Substrate for packaging redistribution layer

Abstract

The utility model relates to a novel substrate designed for a packaging rewiring layer in a semiconductor device. The substrate aims to improve electrical and heat dissipation performance in a semiconductor package by using materials such as glass, ceramic or high-temperature polymer, so as to achieve an effect of improving heat management. One characteristic of the utility model is that the redistribution layer comprises an arc angle so as to promote smooth transition between redistribution lines and effectively reduce filling resistance of a conductive material. The redistribution layer is filled with conductive adhesive, such as copper or silver adhesive, into channels formed by selective laser etching or a 3D line printing technology. The method of manufacturing the printed circuit board ensures accurate formation of the conductive vias having arcuate angles, and involves a subsequent annealing step to cure the conductive adhesive.

Description

Technical Field

[0001] The present utility model relates to semiconductor packaging technology, and more particularly to a substrate for encapsulating redistribution layers (RDL) in semiconductor devices. Background Art

[0002] Semiconductor devices are becoming increasingly complex and require efficient packaging solutions that can accommodate high-density interconnects while also managing the heat dissipation and electrical performance requirements of modern electronic devices. Traditional packaging technologies, such as flip-chip and wire-bonding, have reached their limits in terms of scalability and performance. Fan-Out Wafer Level Packaging (FOWLP) has emerged as a promising alternative due to its higher I / O density and improved thermal characteristics. However, traditional methods of forming redistribution layers involve the stacking of insulating and conductive layers, which are costly and complex, especially for small batch production or diverse product portfolios.

[0003] Typically, the redistribution layers in these packaging technologies are formed on substrates such as non-woven fabric or polyimide. These materials have certain limitations in terms of heat dissipation and electrical performance. In addition, standard methods of forming redistribution layers involve sudden right-angle turns, which can lead to resistance points, hinder the filling ability of conductive materials, and result in inefficient thermal management. Furthermore, these substrates and methods face challenges in achieving the fine line / pitch resolution required for high-density interconnects.

[0004] Therefore, it is necessary to develop a packaging technology that overcomes the limitations of traditional substrates and methods of forming redistribution layers. A solution that can accommodate high-density interconnects, improve thermal and electrical performance, and simplify the manufacturing process would be highly beneficial to the semiconductor industry. Summary of the Utility Model

[0005] In order to solve the above problems, the purpose of the present utility model is to provide a substrate for encapsulating a redistribution layer and a manufacturing method thereof.

[0006] The present utility model solves the above challenges by providing a substrate for encapsulating a redistribution layer that incorporates novel materials and designs to enhance electrical and heat dissipation performance and simplify the manufacturing process. The substrate utilizes materials such as glass, ceramic, or high-temperature polymers, which offer superior thermal properties compared to traditional materials. The redistribution layer is filled with conductive adhesives such as copper or silver paste, which are selected for their excellent conductive performance and compatibility with the substrate materials.

[0007] A key innovation of the present utility model is the design of the redistribution layer, which has rounded corners at the circuit bends, promoting a smooth structure at the turns. This design significantly reduces the resistance points and allows for a smoother filling of the conductive material. The angle between the extension parts of the redistribution is set between 90 and 180 degrees, optimizing the electrical performance and making manufacturing easier.

[0008] The present utility model also includes a method for manufacturing the substrate, which utilizes advanced technologies such as selective laser induced etching (SLE) and 3D printing technology to form redistribution vias with the required rounded corners. These technologies enable precise control of the via geometry and can be applied to various substrate materials. In addition, the method includes the step of annealing the substrate to cure the conductive adhesive, ensuring the robustness and reliability of the finished product.

[0009] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following will be described in detail with reference to embodiments and the accompanying drawings. It should be noted that the components in the accompanying drawings are only schematic and are not drawn according to the actual proportions of the components. Description of the Drawings

[0010] Figure 1 One embodiment of the substrate of the present utility model is shown;

[0011] Figure 2 As shown Figure 1 an enlarged schematic view of the redistribution layer;

[0012] Figure 3 The manufacturing process of one embodiment of the substrate of the present utility model is shown;

[0013] Figure 4 Another embodiment of the substrate of the present utility model is shown;

[0014] Figure 5 As shown Figure 4 an enlarged schematic view of the redistribution layer. Detailed Description of the Embodiments

