Modularized circuit board structure of charging circuit and charging power supply

Abstract

The utility model provides a modular circuit board structure of a charging circuit and a charging power supply, the modular circuit board structure comprises a circuit board body, the circuit board body is provided with a first surface and a second surface which are opposite, the circuit board body is provided with a charging control circuit, and electric components forming the charging control circuit are all arranged on the first surface; the packaging heat dissipation layer is arranged on the first surface and wraps the electric component; wherein the second surface of the circuit board body is provided with a plurality of bonding pads, and the bonding pads are electrically connected with the charging control circuit through printed wires on the circuit board body. The charging control circuit board solves the problems that a charging control circuit board in the prior art is poor in heat dissipation performance and occupies a large space after being assembled.

Description

Technical Field

[0001] This application relates to the technical field of charging power supply devices, and particularly to a modular circuit board structure of a charging circuit and a charging power supply. Background Art

[0002] Existing charging control circuits (such as the charging control circuit of a power bank) usually form a printed circuit board, and various electrical components (capacitors, resistors, diodes, transistors, etc.) are soldered on a printed circuit board to implement corresponding functional circuits.

[0003] In the circuit board of the existing charging control circuit, not only the electrical components (capacitors, resistors, diodes, transistors, etc.) of each charging control circuit are exposed on the circuit board, resulting in poor heat dissipation performance. Moreover, pins are usually provided on the back of the circuit board of the charging control circuit as welding pins. When electrically connected to other circuit boards (main circuit boards), the length of the pins causes the thickness of the entire structure to increase during the connection process between the circuit board and other circuits, requiring more space and being unfavorable for the miniaturization of charging devices.

[0004] Therefore, the existing technology still needs to be improved and developed. Utility Model Content

[0005] In view of the above deficiencies of the existing technology, the purpose of this application is to provide a modular circuit board structure for a charging circuit, which solves the problems of poor heat dissipation performance and large occupied space of the charging control circuit board in the existing technology.

[0006] This application provides a modular circuit board structure for a charging circuit, including:

[0007] A circuit board body, the circuit board body has opposite first and second surfaces, and a charging control circuit is provided on the circuit board body, and the electrical components forming the charging control circuit are all arranged on the first surface;

[0008] An encapsulation heat dissipation layer, the encapsulation heat dissipation layer is arranged on the first surface and wraps the electrical components;

[0009] Wherein, a plurality of pads are provided on the second surface of the circuit board body, and the pads are electrically connected to the charging control circuit through printed traces on the circuit board body.

[0010] Optionally, the pads are arranged on at least one side edge of the circuit board body.

[0011] Optionally, there are a plurality of pads on the edge of the circuit board body, and each pad is a semi-hole.

[0012] Optionally, a shielding cover is arranged around the outside of the encapsulation heat dissipation layer, and the electrical components of the charging control circuit are located inside the shielding cover.

[0013] Optionally, the shielding cover comprises: a plurality of shielding baffles, the plurality of shielding baffles are connected and respectively located outside different sides of the package heat dissipation layer;

[0014] Each shielding baffle includes: a vertical baffle, the vertical baffle is located outside the side of the package heat dissipation layer;

[0015] A bottom connecting portion, which is arranged at one end of the vertical baffle plate facing the circuit board body and is used to connect the circuit board body;

[0016] The edge trimming portion is provided with an end of the vertical baffle away from the circuit board body and is used to bend toward the inner side of the packaging heat dissipation layer.

[0017] Optionally, the bottom connecting portion is bent toward the inner side of the package heat dissipation layer and forms a welding bottom surface, and is fixed to the circuit board body by welding the welding bottom surface;

[0018] Alternatively, the bottom connecting portion includes a plurality of pins, which are fixed to the circuit board body by pin welding.

[0019] Optionally, the end surface of the package heat dissipation layer facing away from the circuit board body is arranged to be a plane;

[0020] An outer heat dissipation layer is arranged on the surface of the package heat dissipation layer facing away from the circuit board body.

