Online cleaning and electroplating integrated equipment for bonding wire
By designing an integrated online cleaning and plating equipment, using ultrasonic cleaner and uniform electroplating solution flow technology, the problems of unstable electroplating solution flow and impurities on the bonded wire surface are solved, and an efficient and stable bonded wire plating process is achieved.
Patent Information
- Application Number
- CN202422259658.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-09-14
AI Technical Summary
In the prior art, the unstable flow of the electroplating solution leads to the height of the liquid level, affecting the electroplating effect of the bonding wire; at the same time, the bonding wire is easily contaminated with impurities during the transmission process, affecting the electroplating effect, and traditional equipment is inefficient and prone to secondary contamination.
An online cleaning and electroplating integrated equipment is designed, including a wire module, a cleaning module and an electroplating module. The cleaning module uses an ultrasonic cleaner to remove impurities on the surface of the bond wire. The electroplating module ensures that the plating liquid flow rate is uniform and thus stabilizes the liquid level by setting the liquid inlet channels in the first and second areas in the electroplating channel.
The bonding wire is realized in-line continuous cleaning and electroplating, ensuring the cleanliness of the bonding wire surface, improving production efficiency, and stabilizing the plating liquid level through uniform electroplating liquid flow, improving the plating quality.
Smart Images
Figure CN223047627U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to an on-line cleaning and electroplating integrated device for bonding wires. Background Art
[0002] Although the chips obtained after the completion of semiconductor integrated circuit manufacturing already have specific functions, to realize these functions, they must be connected to external electronic components. A semiconductor integrated circuit chip needs to go through a bonding process with a package body, and finally a chip package is obtained, so that it can be connected to external electronic components through the pins of the package. In the bonding process between the chip and the package body, bonding wires are used to electrically connect the pads on the chip and the pins of the package body. Therefore, the bonding wire is an essential material for realizing the functions of the chip.
[0003] Currently, when electroplating bonding wires, generally, an electroplating solution is set in an electroplating bath, and the bonding wire passes through the electroplating bath in a way that one end feeds the material and the other end winds up, and is immersed in the electroplating solution, so as to realize synchronous electroplating of the part passing through the electroplating bath during the continuous feeding and winding of the bonding wire.
[0004] However, in the actual production process, the following technical problems exist in the prior art:
[0005] 1. When replenishing the electroplating solution in the electroplating bath, since the flow rate of the electroplating solution is large near the overflow port and slow far from the overflow port, the flow of the electroplating solution in the electroplating bath is unstable, which easily leads to the instability of the overall liquid level height in the electroplating bath and affects the electroplating effect of the bonding wire;
[0006] 2. During the continuous wire feeding of the bonding wire, impurities are easily adhered to its surface, affecting the electroplating effect. Traditional equipment usually uses an independent cleaning device to clean the bonding wire and then transfers it to the electroplating equipment. In this way, not only is the efficiency low, but also the probability of secondary pollution during the transfer of the bonding wire is high. Summary of the Invention
[0007] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an improved on-line cleaning and electroplating integrated device for bonding wires.
[0008] To solve the above technical problems, the technical solutions adopted by the utility model are as follows:
[0009] An on-line cleaning and electroplating integrated device for bonding wires, which includes a wire guiding module for assisting the bonding wires to be transported along the horizontal direction, a cleaning module and an electroplating module sequentially arranged on the bonding wire transport path. The cleaning module includes a cleaning tank; the electroplating module includes an electroplating tank, a liquid supply pipe, and a reflux pipe. An inlet liquid chamber connected to the liquid supply pipe is formed in the electroplating tank, and an electroplating channel located above the inlet liquid chamber and having an overflow port is provided. The electroplating channel is connected to the cleaning tank, and the bonding wire passes through the cleaning tank and the electroplating channel in sequence; the bottom of the electroplating channel is divided into a first area away from the overflow port and a second area close to the overflow port. A first liquid inlet channel and a second liquid inlet channel connecting the electroplating channel and the inlet liquid chamber are correspondingly formed in the first area and the second area, and the flow rate of the electroplating liquid upward through the first area in the inlet liquid chamber is equal to the flow rate upward through the second area.
[0010] According to a specific embodiment and a preferred aspect of the present utility model, a cleaning liquid is provided in the cleaning tank, and the cleaning module further includes an ultrasonic cleaner arranged in the cleaning tank. Here, by using the ultrasonic cleaner, impurities on the surface of the bonding wire can be effectively removed.
