manual work to complete the suction nozzle replacement work can improve the automation degree of the semiconductor processing equipment. The suction nozzle replacement device is applied to the field of semiconductor processing technology.

[0039] It should be noted that the semiconductor processing equipment can be a sorter. When the swing arm mechanism 100 adsorbs and transports materials (the materials here include but are not limited to grains, wafers, etc.), it is necessary to switch between multiple states. By setting the nozzle picking mechanism 200 and the nozzle loading mechanism 300, the nozzle on the swing arm mechanism 100 can be replaced when the swing arm mechanism 100 is in a certain state, without affecting the adsorption and transportation of materials by the swing arm mechanism 100. That is to say, when the nozzle is replaced, the sorter work of the semiconductor processing equipment will not be affected. That is, when the nozzle is replaced, the semiconductor processing equipment can still operate normally. Thus, the technical problem of the semiconductor processing equipment being shut down due to manual nozzle replacement can be avoided, and the production efficiency can be improved. For the swing arm mechanism 100, the nozzles on the swing arm mechanism 100 are usually installed in a sleeved and clamped form (similar to sleeving and clamping an elastic block made of rubber on a convex block with an annular protrusion). Therefore, by inserting and pulling out the nozzle through the nozzle picking mechanism 200 and the nozzle loading mechanism 300, the replacement of the nozzle can be completed.

[0040] Please refer to Figure 3 , in an embodiment of the present utility model, the nozzle picking mechanism 200 further includes a base 230 and a mounting plate 240. The mounting plate 240 is slidably disposed on the base 230. The clamping assembly 220 is disposed on the mounting plate 240, and the first driving member 210 is disposed on the base 230. When the swing arm mechanism 100 is in the disassembly state, the first driving member 210 can drive the mounting plate 240 to slide in the first direction, and further drive the clamping assembly 220 to move in the first direction, where the first direction is the direction indicated by X in Figure 1 . In this embodiment, the first driving member 210 can drive the mounting plate 240 to slide in the first direction, and further drive the clamping assembly 220 to move in the first direction. In order to ensure the stability of the first driving member 210 driving the clamping assembly 220 to move in the first direction, the mounting plate 240 is slidably mounted on the base 230 by means of a slider and a slide rail. In addition, the mounting plate 240 can also be slidably mounted on the base 230 by means of a slider and a chute. In a specific embodiment, the first driving member 210 can be a driving cylinder, a driving oil cylinder, etc.

[0041] Please refer to Figure 3, in an embodiment of the present utility model, the clamping assembly 220 includes a driving body 221 and two clamping blocks 222 spaced apart from each other on the driving body 221. The driving body 221 is disposed on the mounting plate 240, and the driving body 221 can drive the two clamping blocks 222 to move in directions approaching or separating from each other. Specifically, when the first driving member 210 drives the clamping assembly 220 to move to the clamping position, the driving body 221 is controlled to drive the two clamping blocks 222 to move in the direction approaching each other, so as to clamp the nozzle to be replaced on the swing arm mechanism 100. In a specific embodiment, the driving body 221 may be a bidirectional driving cylinder, and clamping curved surfaces matching the nozzle to be replaced are provided on the sides of the two clamping blocks 222 facing each other.

[0042] In an embodiment of the present utility model, the clamping assembly 220 further includes a waste box 223, and the waste box 223 is disposed below the clamping blocks 222. In this embodiment, the waste box 223 is used to recycle the nozzle to be replaced. Specifically, after the nozzle taking mechanism 200 removes the nozzle to be replaced on the swing arm mechanism 100, the driving body 221 is controlled to drive the two clamping blocks 222 to move in the direction separating from each other, so as to release the nozzle to be replaced. At this time, under the action of its own gravity, the nozzle to be replaced will fall into the waste box 223.

[0043] In an embodiment of the present utility model, the first driving member 210 is connected to the mounting plate 240 through a floating joint 211. Specifically, the floating joint 211 is a connecting member that can allow the two connected components to perform axial, lateral or angular displacement to a certain extent. By connecting the first driving member 210 and the mounting plate 240 through the floating joint 211, the relative positions of the first driving member 210 and the mounting plate 240 can deviate to a certain extent, so as to avoid the situation of jamming when the first driving member 210 drives the mounting plate 240 to slide.