[0021] Optionally, the heat dissipation efficiency of the outer heat dissipation layer is higher than the heat dissipation efficiency of the package heat dissipation layer.

[0022] Optionally, the outer heat dissipation layer includes an infrared radiation heat dissipation film, and the infrared radiation heat dissipation film is attached to the surface of the package heat dissipation layer.

[0023] On the other hand, the present application also proposes a charging power supply, comprising a housing, a rechargeable battery disposed in the housing, a charging terminal disposed on the housing, and a modular circuit board structure of the charging circuit as described above;

[0024] At least one modular circuit board structure is provided, and the modular circuit board structure is electrically connected to the rechargeable battery and the charging terminal.

[0025] Beneficial effects: In a modular circuit board structure and a charging power supply of a charging circuit in this application, a printed circuit board is used as the circuit board body. All electrical components forming the charging control circuit are arranged on the first surface of the circuit board body, while the contact points for connecting to an external circuit are arranged on the second surface of the circuit board body, and the contact points are set as a plurality of pads. The connection to the external circuit is made through the pads on the second surface. For the connection method of the pads, it only needs to accurately align the circuit board body to another circuit board (main circuit board) for soldering and fixing. This method of soldering and assembling by pasting reduces the overall thickness of the circuit, optimizes the spatial structure, and is conducive to the miniaturization of the charging power supply. Moreover, on the circuit board body, the electrical components are wrapped by a packaged heat dissipation layer, which not only helps dissipate heat from the electrical components and ensures the stability of the electrical components during high-power charging, but also makes the entire charging control circuit form a modular structure. As a standardized module, during the assembly process of the charging power supply, according to the required functions, the modular charging control circuit can be directly soldered and used. The assembly process is more convenient. The modular circuit board structure uses the designed circuit as a standard, avoiding repeated design of the charging circuit, shortening the development cycle, simplifying the material procurement management, and reducing the board mounting cost. Brief Description of the Drawings

[0026] Figure 1 It is a schematic structural diagram of the main structure of a modular circuit board structure of a charging circuit according to an embodiment of this application;

[0027] Figure 2 It is an exploded view of the specific structure of a modular circuit board structure of a charging circuit according to an embodiment of this application;

[0028] Figure 3 It is a partial cross-sectional view of a shielding cover structure of a modular circuit board structure of a charging circuit according to an embodiment of this application;

[0029] Figure 4 It is a partial cross-sectional view of another shielding cover structure of a modular circuit board structure of a charging circuit according to an embodiment of this application;

[0030] Figure 5 It is a circuit principle block diagram of a charging control circuit of a charging power supply according to an embodiment of this application.

[0031] In the figure: 100, circuit board body; 101, first surface; 102, second surface; 103, jack; 110, charging control circuit; 111, electrical component; 120, pad; 200, packaged heat dissipation layer; 300, shielding cover; 310, shielding baffle; 311, vertical baffle; 312, bottom connection part; 313, edge receiving part; 314, welding bottom surface; 315, pin; 400, external heat dissipation layer. Detailed Description of the Embodiment

[0032] To make the objectives, technical solutions and advantages of this application clearer and more explicit, the following further elaborates on this application with reference to the accompanying drawings and by way of examples. It should be understood that the specific examples described herein are only used to explain this application and are not used to limit this application.

[0033] In the circuit board structure of an existing ordinary charging control circuit, the use of pin pins leads to problems such as large space occupation of the circuit board and poor heat dissipation performance. Moreover, pins are provided on the back of the circuit board of the charging control circuit as welding pins. During the assembly process, it is necessary to insert the pins into the jacks of other circuit boards (main circuit boards) and then weld them. The welding efficiency is not high, and the deformation of the pins will cause problems such as poor welding stability. Moreover, a modular circuit board structure cannot be formed, resulting in problems such as easy errors in the welding and assembly process of the internal electrical components of the charging power supply. Therefore, the following examples are proposed in this application to solve the above problems.

