Printed circuit board packaging structure
By setting a slotted structure in the printed circuit board package structure to increase the creepage distance, the leakage problem caused by insufficient pad spacing in high-voltage scenarios is solved, and the safety of the printed circuit board is improved.
Patent Information
- Application Number
- CN202422037771.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-21
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-21
AI Technical Summary
In high voltage scenarios, insufficient pad spacing of printed circuit boards leads to leakage, which poses safety hazards.
A grooved structure is provided between the conductive parts to increase the creepage distance, and to form a shortest distance by bypassing the end points of the grooved structure to avoid leakage.
It effectively increases the creepage distance between conductive components, avoids leakage of printed circuit board packaging structure, and improves safety.
Smart Images
Figure CN223053171U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of circuit boards, and particularly to a printed circuit board packaging structure. Background Art
[0002] A printed circuit board is a basic material for supporting and connecting electronic components. It mainly consists of one or more layers of insulating materials and conductive copper foils covering them. When the printed circuit board is used as a hardware support for a connector, it is often applied in high-voltage scenarios. Therefore, for printed circuit boards in high-voltage scenarios, a larger creepage distance is often required. At this time, the distance between two pads on the printed circuit board is far from enough. If the distance between the two pads is too short, it will cause the printed circuit board to leak electricity, posing a safety hazard. Summary of the Utility Model
[0003] To solve the problems of the prior art, this application provides a technical solution for a printed circuit board packaging structure. That is, this application sets at least one slotted structure between two conductive components so that the creepage distance between the two conductive components is the shortest distance between the two conductive components bypassing the endpoints of at least one slotted structure, thereby increasing the shortest distance along the surface of the printed circuit board packaging structure between the conductive components, and thus avoiding the occurrence of electricity leakage in the printed circuit board packaging structure.
[0004] This application provides a printed circuit board packaging structure, which includes a printed circuit board packaging body;
[0005] At least one pair of conductive components is provided on the printed circuit board packaging body, and each pair of conductive components in the at least one pair of conductive components includes two conductive components;
[0006] At least one slotted structure is provided between the two conductive components, and the creepage distance between the two conductive components is the shortest distance between the two conductive components bypassing the endpoints of the at least one slotted structure.
[0007] Further, one slotted structure is provided between the two conductive components, and the endpoint area of the slotted structure includes a first tangent point and a second tangent point. The first tangent point is the point where the tangent of the slotted structure passing through the conductive component on one side of the slotted structure intersects the slotted structure, and the second tangent point is the point where the tangent of the slotted structure passing through the conductive component on the other side of the slotted structure intersects the slotted structure;
[0008] The length of the line connecting the conductive component on one side of the slotted structure and the first tangent point, the length of the inner wall of the end region of the slotted structure extending along the direction of the line connecting the two conductive components, and the length of the line connecting the second tangent point and the conductive component on the other side of the slotted structure constitute the creepage distance between the two conductive components.
[0009] Further, at least two slotted structures are provided between the two conductive components. A third tangent point is provided on the slotted structure close to one of the conductive components, and a fourth tangent point is provided on the slotted structure close to the other conductive component. The third tangent point is the point where the tangent line passing through the slotted structure of one of the conductive components intersects the slotted structure, and the fourth tangent point is the point where the tangent line passing through the slotted structure of the other conductive component intersects the slotted structure;
[0010] The length of the line connecting one of the conductive components and the third tangent point, the length of the inner wall from the third tangent point to the end point in the slotted structure close to one of the conductive components, the interval length between the end points of the at least two slotted structures, the length of the inner wall from the fourth tangent point to the end point in the slotted structure close to the other conductive component, and the length of the line connecting the other conductive component and the fourth tangent point constitute the creepage distance between the two conductive components.
[0011] Further, the sizes of the at least two slotted structures are equal.
[0012] Further, the sizes of the at least two slotted structures gradually increase first and then gradually decrease along the length direction of the printed circuit board package body.
[0013] Further, the distance between the two side edges of the slotted structure is 1 mm - 4 mm.
