Test fixture of MCIO connector

Abstract

The test fixture of the MCIO connector is used for testing the MCIO connector on a host processor module of a full-width HPM appearance specification (M-FLW), and comprises a test circuit board, one end of the test circuit board is provided with a protruding part, the height of the protruding part is not smaller than that of a memory slot in the host processor module, and the test circuit board is provided with a plurality of memory slots. A protruding part is arranged on the test circuit board, a golden finger is arranged at the end of the protruding part, the golden finger is used for being connected with a to-be-tested MCIO connector in an inserted mode, a test adapter is arranged at the end, away from the protruding part, of the test circuit board, and the test adapter is connected with the golden finger through a conductive circuit. The test fixture can avoid the memory slot and avoid interference with the memory slot.

Description

Technical Field

[0001] This application belongs to the technical field of connector testing, and particularly relates to a test fixture for an MCIO connector. Background Art

[0002] The MCIO (Mini Cool Edge IO) connector is one of the connectors defined by the Open Compute Project (OCP) in the full-width HPM form factor base Specification (M-FLW). After the modularization of the hardware system, it is necessary to test the signal compatibility between the MCIO connector and the host processor module through the MCIO (Mini Cool Edge IO) connector.

[0003] If the current test fixtures on the market for measuring high-speed cables or connectors are directly used to test the MCIO connector, interference may occur with other components on the board. For example, due to height reasons, the test fixture may interfere with the memory slot adjacent to the MCIO connector, or even prevent the test fixture from being plugged into the MCIO connector. Summary of the Utility Model

[0004] This application aims to provide a test fixture for an MCIO connector to solve the problem of interference between the test fixture and the memory slot adjacent to the MCIO connector.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] An embodiment of this application provides a test fixture for an MCIO connector, which is used to test the MCIO connector on a host processor module with a full-width form factor M-FLW, including: a test circuit board, one end of the test circuit board is provided with a protrusion, the height of the protrusion is not less than the height of the memory slot on the host processor module, a gold finger is provided at the end of the protrusion, the gold finger is used to plug into the MCIO connector to be tested, and a test adapter is provided at the end of the test circuit board away from the protrusion, and the test adapter is connected to the gold finger through a conductive line.

[0007] In a possible implementation, the memory slot includes a dual in-line memory module DIMM slot, and the height of the protrusion is not less than 19 mm.

[0008] In a possible implementation, the test adapter includes a pluggable MMPX connector.

[0009] In a possible implementation, the test adapter includes a transmission test adapter for testing the transmission terminals of the MCIO connector, a reception test adapter for testing the reception terminals of the MCIO connector, and a comparison test adapter for comparing test results.

[0010] In a possible implementation, the number of the transmission test adapters corresponds to the number of the transmission terminals of the MCIO connector, and the number of the reception test adapters corresponds to the number of the reception terminals of the MCIO connector.

[0011] In a possible implementation, the test circuit board includes a first surface for placing the transmission test adapter and a second surface for placing the reception test adapter.

[0012] In a possible implementation, a first area on the first surface for accommodating the test adapter is arranged staggeredly with a second area on the second surface for accommodating the test adapter.

[0013] In a possible implementation, on the first surface, the length of a first conductive line for connecting each transmission test adapter to the gold finger is 2 inches; on the second surface, the length of a second conductive line for connecting each reception test adapter to the gold finger is 4 inches.

[0014] In a possible implementation, the thickness of the test circuit board is not less than the thickness of the gold finger.

[0015] In a possible implementation, the number of the test circuit boards is multiple.

[0016] In an embodiment of the present application, a test fixture for the MCIO connector includes a test circuit board. One end of the test circuit board is provided with a protruding part, the height of the protruding part is not less than the height of a memory slot on the host processor module, a gold finger is arranged at the end of the protruding part, the gold finger is used for plugging with the to-be-tested MCIO connector, a test adapter is arranged at the other end of the test circuit board away from the protruding part, the test adapter is connected to the gold finger through a conductive line, and the test fixture can avoid the memory slot and prevent interference with the memory slot.

