Detection device for wafer snap ring

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a wafer snap ring detection device. The wafer snap ring detection device comprises a detection table, a detection unit and a bearing unit, the detection unit is arranged on the detection table, the detection unit comprises a first detection plate and a second detection plate which are arranged in a spaced mode, a detection gap is formed between the first detection plate and the second detection plate, and the detection gap is larger than a preset thickness value of a wafer snap ring; the receiving unit is arranged on the detection table, and the qualified clamping ring can fall to the receiving unit from the detection gap. The snap ring detection device can detect whether the snap ring has deformation or residual glue, the detection process is simple and convenient, so that the snap rings used in subsequent production are all qualified snap rings, and the production safety and the product yield are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a detection device for a wafer chuck ring. Background Art

[0002] In the wafer cutting process, it is necessary to mount the wafer on the chuck ring for cutting. However, the following problems may occur during the production process or manual operation: First, under the influence of external forces during the production process, the chuck ring will warp upwards. Since the manipulator normally pushes the chuck ring to the chuck at the center position, the warped chuck ring will cause the manipulator to push the chuck ring at the upper end, resulting in a pushing distance greater than the preset pushing distance, and further causing the chuck ring to be placed offset. During cutting, the tool will cut the offset chuck ring, causing tool breakage and also resulting in the wafer cutting not meeting the requirements and becoming defective products. Second, the residual glue on the chuck ring is not wiped clean. After the cutting is completed and the remaining waste film is removed from the chuck ring, residual glue will remain on the chuck ring. Currently, it is mostly wiped with alcohol manually. The uncleaned residual glue will cause two or three chuck rings to stick together. During the production process, due to the reduced viscosity of the residual glue on the chuck ring or exceeding the weight that the vacuum suction nozzle can bear, the wafer will fall or the chuck ring will hit the wafer, resulting in quality accidents.

[0003] Therefore, there is an urgent need for a detection device for a wafer chuck ring to solve the above problems. Summary of the Utility Model

[0004] Based on the above, the purpose of the utility model is to provide a detection device for a wafer chuck ring, which can be used to detect whether the chuck ring is deformed or has residual glue, so that the chuck rings used in subsequent production are all qualified chuck rings, ensuring the safety of production and the yield of products.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] The detection device for a wafer chuck ring includes:

[0007] A detection table;

[0008] A detection unit, arranged on the detection table, the detection unit includes a first detection plate and a second detection plate arranged at intervals, a detection gap is arranged between the first detection plate and the second detection plate, and the detection gap is set to be greater than the preset value of the wafer chuck ring thickness;

[0009] A receiving unit, arranged on the detection table, and the qualified chuck rings can fall from the detection gap to the receiving unit.

[0010] As a preferred scheme of the detection device for a wafer chuck ring, the first detection plate is fixedly arranged on the detection table, and the position of the second detection plate is adjustable on the first detection plate to adjust the detection gap.

[0011] As a preferred embodiment of the detection device for the wafer retaining ring, the detection unit is provided with an adjustment slide rail and a fixing member. One end of the adjustment slide rail is connected to the first detection plate, the second detection plate is slidably connected to the adjustment slide rail, and the fixing member is used to fix the second detection plate and the adjustment slide rail.

[0012] As a preferred embodiment of the detection device for the wafer retaining ring, the detection unit is provided with a holding member, and the holding member is arranged between the first detection plate and the second detection plate.

[0013] As a preferred embodiment of the detection device for the wafer retaining ring, the receiving unit includes a carrying box and two guiding flanges. An opening is provided above the carrying box, and the carrying box is used to carry the qualified retaining rings. The two guiding flanges are respectively arranged on both sides of the opening.

[0014] As a preferred embodiment of the detection device for the wafer retaining ring, a buffer layer is arranged at the inner bottom of the carrying box.

[0015] As a preferred embodiment of the detection device for the wafer retaining ring, the receiving unit is slidably arranged on the detection table so as to be selectively placed below the detection unit.

[0016] As a preferred embodiment of the detection device for the wafer retaining ring, the receiving unit further includes a guide rail, a slider and a carrying plate. The slider is slidably arranged on the guide rail, the carrying plate is arranged on the slider, and the carrying box is arranged on the carrying plate.

[0017] As a preferred embodiment of the detection device for the wafer retaining ring, the detection table includes a bottom plate and two columns arranged on the bottom plate. The detection unit is arranged at the connection of the two columns and is inclined relative to the bottom plate, and the receiving unit is arranged on the bottom plate.

[0018] As a preferred embodiment of the detection device for the wafer retaining ring, the inclination angle of the detection unit relative to the bottom plate is adjustable, and the detection unit can be locked to a certain inclination angle relative to the bottom plate.