[0014] Further, the slotted structure penetrates through the printed circuit board package body along the thickness direction of the printed circuit board package body.
[0015] Further, the slotted structure is oval.
[0016] Further, the end region of the slotted structure is arc-shaped, and the slotted structure is oblong.
[0017] Further, the depth of the slotted structure along the thickness direction of the printed circuit board package body is greater than or equal to 0.9 mm.
[0018] Implementing the present application has the following beneficial effects:
[0019] In the present application, at least one slotted structure is provided between two conductive components, so that the creepage distance between the two conductive components is the shortest distance bypassing the endpoints of at least one slotted structure between the two conductive components. Furthermore, the shortest distance along the surface of the printed circuit board packaging structure between the conductive components can be increased, thereby avoiding the occurrence of leakage in the printed circuit board packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0021] Figure 1 FIG. 9 is a top view structural schematic diagram of a printed circuit board packaging structure provided by an embodiment of the present application;
[0022] Figure 2 FIG. 13 is a top view structural schematic diagram of a printed circuit board packaging structure having two slotted structures provided by an embodiment of the present application;
[0023] Figure 3 FIG. 17 is a top view structural schematic diagram of a printed circuit board packaging structure having three slotted structures provided by an embodiment of the present application;
[0024] Among them, the reference numerals in the figure correspond to: 1 - printed circuit board packaging body; 2 - conductive component; 3 - slotted structure; 31 - first tangent point; 32 - second tangent point; 33 - third tangent point; 34 - fourth tangent point; 35 - endpoint area. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.
[0026] It should be noted that in this application, unless otherwise clearly specified and limited, terms such as "installation", "connection", "linkage", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0027] Hereinafter, embodiments will be described with reference to the accompanying drawings, which do not limit the disclosed content recorded in the claims in any way.
[0028] Please refer to Figures 1 to 3 , and hereinafter, a printed circuit board packaging structure provided by an embodiment of this application will be described in detail in conjunction with Figures 1 to 3 .
[0029] An embodiment of this application provides a printed circuit board packaging structure. As shown in Figures 1 to 3 , specifically, the printed circuit board packaging structure includes a printed circuit board packaging body 1. Among them, at least one set of conductive component pairs is provided on the printed circuit board packaging body 1, and each conductive component pair in at least one set of conductive component pairs includes two conductive components 2; at least one slotted structure 3 is provided between the two conductive components 2, and the creepage distance between the two conductive components 2 is the shortest distance between the two conductive components 2 bypassing the endpoints of at least one slotted structure 3.
[0030] In the embodiment of this application, the printed circuit board packaging structure can be directly used as a plug-in for assembling with other devices. The conductive component pair is a port component that can be used for conduction. Specifically, the conductive component pair can be a conductive component including a positive electrode and a negative electrode. Among them, the conductive component can be a package pad structure. Therefore, the two conductive components 2 can be two package pad structures that can be used to connect wires. When the printed circuit board packaging structure is applied in a high-voltage scenario, the straight-line distance between the two conductive components 2 is often too short, resulting in a leakage situation. Therefore, in the embodiment of this application, at least one slotted structure 3 is provided between the two conductive components 2, so that the creepage distance between the two conductive components 2 is the shortest distance between the two conductive components 2 bypassing the endpoints of at least one slotted structure 3. Furthermore, the shortest distance along the surface of the printed circuit board packaging structure between the two conductive components 2 can be increased, thereby avoiding the occurrence of a leakage situation in the printed circuit board packaging structure.
[0031] In a specific embodiment, at least one slotted structure 3 can be one slotted structure 3, two slotted structures 3, three slotted structures 3, four slotted structures 3, etc. Thus, by setting different numbers of slotted structures 3, it is possible to adapt to different high-voltage scenarios.
[0032] In a specific embodiment, the slotted structure 3 penetrates through the printed circuit board packaging body 1 along the thickness direction of the printed circuit board packaging body 1.
[0033] In the embodiment of the present application, by penetrating the slotted structure 3 through the printed circuit board packaging body 1 along the thickness direction of the printed circuit board packaging body 1, the creepage distance between the two conductive components 2 can be prevented from leaking electricity in a high-voltage scenario, thereby improving the safety of the printed circuit board packaging structure.
