Crimping mechanism and testing device

Abstract

The utility model relates to a crimping mechanism and a testing device, the crimping mechanism comprises a substrate, a carrying platform and a probe module, the carrying platform is arranged on the substrate and is provided with a bearing cavity for bearing a to-be-tested product; the probe module is arranged on the substrate, the probe module comprises a plurality of sheet probes, and when the product to be tested is carried in the carrying cavity, one end of each sheet probe abuts against the electric testing point of the substrate, and the other end of each sheet probe can abut against the testing point of the product to be tested. According to the crimping mechanism provided by the invention, the probe module directly and electrically abuts against the test point of the to-be-tested product, the test crimping action of the to-be-tested product can be simplified, the test crimping efficiency of the to-be-tested product can be improved, and because the thickness of the thin-sheet probe is relatively small, the crimping mechanism can be suitable for test crimping of small-spacing test points, and the test crimping scene of the crimping mechanism is expanded.

Description

Technical Field

[0001] This application relates to the field of testing technologies, and particularly to a crimping mechanism and a testing device. Background Art

[0002] With the increasingly widespread application of products such as wearable devices and semiconductors, various tests are carried out during the production process to ensure product quality. During the testing process, various crimping units are required. One end of the probe module on the crimping unit contacts the test point of the product connector, and the other end contacts the test point of the PCB / FPC, etc. The PCB / FPC, etc. are then connected to other transmission units or testing devices to achieve the conduction of the product.

[0003] However, the crimping operation of the above products is too cumbersome, and with the development of products, the round-tip probes in the probe module are not suitable for the crimping test operation of small-pitch test points, resulting in limited application scenarios of the crimping unit. Summary of the Invention

[0004] Based on this, in view of the problem that the crimping operation of existing products is too cumbersome and not suitable for crimping small-pitch test points, it is necessary to provide a crimping mechanism and a testing device.

[0005] A crimping mechanism, the crimping mechanism includes:

[0006] A substrate;

[0007] A carrier stage, the carrier stage is arranged on the substrate and has a loading cavity for loading the product to be tested;

[0008] A probe module, the probe module is arranged on the substrate, the probe module includes a plurality of thin-film probes, and when the product to be tested is loaded in the loading cavity, one end of the thin-film probe abuts against the electrical test point of the substrate, and the other end can abut against the test point of the product to be tested.

[0009] In one embodiment, the thin-film probe includes a middle part, at least one contact part and at least one connecting part. The contact part and the connecting part respectively protrude from opposite ends of the middle part. The contact part can abut against the test point of the product to be tested, and the connecting part is arranged on the substrate and abuts against the electrical test point of the substrate.

[0010] In one embodiment, both the contact part and the connecting part are multiple, and the multiple contact parts are arranged at intervals in the length direction of the thin-film probe, and the multiple connecting parts are arranged at intervals in the length direction of the thin-film probe.

[0011] In one embodiment, the plurality of thin-film probes are arranged at intervals in the thickness direction, and any two adjacent thin-film probes are offset from each other in their length direction.

[0012] In one embodiment, the probe module also includes a probe seat and at least one elastic member, the probe seat is arranged on the substrate, a plurality of the thin-film probes are movably arranged on the probe seat, the elastic member is arranged between the probe seat and the carrier, and the deformation direction of the elastic member is consistent with the abutment direction of the thin-film probe toward the test point of the product to be tested.

[0013] In one embodiment, the probe module further includes a fixing seat and a cover plate, wherein the fixing seat is disposed on the substrate and has a fixing cavity, the probe seat is disposed in the fixing cavity, and the cover plate is disposed on a side of the fixing seat away from the carrier.

[0014] In one embodiment, the probe seat and the fixing seat are both provided with a plurality of first through holes, the carrier is provided with a plurality of second through holes corresponding to the plurality of first through holes, a plurality of the thin-film probes are correspondingly inserted into the first through holes, and can move to the outside of the second through holes and abut against the test points of the product to be tested, and can also be accommodated inside the second through holes.

