High-temperature-resistant chip capacitor

Abstract

The utility model relates to the technical field of capacitors, and discloses a high-temperature-resistant chip capacitor, which comprises a capacitor body, a high-temperature-resistant cover is sleeved outside the capacitor body, a limiting plate is fixedly connected outside the high-temperature-resistant cover, a sealing plate is arranged at the end part of the high-temperature-resistant cover through a positioning pin, and the sealing plate is fixedly connected with the high-temperature-resistant cover. The two sides of the capacitor body are fixedly connected with binding posts, the inner side of the sealing plate is provided with a spring, and the inner side of the spring is fixedly connected with an extrusion gasket. According to the high-temperature-resistant chip capacitor, the high-temperature-resistant cover is installed outside the capacitor body, the exterior of the capacitor body is protected through the high-temperature-resistant cover, meanwhile, the capacitor body is protected through the high-temperature-resistant cover, heat transmission is reduced, and the high-temperature-resistant performance of equipment is improved; meanwhile, the upper protective cover and the lower protective cover can improve the heat dissipation performance outside the high-temperature-resistant cover of the equipment, and the protective performance of the equipment is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a high-temperature resistant chip capacitor. Background Technique

[0002] A chip capacitor is a type of capacitor material. The full name of a chip capacitor is: multilayer (stacked, laminated) ceramic capacitor, also known as a chip capacitor or chip capacitor. There are two ways to represent chip capacitors, one is in inches and the other is in millimeters. When using a chip capacitor, it will be installed on a power board, and heat will be generated when the circuit board is used. When the heat is too high, it will damage the capacitor.

[0003] In the publicly authorized patent, in the Chinese patent with the patent number "CN202122718097.8", a high-temperature resistant and high-voltage resistant chip capacitor is disclosed. By setting the annular heat sink, during use, heat can be conducted between the sleeve and the annular heat sink, and the contact area between the heat and the air can be increased, so that the heat dissipated by the high-voltage resistant chip capacitor body during use can be quickly dissipated, so that the high-voltage resistant chip capacitor body can withstand high temperatures, so as to make full use of the high-voltage resistant chip capacitor body and reduce the use cost of the high-voltage resistant chip capacitor body;

[0004] In the above device, when producing the chip capacitor, a high-temperature resistant material will be installed outside the capacitor. By improving the heat conductivity of the capacitor through the high-temperature resistant material, the heat resistance performance of the capacitor can be improved, and damage to the capacitor caused by high temperature can be reduced. At the same time, in the prior art, when installing the high-temperature resistant material, the high-temperature resistant material is attached to the outside of the capacitor in a pasting manner. When the high-temperature resistant material is attached to the outside of the capacitor, heat has conductivity. Therefore, when the capacitor is in contact with the heat conduction device and the heat transmitted by the heat conduction device is not completely discharged, it will cause an increase in problems of the heat conduction device. At this time, the heat conduction device will also transmit temperature at the contact part with the capacitor, and the transmitted heat will damage the capacitor. For this reason, we propose a high-temperature resistant chip capacitor. Summary of the Utility Model

[0005] Aiming at the deficiencies of the existing high-temperature resistant chip capacitors, the utility model provides a high-temperature resistant chip capacitor, which has the advantages that a high-temperature resistant cover is sleeved outside the capacitor body, and a limiting plate is installed outside the high-temperature resistant cover. When the upper protective cover is installed outside the high-temperature resistant cover, the contact surface between the high-temperature resistant cover and the upper protective cover is improved through the limiting plate. At the same time, air holes are opened outside the upper protective cover, thereby improving the heat dissipation performance of the device, and solving the problems raised in the above background technique.

[0006] The present utility model provides the following technical solution: A high-temperature resistant chip capacitor, comprising a capacitor body, an outer sleeve of the capacitor body is provided with a high-temperature resistant cover, an outer part of the high-temperature resistant cover is fixedly connected with a limiting plate, an end part of the high-temperature resistant cover is provided with a sealing plate through a positioning pin, two sides of the capacitor body are fixedly connected with wiring columns, a spring is installed inside the sealing plate, an inner part of the spring is fixedly connected with a pressing gasket, an upper protective cover and a lower protective cover are sequentially sleeved on upper and lower ends of the outer part of the high-temperature resistant cover, one sides of the upper protective cover and the lower protective cover are fixedly connected with a first limiting buckle and a second limiting buckle respectively, a rotating buckle is installed outside the first limiting buckle, an air outlet hole is formed inside the lower protective cover, and an air flow baffle is fixedly connected to an outer part of the lower protective cover.