[0044] In an embodiment of the present utility model, the nozzle taking mechanism 200 further includes a control assembly 250, and the control assembly 250 includes a first solenoid valve 251 electrically connected to the first driving member 210 and a second solenoid valve 252 electrically connected to the driving body 221. Among them, the first solenoid valve 251 is used to control the operation of the first driving member 210, and the second solenoid valve 252 is used to control the operation of the driving body 221.

[0045] Please refer to Figure 4 , in an embodiment of the present utility model, the nozzle loading mechanism 300 further includes a mounting seat 330, the second driving member 310 is disposed on the mounting seat 330, and the mounting block 320 is connected to the second driving member 310; when the swing arm mechanism 100 is in the mounting state, the second driving member 310 can drive the mounting block 320 to move along a second direction, where the second direction refers to Figure 1The direction indicated by Y in the figure. In this embodiment, the second driving member 310 is used to drive the mounting block 320 to move in the second direction. In a specific embodiment, the second driving member 310 may be a driving cylinder, a driving oil cylinder, etc.

[0046] In an embodiment of the present utility model, the mounting positions include a plurality of mounting grooves 322, and the plurality of mounting grooves 322 are arranged in a rectangular array on the mounting block 320; the mounting seat 330 includes a first seat body 331 and a second seat body 332. The first seat body 331 includes a first sliding rail 3311, a first sliding block 3312 slidably arranged along the first direction on the first sliding rail 3311, and a first driving unit capable of driving the first sliding block 3312 to slide. The second seat body 332 includes a second sliding rail 3321 arranged on the first sliding block 3312, a second sliding block 3322 slidably arranged along the third direction on the second sliding rail 3321, and a second driving unit capable of driving the second sliding block 3322 to slide. The second driving member 310 is arranged on the second sliding block 3322, wherein the third direction is Figure 1 The direction indicated by Z in the figure. Specifically, by providing a plurality of mounting grooves 322 on the mounting block 320, it can enable the nozzle mounting and sucking mechanism 300 to mount the nozzles to be installed on the swing arm mechanism 100 multiple times, so as to reduce the frequency of manually mounting the nozzles to be installed on the mounting block 320. At the same time, when mounting the nozzles to be installed on the swing arm mechanism 100, it is necessary to adjust the position of the mounting block 320 in the first direction and the third direction through the first seat body 331 and the second seat body 332 to ensure that the nozzles to be installed are aligned with the positions on the swing arm mechanism 100 for nozzle installation.

[0047] Please refer to Figure 5 , in an embodiment of the present utility model, the swing arm mechanism 100 includes a base 110, a third driving member 120 arranged on the base 110, and a swing arm body 130 arranged on the third driving member 120. The swing arm body 130 is provided with a second mounting position 131 for nozzle installation; the third driving member 120 can drive the swing arm body 130 to rotate so that the second mounting position 131 faces the nozzle taking and sucking mechanism 200 or the nozzle mounting and sucking mechanism 300, realizing the switching of the swing arm mechanism 100 between the disassembly state and the installation state. Specifically, controlling the third driving member 120 can drive the swing arm body 130 to rotate so that the second mounting position 131 faces the nozzle taking and sucking mechanism 200 or the nozzle mounting and sucking mechanism 300, realizing the switching of the swing arm mechanism 100 between the disassembly state and the installation state. In a specific embodiment, the swing arm body 130 includes a first connecting portion and second connecting portions respectively arranged at both ends of the first connecting portion, and the second mounting positions 131 are arranged on each second connecting portion. When the swing arm mechanism 100 is in the disassembly state, the two second mounting positions 131 are arranged at intervals along the first direction. When the swing arm mechanism 100 is in the installation state, the two second mounting positions 131 are arranged at intervals along the second direction.

[0048] In an embodiment of the present utility model, a detection sensor 111 for detecting the position of the swing arm body 130 is provided on the base 110. Specifically, the detection sensor 111 is used to detect the position of the swing arm body 130 to confirm the state of the swing arm mechanism 100, and then control the operation of the pick-up nozzle mechanism 200 and the nozzle loading mechanism 300 through an external controller.