[0015] In one of the embodiments, the crimping mechanism further includes a limiting member, and the fixing seat is arranged on the substrate through the limiting member.

[0016] In one of the embodiments, the carrier has a magnetic adsorption property in a region close to the carrying cavity, and the carrier can adsorb the product to be tested.

[0017] A testing device, comprising:

[0018] The crimping mechanism as described in any one of the above technical solutions; and

[0019] The pressing head mechanism is transmission-connected with the crimping mechanism and can move toward or away from the crimping mechanism.

[0020] In the above-mentioned crimping mechanism and testing device, when the product to be tested is carried in the carrying cavity, one end of the thin-film probe abuts against the electrical test point of the substrate, and the other end of the thin-film probe abuts against the test point of the product to be tested, so as to achieve electrical conduction for the product to be tested. In the crimping mechanism provided by the present application, the probe module directly abuts against the test point of the product to be tested, which can simplify the test crimping action of the product to be tested and improve the test crimping efficiency of the product to be tested. Moreover, since the thickness of the thin-film probe is relatively small, it can be applied to the test crimping of small-pitch test points, expanding the test crimping scenario of the crimping mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the crimping mechanism and the module composed of the product to be tested provided in some embodiments.

[0022] Figure 2 It is a schematic exploded view of the crimping mechanism and the module composed of the product to be tested provided in some embodiments.

[0023] Figure 3 It is a schematic structural view of the product to be tested provided in some embodiments.

[0024] Figure 4 It is Figure 3 A partial enlarged view of area B in

[0025] Figure 5 It is Figure 1 A cross-sectional view taken along the A-A direction in

[0026] Figure 6 It is Figure 5 A partial enlarged view of area C in

[0027] Figure 7 It is a schematic structural view of the thin-film probe provided in some embodiments.

[0028] Figure 8 It is a schematic structural view of the module composed of several thin-film probes provided in some embodiments.

[0029] Reference numerals:

[0030] 100, crimping mechanism;

[0031] 110, substrate; 120, carrier; 121, bearing cavity; 122, second through hole; 130, probe module; 131, thin-film probe; 1311, middle part; 1312, contact part; 1313, connecting part; 132, probe base; 133, elastic part; 134, fixing base; 1341, fixing cavity; 135, cover plate; 136, first through hole; 140, limiting part;

[0032] 200, product to be tested; 210, test point. Detailed implementation manners

[0033] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0035] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "coupled", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0037] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0038] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.

[0039] The following introduces the technical solutions provided by the embodiments of this application with reference to the accompanying drawings.

[0040] Referring to Figures 1-3 As shown, this application provides a crimping mechanism 100. The crimping mechanism 100 includes a substrate 110, a carrier 120 and a probe module 130. The crimping mechanism 100 is used for performing electrical crimping tests on a product under test 200. Among them, the product under test 200 can be a wearable device, a semiconductor, etc., and the substrate 110 can be a PCB (Printed Circuit Board), an FPC (Flexible Circuit Board), etc. The specific element types of the product under test 200 and the substrate 110 are not limited in this application.

[0041] The carrier 120 is disposed on the substrate 110 by means of screwing, clamping, etc., and the carrier 120 has a bearing cavity 121 for bearing the product under test 200. Exemplarily, the carrier 120 has a magnetic adsorption property in the area near the bearing cavity 121. When an electrical crimping test needs to be performed on the product under test 200, the product under test 200 is placed on the carrier 120, and the carrier 120 adsorbs and fixes the product under test 200 in the bearing cavity 121 by adsorption. Of course, in other feasible embodiments, the product under test 200 can also be fixed in the bearing cavity 121 by means of plugging, clamping, etc. for electrical crimping tests. The specific fixing method of the product under test 200 to the carrier 120 is not limited in this application.