[0007] Preferably, the capacitor body is arranged in the middle inside the high-temperature resistant cover, and wiring columns are installed on both sides of the capacitor body, and the wiring columns extend to the outside of the high-temperature resistant cover.

[0008] Preferably, the spring is installed between the sealing plate and the pressing gasket, the pressing gasket is sleeved on the outside of the wiring column, and the spring is installed on both sides of the wiring column.

[0009] Preferably, the lower protective cover is arranged at the lower end of the high-temperature resistant cover, and the lower end of the lower protective cover is kept parallel to the lower part of the high-temperature resistant cover.

[0010] Preferably, a movable hole is formed inside the second limiting buckle, and the rotating buckle is arranged inside the movable hole.

[0011] Preferably, the air flow baffle is conical, and the air flow baffles are arranged at equal intervals on the outside of the upper protective cover and on both sides of the lower protective cover.

[0012] Preferably, air outlet holes are formed inside both the upper protective cover and the lower protective cover, and the air outlet holes are arranged in a cross-inclined state.

[0013] Compared with the existing high-temperature resistant chip capacitor, the present utility model has the following beneficial effects:

[0014] 1. For this high-temperature resistant chip capacitor, the high-temperature resistant cover is installed outside the capacitor body, and the high-temperature resistant cover protects the outside of the capacitor body. At the same time, the high-temperature resistant cover protects the capacitor body, reduces heat transfer, improves the high-temperature resistance performance of the device. At the same time, the upper protective cover and the lower protective cover are installed outside the high-temperature resistant cover, and the upper protective cover and the lower protective cover can improve the heat dissipation performance outside the high-temperature resistant cover of the device, and further improve the protection performance of the device.

[0015] 2. The high-temperature resistant patch capacitor is arranged inside the high-temperature resistant cover through the capacitor body. At the same time, sealing plates are installed on both sides of the high-temperature resistant cover. The sealing plates push the extrusion gaskets through springs to squeeze and limit the position of the capacitor body, improving the stability of the capacitor body when its position is limited inside the high-temperature resistant cover. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the main structure of the present utility model;

[0017] Figure 2 It is a schematic diagram of the side sectional structure of the main body of the present utility model;

[0018] Figure 3 It is a schematic diagram of the top sectional structure of the main body of the present utility model;

[0019] Figure 4 It is a schematic diagram of the side sectional structure of the main body of the present utility model;

[0020] Figure 5 It is a schematic diagram of the enlarged partial structure of the protective cover of the present utility model;

[0021] Figure 6 It is a schematic diagram of the enlarged partial structure of the limit buckle of the present utility model.

[0022] In the figure: 1. Capacitor body; 2. High-temperature resistant cover; 3. Limit plate; 4. Sealing plate; 5. Spring; 6. Extrusion gasket; 7. Terminal; 8. Positioning pin; 9. Upper protective cover; 10. Lower protective cover; 11. First limit buckle; 12. Second limit buckle; 13. Rotating buckle; 14. Air outlet; 15. Gas flow baffle. Detailed Implementation Manner