[0034] Embodiment 1

[0035] As Figure 1 shown, this embodiment proposes that this application provides a modular circuit board structure for a charging circuit, which can be used as a wired charging control circuit board or a wireless charging control circuit board. The modular circuit board structure of this embodiment mainly includes: a circuit board body 100 and a packaging heat dissipation layer 200. The circuit board body 100 of this embodiment uses a printed circuit board (PCB board), so it has printed traces (as wires). The circuit board body 100 has opposite first surface 101 (upper surface) and second surface 102 (back surface). As Figure 2As shown in the figure, a charging control circuit 110 is provided on the circuit board body 100. The charging control circuit 110 includes a variety of electrical components 111, such as capacitors, resistors, inductors, diodes, triodes, and control chips, etc. The charging control function is realized through electrical connection by printed traces. The electrical components 111 that form the charging control circuit 110 are all arranged on the first surface 101. Therefore, there are basically no electrical components 111, pin solder joints, etc. on the second surface 102 of the circuit board body 100, keeping the second surface 102 of the circuit board body 100 relatively flat. A plurality of pads 120 are provided on the second surface 102 of the circuit board body 100. The pads 120 are electrically connected to the charging control circuit 110 through the printed traces on the circuit board body 100. The plurality of pads 120 can be arranged at the edge or in the middle of the circuit board body 100. When arranged in the middle position, the pads 120 can be exposed metal sheet structures. During the connection process, solder balls are correspondingly arranged at the pads 120, and then covered at the predetermined positions of other circuit boards (main circuit boards), and then heated and welded and fixed (similar to the welding and fixing method of structures such as memories on mobile phones). When the plurality of pads 120 are arranged at the edge of the circuit board body 100, after covering the circuit board body 100 at the predetermined positions of other circuit boards (main circuit boards), welding and fixing can be directly performed at the edge. The encapsulation heat dissipation layer 200 is arranged on the first surface 101 and wraps the electrical components 111, so that the sides and the upper surfaces of the electrical components 111 on the first surface 101 are all wrapped, and heat conduction can be carried out to enable the electrical components 111 to dissipate heat as soon as possible. The upper surface of the encapsulation heat dissipation layer 200 is a plane, and the height to the first surface 101 of the circuit board body 100 is the same. In this way, the charging control circuit 110 forms a modular circuit board structure, and can be assembled as a kind of standardized module, facilitating the assembly of the charging power supply.

[0036] As Figure 1 , Figure 2As shown in the figure, in the modular circuit board structure of this embodiment, a printed circuit board is used as the circuit board body 100. All the electrical components 111 that form the charging control circuit 110 are arranged on the first surface 101 of the circuit board body 100, while the contact points for connecting the external circuit are arranged on the second surface 102 of the circuit board body 100, and the contact points are set as a plurality of pads 120, and are connected to the external circuit through the pads 120 on the second surface 102. For the connection method of the pads 120, the circuit board body 100 only needs to be accurately aligned with other circuit boards for welding and fixing. This method of welding and assembling by pasting reduces the overall thickness of the circuit, optimizes the spatial structure, and is conducive to the miniaturization of the charging power supply. Moreover, the electrical components 111 are wrapped by the encapsulation heat dissipation layer 200 on the circuit board body 100, which is not only conducive to dissipating heat from the electrical components 111 and ensuring the stability of the operation of the electrical components 111 during high-power charging. Moreover, the entire charging control circuit 110 forms a modular structure. As a standardized module, during the assembly process of the charging power supply, according to the required functions, the modular charging control circuit 110 can be directly welded and used, making the assembly process more convenient. Moreover, the modular circuit board structure uses the designed circuit as a standard, avoiding repeated design of the charging circuit, without having to re-conduct the principle design of the charging circuit and the layout design of the charging circuit board, greatly shortening the development cycle, and simplifying the material procurement management, thereby reducing the cost of pasting the board.