[0042] The probe module 130 is disposed on the substrate 110 by means of screwing, clamping, etc. Continuing to refer to Figures 4-6 As shown, the probe module 130 includes a plurality of thin-film probes 131. When the product under test 200 is carried in the bearing cavity 121, one end of the thin-film probe 131 is electrically abutted against an electrical measurement point (not shown in the figure) of the substrate 110, and the other end of the thin-film probe 131 can abut against a test point 210 of the product under test 200 to achieve electrical conduction of the product under test 200, and an electrical crimping test can be performed on the product under test 200.

[0043] In the above-mentioned crimping mechanism 100, the probe module 130 is directly in electrical contact with the test point 210 of the product under test 200. The probe module 130 can realize the crimping test of the product under test 200 without being transferred through a connector, which can simplify the test crimping operation of the product under test 200, improve the test crimping efficiency of the product under test 200, and because the thickness of the thin-film probe 131 is small and multiple thin-film probes 131 are arranged at intervals, it can be applied to the test crimping of small-pitch test points 210, expanding the test crimping scenario of the crimping mechanism 100.

[0044] In one embodiment, referring to Figure 2 , Figure 4 , Figure 6 and Figure 7 as shown, the thin-film probe 131 includes a middle portion 1311, at least one contact portion 1312 and at least one connection portion 1313. The contact portion 1312 and the connection portion 1313 respectively protrude from opposite ends of the middle portion 1311. That is to say, if the contact portion 1312 is located at the head of the middle portion 1311, the connection portion 1313 is located at the tail of the middle portion 1311. Preferably, the middle portion 1311, the contact portion 1312 and the connection portion 1313 are integrally formed by injection molding, extrusion and other methods to simplify the forming process of the thin-film probe 131 and improve the structural strength of the thin-film probe 131. The contact portion 1312 can be in contact with the test point 210 of the product under test 200, and the connection portion 1313 is arranged on the substrate 110 by plugging, clamping and other methods, and the connection portion 1313 is in contact with the electrical test point of the substrate 110 to realize the electrical conduction of the product under test 200 and realize the electrical crimping test of the product under test 200.

[0045] Furthermore, referring to Figure 2 , Figure 6 and Figure 7 as shown, both the contact portion 1312 and the connection portion 1313 are multiple. And multiple contact portions 1312 are arranged at intervals in the length direction of the thin-film probe 131, and multiple connection portions 1313 are arranged at intervals in the length direction of the thin-film probe 131. Exemplarily, taking Figure 7 the perspective as an example, multiple contact portions 1312 are arranged at intervals along the Figure 7 horizontal direction shown, and multiple connection portions 1313 are arranged at intervals along the Figure 7 horizontal direction shown. As in this embodiment, both the contact portion 1312 and the connection portion 1313 are two, and the two contact portions 1312 are arranged at intervals along the Figure 7 horizontal direction shown. The two contact portions 1312 and the middle portion 1311 form a harpoon-shaped structure, and the two connection portions 1313 are along the Figure 7The two connecting parts 1313 are arranged at intervals in the horizontal direction, and the two connecting parts 1313 and the middle part 1311 form a harpoon-shaped structure. The area where the contact part 1312 abuts against the product 200 to be tested has an arc chamfer, so as to avoid damage such as scratching and scraping of the test point 210 of the product 200 to be tested by the contact part 1312 during the abutting process between the contact part 1312 and the test point 210 of the product 200 to be tested. Moreover, the area where the connecting part 1313 abuts against the electrical test point of the substrate 110 has an arc chamfer, so as to avoid damage such as scratching and scraping of the electrical test point of the substrate 110 by the connecting part 1313 during the abutting process between the connecting part 1313 and the electrical test point of the substrate 110.

[0046] In the above-mentioned crimping mechanism 100, any one of the contact parts 1312 or multiple contact parts 1312 simultaneously abut against the test points 210 of the product 200 to be tested, and any one of the connecting parts 1313 or multiple connecting parts 1313 simultaneously abut against the electrical test points of the substrate 110, which can improve the abutting reliability and stability of the product 200 to be tested during the crimping test, and further improve the electrical conduction reliability and stability of the product 200 to be tested during the crimping test.