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6, A high-temperature resistant patch capacitor, comprising a capacitor body 1. An external high-temperature resistant cover 2 is sleeved outside the capacitor body 1. The high-temperature resistant cover 2 protects the outside of the capacitor body 1, reducing the contact between the capacitor body 1 and external objects and reducing heat transfer, thereby improving the heat resistance of the device. A limiting plate 3 is fixedly connected to the outside of the high-temperature resistant cover 2. The limiting plate 3 drives a space to be formed between the capacitor body 1 and the high-temperature resistant cover 2, reducing heat transfer. A sealing plate 4 is installed at the end of the high-temperature resistant cover 2 through a positioning pin 8. The sealing plate 4 is installed on both sides of the high-temperature resistant cover 2, and at the same time, it controls that the capacitor body 1 can be disassembled inside the high-temperature resistant cover 2. Wiring columns 7 are fixedly connected to both sides of the capacitor body 1. The wiring columns 7 drive the capacitor to form a circuit. A spring 5 is installed inside the sealing plate 4. An extrusion gasket 6 is fixedly connected to the inside of the spring 5. The spring 5 pushes the extrusion gasket 6 to control the position of the capacitor body 1 inside the high-temperature resistant cover 2 to be limited. An upper protective cover 9 and a lower protective cover 10 are sequentially sleeved on the upper and lower ends of the outside of the high-temperature resistant cover 2. The upper protective cover 9 and the lower protective cover 10 are sleeved outside the capacitor body 1. A first limiting buckle 11 and a second limiting buckle 12 are fixedly connected to one side of the side surfaces of the upper protective cover 9 and the lower protective cover 10. The first limiting buckle 11 and the second limiting buckle 12 drive the upper protective cover 9 and the lower protective cover 10 to be spliced and limited to each other. A rotating buckle 13 is installed outside the first limiting buckle 11. An air outlet hole 14 is opened inside the lower protective cover 10. The air outlet hole 14 drives the air to circulate. A gas circulation baffle 15 is fixedly connected to the outside of the lower protective cover 10. The gas circulation baffle 15 is installed on the outside of the upper protective cover 9 and the lower protective cover 10. The gas circulation baffle 15 performs a protective treatment on the outside of the upper protective cover 9 and the lower protective cover 10.

[0025] Please refer to Figure 3 , The capacitor body 1 is arranged in the middle inside the high-temperature resistant cover 2. At the same time, wiring columns 7 are installed on both sides of the capacitor body 1. The wiring columns 7 extend to the outside of the high-temperature resistant cover 2. After installing the capacitor body 1 inside the high-temperature resistant cover 2 and extending the wiring columns 7 to the outside of the high-temperature resistant cover 2, the capacitor can be installed on the circuit through the wiring columns 7.

[0026] Please refer to Figure 3 , The spring 5 is installed between the sealing plate 4 and the extrusion gasket 6. The extrusion gasket 6 is sleeved outside the wiring column 7. The spring 5 is installed on both sides of the wiring column 7. By installing the spring 5 inside the sealing plate 4, at the same time, the spring 5 pushes the extrusion gasket 6 to move inward, and at the same time, the extrusion gasket 6 can drive the position of the capacitor body 1 inside the high-temperature resistant cover 2 to be squeezed and limited.

[0027] Please refer to Figure 1, the lower protective cover 10 is arranged at the lower end of the high-temperature resistant cover 2. At the same time, the lower end of the lower protective cover 10 remains parallel to the lower part of the high-temperature resistant cover 2. The lower protective cover 10 is installed at the lower end of the high-temperature resistant cover 2. After the high-temperature resistant cover 2 is controlled to be fitted and installed on the circuit board, the high-temperature resistant cover 2 can remain in a fitted state with the circuit board.

[0028] Please refer to Figure 6 , an activity hole is formed inside the second limit buckle 12. At the same time, the rotating buckle 13 is arranged inside the activity hole. By forming the activity hole inside the second limit buckle 12, when the upper protective cover 9 and the lower protective cover 10 are fitted and installed on the outside of the high-temperature resistant cover 2, the upper protective cover 9 and the lower protective cover 10 drive the first limit buckle 11 and the second limit buckle 12 to contact each other. At the same time, the rotating buckle 13 extends into the second limit buckle 12. By rotating the rotating buckle 13, the rotating buckle 13 can drive the position between the first limit buckle 11 and the second limit buckle 12 to be limited.

[0029] Please refer to Figure 1 , the gas flow baffle 15 is conical. At the same time, the gas flow baffle 15 is arranged at equal intervals on the outside of the upper protective cover 9 and on both sides of the lower protective cover 10. Since the gas flow baffle 15 is conical, the gas flow baffle 15 can protect one side of the outside of the upper protective cover 9. At the same time, when gas flows, through the inclined plane formed by the gas flow baffle 15 on the outside of the upper protective cover 9 and the lower protective cover 10, the gas can be driven to flow into the high-temperature resistant cover 2, and then the inside of the high-temperature resistant cover 2 can be cooled. By using the high-temperature resistant cover 2, the overall heat resistance of the equipment can be improved.