[0037] As Figure 1 , Figure 2 shown, further, the pads 120 in this embodiment are arranged on at least one side edge of the circuit board body 100. For example, they are arranged on the opposite side edges of the circuit board (the left and right side edges), or can also be on the edges of the four sides of the circuit board (the front, back, left, and right side edges). The pads 120 are arranged at the edge of the circuit board body 100, and after the circuit board body 100 is welded to other circuit boards (main circuit boards) through the side pads 120, electrical signals (currents) are input / output. By using the method of side pads 120, it is convenient to closely weld and fix the circuit board body 100 and other circuit boards, ensuring welding stability.

[0038] As Figure 1 , Figure 2As shown, further, a plurality of pads 120 are provided on the edge of the circuit board body 100 in this embodiment, and each pad 120 is a half-hole. The plurality of semi-circular pads 120 form a stamp hole structure (stamp hole). The connection is achieved through the stamp hole structure. When it is welded to other circuit boards or combined with wires by welding or other forms, the half-hole pads 120 serve as welding connection points. The circuit board body 100 can be split by hand without special tools, ensuring a stable connection between the circuit board body 100 and other circuit boards. During the surface mount process, it is easier to suck solder, greatly reducing the occurrence of defects such as false soldering, improving the product qualification rate, and facilitating board-to-board welding.

[0039] As Figure 1 , Figure 2 , Figure 3 As shown, further, a shielding cover 300 is disposed around the outside of the encapsulation heat dissipation layer 200 in this embodiment, and the electrical components 111 of the charging control circuit 110 are located inside the shielding cover 300. The shielding cover 300 is formed by a metal cover to form a four-sided edge structure on the front, back, left, and right, surrounding the electrical components 111 on the first surface 101 within the four-sided edge structure. This not only makes the electrical components 111 concentrated and easy to form a modular structure, but also shields the electrical components 111 within the four-sided edge structure, ensuring that the charging control chip and the composed charging control circuit 110 are protected from external signal interference and can operate normally and stably. Moreover, the space enclosed by the shielding cover 300 provides a shaping space for the encapsulation heat dissipation layer 200, enabling the encapsulation heat dissipation layer 200 to be filled inside the shielding cover 300, ensuring the standardization of the formed modular structure.

[0040] As Figure 2 , Figure 3As shown, further, the shielding cover 300 in this embodiment specifically includes: a plurality of shielding baffles 310, and the plurality of shielding baffles 310 are connected and respectively located on the outside of different sides of the package heat dissipation layer 200. The shielding cover 300 can be a square frame structure formed by bending a metal strip, and the front, back, left, and right sides of the square frame structure are all shielding baffles 310. The upper and lower sides of the shielding cover 300 are open, and the inner package heat dissipation layer 200 is enclosed by the shielding baffles 310. In the specific structure, each shielding baffle 310 includes: a vertical baffle 311, a bottom connecting portion 312, and a trimming portion 313. The vertical baffle 311 is located on the outside of the side of the package heat dissipation layer 200, the bottom connecting portion 312 is arranged at one end of the vertical baffle 311 facing the circuit board body 100, and is used to connect the circuit board body 100, and the trimming portion 313 is arranged at one end of the vertical baffle 311 away from the circuit board body 100, and is used to bend toward the inside of the package heat dissipation layer 200. The bottom connection part 312 is connected to the circuit board body 100 for fixing, so that the entire shielding cover 300 can be stably fixed on the circuit board body 100. The upper open part of the shielding cover 300 is trimmed by the trimming part 313, firstly, to avoid the sharp edge of the upper end of the vertical baffle 311 from coming out and causing safety problems. Secondly, the trimming part 313 can press the upper surface edge of the package heat dissipation layer 200 downward, increase the upper limit of the inner package heat dissipation layer 200, make the package heat dissipation layer 200 more firmly fixed in the shielding cover 300, and also avoid the upper surface of the package heat dissipation layer 200 protruding from the trimming part 313, which is more convenient for the shaping of the package heat dissipation layer 200.