[0047] As the product 200 to be tested tends to develop towards miniaturization, the test points 210 of the product 200 to be tested are becoming more and more dense, the distance between two adjacent test points 210 is small, and the number of test points 210 increases. In order to adapt to the above development trend, refer to Figure 4 As shown, multiple test points 210 of the product 200 to be tested are often misaligned, so as to reduce the distance between two adjacent test points 210 of the product 200 to be tested and increase the number of test points 210 under the condition of the product 200 to be tested with the same specification size.

[0048] In order to adapt to the crimping test of the above-mentioned product 200 to be tested, in one embodiment, continue to refer to Figure 2 and Figure 8 As shown, a plurality of thin-film probes 131 are arranged at intervals in the thickness direction, and any two adjacent thin-film probes 131 are misaligned with each other in their length directions. Taking Figure 8 the perspective as an example, a plurality of thin-film probes 131 are arranged at intervals along the Figure 8 X direction shown, and two adjacent thin-film probes 131 are misaligned with each other along the Figure 8 Y direction shown. In this way, the misaligned plurality of thin-film probes 131 can adaptively abut against the misaligned distributed multiple test points 210, and further realize the crimping test of the product 200 to be tested with small-spacing test points 210.

[0049] Exemplarily, as in this embodiment, the thickness of the thin-film probe 131 is 40 μm to 120 μm. Specifically, the thickness of the thin-film probe 131 can be one of 40 μm, 60 μm, 80 μm, 100 μm, and 120 μm; the distance between two adjacent thin-film probes 131 in the spacing direction is 100 μm to 250 μm. Specifically, the distance between two adjacent thin-film probes 131 in the spacing direction can be one of 100 μm, 150 μm, 200 μm, and 250 μm, so as to be compatible with the electrical contact test of two test points 210 of the product under test 200 with a distance of 100 μm to 250 μm. Of course, the thickness of the thin-film probe 131 and the distance between two adjacent thin-film probes 131 are not limited to the specific values within the above ranges, and can also be other values within this range. The present application does not limit the specific values of the thickness of the thin-film probe 131 and the distance between two adjacent thin-film probes 131.

[0050] In one embodiment, referring to Figure 2 , Figure 4 and Figure 6 as shown, the probe module 130 further includes a probe base 132 and at least one elastic member 133. The probe base 132 is disposed on the substrate 110 by means of screwing, clamping, etc. A plurality of thin-film probes 131 are all movably disposed on the probe base 132. The elastic member 133 is disposed between the probe base 132 and the stage 120. For example, one end of the elastic member 133 is connected to the surface of the probe base 132 close to the stage 120, and the other end of the elastic member 133 is connected to the surface of the stage 120 close to the probe base 132, and the deformation direction of the elastic member 133 is the same as the contact direction of the thin-film probe 131 towards the test point 210 of the product under test 200.

[0051] Exemplarily, when performing a crimping test on the product under test 200, a force is applied to the product under test 200. The elastic member 133 is compressed, and the thin-film probe 131 extends into the bearing cavity 121 and contacts the test point 210 of the product under test 200 to perform an electrical crimping test on the product under test 200. After the crimping test of the product under test 200 is completed, the force applied to the product under test 200 is removed, the elastic member 133 undergoes elastic reset, the elastic member 133 drives the stage 120 to reset, and the thin-film probe 131 is separated from the test point 210 of the product under test 200, facilitating the picking and placing operation of the product under test 200. Moreover, the elastic member 133 can make the stage 120 float on the probe base 132, so that during the crimping test of the product under test 200, the stage 120 is in flexible contact with the force-applying structure, avoiding damage to the internal components (such as the thin-film probe 131) of the crimping mechanism 100 due to excessive instantaneous force.

