Mounting structure of multilayer circuit board and corresponding intelligent information communication case

Abstract

The utility model provides a multilayer circuit board mounting structure and a corresponding intelligent information communication chassis, the multilayer circuit board mounting structure comprises a bottom plate, the top of the bottom plate is provided with a plurality of mounting racks close to the two ends along the vertical direction, and the side wall of each mounting rack is provided with a plurality of limiting convex edges formed by flanging. A limiting rail is arranged between every two adjacent limiting convex edges, a circuit board is installed in each limiting rail, the limiting rails are horizontally arranged, one ends of the multiple installation frames are connected through a connecting plate, multiple end cover plates are installed at the ends, away from the connecting plate, of the adjacent installation frames, and the end cover plates directly face the circuit boards; the circuit board is limited between the end cover plate and the connecting plate, according to the mounting structure of the multi-layer circuit board and the corresponding intelligent information communication case, the mounting structure of the multi-layer circuit board enables the circuit board to be easy to mount, dismount and maintain, the maintainability of equipment is improved, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of chassis, in particular to an installation structure for multi-layer circuit boards and a corresponding intelligent information communication chassis. Background Art

[0002] The intelligent information communication chassis has perfect and powerful data application functions and also has functions such as a lightning protection system. Therefore, there are generally many circuit board modules inside it, and the structure is relatively complex. For the existing installation structure of circuit boards in the chassis, too many screws are required to fix the circuit boards, and the installation and disassembly are relatively troublesome. Moreover, the multi-layer circuit boards generate heat severely, and if the heat dissipation channel design is unreasonable, it is easy to cause a relatively high temperature, affecting the performance of the chips on the circuit boards.

[0003] Therefore, it is necessary to provide an installation structure for multi-layer circuit boards and a corresponding intelligent information communication chassis to solve the above technical problems. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model provides an installation structure for multi-layer circuit boards and a corresponding intelligent information communication chassis.

[0005] An installation structure for multi-layer circuit boards provided by the utility model includes a bottom plate. A plurality of mounting frames are vertically installed at both ends of the top of the bottom plate. The side wall of the mounting frame is provided with a plurality of limiting convex edges formed by flanging, and a limiting track is arranged between adjacent limiting convex edges. A circuit board is installed in the limiting track, and the limiting track is horizontally arranged. One end of each of the plurality of mounting frames is connected to the same connecting plate, and the other ends of two adjacent mounting frames are provided with the same end cover plate. The end cover plate is arranged opposite to the circuit board, and the circuit board is limited between the end cover plate and the connecting plate.

[0006] In the utility model, the top and bottom of the end cover plate are respectively provided with an upper bending part and a lower bending part perpendicular to the end cover plate, and the upper bending parts and the lower bending parts of adjacent end cover plates are in contact with each other.

[0007] Furthermore, a threaded sleeve for fixing the circuit board is riveted and fixed on the lower bending part.

[0008] In addition, two adjacent end cover plates share a screw. A limiting plate is sleeved on the screw. The screw fixedly connects one end cover plate with the corresponding mounting frame, and at the same time, the screw forms a fixed fit between the adjacent end cover plate and the corresponding mounting frame through the limiting plate. A limiting block is arranged on the limiting plate, and a limiting hole connected to the limiting block is arranged on the adjacent end cover plate.

[0009] The present utility model also provides an intelligent information communication chassis, which includes the installation structure of the above-mentioned multi-layer circuit board. The intelligent information communication chassis further includes a U-shaped cover plate that cooperates with the bottom plate to form a box body, and the U-shaped cover plate is fixedly connected to the top of the mounting rack. A front cover plate is installed between the U-shaped cover plate and the bottom plate, and the front cover plate is arranged parallel to the connecting plate.

[0010] Preferably, one end of the top of the bottom plate is fixedly provided with a fan rack, a heat dissipation fan is fixed inside the fan rack, a first heat dissipation channel is provided on the side wall of the fan rack, a second heat dissipation channel is provided on the mounting rack, and heat dissipation holes are provided on both side walls of the two ends of the U-shaped cover plate.

[0011] Preferably, support bending parts are provided at the four corners of the fan rack, and the bending parts are respectively in contact with the U-shaped cover plate and the bottom plate.

[0012] Preferably, L-shaped mounting plates are fixed on both sides of the U-shaped cover plate, and mounting holes are provided on the L-shaped mounting plates.

[0013] Preferably, the U-shaped cover plate, the mounting rack and the fan rack are all sheet metal parts.