[0019] As a preferred embodiment of the detection device for the wafer retaining ring, one end of the detection unit is rotatably connected to the column. The detection device is further provided with a first adjusting member, a second adjusting member and a locking member. One end of the first adjusting member is rotatably connected to the column, and the other end is provided with a plurality of first adjusting holes. One end of the second adjusting member is rotatably connected to the detection unit, and the other end is provided with a second adjusting hole. The locking member can pass through the second adjusting hole and one of the first adjusting holes.

[0020] The beneficial effects of the present utility model are:

[0021] The utility model realizes the detection of the chuck by setting a detection table for carrying a detection unit and a receiving unit. A detection gap is arranged between a first detection plate and a second detection plate of the detection unit, and the detection gap is larger than a preset value of the thickness of the wafer chuck. During detection, the chuck to be detected is placed above the first detection plate and the second detection plate, so that the chuck to be detected can freely fall above the detection gap. Due to the setting of the preset value, the deformed and / or residual adhesive chucks cannot fall to the receiving unit, and the chucks that can fall to the receiving unit are qualified chucks, thereby realizing the detection of the chucks. The detection process is simple and convenient, so that the chucks used in subsequent production are all qualified chucks, ensuring the safety of production and the yield rate of products. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments of the present utility model. Obviously, the following described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the content of the embodiments of the present utility model and these drawings.

[0023] Figure 1 FIG. 11 is a schematic diagram of a detection device for a wafer chuck provided by a specific embodiment of the present utility model;

[0024] Figure 2 FIG. 15 is a top view of a detection device for a wafer chuck provided by a specific embodiment of the present utility model;

[0025] Figure 3 FIG. 19 is a partial side view of a detection device for a wafer chuck provided by a specific embodiment of the present utility model.

[0026] In the figure:

[0027] 100, detection table; 110, bottom plate; 120, column;

[0028] 200, detection unit; 201, detection gap; 210, first detection plate; 220, second detection plate; 231, adjustment slide rail; 232, fixing member; 240, holding member;

[0029] 300, receiving unit; 310, carrying box; 320, guiding flange;

[0030] 410, first adjustment member; 411, first adjustment hole; 420, second adjustment member. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where like or similar reference numerals denote like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present utility model, and should not be construed as limiting the present utility model.

[0032] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0033] Unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed" should be understood in a broad sense. For example, it may be a fixed connection or a detachable connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "under" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0035] The technical solution of the present utility model will be further described below in conjunction with the accompanying drawings and through specific embodiments.

[0036] As Figures 1-3As shown in the figure, this embodiment provides a detection device for a wafer retaining ring. The detection device for the wafer retaining ring includes a detection table 100, a detection unit 200, and a receiving unit 300. The detection unit 200 is disposed on the detection table 100. The detection unit 200 includes a first detection plate 210 and a second detection plate 220 that are spaced apart from each other. A detection gap 201 is provided between the first detection plate 210 and the second detection plate 220, and the detection gap 201 is set to be greater than a preset value of the thickness of the wafer retaining ring. The receiving unit 300 is disposed on the detection table 100, and a qualified retaining ring can fall from the detection gap 201 to the receiving unit 300.

[0037] By providing the detection table 100, it is used to carry the detection unit 200 and the receiving unit 300. A detection gap 201 is provided between the first detection plate 210 and the second detection plate 220 of the detection unit 200, and the detection gap 201 is greater than the preset value of the thickness of the wafer retaining ring. During detection, the retaining ring to be detected is placed above the first detection plate 210 and the second detection plate 220, so that the retaining ring to be detected can freely fall above the detection gap 201. Due to the setting of the preset value, the deformed and / or residual adhesive retaining ring cannot fall to the receiving unit 300, and the retaining ring that can fall to the receiving unit 300 is a qualified retaining ring. In this way, the detection of the retaining ring is realized. The detection process is simple and convenient, so that the retaining rings used in subsequent production are all qualified retaining rings, ensuring the safety of production and the yield of products.

[0038] Exemplarily, the preset value is set to 0.3 mm - 0.5 mm. Optionally, when detecting a retaining ring with a thickness of 1.6 mm, the detection gap 201 can be set to 2 mm; when detecting a retaining ring with a thickness of 2 mm, the detection gap 201 can be set to 2.4 mm. It can be understood that the width of the detection gap 201 is not less than the diameter of the largest-sized wafer retaining ring among the wafer retaining rings to be detected, ensuring that the wafer retaining ring to be detected can pass through while improving the versatility of the detection device.

[0039] Specifically, the first detection plate 210 is fixedly disposed on the detection table 100, and the second detection plate 220 is disposed to be position-adjustable relative to the first detection plate 210. Therefore, when it is necessary to adjust the detection gap 201, only the position of the second detection plate 220 relative to the first detection plate 210 needs to be adjusted, with a simpler structure and more convenient adjustment.