[0034] In an alternative embodiment, the slotted structure 3 is oval.
[0035] In another alternative embodiment, as Figures 1 to 3 shown, the end region 35 of the slotted structure 3 is arc-shaped, and the slotted structure 3 is oblong. Specifically, the diameter corresponding to the arc-shaped end region 35 is equal to the width on both sides of the oblong slotted structure 3. Here, the width on both sides of the slotted structure 3 is the length of the slotted structure 3 along the direction parallel to the connection line between the two conductive components 2.
[0036] In an alternative embodiment, as Figure 1 shown, one slotted structure 3 is provided between the two conductive components 2. The end region 35 of the slotted structure 3 includes a first tangent point 31 and a second tangent point 32. The first tangent point 31 is the point where the tangent line of the slotted structure 3 passing through the conductive component 2 on one side of the slotted structure 3 intersects the slotted structure 3, and the second tangent point 32 is the point where the tangent line of the slotted structure 3 passing through the conductive component 2 on the other side of the slotted structure 3 intersects the slotted structure 3; the connection line length between the conductive component 2 on one side of the slotted structure 3 and the first tangent point 31, the inner wall length of the end region 35 of the slotted structure 3 extending along the direction towards the connection line between the two conductive components 2, and the connection line length between the second tangent point 32 and the conductive component 2 on the other side of the slotted structure 3 constitute the creepage distance between the two conductive components 2.
[0037] In the embodiment of the present application, as Figure 1 shown, the creepage distance between the two conductive components 2 can be referred to Figure 1The length of the thickened line segment, that is, when a slotted structure 3 is provided between two conductive components 2, the two conductive components 2 can creep along the path of the connection line length between the first tangent point 31 and the left conductive component 2, the cross-sectional arc length of the end region 35 along the length direction of the printed circuit board package body 1, and the connection line length between the second tangent point 32 and the right conductive component 2. Furthermore, compared with the creepage distance between two conductive components 2 without a slotted structure 3, the shortest distance between the two conductive components 2 along the surface of the printed circuit board package structure can be increased, thereby effectively avoiding the occurrence of leakage in the printed circuit board package structure.
[0038] In a specific embodiment, the first tangent point 31 is the point where a tangent is made from the conductive component 2 to the slotted structure 3 close to the conductive component 2, and this tangent intersects the slotted structure 3 close to the conductive component 2. The second tangent point 32 is the point where a tangent is made from the other conductive component 2 to the slotted structure 3 close to the conductive component 2, and this tangent intersects the slotted structure 3 close to the conductive component 2. The inner wall length of the end region 35 of the slotted structure 3 extending along the connection line direction of the two conductive components 2 is the entire arc length of the cross-section of the end region 35 of the slotted structure 3 along the length direction of the printed circuit board package body 1. It should be noted that the creepage distance between the two conductive components 2 refers to the shortest distance between the two conductive components 2 along the surface of the printed circuit board package body 1.
[0039] In an alternative embodiment, as Figure 2 and Figure 3 shown, at least two slotted structures 3 are provided between the two conductive components 2. A third tangent point 33 is provided on the slotted structure 3 close to one of the conductive components 2, and a fourth tangent point 34 is provided on the slotted structure 3 close to the other conductive component 2. The third tangent point 33 is the point where the tangent passing through the slotted structure 3 of one of the conductive components 2 intersects the slotted structure 3, and the fourth tangent point 34 is the point where the tangent passing through the slotted structure 3 of the other conductive component 2 intersects the slotted structure 3; the connection line length between one of the conductive components 2 and the third tangent point 33, the inner wall length from the third tangent point 33 in the slotted structure 3 close to one of the conductive components 2 to the end point in the slotted structure 3, the interval length between the end points of at least two slotted structures 3, the inner wall length from the fourth tangent point 34 in the slotted structure 3 close to the other conductive component 2 to the end point in the slotted structure 3, and the connection line length between the other conductive component 2 and the fourth tangent point 34 constitute the creepage distance between the two conductive components 2.