[0052] Among them, the elastic member 133 is preferably multiple, and the multiple elastic members 133 are spaced apart along the circumferential direction of the probe seat 132. For example, if there are four elastic members 133, the four elastic members 133 are respectively located at the four diagonal positions of the probe seat 132. The multiple elastic members 133 can improve the stability of the carrier 120 during the movement, and can improve the reset reliability of the carrier 120. In the present embodiment, the elastic member 133 is a reset spring, and the elastic member 133 can be compressed when subjected to force, and the elastic member 133 can be elastically reset when the force applied to the elastic member 133 is removed. Of course, in other feasible embodiments, the elastic member 133 can also be an elastic sheet, an elastic pad, or other element that can be deformed when subjected to force. The present application does not limit the specific element type of the elastic member 133.

[0053] Further, see Figure 2 , Figure 4 and Figure 6 As shown, the probe seat 132 and the fixing seat 134 are both provided with a plurality of first through holes 136, and the carrier 120 is provided with a plurality of second through holes 122 corresponding to the plurality of first through holes 136, such as the number of the thin-sheet probes 131 is consistent with the number of the first through holes 136 and the second through holes 122. The plurality of thin-sheet probes 131 are correspondingly inserted into the first through holes 136 to achieve the fixation of the thin-sheet probes 131, and the thin-sheet probes 131 can move to the outside of the second through holes 122 and abut against the test points 210 of the product 200 to be tested, and the thin-sheet probes 131 can be accommodated in the inside of the second through holes 122.

[0054] Specifically, when a crimping test is required on the product to be tested 200, a force is applied to the product to be tested 200, the elastic member 133 is compressed, and a plurality of thin-film probes 131 move from the second through hole 122 into the carrying cavity 121 and abut against the test point 210 of the product to be tested 200, so as to perform an electrical crimping test on the product to be tested 200. After the crimping test of the product to be tested 200 is completed, the force applied to the product to be tested 200 is removed, the elastic member 133 is elastically reset, and the elastic member 133 drives the carrier 120 to reset. The thin-film probes 131 are separated from the test point 210 of the product to be tested 200, and can be accommodated inside the second through hole 122, so as to protect the thin-film probes 131 when the crimping mechanism 100 does not need to perform a test operation.

[0055] In one embodiment, refer to Figure 2 and Figure 6As shown, the probe module 130 includes a fixing seat 134 and a cover plate 135. The fixing seat 134 is arranged on the substrate 110 by screwing, clamping, etc., and the fixing seat 134 has a fixing cavity 1341. The probe seat 132 is arranged in the fixing cavity 1341 by embedding, so that the probe module 130 is indirectly arranged on the substrate 110 through the fixing seat 134. The cover plate 135 is arranged on the side of the fixing seat 134 away from the carrier 120, such as the cover plate 135 is covered on the outside of the probe module 130 to protect the pin position of the thin probe 131, to avoid the undesirable phenomenon of the thin probe 131 breaking during the pressing process of the thin probe 131 to be tested The product 200, and to prevent the thin probe 131 from being damaged externally.

[0056] Further, see Figure 2 and Figure 6 As shown, the crimping mechanism 100 also includes a limiter 140. The fixing seat 134 is arranged on the substrate 110 through the limiter 140 to ensure that the probe module 130 is arranged at a preset position of the substrate 110, and to ensure that a plurality of thin-sheet probes 131 in the probe module 130 are correspondingly abutted against a plurality of electrical measuring points of the substrate 110, thereby improving the stability and reliability of the product to be tested 200 during the crimping test process. Among them, the limiter 140 is a limiter column, a limiter pin, etc., and the present application does not limit the specific component type of the limiter 140.