[0017] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 It is a schematic diagram of a test fixture for an MCIO connector according to an embodiment of the present application;

[0020] Figure 2 It is a layout diagram according to the full-width form factor M-FLW;

[0021] Figure 3 It is another schematic diagram of a test fixture for an MCIO connector according to an embodiment of the present application;

[0022] Figure 4 It is another schematic diagram of a test fixture for an MCIO connector according to an embodiment of the present application;

[0023] Figure 5 It is a front view of a test fixture for an MCIO connector according to an embodiment of the present application;

[0024] Figure 6 It is a top view of a test fixture for an MCIO connector according to an embodiment of the present application;

[0025] Figure 7 It is a side view of a test fixture for an MCIO connector according to an embodiment of the present application;

[0026] Figure 8 It is another side view of a test fixture for an MCIO connector according to an embodiment of the present application. Detailed implementation manners

[0027] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0028] The terms "first" and "second" in the specification and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0029] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "positive", "negative", "far", "near", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0030] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] The following will describe, in conjunction with Figures 1 - 8 , a test fixture for an MCIO connector according to an embodiment of the present application.

[0032] As Figure 1 shown, a test fixture 100 for an MCIO connector, which is used to test the MCIO connector on a host processor module with a full-width form factor M-FLW, includes: a test circuit board 11, one end of the test circuit board 11 is provided with a protrusion 12, the height H of the protrusion 12 is not less than the height of the memory slot on the host processor module, a gold finger 13 is provided at the end of the protrusion 12, the gold finger 13 is used for plugging into the MCIO connector to be tested, and a test adapter 14 is provided at the end of the test circuit board 11 away from the protrusion, and the test adapter 14 is connected to the gold finger 13 through a conductive line (not shown in the figure).

[0033] The test fixture 100 is used for signal testing of the MCIO connector, such as for signal integrity verification and analysis of the MCIO connector for the 5.0 version of the High-Speed Serial Computer Extension Bus Standard (PCIe Gen5). The test circuit board is a circuit board capable of being used for signal testing, including a Printed Circuit Board (PCB), a Printed Circuit Board Assembly (PCBA), etc., and its type is not specifically limited. The protrusion 12 provided at one end of the test circuit board 11 is used to avoid the memory slot on the host processor module, and its height H is not less than the height of the memory slot. Optionally, the protrusion 12 is part of the test circuit board 11. The gold finger 13 provided at the end of the protrusion 12 is plugged into the MCIO connector to be tested on the one hand, and is connected to the test adapter 14 through a conductive line on the other hand, so as to form a connection between the test adapter 14 and the MCIO connector to be tested, enabling the test adapter 14 to be used for signal testing of different terminals of the MCIO connector.

[0034] According to Figure 2 The layout diagram of the M-FLW specification shown, the host processor module includes a platform customization area, an infrastructure connection area, a reference plane, a "far" IO connector area 20 away from the reference plane, a "near" IO connector area 30 close to the reference plane, etc., and this specification further stipulates the placement areas of different devices. For example, according to this specification, the MCIO connector should be placed in the "far" IO connector area 20. When testing the MCIO connector placed in the "far" IO connector area 20, the devices that are likely to interfere with its test fixture include the memory card slot, the Central Processing Unit (CPU), etc. Among them, the CPU can be replaced with a version with a relatively low height, such as using an ultra-thin CPU; while the height variable range of the memory card slot is relatively small, so when avoiding interfering devices, the height of the memory card slot needs to be considered.

[0035] According to the test fixture 100 of the MCIO connector in the embodiment of the present application, by including a test circuit board, a protrusion is provided at one end of the test circuit board, the height of the protrusion is not less than the height of the memory slot on the host processor module, a gold finger is provided at the end of the protrusion, the gold finger is used for plugging into the MCIO connector to be tested, a test adapter is provided at the end of the test circuit board away from the protrusion, and the test adapter is connected to the gold finger through a conductive line. The test fixture has a protrusion with a height higher than the memory slot, so it can avoid the memory slot and prevent interference with the memory slot, and then smoothly plug into the MCIO connector.

[0036] In a possible implementation, the memory slot includes a dual in-line memory module (DIMM) slot, and the height of the protrusion 12 is not less than 19 mm.

[0037] Optionally, the memory slot can also be other types of slots suitable for the memory of the host processor module, such as a small outline dual in-line memory module (SODIMM) slot, a double data rate synchronous dynamic random-access memory (DDR SDRAM) card slot, etc. For other different types of card slots, the height of the protrusion 12 can be changed accordingly.