[0015] Please refer to Figure 1 and Figure 2 Figure 1 One embodiment of the substrate of the present utility model is shown, Figure 2 As shown Figure 1An enlarged schematic diagram of the redistribution layer. In this embodiment, a novel substrate 100 for encapsulating the redistribution layer is introduced. The substrate 100 includes a first surface 102, a second surface 104, and a redistribution layer 110. The material of the substrate 100 needs to use glass, ceramic, or high-temperature polymer as the main material of the substrate. Among them, glass has excellent thermal stability and insulation performance. Compared with traditional substrates, it provides superior heat dissipation performance. In addition, the inherent rigidity and dimensional stability of glass help to improve the mechanical strength of semiconductor packages. Ceramics have high thermal conductivity and good insulation ability, and can withstand high temperatures. Moreover, their chemical stability and mechanical strength further improve the durability and lifespan of semiconductor packages. The substrate made of high-temperature polymer can withstand high temperatures without degradation, and it has the advantages of being lightweight and able to be shaped into complex shapes. In this embodiment, since the material of the substrate 100 is selected from the group consisting of glass, ceramic, and high-temperature polymer, these materials have relatively high thermal conductivity, thereby improving the heat dissipation ability of the substrate 100.

[0016] The redistribution layer 110 is mainly used for electrically connecting the wafer and the external circuit in the semiconductor package. In this embodiment, each redistribution of the redistribution layer 110 includes a first redistribution 112 and a second redistribution 114. Among them, the first end point 1122 of the first redistribution 112 is connected to the electronic component contact pad 130 on the first surface 102 of the substrate 100, and extends outward via the first extension portion 1124 and ends at the second end point 1126. Among them, the second end point 1126 can be used as the starting point for connecting to the second redistribution 114. The second redistribution 114 is electrically connected to the second end point 1126 of the first redistribution 112 via the third end point 1142. The second redistribution 114 further extends the path to the printed circuit board contact pad 140 on the second surface 104 of the substrate 100 via its second extension portion 1144, that is, the fourth end point 1146 of the second redistribution 114 is connected to the printed circuit board contact pad 140. In this embodiment, the cross-sectional area of the printed circuit board contact pad 140 is larger than the cross-sectional area of the electronic component contact pad 130, and the cross-section of the second redistribution 114 at the fourth end point 1146 is elliptical.

[0017] It should be noted that one of the features of the redistribution layer 110 in this embodiment is that arc corners are adopted at the turning points between the redistribution lines. That is to say, the angle between the first extension part 1124 of the first redistribution line 112 and the second extension part 1144 of the second redistribution line 114 is between 90 and 180 degrees. This feature of the arc corner can avoid stress concentration and promote the flow of the conductive material in the redistribution layer 110 during the fabrication of the substrate 100, thereby improving the reliability of the electrical connection, achieving the advantages of minimizing signal loss and ensuring high-speed signal transmission. During the process of filling the redistribution layer 110 with a conductive material such as conductive adhesive, the arc corner promotes a more uniform and effective flow of the conductive material. This ensures complete filling without air gaps or voids, thereby achieving better electrical connection in the redistribution layer 110. In addition, the smoother turning provided by the arc corner minimizes reflections and impedance discontinuities on the signal path. This improvement is of certain importance for maintaining signal integrity, especially at higher frequencies where signal attenuation may seriously affect the performance of the device.

[0018] Hereinafter, the manufacturing process of the substrate will be introduced in detail. Please refer to Figure 3 , Figure 3 which shows the manufacturing process of one embodiment of the substrate of the present utility model. First, step S110 is executed to provide a substrate 100 for the redistribution layer. Those skilled in the art select the substrate 100 according to the required performance and the type of material. The materials of the substrate include, for example, glass, ceramic, or high-temperature polymer. Then, step S120 is executed to form a plurality of redistribution vias in the substrate 100, wherein the redistribution vias form a smooth structure with arc corners at the turning points. In this embodiment, the redistribution vias are formed by selective laser etching. Selective laser etching works by focusing high-power laser light on specific positions of a transparent material substrate. The laser light has sufficient intensity to change the structure of the material at the focal point without significantly affecting the surrounding material, and then the changed material can be selectively removed in subsequent etching steps.

[0019] In other embodiments, the above steps S110 and S120 can be combined into one step, that is: using 3D printing technology. In this way, the redistribution vias can be formed while the substrate 100 is being formed.

[0020] After that, step S130 is performed to fill the redistribution vias with a conductive material (e.g., conductive adhesive) to form the redistribution layer 110. In this embodiment, the conductive adhesive can be copper paste or silver paste. Copper paste has low impedance, high thermal conductivity, and good cost-effectiveness. Silver paste has the lowest impedance among all metal pastes, making it an ideal choice for applications that require minimal signal loss. In addition, filling the redistribution vias can be mainly divided into two steps. First, the redistribution vias are evacuated, which helps to remove air from the redistribution vias and prevent the formation of air pockets during the filling process. Then, the conductive adhesive is injected into the redistribution vias under a controlled pressure. The pressure magnitude is adjusted according to the viscosity of the conductive adhesive and the characteristics of the redistribution vias to achieve complete and uniform filling.

