High-temperature simulation test device for integrated circuit

Abstract

The utility model discloses an integrated circuit high temperature simulation test device comprising a machine body, an inner wall of the machine body is provided with a mounting plate, a top of the mounting plate is provided with an air cylinder, an output end of the air cylinder is provided with a telescopic rod, one end of the telescopic rod is connected with a butt joint rod, one end of the butt joint rod is provided with a partition sheet, and the partition sheet is connected with the air cylinder. A heated head is installed on the inner wall of the partition piece, a detection needle is arranged at one end of the heated head, and a heat conduction ring is installed on the outer wall of the heated head. According to the integrated circuit high-temperature simulation test device provided by the utility model, the heat conduction ring, the heat conduction pipe and the heated plate are ingeniously combined, so that efficient and uniform heat transfer is realized, and the heated head can penetrate through the inner wall of the heat conduction ring, so that a detection needle can quickly and accurately reach a required high-temperature state in a test process, and the test efficiency is improved. Therefore, accurate high-temperature testing is carried out on the specific part of the integrated circuit, and the testing accuracy is improved through the design.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit testing equipment, and particularly relates to an integrated circuit high-temperature simulation testing device. Background Art

[0002] In the utility model patent application with the publication number of CN219831307U, it includes a base, and also includes a testing component arranged above the base; the testing component includes several groups of mechanical springs fixed on the top of the base, a vibration motor arranged above the base, and a counterweight block fixed on the output end of the vibration motor. The top of the mechanical spring is fixed with a plate vibration seat. A through vibration groove is formed on the surface of the plate vibration seat, and several groups of mesh grooves arranged in a rectangular array are formed on the top of the plate vibration seat.

[0003] Advantages: Through the arranged testing component, the device can simulate the height amplitude and high-temperature state of the circuit board, detect the solder joint quality of the circuit board in the height amplitude and high-temperature state. Through the arranged conveying component, the circuit board is moved to the detection position to obtain whether the solder joint positions of the circuit board are connected, so as to detect the solder joint quality of the circuit board.

[0004] In the prior art including the above patent, when the integrated circuit board is subjected to high-temperature simulation testing, the high temperature will accelerate the aging process of the components in the integrated circuit, such as oxidation of electronic components, aging of packaging materials, etc., resulting in a shortened service life of the integrated circuit. At the same time, the current high-temperature testing device heats the whole circuit board, so it is impossible to accurately test the stability of each component under high-temperature conditions. Content of the Utility Model

[0005] The purpose of the utility model is to provide an integrated circuit high-temperature simulation testing device to solve the problems put forward in the above background art.

[0006] To achieve the above purpose, the utility model provides the following technical solution: An integrated circuit high-temperature simulation testing device includes a machine body. An installation plate is installed on the inner wall of the machine body. A cylinder is arranged on the top of the installation plate. A telescopic rod is installed at the output end of the cylinder. One end of the telescopic rod is connected with a docking rod. One end of the docking rod is installed with a partition piece. A heating head is installed on the inner wall of the partition piece. A detection needle is arranged at one end of the heating head. A heat conduction ring is installed on the outer wall of the heating head.

[0007] Further, the outer wall of the heat conduction ring is connected with a heat conduction pipe. One end of the heat conduction pipe is connected with a heating plate. A heating device is connected to the outer wall of the heating plate. An operation panel is arranged on the outer wall of the machine body.

[0008] Furthermore, a bottom plate is installed at the bottom of the inner wall of the machine body. A control rod is movably installed inside the bottom plate, and a clamping plate is installed at one end of the control rod.

[0009] Furthermore, the telescopic rod is connected to the docking rod, and the docking rod is connected to the heating head.

[0010] Furthermore, the partition piece is installed at one end of the docking rod, and the docking rod is connected to the heating head through the partition piece.

[0011] Furthermore, the three-dimensional view of the partition piece is in a circular ring shape, and the material of the partition piece is broken bridge aluminum profile.

[0012] Furthermore, the material of the heat conduction tube is copper. The heat conduction ring and the heating plate are connected through the heat conduction tube, and the material of the detection needle is the same as that of the heat conduction tube.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows: This integrated circuit high-temperature simulation test device is reasonable and has the following advantages:

[0014] Through the ingenious combination of the heat conduction ring, the heat conduction tube and the heating plate, the efficient and uniform transfer of heat is realized. The heating head can penetrate the inner wall of the heat conduction ring, ensuring that during the test, the detection needle can quickly and accurately reach the required high-temperature state, so as to perform precise high-temperature tests on specific parts of the integrated circuit. This design not only improves the accuracy of the test, but also effectively avoids the damage of the integrated circuit caused by uneven or excessive temperature, providing strong support for the research and development and production of the integrated circuit;

[0015] Through the ingenious design of the control rod and the clamping plate, the user can easily fix the integrated circuit board at the bottom of the inner wall of the machine body, ensuring that the integrated circuit board will not move or shake during the test. This stable fixing method not only improves the accuracy of the test, but also effectively prevents test errors or equipment damage caused by the movement of the integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the whole of the present utility model;

[0017] Figure 2 is a schematic internal structure diagram of the machine body of the present utility model;

[0018] Figure 3 is a schematic installation position diagram of the operation panel of the present utility model;

[0019] Figure 4 is a schematic structural diagram of the heating head of the present utility model;

[0020] Figure 5This is a schematic structural diagram of the clamping plate of the present utility model.