[0041] like Figure 2 , Figure 3 As shown, further, the bottom connection part 312 in this embodiment can be set into a variety of structures. In the first structure: it is bent toward the inner side of the package heat dissipation layer 200 to form a welding bottom surface 314, and is fixed to the circuit board body 100 by welding the welding bottom surface 314. The bottom connection part 312 can be a flat plate, which is perpendicular to the vertical baffle 311 and can extend a predetermined length toward the inner side or outer side of the space enclosed by the shielding cover 300. The flat plate in this embodiment extends toward the inner side of the shielding cover 300. Correspondingly, a fixing position is set on the circuit board body 100, and a relatively firm fixation is achieved by directly bonding or welding the flat plate to the fixing position of the circuit board body 100.

[0042] like Figure 2 , Figure 4As shown, in the second structure: the bottom connection part 312 includes a plurality of pins 315, which are fixed to the circuit board body 100 by welding. The pins 315 are directly arranged at the lower end of the vertical baffle 311 along the vertical direction, and the length of the pins 315 is not greater than the thickness of the circuit board body 100. Correspondingly, a plug hole 103 is arranged on the circuit board body 100, and the pins 315 are directly inserted into the plug hole 103 to achieve positioning, and then bonded or welded to the circuit board body 100 to achieve fixation.

[0043] like Figure 1 , Figure 2 , Figure 3 As shown, further, an external heat dissipation layer 400 is provided on the outer surface of the package heat dissipation layer 200 and / or the outer surface of the shielding cover 300 in this embodiment. The external heat dissipation layer 400 may be an infrared heat dissipation coating or an infrared radiation heat dissipation film. The heat dissipation efficiency of the external heat dissipation layer 400 in this embodiment is higher than the heat dissipation efficiency of the package heat dissipation layer 200. In the specific structure, the package heat dissipation layer 200 may be encapsulated with a heat dissipation silicone material, and the heat generated by the electrical component 111 during the charging process is promptly conducted out, and the heat is promptly dissipated through the external heat dissipation layer 400 on the upper surface. Since the heat dissipation efficiency of the external heat dissipation layer 400 is higher, the heat conducted by the package heat dissipation layer 200 is further dissipated into the air, thereby improving the heat dissipation efficiency and ensuring the stability of the operation of the charging control circuit 110.

[0044] The outer heat dissipation layer 400 can cover the outer surface of the shielding cover 300. In a specific structure, the outer heat dissipation layer 400 can be selected as an infrared heat dissipation coating, and the infrared heat dissipation material is attached to the shielding cover by direct spraying or electrophoresis. The infrared heat dissipation coating converts thermal energy into infrared radiation energy, thereby quickly dissipating heat into the air, thereby achieving the purpose of reducing the surface temperature, enhancing its infrared emissivity, and improving the heat radiation capacity.

[0045] like Figure 1 , Figure 2 , Figure 3 As shown, the outer heat dissipation layer 400 can also be only arranged on the surface of the package heat dissipation layer 200 away from the circuit board body 100. In the specific structure, the end surface of the package heat dissipation layer 200 away from the circuit board body 100 is set to a plane, so that the outer heat dissipation layer 400 can be stably bonded to the upper surface of the package heat dissipation layer 200, further promoting the heat dissipation of the circuit board, and ensuring the stability of the charging control circuit 110 during operation. The outer heat dissipation layer 400 in this embodiment includes an infrared radiation heat dissipation film, which is attached to the surface of the package heat dissipation layer 200. The infrared radiation heat dissipation film can achieve heat dissipation and cooling. It converts heat energy into infrared radiation energy through a coating paint, thereby quickly dissipating heat into the air, thereby achieving the purpose of reducing the surface temperature.

[0046] In addition, the external heat dissipation layer 400 can cover the outer surface of the shielding cover 300 and the surface of the encapsulation heat dissipation layer 200 facing away from the circuit board body 100. In a specific structure, the external heat dissipation layer 400 can be selected as an infrared heat dissipation coating, and the infrared heat dissipation material is attached to the outer surfaces of the shielding cover 300 and the encapsulation heat dissipation layer 200 by spraying, so as to enhance its infrared emissivity and improve the heat radiation ability.