[0021] After filling the conductive adhesive, step S140 is performed to anneal the redistribution layer substrate 100. This step involves heating the substrate 100 to a specific temperature for a predetermined time to cure the conductive adhesive within the redistribution vias. The annealing conditions are optimized according to the type of conductive adhesive used and the material of the substrate to enhance the bonding strength of the conductive adhesive and reduce the conduction impedance.

[0022] After that, step S150 is performed to form electronic component contact pads 130 on the first surface 102 of the redistribution layer substrate 100. These electronic component contact pads 130 are the locations where semiconductor devices will be connected. Then, step S160 is performed to form a plurality of printed circuit board contact pads 140 on the second surface 104 of the redistribution layer substrate 100. These printed circuit board contact pads 140 are to match the contact pads on the printed circuit board of the test device to ensure reliable electrical connection.

[0023] After completing the above steps, the fabrication of the redistribution layer substrate 100 of this embodiment is basically completed. However, those with ordinary knowledge in the art can continue with measures such as quality control and functional testing. For example, techniques such as microscopy, electrical testing, and thermal analysis can be used to evaluate the quality and function of the redistribution layer substrate 100 and the redistribution layer 110.

[0024] Please refer to Figure 4 and Figure 5 , Figure 4 Another embodiment of the substrate of the present utility model is shown in Figure 5 as shown in Figure 4 an enlarged schematic diagram of the redistribution layer. Compared with Figure 1In the illustrated embodiment, each of the redistribution layers 210 of this embodiment has a setting that is more than that of the third redistribution layer 116. In the substrate 200 of this embodiment, the third redistribution layer 116 is connected to the second redistribution layer 114. The fifth end point 1162 of the third redistribution layer 116 is connected to the fourth end point 1146 of the second redistribution layer 114, and the third extension portion 1164 of the third redistribution layer 116 further extends the circuit. The angle between the second extension portion 1144 of the second redistribution layer 114 and the third extension portion 1164 of the third redistribution layer 116 is between 90 and 180 degrees, and the fifth end point 1166 of the third redistribution layer 116 is connected to the printed circuit board contact pad 140. Similar to Figure 1 the embodiment of, this embodiment also has rounded corners at the circuit bends, which promotes a smooth structure at the bends. This design significantly reduces the resistance points and allows for more effective filling of the conductive material.

[0025] To elaborate in detail on the technical content, structural features, achieved objectives, and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and with reference to the accompanying drawings.

[0026] The above embodiments are merely examples for convenience of description. Even if arbitrarily modified by those skilled in the art to which they belong, they will not depart from the scope to be protected as set forth in the claims.

Claims

1. A substrate for packaging a redistribution layer, characterized in that: include: A first surface and a second surface, the first surface and the second surface are opposite to each other; a plurality of electronic component contact pads disposed on the first surface; A plurality of first redistribution lines, each of which has a first end point, a first extension portion and a second end point, and the first end point is electrically connected to the electronic component contact pad; A plurality of second redistribution lines, each of which has a third terminal, a second extension portion and a fourth terminal, the third terminal being electrically connected to the second terminal of the first redistribution line; a plurality of printed circuit board contact pads, located on the second surface of the substrate, the printed circuit board contact pads being electrically connected to the fourth end of the second redistribution wiring; The connection between the first redistribution wiring and the second redistribution wiring includes an arc angle to facilitate a smooth transition between the first redistribution wiring and the second redistribution wiring.

2. The substrate according to claim 1, characterized in that An angle between the first extending portion of the first redistribution wiring and the second extending portion of the second redistribution wiring is between 90 and 180 degrees.

3. The substrate according to claim 1, characterized in that The cross-sectional area of ​​the printed circuit board contact pad is greater than the cross-sectional area of ​​the electronic component contact pad.

4. The substrate according to claim 1, characterized in that It further includes a third redistribution wiring having a fifth terminal, a third extension portion, and a sixth terminal, wherein the fifth terminal is connected to the fourth terminal of the second redistribution wiring, and the sixth terminal is electrically connected to the printed circuit board contact pad.

5. The substrate according to claim 4, characterized in that An angle between the second extending portion of the second redistribution wiring and the third extending portion of the third redistribution wiring is between 90 and 180 degrees.

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