[0011] Preferably, the bottom of the cleaning tank extends obliquely up and down. The bottom of the cleaning tank is provided with a liquid inlet hole and a liquid discharge hole, and the liquid discharge hole is at the lowest position of the bottom of the cleaning tank, and the liquid inlet hole is higher than the liquid discharge hole. Here, it is convenient for the cleaning liquid to be discharged.
[0012] According to another specific embodiment and a preferred aspect of the present utility model, the electroplating tank includes an outer tank body and an inner tank body arranged in the outer tank body and forming an electroplating channel and an inlet liquid chamber; the reflux pipe is connected to the outer tank body. Here, the electroplating liquid in the inner tank body overflows and enters the outer tank body, and is refluxed through the reflux pipe.
[0013] Preferably, the bottom of the outer tank body extends obliquely up and down, and the connection of the reflux pipe to the outer tank body is located at the lowest position of the bottom of the outer tank body. Here, the electroplating liquid in the outer tank body can automatically converge downward and be discharged from the reflux pipe.
[0014] Preferably, the electroplating channel, the inlet liquid chamber, and the liquid supply pipe form an electroplating group, and there are multiple electroplating groups arranged side by side at intervals along the direction perpendicular to the bonding wire transport direction; and / or, the height of the electroplating channel is h1, and the height of the inlet liquid chamber is h2, where 1.5h1 ≤ h2 ≤ 2h1. Here, it is possible to synchronously electroplate multiple bonding wires with the same process or different processes, effectively improving the electroplating process; at the same time, based on the layout of the height of the channel and the cavity in this application, while forming the best buffer for the replenishment kinetic energy of the electroplating liquid in the cavity, ensuring the replenishment rate of the electroplating liquid in the channel to ensure the electroplating quality.
[0015] Preferably, the inner tank body includes a horizontally arranged tank bottom plate, a plurality of side plates arranged side by side and spaced apart on the tank bottom plate along a direction perpendicular to the wire transmission direction, end plates arranged on the tank bottom plate and respectively connected to both ends of the plurality of side plates, and flow combing plates correspondingly connected between adjacent side plates and end plates to form a first liquid inlet channel and a second liquid inlet channel, wherein a liquid inlet cavity is formed between every two adjacent side plates, the tank bottom plate, the end plates, and the flow combing plates; an electroplating channel is formed between every two adjacent side plates, the end plates, and the flow combing plates. Herein, the structure is simple, facilitating installation and implementation.
[0016] Specifically, a plurality of overlapping grooves recessed inward from the inner wall are formed on each end plate, each flow combing plate is correspondingly overlapped in the overlapping grooves from opposite sides, and the periphery of the flow combing plate is respectively attached to the corresponding side plate and the side wall of the overlapping groove; an overflow port communicating with each electroplating channel is formed on each end plate, and a baffle for adjusting the size of the overflow port up and down is arranged on the outer wall of each end plate, and each bonding wire passes through the corresponding electroplating channel from the overflow port; there are two second regions, which are symmetrically arranged on opposite sides of the first region in the wire transmission direction. Herein, the stability of the flow combing plate is improved, avoiding shaking when bearing the kinetic energy of electroplating solution replenishment; by adjusting the size of the overflow port, it is beneficial to control the rate of electroplating solution oozing out from the overflow port to precisely control the liquid level height.
[0017] According to another specific implementation manner and preferred aspect of the present invention, the liquid supply pipeline is communicated with the bottom of the liquid inlet cavity, and in the orthographic projection on the horizontal plane, the connection part of the liquid supply pipeline and the liquid inlet cavity is located in the middle of the first region.
[0018] In addition, the inner diameters of the first liquid inlet channel and the second liquid inlet channel are equal; a plurality of first liquid inlet channels are distributed in the first region, and a plurality of second liquid inlet channels are distributed in the second region, wherein the plurality of first liquid inlet channels are divided into a plurality of first channel groups, the plurality of second liquid inlet channels are divided into a plurality of second channel groups, and the plurality of first liquid inlet channels and the plurality of second liquid inlet channels in each first channel group and second channel group are respectively spaced apart along a direction perpendicular to the wire transmission direction; the distance between adjacent first channel groups is less than the distance between adjacent second channel groups. The flow rates of different electroplating solutions are controlled by using the density of the liquid inlet channels in each region.