[0040] Furthermore, the detection table 100 includes a bottom plate 110 and two columns 120 disposed on the bottom plate 110. The detection unit 200 is connected to the two columns 120. Specifically, the first detection plate 210 is disposed on the two columns 120; the receiving unit 300 is disposed on the bottom plate 110, and the bottom plate 110 is used to integrate the detection unit 200 and the receiving unit 300.

[0041] In this embodiment, the first inspection plate 210 is tilted relative to the bottom plate 110 , which is helpful to slow down the falling speed of the wafer retaining ring and avoid secondary damage to the wafer retaining ring.

[0042] Preferably, the detection unit 200 is adjustable in its inclination angle relative to the bottom plate 110, so that those skilled in the art can adjust the preset angle according to actual requirements to adapt to different detection scenarios. At the same time, the detection unit 200 can be locked to a certain inclination angle relative to the bottom plate 110, so that during the detection process, the positions of the detection unit 200 and the bottom plate 110 are fixed, avoiding the influence of relative movement on the detection results, thereby improving the reliability of the detection.

[0043] Exemplarily, one end of the detection unit 200 is rotatably connected to the column 120, and the detection device is further provided with a first adjustment member 410, a second adjustment member 420 and a locking member. One end of the first adjustment member 410 is rotatably set on the column 120, and the other end is provided with a plurality of first adjustment holes 411. One end of the second adjustment member 420 is rotatably set on the detection unit 200, and the other end is provided with a second adjustment hole. It can be understood that when the second adjustment hole is directly opposite to different first adjustment holes 411, there is a certain inclination angle between the detection unit 200 and the base plate 110. Further, in order to enable the detection unit 200 to be locked relative to the base plate 110 at the inclination angle, the locking member can be inserted into the second adjustment hole and the first adjustment hole 411. Optionally, the locking member can be set as a pin or a bolt. When it is set as a nut, after being inserted into the second adjustment hole and the first adjustment hole 411, the reliability of the locking can be further improved by screwing the nut.

[0044] It is worth noting that the lower end of the detection unit 200 can be set to be rotatably connected to the column 120, so that no matter how the tilt angle is adjusted, the wafer retaining ring falls to the same position, ensuring that the receiving unit 300 can reliably receive the qualified wafer retaining ring.

[0045] In other embodiments, the column 120 may be configured to be rotatably connected to the base plate 110, so as to achieve adjustable and lockable tilt angles of the detection unit 200 relative to the base plate 110. Those skilled in the art may configure the specific structure according to the prior art, and no specific limitation is made here.

[0046] Optionally, the detection unit 200 is provided with an adjusting rail 231 and a fixing member 232, one end of the adjusting rail 231 is connected to the first detection plate 210, and the second detection plate 220 is slidably connected to the adjusting rail 231. When adjusting the detection gap 201, it is only necessary to slide the second detection plate 220. When the second detection plate 220 is slid to a suitable position, the second detection plate 220 is fixed to a suitable position of the adjusting rail 231 by the fixing member 232, so as to avoid changes in the detection gap 201 during detection and ensure the reliability of the detection process.

[0047] Preferably, the detection unit 200 is provided with a holding member 240. The holding member 240 is disposed between the first detection plate 210 and the second detection plate 220 and elastically supports the first detection plate 210 and the second detection plate 220, so that the two have a tendency to move away from each other. By providing the holding member 240, a supporting force can be provided to the second detection plate 220 to avoid the problem that the preset gap between the first detection plate 210 and the second detection plate 220 becomes smaller due to the failure of the fixing member 232. Exemplarily, the holding member 240 is provided as a spring, and the spring is compressively installed between the first detection plate 210 and the second detection plate 220. Correspondingly, the adjusting slide rail 231 can be provided as a bolt, the fixing member 232 is provided as a nut, the second detection plate 220 is slidably disposed on the smooth rod end of the screw, and the nut is connected to the threaded end of the screw.

[0048] As an alternative solution of the detection device for the wafer chuck, the receiving unit 300 includes a carrying box 310. An opening is provided above the carrying box 310, and a qualified chuck can enter the carrying box 310 through the opening, and the carrying box 310 is used to carry the qualified chuck. Specifically, the carrying box 310 is further provided with two guiding flanges 320, and the two guiding flanges 320 are respectively disposed on both sides of the opening, which can prevent the qualified chuck from falling outside the carrying box 310 and improve the reliability of the carrying box 310 for receiving the chuck.

[0049] Furthermore, a buffer layer is provided on the inner side wall of the carrying box 310. By providing the buffer layer, the secondary damage when the chuck falls is reduced. Optionally, the buffer layer can be provided as a rubber layer.