[0049] It should be noted that in this embodiment, the first direction is not specifically defined as a straight line direction. That is to say, the first driving member 210 can also be a driving motor. When the swing arm mechanism 100 is in a disassembled state, the first driving member 210 can drive the mounting plate 240 to rotate, and then drive the clamping assembly 220 to rotate to one side of the second mounting position 131 of the swing arm mechanism 100. At this time, the clamping assembly 220 can clamp the nozzle, and then rotate in the reverse direction under the drive of the first driving member 210, so as to remove the nozzle to be replaced at the second mounting position 131 of the swing arm mechanism 100. Similarly, the second direction is not specifically defined as a straight line direction. Specifically, when designing the nozzle replacement device, researchers can design the pick-up nozzle mechanism 200 and the nozzle loading mechanism 300 into different driving forms according to actual use requirements to avoid interference between the nozzle replacement device and other mechanisms of the semiconductor processing equipment.

[0050] The present utility model also proposes a semiconductor processing equipment, which includes the above-mentioned nozzle replacement device. The specific structure of the nozzle replacement device refers to the above embodiment. Since the semiconductor processing equipment adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one.

[0051] The above is only an exemplary embodiment of the present utility model, and does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. A nozzle replacement device, characterized in that: include: A swing arm mechanism, wherein the swing arm mechanism has a disassembly state and an installation state, and the swing arm mechanism can switch between the disassembly state and the installation state; A suction nozzle removal mechanism, the suction nozzle removal mechanism is arranged on one side of the swing arm mechanism, the suction nozzle removal mechanism comprises a first driving member and a clamping assembly for clamping the suction nozzle, when the swing arm mechanism is in a disassembled state, the clamping assembly can clamp the suction nozzle and move under the drive of the first driving member to remove the suction nozzle from the swing arm mechanism; A suction nozzle mounting mechanism, wherein the suction nozzle mounting mechanism is arranged on the other side of the swing arm mechanism, and the suction nozzle mounting mechanism comprises a second driving member and a mounting block, wherein the mounting block has a first mounting position for mounting the suction nozzle; when the swing arm mechanism is in the mounting state, the second driving member can drive the mounting block to move so as to mount the suction nozzle at the first mounting position on the swing arm mechanism.

2. The nozzle replacement device according to claim 1, characterized in that: The nozzle removal mechanism further includes a base and a mounting plate, wherein the mounting plate is slidably disposed on the base, the clamping assembly is disposed on the mounting plate, and the first driving member is disposed on the base; When the swing arm mechanism is in a disassembled state, the first driving member can drive the mounting plate to slide along a first direction, thereby driving the clamping assembly to move along the first direction.

3. The nozzle replacement device according to claim 2, characterized in that: The clamping assembly comprises a driving body and two clamping blocks spaced apart from each other on the driving body. The driving body is arranged on the mounting plate, and the driving body can drive the two clamping blocks to move towards or away from each other.

4. The nozzle replacement device according to claim 3, characterized in that: The clamping assembly also includes a waste box, which is arranged below the clamping block.

5. The nozzle replacement device according to claim 2, characterized in that: The first driving member is connected to the mounting plate via a floating joint.

6. The nozzle replacement device according to claim 1, characterized in that: The nozzle mounting mechanism further comprises a mounting seat, the second driving member is arranged on the mounting seat, and the mounting block is connected to the second driving member; When the swing arm mechanism is in the installation state, the second driving member can drive the installation block to move along the second direction.

7. The nozzle replacement device according to claim 6, characterized in that: The mounting position includes a plurality of mounting grooves, and the plurality of mounting grooves are arranged in a rectangular array on the mounting block; The mounting seat includes a first seat body and a second seat body, the first seat body includes a first slide rail, a first slider slidably arranged on the first slide rail along a first direction, and a first driving unit capable of driving the first slider to slide, the second seat body includes a second slide rail arranged on the first slider, a second slider slidably arranged on the second slide rail along a third direction, and a second driving unit capable of driving the second slider to slide, and the second driving member is arranged on the second slider.

8. The nozzle replacement device according to any one of claims 1 to 7, characterized in that: The swing arm mechanism includes a base, a third driving member arranged on the base and a swing arm body arranged on the third driving member, and the swing arm body is provided with a second mounting position for installing a suction nozzle; the third driving member can drive the swing arm body to rotate so that the second mounting position is toward the suction nozzle removal mechanism or the suction nozzle installation mechanism, thereby realizing the switching of the swing arm mechanism between the disassembly state and the installation state.

9. The nozzle replacement device according to claim 8, characterized in that: A detection sensor for detecting the position of the swing arm body is arranged on the base.

10. A semiconductor processing equipment, characterized in that: It comprises a nozzle replacement device as described in claims 1 to 9.

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