[0019] Due to the implementation of the above technical solutions, the present invention has the following advantages compared with the prior art:
[0020] When replenishing the electroplating solution in the electroplating bath in the prior art, due to the high flow rate of the electroplating solution near the overflow port and the slow flow rate of the electroplating solution far from the overflow port, the flow of the electroplating solution in the electroplating bath is unstable, which easily leads to the instability of the overall liquid level height in the electroplating bath and affects the electroplating effect of the bonding wire. During the continuous wire release of the bonding wire, impurities are easily contaminated on its surface, affecting the electroplating effect. Traditional equipment usually uses an independent cleaning device to clean the bonding wire and then transfer it to the electroplating equipment. In this way, not only is the efficiency low, but the probability of secondary pollution during the transfer of the bonding wire is high. In this application, the structure of the on-line cleaning and electroplating integrated equipment for bonding wires is designed as a whole, cleverly solving the deficiencies and defects of the prior art. After adopting this cleaning and electroplating integrated equipment, the bonding wire is assisted by a wire module to be transmitted horizontally and sequentially pass through the cleaning module and the electroplating module. Among them, the bonding wire first passes through the cleaning tank for surface cleaning, and then the cleaned bonding wire passes through the electroplating channel. The electroplating solution is supplied to the liquid inlet cavity through the liquid supply pipe. The electroplating solution passes upward through the first liquid inlet channels and the second liquid inlet channels in the first area and the second area and enters the electroplating channel, so that the flow rate of the electroplating solution far from the overflow port is equal to the flow rate of the electroplating solution near the overflow port. Therefore, compared with the prior art, on the one hand, the present invention realizes on-line continuous cleaning and electroplating of the bonding wire, effectively ensuring the cleanliness of the bonding wire surface and having high production efficiency; on the other hand, based on the distribution of the first and second liquid inlet channels, the uniform flow of the electroplating solution is realized, ensuring the stability of the electroplating solution level in the electroplating bath and effectively improving the electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 FIG. is a schematic perspective view (partially omitted) of the on-line cleaning and electroplating integrated equipment for bonding wires of the present invention;
[0022] Figure 2 FIG. is a top view of the on-line cleaning and electroplating integrated equipment for bonding wires of the present invention;
[0023] Figure 3 FIG. is a schematic perspective view of the inner tank body of the present invention;
[0024] Figure 4 FIG. is a top view of the inner tank body of the present invention;
[0025] Figure 5 is Figure 4 the cross-sectional view taken along the line A-A in
[0026] Figure 6 is Figure 4 the cross-sectional view taken along the line B-B in
[0027] Wherein: 1. Cleaning module; 10. Cleaning tank; 101. Liquid inlet hole; 102. Liquid discharge hole;
[0028] 2. Electroplating module; 20. Electroplating tank; q0. Liquid inlet chamber; t0. Electroplating channel; q1. First region; t1. First liquid inlet channel; q2. Second region; t2. Second liquid inlet channel; 200. Outer tank body; 201. Inner tank body; a0. Tank bottom plate; a1. Side plate; a2. End plate; a20. Lapping groove; a21. Overflow port; a22. Baffle; a3. Flow combing plate; 21. Liquid supply pipeline
[0029] 3. Conductor module; 30. Conductor wheel Detailed implementation manners
[0030] To make the above objects, features, and advantages of the present application more apparent and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below
[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application
[0032] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined
[0033] In the present application, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances
[0034] In this application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0035] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.
[0036] As Figures 1 to 6 shown, the on-line cleaning and electroplating integrated equipment for bonding wires in this embodiment includes a cleaning module 1, an electroplating module 2, and a wire guiding module 3 for assisting the bonding wires to be transported in the horizontal direction, wherein the cleaning module 1 and the electroplating module 2 are sequentially arranged on the bonding wire transport path.
[0037] Specifically, the cleaning module 1 includes a cleaning tank 10 and an ultrasonic cleaner disposed in the cleaning tank 10. The cleaning tank 10 is provided with a cleaning liquid, such as water. The bonding wire passes through the cleaning tank 10 and is immersed in the cleaning liquid, and the ultrasonic cleaner performs ultrasonic cleaning on the bonding wire. The ultrasonic cleaner in this embodiment is a commercially available product and will not be elaborated here.
