Mini-Led lamp panel
By setting the heat dissipation components and contact parts in the Mini-Led backlight module, the heat accumulation problem caused by the increase in the temperature of the Mini-Led chip is solved, the heat dissipation efficiency and luminous efficiency are improved, and the service life of the chip is extended.
Patent Information
- Application Number
- CN202422236988.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-09-12
AI Technical Summary
In the Mini-Led backlight module, the high-reflective plastic surrounding chip causes the chip temperature to rise, heat gather, causing the non-uniform distribution of thermal stress, and resulting in a decrease in luminous efficiency.
The heat dissipation assembly is arranged in the back panel, and contact parts are arranged at the bottom of the highly reflective plastic enclosure, so that heat is transferred to the heat dissipation plate and the back panel through the contact parts, increasing the heat transfer path and improving the heat dissipation efficiency.
Prevent heat from aggregation on highly reflective plastics, avoid non-uniform distribution of thermal stress, improve chip luminescence efficiency and service life, and enhance structural stability.
Smart Images
Figure CN223049993U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of Mini-Led backlight panels, and specifically relates to a Mini-Led light panel. Background Art
[0002] The Mini-Led backlight source adopts a huge number of Mini-Led chips and backplates of different sizes and types to achieve the uniformity of the overall picture. At present, for small-size Mini-Led backlight modules, most of them adopt the methods of full-surface coating or scribing and dispensing to achieve the overall encapsulation. When using the method of full-surface coating for encapsulation, because only the bottom backplate reflects, the overall reflectivity is low, and the light will scatter around in the colloid. The light will be greatly lost inside the colloid, so a lot of the overall light efficiency and brightness will be sacrificed.
[0003] In order to solve the above problems, in the prior art, by adding a high-reflection plastic at the upper end of the backplate, and using the high-reflection plastic to surround the Mini-Led chips, the plastic can reflect the light emitted from the side of the chips upward, increasing the brightness of the module and improving the light efficiency. However, the prior art has the following problems: Since the Mini-Led chips are surrounded by the high-reflection plastic, the contact area between the Mini-Led chips and the outside is reduced, resulting in the temperature of the Mini-Led chips rising, which causes heat to accumulate on the high-reflection plastic, and then causes non-uniform distribution of thermal stress, ultimately leading to a decrease in the light-emitting efficiency of the chips. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a Mini-Led light panel to solve the technical problem in the above background art that the Mini-Led light panel in the current market uses high-reflection plastic to surround the chips, resulting in heat accumulation in the chips and the high-reflection plastic, and thus reducing the heat dissipation effect.
[0005] To achieve the above purpose, the utility model provides the following technical solution: A Mini-Led light panel, including a backplate and a plurality of substrates arranged in an array on the backplate, a plurality of Mini-Led chips are arranged on the substrates, a high-reflection plastic fence is arranged on the backplate and at the outer edge of each substrate, and the light panel further includes:
[0006] A heat dissipation component for absorbing heat, which is arranged in the inner cavity opened on the backplate;
[0007] A contact component arranged at the bottom of the high-reflection plastic fence, the contact component penetrates through the upper end of the backplate and extends into the inner cavity to contact the heat dissipation plate. During operation, the heat generated by the Mini-Led chips on the high-reflection plastic fence is transferred to the backplate and the heat dissipation component through the contact component.
[0008] As a preferred technical solution of the present utility model, the heat dissipation component is a heat dissipation plate.
[0009] As a preferred technical solution of the present utility model, the bottom of the heat dissipation plate is provided with dense heat dissipation strips to increase the surface area of the heat dissipation plate.
[0010] As a preferred technical solution of the present utility model, the contact component is a first protrusion provided at the bottom of the high-reflection plastic enclosure, and the first protrusion penetrates through a recessed groove opened on the upper surface of the back plate to contact the heat dissipation plate.
[0011] As a preferred technical solution of the present utility model, the upper surface of the heat dissipation plate is provided with a second protrusion that cooperates with the first protrusion.
[0012] As a preferred technical solution of the present utility model, a protective glue for encapsulating the high-reflection plastic enclosure and the Mini-Led chip is provided at the upper end of the back plate.
[0013] As a preferred technical solution of the present utility model, an adhesive is provided in the recessed groove to connect the recessed groove with the first protrusion.