[0038] For the commonly used DIMM slot, the height of the protrusion is restricted to avoid the DIMM slot on the premise of meeting the height limit requirements of the M-FLW specification.

[0039] In a possible implementation, the test adapter 14 includes a pluggable MMPX connector.

[0040] The MMPX connector is a small coaxial connector with a quick-connect structure and has a small mechanical size. In addition, compared with connectors of other connection methods, using a pluggable MMPX connector can provide a reliable connection, ensure the stability of signal transmission and signal quality, so as to improve the accuracy of signal testing.

[0041] In a possible implementation, the test adapter 14 includes a transmit test adapter for testing the transmit terminals of the MCIO connector, a receive test adapter for testing the receive terminals of the MCIO connector, and a comparison test adapter for comparing test results. The number of the transmit test adapters corresponds to the number of the transmit terminals of the MCIO connector, and the number of the receive test adapters corresponds to the number of the receive terminals of the MCIO connector.

[0042] Optionally, the number of the transmitting test adapters is the same as the number of the transmitting terminals of the MCIO connector, and the number of the receiving test adapters is the same as the number of the receiving terminals of the MCIO connector. For example, for an 8x MCIO connector, the number of the transmitting test adapters is 8 pairs, and the number of the receiving test adapters is also 8 pairs. Further, the transmitting test adapters are connected to the transmitting terminals of the MCIO connector in a one-to-one correspondence manner, and the receiving test adapters are connected to the receiving terminals of the MCIO connector in a one-to-one correspondence manner. For example, the first transmitting test adapter is connected to the first transmitting terminal of the MCIO connector. When the test result of the first transmitting test adapter is abnormal, it indicates that the first transmitting terminal of the MCIO connector is faulty. Therefore, each terminal of the MCIO connector can be tested in a targeted manner.

[0043] In addition, the comparison test adapter is used to provide a reference value for the test. Based on this reference value, the test results of different terminals can be compared. Therefore, the accuracy of the test can be further improved.

[0044] See Figure 3 Another schematic diagram of the test fixture for the MCIO connector according to an embodiment of the present application is shown. In a possible implementation manner, the test circuit board 14 includes a first surface a for placing the transmitting test adapters and a second surface b for placing the receiving test adapters. Optionally, the first surface a is the front surface of the test circuit board 14, which is used to place the transmitting test adapters and the comparison test adapters; the second surface b is the back surface of the test circuit board 14, which is used to place the receiving test adapters and the comparison test adapters.

[0045] In a possible implementation manner, a first area 101 on the first surface a for accommodating the test adapters is arranged staggeredly with a second area 102 on the second surface for accommodating the test adapters b.

[0046] The first area and the second area do not coincide, including that the positions of the receiving test adapters (or comparison test adapters) located in the upper part of the front surface of the circuit board and the transmitting test adapters (or comparison test adapters) located in the lower part of the back surface of the circuit board do not coincide. The non-coincidence of the first area and the second area also includes that the arrangement manner of the test adapters in the first area is different from the arrangement manner of the test adapters in the second area. Optionally, the first area 101 for accommodating the receiving test adapters and the comparison test adapters is located in the upper part of the front surface of the test circuit board 14; the second area 102 for accommodating the transmitting test adapters and the comparison test adapters is located in the lower part of the back surface of the test circuit board 14. It can be understood that it can also be that the first area 101 is located on the left side of the circuit board and the second area 102 is located on the right side of the circuit board, or other ways to stagger the first area and the second area.

[0047] By staggering the first region and the second region, signal crosstalk during the test can be avoided, and the connection reliability between the test adapter and the test circuit board can be improved.

[0048] In a possible implementation, on the first surface a, the length of the first conductive line for connecting each transmitting test adapter to the gold finger is 2 inches; on the second surface b, the length of the second conductive line for connecting each receiving test adapter to the gold finger is 4 inches. By restricting the lengths of different conductive lines, the structure of the test fixture is further clarified.

[0049] In a possible implementation, the thickness of the test circuit board is not less than the thickness of the gold finger.

[0050] Among the different components included in the test fixture of the MCIO connector, the gold finger is usually the component with the thickest thickness. Therefore, the thickness of the test circuit board is not less than the thickness of the gold finger. Optionally, the thickness of the test circuit board is equal to the thickness of the gold finger.