[0038] For the convenience of implementation, the bottom of the cleaning tank 10 extends obliquely up and down. The bottom of the cleaning tank 10 is provided with a liquid inlet hole 101 and a liquid discharge hole 102, wherein the liquid discharge hole 102 is at the lowest position of the bottom of the cleaning tank, and the liquid inlet hole 101 is higher than the liquid discharge hole 102.
[0039] In this example, the electroplating module 2 includes an electroplating tank 20, a liquid supply pipe 21, and a reflux pipe. An inlet liquid chamber q0 communicating with the liquid supply pipe is formed in the electroplating tank 20, and an electroplating channel t0 located above the inlet liquid chamber q0 and having an overflow port is provided. The electroplating channel t0 is communicated with the cleaning tank 10, and the bonding wire sequentially passes through the cleaning tank 10 and the electroplating channel t0. A plurality of inlet channels t0 communicating with the inlet liquid chamber q0 are further formed at the bottom of the electroplating channel t0. The bottom of the electroplating channel t0 is divided into a first region q1 far from the overflow port and a second region q2 close to the overflow port. A first inlet channel t1 and a second inlet channel t2 communicating the electroplating channel t0 and the inlet liquid chamber q0 are correspondingly formed in the first region q1 and the second region q2. The flow rate of the electroplating solution in the inlet liquid chamber q0 flowing upward through the first region q1 is equal to the flow rate flowing upward through the second region q2.
[0040] To further improve the efficiency, the electroplating channel t0, the inlet liquid chamber q0, and the liquid supply pipe 21 form an electroplating group. There are four electroplating groups and they are arranged side by side at intervals along the direction perpendicular to the transmission direction of the bonding wire. At the same time, the cleaning module 1 and the electroplating module 2 can also form a group. In this embodiment, two groups are arranged side by side. In this way, electroplating of eight bonding wires can be realized synchronously. And to meet the process requirements, in each group, two electroplating modules 2 can be provided and arranged continuously. That is, after the bonding wire undergoes a cleaning process, two electroplating processes are carried out in sequence.
[0041] In some specific embodiments, the electroplating tank 20 includes an outer tank body 200 and an inner tank body 201 provided in the outer tank body 200 and forming the electroplating channel t0 and the inlet liquid chamber q0. The reflux pipe of this embodiment is communicated with the outer tank body 200. The bottom of the outer tank body 200 extends obliquely up and down, and the connection part of the reflux pipe and the outer tank body 200 is located at the lowest point of the bottom of the outer tank body 200.
[0042] The inner tank body 201 includes a horizontally arranged tank bottom plate a0, a plurality of side plates a1 arranged side by side at intervals along the direction perpendicular to the wire transmission direction on the tank bottom plate a0, end plates a2 provided on the tank bottom plate a0 and respectively connected to both ends of the plurality of side plates, and flow combing plates a3 correspondingly connected between adjacent side plates a1 and end plates a2 and forming the first inlet channel t1 and the second inlet channel t2. An inlet liquid chamber q0 is formed between every two adjacent side plates a1, the tank bottom plate a0, the end plates a2, and the flow combing plates a3. An electroplating channel t0 with an open top is formed between every two adjacent side plates a1, the end plates a2, and the flow combing plates a3. The anode metal plate is installed in each electroplating channel t0 and extends along the transmission direction of the bonding wire. The height of the electroplating channel t0 is h1, and the height of the inlet liquid chamber q0 is h2, where 1.5h1 ≤ h2 ≤ 2h1. In this embodiment, preferably, h2 = 1.95h1.
[0043] A plurality of lapping grooves a20 recessed inward from the inner wall are formed on each end plate a2. Each flow combing plate a3 is correspondingly lapped in the lapping grooves a20 from opposite sides, and the four sides of the flow combing plate a3 are respectively fitted with the corresponding side plates a1 and the side walls of the lapping grooves a20; an overflow port a21 communicating with each electroplating channel t0 is formed on each end plate a2, and a baffle a22 for adjusting the size of the overflow port a21 up and down is arranged on the outer wall of each end plate a2. Each bonding wire passes through the corresponding electroplating channel t0 from the overflow port a21. That is to say, in the present application, there are two overflow ports on the electroplating channel, and they are respectively located at both ends. The electroplating solution enters from the bottom and overflows from the overflow ports at both ends. At the same time, the overflow ports in the present application also serve the function of allowing the wire to pass through.