[0057] Also, see Figures 1-6 As shown, the present application also provides a testing device (not shown in the figure), which includes a crimping mechanism 100 and a pressing head mechanism (not shown in the figure) as in the above technical solution. The pressing head mechanism is transmission-connected to the crimping mechanism 100, and the pressing head mechanism can move in a direction close to or away from the crimping mechanism 100, and when the pressing head mechanism moves in a direction close to the crimping mechanism 100 and applies a crimping force on the crimping mechanism 100, a crimping test can be performed on the product 200 to be tested; on the contrary, after the crimping test of the product 200 to be tested is completed, the pressing head mechanism moves in a direction away from the crimping mechanism 100, removes the crimping force applied to the product 200 to be tested, and releases the electrical conduction relationship between the product 200 to be tested and the crimping mechanism 100, so as to facilitate the pick-up and placement operation of the product 200 to be tested.

[0058] In the above-mentioned test device, the probe module 130 is directly electrically connected to the test point 210 of the product to be tested 200, which can simplify the test crimping action of the product to be tested 200 and improve the test crimping efficiency of the product to be tested 200. Moreover, since the thickness of the thin-film probe 131 is relatively small, it can be suitable for the test crimping of small-pitch test points 210, thereby expanding the test crimping scenario of the test device.

[0059] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0060] The above-described embodiments merely represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A crimping mechanism, characterized in that: The crimping mechanism comprises: substrate; A carrier, which is disposed on the substrate and has a carrying cavity for carrying the product to be tested; A probe module is arranged on the substrate, the probe module includes a plurality of thin-sheet probes, and when the product to be tested is carried in the carrying cavity, one end of the thin-sheet probe abuts against the electrical measuring point of the substrate, and the other end can abut against the testing point of the product to be tested.

2. The crimping mechanism according to claim 1, characterized in that: The thin-sheet probe includes a middle portion, at least one contact portion and at least one connecting portion, wherein the contact portion and the connecting portion protrude from opposite ends of the middle portion, respectively, the contact portion can abut against a test point of the product to be tested, and the connecting portion is disposed on the substrate and abuts against an electrical test point of the substrate.

3. The crimping mechanism according to claim 2, characterized in that: There are a plurality of the contact portions and a plurality of the connecting portions, and the plurality of the contact portions are arranged at intervals in the length direction of the thin-sheet probe, and the plurality of the connecting portions are arranged at intervals in the length direction of the thin-sheet probe.

4. The crimping mechanism according to claim 1, characterized in that: The plurality of thin-sheet probes are arranged at intervals in the thickness direction, and any two adjacent thin-sheet probes are offset from each other in the length direction thereof.

5. The crimping mechanism according to claim 1, characterized in that: The probe module also includes a probe seat and at least one elastic member, the probe seat is arranged on the substrate, and a plurality of thin-film probes are movably arranged on the probe seat. The elastic member is arranged between the probe seat and the carrier, and the deformation direction of the elastic member is consistent with the abutment direction of the thin-film probe toward the test point of the product to be tested.

6. The crimping mechanism according to claim 5, characterized in that: The probe module also includes a fixing seat and a cover plate. The fixing seat is arranged on the substrate and has a fixing cavity. The probe seat is arranged in the fixing cavity. The cover plate is arranged on a side of the fixing seat away from the carrier.

7. The crimping mechanism according to claim 6, characterized in that: The probe seat and the fixing seat are both provided with a plurality of first through holes, the carrier is provided with a plurality of second through holes corresponding to the plurality of first through holes, a plurality of the thin-film probes are correspondingly inserted into the first through holes, and can move to the outside of the second through holes and abut against the test points of the product to be tested, and can also be accommodated inside the second through holes.

8. The crimping mechanism according to claim 6, characterized in that: The crimping mechanism further includes a limiting member, and the fixing seat is arranged on the substrate through the limiting member.

9. The crimping mechanism according to claim 1, characterized in that: The carrier has a magnetic adsorption property in a region close to the carrying cavity, and the carrier can adsorb the product to be tested.

10. A testing device, characterized in that: The testing device comprises: The crimping mechanism according to any one of claims 1 to 9; and The pressing head mechanism is transmission-connected with the crimping mechanism and can move toward or away from the crimping mechanism.

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