[0051] In a possible implementation, the number of the test circuit boards is multiple. By including multiple test circuit boards in the test fixture, multiple circuit boards can be simultaneously used for signal testing of the MCIO connector. Therefore, the test efficiency can be improved.

[0052] See Figure 4 Another schematic diagram of the test fixture of the MCIO connector shown. In a possible implementation, x1 and x3 are greater than or equal to 44 mm to accommodate 20 MMPX connectors. x2 is the same as the width of the MCIO connector, and optionally x2 is equal to 23 mm. x4 is greater than or equal to 111 mm, y1 is greater than or equal to 69 mm, and y3 is greater than or equal to 88 mm to accommodate 44 MMPX connectors. y2 is greater than or equal to 19 mm to avoid interference with the memory card slot. d is the same as the gold finger size and is equal to 15.7 mm.

[0053] In a possible implementation, the protruding portion is rectangular. Optionally, its length is 23 mm and its width is 19 mm.

[0054] To further illustrate the situation of using the test fixture of the MCIO connector according to the embodiment of the present application on the host processor module, Figure 5 A front view of the test fixture 100 of the MCIO connector plugged into the host processor module is shown, Figure 6 A top view of the test fixture 100 of the MCIO connector plugged into the host processor module is shown, Figure 7 A side view of the test fixture 100 of the MCIO connector plugged into the host processor module is shown, Figure 8Shows another side view of the test fixture 100 plugged into the MCIO connector of the host processor module.

[0055] The test fixture 100 for the MCIO connector according to an embodiment of the present application includes a test circuit board. One end of the test circuit board is provided with a protrusion, the height of the protrusion is not less than the height of the memory slot on the host processor module, and a gold finger is provided at the end of the protrusion. The gold finger is used for plugging into the MCIO connector to be tested. A test adapter is provided at the end of the test circuit board away from the protrusion, and the test adapter is connected to the gold finger through a conductive line. Since the test fixture has a protrusion with a height higher than the memory slot, it can avoid the memory slot and prevent interference with the memory slot, and then successfully plug into the MCIO connector.

[0056] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0057] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A test fixture for an MCIO connector, used for testing an MCIO connector on a host processor module with a full-width form factor M-FLW, characterized in that: include: A test circuit board, wherein a protrusion is provided at one end of the test circuit board, wherein the height of the protrusion is not less than the height of the memory slot on the host processor module, a gold finger is provided at the end of the protrusion, and the gold finger is used to be plugged with the MCIO connector to be tested, and a test adapter is provided at one end of the test circuit board away from the protrusion, and the test adapter is connected to the gold finger through a conductive line.

2. The test fixture according to claim 1, characterized in that: The memory slot comprises a dual in-line memory module DIMM slot, and the height of the protrusion is not less than 19 mm.

3. The test fixture according to claim 1, characterized in that: The test adapter comprises a pluggable MMPX connector.

4. The test fixture according to claim 1, characterized in that: The test adapter includes a sending test adapter for testing the sending terminal of the MCIO connector, a receiving test adapter for testing the receiving terminal of the MCIO connector, and a comparison test adapter for comparing test results.

5. The test fixture according to claim 4, characterized in that: The number of the transmission test adapters corresponds to the number of the transmission terminals of the MCIO connector, and the number of the reception test adapters corresponds to the number of the reception terminals of the MCIO connector.

6. The test fixture according to claim 4, characterized in that: The test circuit board includes a first surface for placing the transmitting test adapter and a second surface for placing the receiving test adapter.

7. The test fixture according to claim 6, characterized in that: A first area of ​​the first surface for accommodating a test adapter is staggered with a second area of ​​the second surface for accommodating a test adapter.

8. The test fixture according to claim 6, characterized in that: On the first surface, the length of the first conductive line for connecting each transmission test adapter and the gold finger is 2 inches; On the second surface, the length of the second conductive circuit used to connect each receiving test adapter and the gold finger is 4 inches.

9. The test fixture according to claim 1, characterized in that: The thickness of the test circuit board is not less than the thickness of the gold finger.

10. The test fixture according to claim 1, characterized in that: The protrusion is rectangular.

Images