[0040] In the embodiment of the present application, when two slotted structures 3 are provided between the two conductive components 2, the creepage distance between the two conductive components 2 can be referred to Figure 2The length of the thickened line segment, that is, when two slot structures 3 are provided between two conductive components 2, the two conductive components 2 can creep along the path of the connection length between the third tangent point 33 and the left conductive component 2, the inner wall length from the third tangent point 33 to the end point in the left slot structure 3, the interval length between the end points of the left slot structure 3 and the end points of the right slot structure 3, the inner wall length from the fourth tangent point 34 to the end point in the right slot structure 3, and the connection length between the right conductive component 2 and the fourth tangent point 34. Furthermore, compared with the creepage distance between two conductive components 2 with one slot structure 3, the shortest distance between the conductive components 2 along the surface of the printed circuit board packaging structure can be increased. Thus, while effectively avoiding the occurrence of leakage in the printed circuit board packaging structure, leakage protection in application scenarios with different high-voltage values can also be achieved to adapt to application scenarios with different high voltages.
[0041] In another specific embodiment, when three slot structures 3 are provided between two conductive components 2, the creepage distance between the two conductive components 2 can refer to Figure 3 the length of the thickened line segment, that is, when three slot structures 3 are provided between two conductive components 2, the two conductive components 2 can creep along the path of the connection length between the third tangent point 33 and the left conductive component 2, the inner wall length from the third tangent point 33 to the end point in the leftmost slot structure 3, the interval length between the end points of the leftmost slot structure 3 and the end points of the rightmost slot structure 3, the inner wall length from the fourth tangent point 34 to the end point in the rightmost slot structure 3, and the connection length between the right conductive component 2 and the fourth tangent point 34. Furthermore, compared with the creepage distance between two conductive components 2 with three slot structures 3, the shortest distance between the conductive components 2 along the surface of the printed circuit board packaging structure can be increased. Thus, while effectively avoiding the occurrence of leakage in the printed circuit board packaging structure, it can also adapt to application scenarios with different high voltages.
[0042] It should be noted that compared with two slot structures 3 provided between two conductive components 2, when three slot structures 3 are provided between two conductive components 2, the positions of the slot structures 3 are different, and the connection length between the third tangent point 33 and the left conductive component 2 is different. Furthermore, when different numbers of slot structures 3 are provided between two conductive components 2, their corresponding creepage distances are different.
[0043] In an alternative embodiment, as Figure 2 and Figure 3 shown, the sizes of at least two slot structures 3 are equal. Furthermore, by setting the sizes of at least two slot structures 3 to be equal, the slotting difficulty can be reduced.
[0044] In another alternative embodiment, the sizes of at least two slotted structures 3 gradually increase first and then gradually decrease along the length direction of the printed circuit board package body 1. Furthermore, by making the sizes of at least two slotted structures 3 gradually increase first and then gradually decrease along the length direction of the printed circuit board package body 1, it is possible to adapt to a high-voltage scenario different from those with equal sizes.
[0045] In an alternative embodiment, the distance between the two side edges of the slotted structure 3 is 1 mm - 4 mm.
[0046] Specifically, the distance between the two side edges of the slotted structure 3 can be 1 mm, 1.5 mm, 2 mm, 3 mm, 3.5 mm, 4 mm, etc. There is no specific limitation on the distance between the two side edges of the slotted structure 3 here.
[0047] In an alternative embodiment, the depth of the slotted structure 3 along the thickness direction of the printed circuit board package body 1 is greater than or equal to 0.9 mm.
[0048] Specifically, the depth of the slotted structure 3 along the thickness direction of the printed circuit board package body 1 can be 0.9 mm, 1 mm, 1.5 mm, 2 mm, etc.
[0049] The above embodiments of the present application have the following beneficial effects:
[0050] By providing at least one slotted structure between two conductive components in the present application, the creepage distance between the two conductive components is the shortest distance around the endpoints of at least one slotted structure between the two conductive components. Furthermore, the shortest distance along the surface of the printed circuit board package structure between the conductive components can be increased, thereby avoiding the occurrence of leakage in the printed circuit board package structure.