[0050] In this embodiment, the receiving unit 300 is slidably disposed on the detection table 100 to be selectively placed below the detection unit 200. It can be understood that during detection, the receiving unit 300 is disposed below the detection unit 200 to receive the qualified chuck; after detection, the receiving unit 300 can be slid to a position away from below the detection unit 200, which is convenient for the operator to take out the qualified chuck from the receiving unit 300.

[0051] Specifically, the receiving unit 300 further includes a guide rail, a slider and a carrying plate. The guide rail is disposed on the bottom plate 110, the slider is slidably disposed on the guide rail, the carrying plate is disposed on the slider, and the carrying box 310 is disposed on the carrying plate. The carrying plate can play a certain role in carrying the carrying box 310, thereby ensuring the reliability of the carrying box 310 for carrying the chuck. Exemplarily, a limiting block is further correspondingly disposed on the guide rail, so that when the slider cooperates with the limiting block, the carrying box 310 can be exactly located below the detection unit 200 to accurately receive the chuck.

[0052] Preferably, the detection unit 200 is provided with a measuring scale which can display the size of the detection gap 201, facilitating the operator to clarify the specific value of the detection gap 201. Further, at least three measuring scales are provided, and the three measuring scales are arranged circumferentially on the second detection plate 220. The arrangement of at least three measuring scales is conducive to detecting whether the detection gap 201 is consistent everywhere, avoiding the situation that the detection gap 201 is too small at a certain place, which may cause a qualified snap ring to be stuck and unable to fall, ensuring the accuracy and reliability of the snap ring detection. Optionally, the measuring scale can also be replaced by a distance sensor to make the detection of the detection gap 201 more accurate.

[0053] The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. A wafer retaining ring detection device, characterized in that: include: Testing station (100); A detection unit (200) is arranged on the detection platform (100), the detection unit (200) comprising a first detection plate (210) and a second detection plate (220) which are arranged at an interval from each other, a detection gap (201) is arranged between the first detection plate (210) and the second detection plate (220), and the detection gap (201) is set larger than a preset value of the wafer retaining ring thickness; A receiving unit (300) is arranged on the testing platform (100), and a qualified snap ring can fall from the testing gap (201) to the receiving unit (300).

2. The wafer retaining ring detection device according to claim 1, characterized in that: The first detection plate (210) is fixedly arranged on the detection platform (100), and the second detection plate (220) is adjustably arranged on the first detection plate (210) to adjust the detection gap (201).

3. The wafer retaining ring detection device according to claim 2, characterized in that: The detection unit (200) is provided with an adjustment slide rail (231) and a fixing member (232); one end of the adjustment slide rail (231) is connected to the first detection plate (210); the second detection plate (220) is slidably connected to the adjustment slide rail (231); and the fixing member (232) is used to fix the second detection plate (220) and the adjustment slide rail (231).

4. The wafer retaining ring detection device according to claim 2, characterized in that: The detection unit (200) is provided with a retaining member (240), and the retaining member (240) is arranged between the first detection plate (210) and the second detection plate (220), and elastically supports the first detection plate (210) and the second detection plate (220) so that the two have a tendency to move away from each other.

5. The wafer retaining ring detection device according to claim 1, characterized in that: The receiving unit (300) comprises a carrying box (310) and two guide flanges (320); an opening is arranged above the carrying box (310); the carrying box (310) is used to carry the qualified clamping ring; and the two guide flanges (320) are respectively arranged on both sides of the opening.

6. The wafer retaining ring detection device according to claim 5, characterized in that: The inner side wall of the carrying box (310) is provided with a buffer layer.

7. The wafer retaining ring detection device according to claim 1, characterized in that: The receiving unit (300) is slidably disposed on the detection platform (100) so as to be selectively placed below the detection unit (200).

8. The wafer retaining ring detection device according to any one of claims 1 to 7, characterized in that: The detection platform (100) comprises a base plate (110) and two columns (120) arranged on the base plate (110); the detection unit (200) is arranged on the two columns (120) and is inclined relative to the base plate (110); and the receiving unit (300) is arranged on the base plate (110).

9. The wafer retaining ring detection device according to claim 8, characterized in that: The detection unit (200) is adjustable in its inclination angle relative to the bottom plate (110), and the detection unit (200) can be locked to a certain inclination angle relative to the bottom plate (110).

10. The wafer retaining ring detection device according to claim 9, characterized in that: One end of the detection unit (200) is rotatably connected to the column (120), and the detection device is further provided with a first adjusting member (410), a second adjusting member (420) and a locking member, wherein one end of the first adjusting member (410) is rotatably arranged on the column (120), and the other end is provided with a plurality of first adjusting holes (411), one end of the second adjusting member (420) is rotatably arranged on the detection unit (200), and the other end is provided with a second adjusting hole, and the locking member can be inserted into the second adjusting hole and one of the first adjusting holes (411).

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