[0044] In each flow combing plate a3, there are two second regions q2, which are symmetrically arranged on opposite sides of the first region q1 in the wire transmission direction. As for the area sizes of the first region q1 and the second region q2, they are set according to the actual production conditions and are not limited in the present application; the inner diameters of the first liquid inlet channel t1 and the second liquid inlet channel t2 are equal; a plurality of first liquid inlet channels t1 are distributed in the first region q1, and a plurality of second liquid inlet channels t2 are distributed in the second region q2. Among them, the plurality of first liquid inlet channels t1 are divided into a plurality of first channel groups, and the plurality of second liquid inlet channels t2 are divided into a plurality of second channel groups. The plurality of first liquid inlet channels t1 and the plurality of second liquid inlet channels t2 in each first channel group and second channel group are respectively spaced apart along a direction perpendicular to the wire transmission direction; the distance between adjacent first channel groups is smaller than the distance between adjacent second channel groups.
[0045] Each liquid supply pipe 21 is communicated with the bottom of the corresponding liquid inlet cavity q0; in the orthographic projection on the horizontal plane, the connection part of each liquid supply pipe 21 and the liquid inlet cavity q0 is located in the middle of the first region q1.
[0046] In addition, the wire guide module 3 includes two wire guide wheel groups correspondingly arranged at the feeding end and the discharging end of each inner groove body 201. Each wire guide wheel group 4 includes a plurality of wire guide wheels 30 correspondingly connected to a plurality of electroplating channels t0 one by one. Each wire passes through the corresponding wire guide wheel 30 to enter and exit the corresponding electroplating channel t0.
[0047] In summary, after adopting the integrated cleaning and electroplating equipment, the bonding wire is assisted by the wire module to be transmitted horizontally and sequentially pass through the cleaning module and the electroplating module. Among them, the bonding wire first passes through the cleaning tank for surface cleaning, and then the cleaned bonding wire passes through the electroplating channel. The electroplating solution is supplied to the liquid inlet cavity through the liquid supply pipe. The electroplating solution passes upward through the first liquid inlet channels and the second liquid inlet channels in the first area and the second area and enters the electroplating channel, so that the flow rate of the electroplating solution far from the overflow port is equal to the flow rate of the electroplating solution close to the overflow port. Therefore, compared with the prior art, on the one hand, the present utility model realizes the on-line continuous cleaning and electroplating of the bonding wire, effectively guarantees the surface cleanliness of the bonding wire, and has high production efficiency; on the other hand, based on the distribution of the first and second liquid inlet channels, the uniform flow of the electroplating solution is realized, the stability of the electroplating solution level in the electroplating tank is ensured, and the electroplating quality is effectively improved; on the third hand, an ultrasonic cleaner is adopted to effectively remove impurities on the surface of the bonding wire; on the fourth hand, the electroplating solution in the outer tank body can automatically converge downward and be discharged through the self-return pipe; on the fifth hand, a multi-channel design is adopted, and the electroplating of multiple bonding wires can be realized synchronously with the same process or different processes, effectively improving the electroplating process; on the sixth hand, based on the layout of the channels and the cavity height of the present application, while forming the best buffer for the replenishment kinetic energy of the electroplating solution in the cavity, the replenishment rate of the electroplating solution in the channel is ensured to guarantee the electroplating quality; on the seventh hand, by adjusting the size of the overflow port, it is beneficial to control the seepage rate of the electroplating solution from the overflow port to accurately control the liquid level height.
[0048] The above has made a detailed description of the present utility model, and its purpose is to enable those skilled in this field to understand the content of the present utility model and implement it. However, the protection scope of the present utility model cannot be limited thereby. Any equivalent changes or modifications made according to the spirit and essence of the present utility model should be covered within the protection scope of the present utility model.
Claims
1. An online cleaning and electroplating integrated equipment for bonding wires, characterized in that: It includes a wire module for assisting the bonding wire to be transmitted along the horizontal direction, a cleaning module and an electroplating module which are sequentially arranged on the bonding wire transmission path, wherein the cleaning module includes a cleaning tank; the electroplating module includes an electroplating tank, a liquid supply pipe, and a reflux pipe, wherein a liquid inlet cavity connected to the liquid supply pipe and an electroplating channel located above the liquid inlet cavity and having an overflow port are formed in the electroplating tank, the electroplating channel is arranged in communication with the cleaning tank, and the bonding wire passes through the cleaning tank and the electroplating channel in sequence; the bottom of the electroplating channel is divided into a first area away from the overflow port and a second area close to the overflow port, wherein the first area and the second area are correspondingly formed with a first liquid inlet channel and a second liquid inlet channel connecting the electroplating channel and the liquid inlet cavity, and the flow rate of the electroplating liquid in the liquid inlet cavity passing through the first area upward is equal to the flow rate passing through the second area upward.