[0047] Embodiment 2

[0048] This embodiment provides a charging power supply, which includes a housing, a charging battery arranged in the housing, a charging terminal arranged on the housing, and a modular circuit board structure of the charging circuit as described above; at least one modular circuit board structure is provided, and the modular circuit board structure is electrically connected to the charging battery and the charging terminal. For example, the circuit board body of the modular circuit board structure can be closely attached to the main circuit board for electrical connection, and the charging battery and the charging terminal are electrically connected through the main circuit board.

[0049] The charging terminal of this embodiment can be a wired charging terminal, such as various connectors (Type-C, USB, micro-USB, etc.). Then, the charging control circuit is correspondingly a wired charging control circuit. The charging terminal can also be a wireless charging terminal, such as a wireless charging coil. Then, the charging control circuit 110 is correspondingly a wireless charging control circuit (as Figure 5 shown). It should be noted that both the wired charging control circuit and the wireless charging control circuit adopt existing conventional circuits and will not be described in detail.

[0050] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. A modular circuit board structure of a charging circuit, characterized in that: include: A circuit board body, the circuit board body having a first surface and a second surface opposite to each other, a charging control circuit being arranged on the circuit board body, and electrical components forming the charging control circuit being arranged on the first surface; A packaging heat dissipation layer, the packaging heat dissipation layer is arranged on the first surface and wraps the electrical components; Wherein, a plurality of pads are arranged on the second surface of the circuit board body, and the pads are electrically connected to the charging control circuit through printed wiring on the circuit board body.

2. The modular circuit board structure of the charging circuit according to claim 1, characterized in that: The pad is arranged on at least one side edge of the circuit board body.

3. The modular circuit board structure of the charging circuit according to claim 2, characterized in that: A plurality of pads are arranged on the edge of the circuit board body, and each of the pads is a half hole.

4. The modular circuit board structure of the charging circuit according to claim 1, characterized in that: A shielding cover is arranged around the outer side of the package heat dissipation layer, and the electrical components of the charging control circuit are located inside the shielding cover.

5. The modular circuit board structure of the charging circuit according to claim 4, characterized in that: The shielding cover comprises: a plurality of shielding baffles, which are connected and respectively located outside different sides of the package heat dissipation layer.

6. The modular circuit board structure of the charging circuit according to claim 5, characterized in that: Each of the shielding baffles comprises: a vertical baffle, the vertical baffle being located outside the side of the package heat dissipation layer; A bottom connecting portion, which is disposed at one end of the vertical baffle plate facing the circuit board body and is used to connect the circuit board body; The edge trimming portion is provided at one end of the vertical baffle away from the circuit board body and is used to bend toward the inner side of the package heat dissipation layer.

7. The modular circuit board structure of the charging circuit according to claim 6, characterized in that: The bottom connecting portion is bent toward the inner side of the package heat dissipation layer to form a welding bottom surface, and is fixed to the circuit board body by welding through the welding bottom surface; Alternatively, the bottom connecting portion includes a plurality of pins, which are inserted into the circuit board body.

8. The modular circuit board structure of the charging circuit according to claim 1, characterized in that: An outer surface of the package heat dissipation layer and / or an outer surface of the package heat dissipation layer is provided with an outer heat dissipation layer.

9. The modular circuit board structure of the charging circuit according to claim 8, characterized in that: The outer heat dissipation layer includes an infrared radiation heat dissipation film, and the infrared radiation heat dissipation film is attached to the surface of the package heat dissipation layer.

10. A charging power supply, characterized in that: It comprises: a housing, a rechargeable battery arranged in the housing, a charging terminal arranged on the housing, and a modular circuit board structure of the charging circuit according to any one of claims 1 to 9; The modular circuit board structure is provided with at least one, and the modular circuit board structure of the charging circuit is electrically connected to the rechargeable battery and the charging terminal.

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