[0030] Please refer to Figure 2 , air outlet holes 14 are formed inside both the upper protective cover 9 and the lower protective cover 10. The air outlet holes 14 are arranged in a cross-inclined state. By fitting the upper protective cover 9 and the lower protective cover 10 on the outside of the high-temperature resistant cover 2, the upper protective cover 9 and the lower protective cover 10 protect the outside of the high-temperature resistant cover 2. At the same time, the air outlet holes 14 are arranged in a cross pattern. Then the holes can drive gas to flow, and the air outlet holes 14 are in an inclined state, which can prevent dust in the air from being transmitted to the outside of the high-temperature resistant cover 2 and improve the dust-proof effect when the capacitor is used.

[0031] Working principle: When in use, the capacitor body 1 is installed inside the high-temperature resistant cover 2. At the same time, sealing plates 4 are installed on both sides of the high-temperature resistant cover 2. The sealing plates 4 drive the springs 5 to push the extrusion gaskets 6 to squeeze and limit the position of the capacitor body 1 inside the high-temperature resistant cover 2. A positioning pin 8 is installed on the side of the high-temperature resistant cover 2 to limit the position of the sealing plate 4. At the same time, an upper protective cover 9 and a lower protective cover 10 are sleeved outside the high-temperature resistant cover 2. The heat dissipation performance of the device is improved by the air outlet holes 14 and the gas flow baffles 15 provided on the outside of the upper protective cover 9. And because the high-temperature resistant cover 2 protects the outside of the capacitor body 1, the heat transfer to the outside of the capacitor body 1 is reduced, and the heat resistance of the device is improved.

[0032] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high temperature resistant chip capacitor, comprising a capacitor body (1), the outside of the capacitor body (1) is sleeved with a high temperature resistant cover (2), the outside of the high temperature resistant cover (2) is fixedly connected to a limit plate (3), the end of the high temperature resistant cover (2) is installed with a sealing plate (4) through a positioning pin (8), and the two sides of the capacitor body (1) are fixedly connected with terminal posts (7), characterized in that: A spring (5) is installed on the inner side of the sealing plate (4), and an extrusion gasket (6) is fixedly connected to the inner side of the spring (5). The upper end and the lower end of the outer side of the high-temperature resistant cover (2) are respectively sleeved with an upper protective cover (9) and a lower protective cover (10). A first limit buckle (11) and a second limit buckle (12) are fixedly connected to the side of the upper protective cover (9) and the lower protective cover (10). A rotating buckle (13) is installed on the outside of the first limit buckle (11). An air outlet (14) is opened inside the lower protective cover (10), and a gas flow baffle (15) is fixedly connected to the outside of the lower protective cover (10).

2. A high temperature resistant chip capacitor according to claim 1, characterized in that: The capacitor body (1) is arranged in the middle of the high temperature resistant cover (2), and binding posts (7) are installed on both sides of the capacitor body (1), and the binding posts (7) extend to the outside of the high temperature resistant cover (2).

3. The high temperature resistant chip capacitor according to claim 1, characterized in that: The spring (5) is installed between the sealing plate (4) and the extrusion gasket (6), the extrusion gasket (6) is sleeved on the outside of the terminal (7), and the spring (5) is installed on both sides of the terminal (7).

4. The high temperature resistant chip capacitor according to claim 1, characterized in that: The lower protective cover (10) is arranged at the lower end of the high temperature resistant cover (2), and the lower end of the lower protective cover (10) is kept parallel to the lower part of the high temperature resistant cover (2).

5. The high temperature resistant chip capacitor according to claim 1, characterized in that: A movable hole is provided inside the second limiting buckle (12), and a rotating buckle (13) is arranged inside the movable hole.

6. The high temperature resistant chip capacitor according to claim 1, characterized in that: The gas circulation baffles (15) are conical in shape, and are arranged at equal intervals outside the upper protective cover (9) and on both sides of the lower protective cover (10).

7. The high temperature resistant chip capacitor according to claim 1, characterized in that: The upper protective cover (9) and the lower protective cover (10) are both provided with air outlet holes (14) inside, and the air outlet holes (14) are arranged in a cross-tilted state.

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