2. The online cleaning and electroplating integrated equipment for bonding wires according to claim 1, characterized in that: A cleaning liquid is arranged in the cleaning tank, and the cleaning module further comprises an ultrasonic cleaner arranged in the cleaning tank.
3. The online cleaning and electroplating integrated equipment for bonding wires according to claim 2, characterized in that: The bottom of the cleaning tank extends up and down in an inclined manner, and is provided with a liquid inlet hole and a liquid discharge hole at the bottom of the cleaning tank, wherein the liquid discharge hole is at the lowest point of the bottom of the cleaning tank, and the liquid inlet hole is higher than the liquid discharge hole.
4. The online cleaning and electroplating integrated equipment for bonding wires according to claim 1, characterized in that: The electroplating tank comprises an outer tank body, and an inner tank body which is arranged in the outer tank body and forms the electroplating channel and the liquid inlet cavity; the reflux pipe is arranged in communication with the outer tank body.
5. The online cleaning and electroplating integrated equipment for bonding wires according to claim 4, characterized in that: The bottom of the outer tank body extends obliquely up and down, and the connection point between the return pipe and the outer tank body is located at the lowest point of the bottom of the outer tank body.
6. The online cleaning and electroplating integrated equipment for bonding wires according to claim 4, characterized in that: The electroplating channel, the liquid inlet cavity, and the liquid supply pipeline constitute an electroplating group, and the electroplating group has multiple electroplating groups and is distributed side by side and spaced perpendicular to the transmission direction of the bonding wire; and / or, the height of the electroplating channel is h1, the height of the liquid inlet cavity is h2, wherein 1.5h1≤h2≤2h1.
7. The online cleaning and electroplating integrated equipment for bonding wires according to claim 6, characterized in that: The inner trough body includes a horizontally arranged trough bottom plate, a plurality of side plates arranged side by side and spaced apart on the trough bottom plate along a direction perpendicular to the wire transmission direction, an end plate arranged on the trough bottom plate and respectively connected to both ends of the plurality of side plates, and a combing flow plate correspondingly connected between each adjacent side plate and end plate to form the first liquid inlet channel and the second liquid inlet channel, wherein the liquid inlet cavity is formed between every two adjacent side plates, trough bottom plates, end plates, and combing flow plates; and the electroplating channel is formed between every two adjacent side plates, end plates, and combing flow plates.
8. The online cleaning and electroplating integrated equipment for bonding wires according to claim 7, characterized in that: A plurality of overlapping grooves recessed inward from the inner wall are formed on each of the end plates, and each of the comb flow plates is overlapped in the overlapping grooves from opposite sides, and the four sides of the comb flow plates are respectively fitted with the corresponding side plates and the side walls of the overlapping grooves; an overflow port connected to each electroplating channel is formed on each of the end plates, and a baffle which can be adjusted up and down to adjust the size of the overflow port is provided on the outer wall of each of the end plates, and each bonding wire passes through the corresponding electroplating channel from the overflow port; there are two second areas, which are symmetrically arranged on opposite sides of the first area in the wire transmission direction.
9. The online cleaning and electroplating integrated equipment for bonding wires according to claim 1, characterized in that: The liquid supply pipeline is connected to the bottom of the liquid inlet cavity, and in the orthographic projection on the horizontal plane, the connection point between the liquid supply pipeline and the liquid inlet cavity is located in the middle of the first area.
10. The online cleaning and electroplating integrated equipment for bonding wires according to claim 1, characterized in that: The inner diameters of the first liquid inlet channel and the second liquid inlet channel are equal; a plurality of the first liquid inlet channels are distributed in the first area, and a plurality of the second liquid inlet channels are distributed in the second area, wherein the plurality of the first liquid inlet channels are divided into a plurality of first channel groups, and the plurality of the second liquid inlet channels are divided into a plurality of second channel groups, and the plurality of the first liquid inlet channels and the second liquid inlet channels in each of the first channel group and the second channel group are respectively distributed at intervals perpendicular to the wire transmission direction; The distance between adjacent first channel groups is smaller than the distance between adjacent second channel groups.