[0014] Compared with the prior art, the beneficial effects of the present utility model are:
[0015] Since the present utility model is provided with a heat dissipation plate in the back plate and a contact component at the bottom of the high-reflection plastic enclosure, the high-reflection plastic enclosure can transfer the heat generated by the Mini-Led chip to the heat dissipation plate and the back plate simultaneously through the contact component, increasing the heat transfer path, improving the heat dissipation efficiency of the high-reflection plastic enclosure, and preventing the problem of non-uniform distribution of thermal stress caused by heat accumulation on the high-reflection plastic due to the increase in the temperature of the Mini-Led chip, resulting in a decrease in the light-emitting efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a semi-sectional three-dimensional structure diagram of the present utility model;
[0017] Figure 2 is the Figure 1 magnified structure diagram of part A in the present utility model;
[0018] Figure 3 is a partial-sectional three-dimensional structure diagram of the back plate and the heat dissipation plate of the present utility model;
[0019] Figure 4 is a bottom-up view structure diagram of the bottom of the heat dissipation plate of the present utility model.
[0020] In the figure: 1. Backplane; 2. Substrate; 3. High-reflection plastic enclosure; 4. First protrusion; 5. Recessed groove; 6. Inner cavity; 7. Heat dissipation plate; 8. Second protrusion; 9. Heat dissipation strip. Detailed implementation mode
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the specific implementation modes of the present application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings, and other implementation modes can also be obtained.
[0022] To make the drawings concise, only the parts related to the utility model are schematically shown in each drawing, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, components with the same structure or function are only schematically shown for one of them, or only one of them is marked. In this article, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0023] Please refer to Figures 1-4 , the present utility model provides a technical solution: a Mini-Led light board, including a backplane 1 and a plurality of substrates 2 arranged in an array on the backplane 1. A plurality of Mini-Led chips are arranged on the substrates 2. A high-reflection plastic enclosure 3 is arranged on the backplane 1 and at the outer edge of each substrate 2. As Figure 1 shown, the light board further includes: a heat dissipation component for absorbing heat, which is arranged in the inner cavity 6 opened on the backplane 1;
[0024] As Figure 1 shown, the light board further includes: a contact component arranged at the bottom of the high-reflection plastic enclosure 3. The contact component penetrates through the upper end of the backplane 1 and extends into the inner cavity 6 to contact the heat dissipation plate 7. During operation, the heat generated by the Mini-Led chips on the high-reflection plastic enclosure 3 is transferred to the backplane 1 and the heat dissipation component through the contact component;
[0025] Adopting the above technical solution can improve the heat dissipation efficiency of the highly reflective plastic enclosure 3. During operation, through the added highly reflective plastic enclosure 3, the light emitted from the side of the Mini-Led chip can be reflected upward, increasing the brightness of the module, improving the light efficiency, and through the dam-type arrangement of the highly reflective plastic enclosure 3 and the Mini-Led chip, the light spot of each chip can be made uniform, and the overall picture has good consistency. In addition to light, the Mini-Led chip also generates heat on the highly reflective plastic enclosure 3, and these heats are transferred to the backplane 1 and the heat dissipation component through the contact part, thereby indirectly increasing the heat dissipation area of the highly reflective plastic enclosure 3, preventing the problem of non-uniform distribution of thermal stress caused by heat accumulation on the highly reflective plastic due to the increase in the temperature of the Mini-Led chip, and the decrease in the light-emitting efficiency of the chip, effectively improving the service life of the Mini-Led chip.
[0026] As Figure 1 shown, in this embodiment, the heat dissipation component is the heat dissipation plate 7;
[0027] As Figure 4 shown, in order to further improve the heat dissipation efficiency of the heat dissipation plate 7, a dense heat dissipation strip 9 can be provided at the bottom of the heat dissipation plate 7 to increase the surface area of the heat dissipation plate 7; the heat dissipation plate 7 can be made of materials with excellent heat dissipation performance, such as aluminum, aluminum alloy or silicon carbide;
[0028] Adopting the above technical solution can improve the heat dissipation effect. The principle is to increase the heat dissipation area of the heat dissipation plate 7 by providing a heat dissipation strip 9 at the bottom of the heat dissipation plate 7.