[0021] In the figure: 1, the body; 2, the mounting plate; 3, the cylinder; 4, the telescopic rod; 5, the docking rod; 6, the partition piece; 7, the heating head; 8, the detection needle; 9, the heat conduction ring; 10, the heat conduction tube; 11, the heating plate; 12, the heating device; 13, the operation panel; 14, the bottom plate; 15, the control rod; 16, the clamping plate. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1-5 , the technical solution provided by the present utility model:

[0024] In this embodiment, an integrated circuit high-temperature simulation test device includes a body. A mounting plate is installed on the inner wall of the body. A cylinder is arranged on the top of the mounting plate. The output end of the cylinder is installed with a telescopic rod. One end of the telescopic rod is connected with a docking rod. One end of the docking rod is installed with a partition piece. A heating head is installed on the inner wall of the partition piece. A detection needle is arranged at one end of the heating head. A heat conduction ring is installed on the outer wall of the heating head.

[0025] In this embodiment, the outer wall of the heat conduction ring is connected with a heat conduction tube. One end of the heat conduction tube is connected with a heating plate. The outer wall of the heating plate is connected with a heating device. An operation panel is arranged on the outer wall of the body.

[0026] In this embodiment, the bottom plate is installed at the bottom of the inner wall of the body. A control rod is movably installed on the inner wall of the bottom plate. One end of the control rod is installed with a clamping plate.

[0027] In this embodiment, the telescopic rod is connected with the docking rod, and the docking rod is connected with the heating head. After the cylinder is started, it will drive the telescopic rod to move. Since the telescopic rod is connected with the docking rod, the docking rod will also move synchronously.

[0028] In this embodiment, the partition piece is installed at one end of the docking rod. The docking rod and the heating head are connected through the partition piece. When the docking rod moves, it will drive the heating head to move synchronously.

[0029] In this embodiment, the three-dimensional view of the partition piece is in a circular ring shape. The material of the partition piece is a broken bridge aluminum profile. The heating head can penetrate the inner wall of the heat conduction ring.

[0030] In this embodiment, the material of the heat conduction tube is copper. The heat conduction ring is connected to the heat receiving plate through the heat conduction tube. The material of the detection needle is the same as that of the heat conduction tube. The heat receiving plate will transfer heat to the heat conduction ring through the copper material of the heat conduction tube.

[0031] Working principle: When in use, first, the user places the integrated circuit board at the bottom of the inner wall of the machine body. Then, the clamping plate is driven by the control lever to move towards the inner wall of the machine body, so that the clamping plate clamps the integrated circuit board. After that, the place on the circuit board that needs precise high-temperature testing is aligned with the detection needle.

[0032] Secondly, after the position is fixed, the user sends an electrical signal to the heating device through the operation panel, so that the heating device starts to heat. When the heating device is heating, it will transfer heat to the heat receiving plate, and the heat receiving plate will transfer heat to the heat conduction ring through the copper material of the heat conduction tube. At this time, the heat conduction ring will gradually become hot.

[0033] Finally, after the heat conduction ring is heated, the user starts the cylinder through the operation panel. After the cylinder is started, it will drive the telescopic rod to move. The telescopic rod is connected to the docking rod, and the docking rod will also move synchronously. When the docking rod moves, it will drive the heat receiving head to move synchronously. At this time, the heat receiving head will penetrate the inner wall of the heat conduction ring, and the heat conduction ring will heat the outer wall of the heat receiving head. After the heat receiving head is heated, it will transfer heat to the detection needle. Then, continue to control the cylinder to drive the detection needle to press down until it is aligned with the place on the integrated circuit board that needs to be tested.

[0034] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. An integrated circuit high temperature simulation test device, comprising a body (1), characterized in that: The inner wall of the machine body (1) is mounted with a mounting plate (2), the top of the mounting plate (2) is provided with a cylinder (3), the output end of the cylinder (3) is mounted with a telescopic rod (4), one end of the telescopic rod (4) is connected with a docking rod (5), one end of the docking rod (5) is mounted with a partition plate (6), the inner wall of the partition plate (6) is mounted with a heating head (7), one end of the heating head (7) is provided with a detection needle (8), and the outer wall of the heating head (7) is mounted with a heat conducting ring (9).

2. The high temperature simulation test device for integrated circuits according to claim 1, characterized in that: The outer wall of the heat-conducting ring (9) is connected to a heat-conducting pipe (10), one end of the heat-conducting pipe (10) is connected to a heating plate (11), the outer wall of the heating plate (11) is connected to a heating device (12), and the outer wall of the machine body (1) is provided with an operation panel (13).

3. The high temperature simulation test device for integrated circuits according to claim 1, characterized in that: A bottom plate (14) is installed at the bottom of the inner wall of the machine body (1), a control rod (15) is movably installed on the inner wall of the bottom plate (14), and a clamping plate (16) is installed at one end of the control rod (15).

4. The high temperature simulation test device for integrated circuits according to claim 1, characterized in that: The telescopic rod (4) is connected to the docking rod (5), and the docking rod (5) is connected to the heating head (7).

5. The high temperature simulation test device for integrated circuits according to claim 1, characterized in that: The partition plate (6) is mounted on one end of the docking rod (5), and the docking rod (5) and the heating head (7) are connected via the partition plate (6).

6. The high temperature simulation test device for integrated circuits according to claim 1, characterized in that: The partition piece (6) is in the shape of a circular ring in a three-dimensional view, and the material of the partition piece (6) is a thermally-insulated aluminum profile.

7. The high temperature simulation test device for integrated circuits according to claim 2, characterized in that: The material of the heat conducting pipe (10) is copper, the heat conducting ring (9) and the heated plate (11) are connected via the heat conducting pipe (10), and the material of the detection needle (8) is the same as that of the heat conducting pipe (10).

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