[0014] Preferably, a fixing rack is fixed on the circuit board. One end of the fixing rack is hinged with a clamping plate. A fixed hard disk installation slot is provided inside the fixing rack. A clamping slot is provided at one end of the fixing rack, and a clamping plate cooperating with the clamping slot is provided at one end of the clamping plate.

[0015] Preferably, a pick-and-place notch is provided on the fixing rack.

[0016] Compared with the related art, the present utility model has the following beneficial effects:

[0017] Modular design: The installation structure of the multi-layer circuit board makes the circuit board easy to install, disassemble and maintain, improving the maintainability and service life of the device.

[0018] Heat dissipation optimization: Through the design of the fan rack, heat dissipation fan, heat dissipation channel and heat dissipation hole, an effective heat dissipation system is formed, ensuring the temperature stability inside the chassis and improving the reliability and stability of the device.

[0019] Space utilization: The design of the multi-layer circuit board makes full use of the internal space of the chassis, improving the integration and space utilization rate of the device.

[0020] The solid-state hard disk is easy to disassemble and assemble: The fixed hard disk is fixed in the fixed hard disk installation slot through the clamping plate, and the fixed hard disk is connected to the circuit board through a data cable. The clamping slot and the clamping plate are clamped and matched, which is convenient for installation and disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of the installation position of the circuit board of the present utility model;

[0022] Figure 2 Schematic diagram of the distribution of the mounting frame of the present utility model;

[0023] Figure 3 Schematic diagram of the relative positions of the bottom plate and the mounting frame of the present utility model;

[0024] Figure 4 Schematic diagram of the structure of the mounting frame of the present utility model;

[0025] Figure 5 Schematic diagram of the overall structure of the present utility model;

[0026] Figure 6 Schematic diagram of the structure of the end cover plate of the present utility model;

[0027] Figure 7 Schematic diagram of the structure of the fixing frame of the present utility model;

[0028] Figure 8 Schematic diagram of the structure of the fan frame of the present utility model.

[0029] Reference numerals in the figure: 1, circuit board; 2, bottom plate; 3, mounting frame; 4, limiting convex edge; 5, limiting track; 6, connecting plate; 7, end cover plate; 8, U-shaped cover plate; 9, front cover plate; 10, fan frame; 11, cooling fan; 12, first heat dissipation channel; 13, second heat dissipation channel; 14, heat dissipation holes; 15, support bending part; 16, L-shaped mounting plate; 17, mounting holes; 18, upper bending part; 19, lower bending part; 20, threaded sleeve; 21, fixing frame; 22, clamping plate; 23, fixed hard disk mounting groove; 24, card slot; 25, card plate; 26, access notch; 27, limiting plate; 28, limiting hole. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present utility model.

[0031] The directional terms mentioned in the present utility model, such as "up", "down", "front", "rear", "left", "right", "inside", "outside", "side", "top" and "bottom" and other words, are only references to the orientation of the accompanying drawings. The directional terms used are for explaining and understanding the present utility model, rather than for limiting the present utility model.

[0032] In the terms of this utility model, words such as "first" and "second" are only for descriptive purposes and cannot be construed as indicating or implying relative importance, nor as limiting the order of precedence.

[0033] In this utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "linkage", "fixation" should be understood in a broad sense. For example, the connection can be a detachable connection or a connection of an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0034] The following is an intelligent information communication chassis provided by this utility model, which can solve the above technical problems.

[0035] Please refer to Figure 1 and Figure 2 , the design of the intelligent information communication chassis in this embodiment follows the principles of modularization and heat dissipation optimization. The intelligent information communication chassis includes an installation structure for multi-layer circuit boards. In the installation structure of the multi-layer circuit boards, circuit board 1 is firmly fixed on the bottom plate 2 through a carefully designed mounting bracket 3. A number of mounting brackets 3 are installed along the vertical direction at the top of the bottom plate 2. The side wall of the mounting bracket 3 is provided with a number of limiting convex edges 4 formed by flanging, and a limiting track 5 is provided between adjacent limiting convex edges 4. Circuit board 1 is installed in the limiting track 5. The limiting track 5 is horizontally arranged. One end of a number of mounting brackets 3 is all connected to the same through a connecting plate 6. The ends of two adjacent mounting brackets 3 away from the connecting plate 6 are installed with the same end cover plate 7. The end cover plate 7 is arranged facing the circuit board 1, forming a structure that is both stable and easy to maintain. Circuit board 1 is accurately limited in the limiting track 5 of the mounting bracket 3. Circuit board 1 is limited between the end cover plate 7 and the connecting plate 6, ensuring the stability and easy maintainability of the circuit board 1.