[0051] The structure shown in this embodiment is only a part of the structure related to the solution of the present application and does not constitute a limitation on the device to which the solution of the present application is applied. Specifically, the device may include more or fewer components than those shown, or combine some components, or have a different arrangement of components. It should be understood that the methods, devices, etc. disclosed in this embodiment can be implemented in other ways.
[0052] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A printed circuit board packaging structure, characterized in that: It comprises a printed circuit board packaging body (1); The printed circuit board package body (1) is provided with at least one group of conductive component pairs, and each conductive component pair in the at least one group of conductive component pairs includes two conductive components (2); At least one slotted structure (3) is provided between the two conductive components (2), and the creepage distance between the two conductive components (2) is the shortest distance between the two conductive components (2) bypassing the end points of the at least one slotted structure (3).
2. The printed circuit board packaging structure according to claim 1, characterized in that: A slotted structure (3) is provided between the two conductive components (2), and an end point region (35) of the slotted structure (3) comprises a first tangent point (31) and a second tangent point (32), wherein the first tangent point (31) is a point where a tangent line of the slotted structure (3) passing through the conductive component (2) on one side of the slotted structure (3) intersects with the slotted structure (3), and the second tangent point (32) is a point where a tangent line of the slotted structure (3) passing through the conductive component (2) on the other side of the slotted structure (3) intersects with the slotted structure (3); The length of a line between the conductive component (2) on one side of the slot structure (3) and the first tangent point (31), the length of an inner wall of an end point region (35) of the slot structure (3) extending in a direction toward the line connecting the two conductive components (2), and the length of a line between the second tangent point (32) and the conductive component (2) on the other side of the slot structure (3) constitute a creepage distance between the two conductive components (2).
3. The printed circuit board packaging structure according to claim 1, characterized in that: At least two slotted structures (3) are provided between the two conductive components (2); a third tangent point (33) is provided on the slotted structure (3) close to one of the conductive components (2); and a fourth tangent point (34) is provided on the slotted structure (3) close to the other conductive component (2); the third tangent point (33) is a point where a tangent line passing through the slotted structure (3) of one of the conductive components (2) intersects with the slotted structure (3); and the fourth tangent point (34) is a point where a tangent line passing through the slotted structure (3) of the other conductive component (2) intersects with the slotted structure (3); The creepage distance between the two conductive components (2) is constituted by the length of a line between one of the conductive components (2) and the third tangent point (33), the length of an inner wall between the third tangent point (33) in the slot structure (3) close to the one of the conductive components (2) and an end point in the slot structure (3), the interval length between the end points of the at least two slot structures (3), the length of an inner wall between a fourth tangent point (34) in the slot structure (3) close to another of the conductive components (2) and an end point in the slot structure (3), and the length of a line between another of the conductive components (2) and the fourth tangent point (34).
4. The printed circuit board packaging structure according to claim 3, characterized in that: The sizes of the at least two slotted structures (3) are equal.
5. The printed circuit board packaging structure according to claim 3, characterized in that: The sizes of the at least two slotted structures (3) first gradually increase and then gradually decrease along the length direction of the printed circuit board packaging body (1).
6. The printed circuit board packaging structure according to claim 2 or 3, characterized in that: The distance between the two side edges of the slotted structure (3) is 1 mm to 4 mm.
7. The printed circuit board packaging structure according to claim 1, characterized in that: The slotted structure (3) penetrates the printed circuit board packaging body (1) along the thickness direction of the printed circuit board packaging body (1).
8. The printed circuit board packaging structure according to claim 1, characterized in that: The slotted structure (3) is elliptical.
9. The printed circuit board packaging structure according to claim 1, characterized in that: The end point region (35) of the slotted structure (3) is arc-shaped, and the slotted structure (3) is oblong.
10. The printed circuit board packaging structure according to claim 1, characterized in that: The depth of the slotted structure (3) along the thickness direction of the printed circuit board packaging body (1) is greater than or equal to 0.9 millimeters.