[0029] As Figure 2 shown, in this embodiment, the contact part is the first protrusion 4 provided at the bottom of the highly reflective plastic enclosure 3. The first protrusion 4 penetrates through the recessed groove 5 opened on the upper surface of the backplane 1 and then contacts the heat dissipation plate 7; a second protrusion 8 matching the first protrusion 4 is provided on the upper surface of the heat dissipation plate 7; an adhesive is provided in the recessed groove 5 to connect the recessed groove 5 and the first protrusion 4; the first protrusion 4 and the second protrusion 8 can be made of materials with excellent heat conduction, such as copper;
[0030] Adopting the above technical solution can further improve the heat dissipation effect. The first protrusion 4 at the bottom of the highly reflective plastic enclosure 3 and the second protrusion 8 at the upper end of the heat dissipation plate 7 are engaged with each other, which can increase the contact area between the highly reflective plastic enclosure 3 and the heat dissipation plate 7 to improve the heat conduction efficiency. At the same time, the setting of the protrusions can also prevent loosening between the heat dissipation plate 7 and the highly reflective plastic enclosure 3, improving the structural stability.
[0031] In this embodiment, a protective glue (not shown in the figure) for encapsulating the highly reflective plastic enclosure 3 and the Mini-Led chip is provided at the upper end of the backplane 1;
[0032] Adopting the above technical solution can improve the waterproof effect of the backplane 1. Since the high-reflection plastic enclosure 3 and the Mini-Led chip are encapsulated with a protective glue, it can isolate external water vapor and prevent liquid from entering and causing a short circuit.
[0033] Working principle: By adding the high-reflection plastic enclosure 3, the light emitted from the side of the Mini-Led chip can be reflected upward, increasing the brightness of the module, improving the light efficiency. And through the dam-type setting of the high-reflection plastic enclosure 3 and the Mini-Led chip, the light spot of each chip can be made uniform, and the overall picture has a good consistency. In addition to light, the Mini-Led chip also generates heat on the high-reflection plastic enclosure 3. These heats are transferred to the backplane 1 and the heat dissipation component through the contact parts, thereby indirectly increasing the heat dissipation area of the high-reflection plastic enclosure 3, preventing the problem that the non-uniform distribution of thermal stress caused by the heat accumulation on the high-reflection plastic due to the increase in the temperature of the Mini-Led chip leads to the decrease in the light-emitting efficiency of the chip, and effectively improving the service life of the Mini-Led chip. In addition, the first protrusion 4 at the bottom of the high-reflection plastic enclosure 3 engages with the second protrusion 8 at the upper end of the heat dissipation plate 7, which can increase the contact area between the high-reflection plastic enclosure 3 and the heat dissipation plate 7 to improve the heat conduction efficiency. At the same time, the setting of the protrusions can also prevent loosening between the heat dissipation plate 7 and the high-reflection plastic enclosure 3, improving the structural stability.
[0034] Thus, a series of operations are completed. The circuits, electronic components, and modules involved are all existing technologies, which can be fully realized by those skilled in the art without further elaboration. The content protected by the present utility model does not involve improvements to software and methods either.
[0035] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.
Claims
1. A Mini-Led light panel, comprising a back panel (1) and a plurality of substrates (2) arranged in an array on the back panel (1), a plurality of Mini-Led chips being arranged on the substrates (2), and a high-reflection plastic enclosure (3) being arranged on the back panel (1) and at the outer edge of each substrate (2), characterized in that: The light board also includes: A heat dissipation component for absorbing heat, which is arranged in an inner cavity (6) opened in the back plate (1); A contact component is provided at the bottom of the highly reflective plastic enclosure (3), the contact component penetrates the upper end of the back plate (1) and extends into the inner cavity (6) to contact the heat dissipation plate (7). When in operation, the heat generated by the Mini-Led chip to the highly reflective plastic enclosure (3) is transferred to the back plate (1) and the heat dissipation component through the contact component.
2. The Mini-Led light board according to claim 1, characterized in that: The heat dissipation component is a heat dissipation plate (7).
3. The Mini-Led light board according to claim 2, characterized in that: The bottom of the heat dissipation plate (7) is provided with dense heat dissipation strips (9) to increase the surface area of the heat dissipation plate (7).
4. The Mini-Led light board according to claim 2 or 3, characterized in that: The contact component is a first protrusion (4) provided at the bottom of the high-reflection plastic enclosure (3); the first protrusion (4) penetrates a recessed groove (5) provided on the upper surface of the back plate (1) so as to contact the heat dissipation plate (7).
5. The Mini-Led light board according to claim 4, characterized in that: The upper surface of the heat dissipation plate (7) is provided with a second protrusion (8) that matches the first protrusion (4).
6. The Mini-Led light board according to claim 1, characterized in that: A protective glue for encapsulating a high-reflection plastic enclosure (3) and a Mini-Led chip is provided at the upper end of the back plate (1).
7. The Mini-Led light board according to claim 4, characterized in that: An adhesive is provided in the recessed groove (5) so that the recessed groove (5) is connected to the first protrusion (4).