[0036] Please refer to Figure 2 and Figure 5 , the intelligent information communication chassis is composed of key components such as the bottom plate 2, the U-shaped cover plate 8, and the front cover plate 9. They jointly form a closed and protective space, providing comprehensive protection for the internal circuit board 1 and electronic components. Among them, the U-shaped cover plate 8 is closely matched with the bottom plate 2 to form the main body part of the chassis, and it is also fixedly connected to the top of the mounting bracket 3. The front cover plate 9 is installed between the U-shaped cover plate 8 and the bottom plate 2, and it is parallel to the connecting plate 6, further enhancing the structural strength and stability of the chassis.

[0037] Please refer to Figure 3 and Figure 8, in terms of heat dissipation, this design also performs excellently. At one end of the top of the bottom plate 2, a fan frame 10 is fixedly installed, which is equipped with an efficient heat dissipation fan 11 inside. The side wall of the fan frame 10 is provided with a first heat dissipation channel 12, and the mounting frame 3 is provided with a second heat dissipation channel 13. These channels and the heat dissipation holes 14 on the side walls at both ends of the U-shaped cover plate 8 together form an effective heat dissipation path, ensuring that the heat inside the chassis can be discharged in time, thereby maintaining the temperature stability inside the chassis.

[0038] Please refer to Figure 5 , in addition, this design also takes into account the convenience of installation and the flexibility of use. L-shaped mounting plates 16 are fixedly installed on both sides of the U-shaped cover plate 8, and mounting holes 17 are provided on them, which facilitates the easy installation of the entire chassis module into the cabinet. At the same time, the U-shaped cover plate 8, the mounting frame 3, and the fan frame 10 are all made of sheet metal parts, which are not only easy to process and manufacture, but also have high strength and good heat dissipation performance.

[0039] Please refer to Figure 6 , in the detail design, upper bending parts 18 and lower bending parts 19 perpendicular to the end cover plate 7 are respectively provided at the top and bottom of the end cover plate 7. The upper bending parts 18 and lower bending parts 19 of adjacent end cover plates 7 are in contact with each other, making the installation of the end cover plate 7 more stable and reliable. A threaded sleeve 20 for fixing the circuit board 1 is also riveted and fixed on the lower bending part 19. This design facilitates the firm connection of the circuit board 1 and the end cover plate 7 through screws.

[0040] Please refer to Figure 1 and Figure 3 , in this embodiment, two adjacent end cover plates 7 share screws. A limiting plate 27 is sleeved on the screws. The screws fixedly connect one end cover plate 7 with the corresponding mounting frame 3. At the same time, the screws form a fixed fit between an adjacent end cover plate 7 and the corresponding mounting frame 3 through the limiting plate 27. Limiting blocks are provided on the limiting plate 27, and limiting holes 28 connected to the limiting blocks are provided on an adjacent end cover plate 7, saving the number of screws and reducing the workload of disassembly and assembly.

[0041] Please refer to Figure 1 and Figure 7, the fixation of solid-state drives in the prior art requires the use of screws, making disassembly and assembly rather troublesome. In this embodiment, a clever fixing bracket 21 is also fixed on the circuit board 1. One end of the fixing bracket 21 is hinged with a clamping plate 22, and it internally has a fixed hard disk installation groove 23. A clamping groove 24 is also provided at one end of the fixing bracket 21, while a clamping plate 25 that cooperates with the clamping groove 24 is provided at one end of the clamping plate 22. Through the design of the clamping plate 22, the fixed hard disk can be conveniently fixed in the fixed hard disk installation groove 23 and connected to the circuit board 1 through a data cable. The snap-fit cooperation between the clamping groove 24 and the clamping plate 25 further simplifies the installation and disassembly process. At the same time, a pick-and-place notch 26 is also provided on the fixing bracket 21, and this design makes the pick-and-place of the solid-state drive more convenient and fast.

[0042] The installation structure of the multi-layer circuit board and the design of the intelligent information communication chassis in this embodiment are based on the principles of modularization and heat dissipation optimization. The circuit board 1 is fixed on the bottom plate 2 through the mounting bracket 3, and each mounting bracket 3 is connected by a connecting plate 6 to form a stable structure. The circuit board 1 is limited within the limiting track 5 of the mounting bracket 3 and fixed by the end cover plate 7 and screws to ensure the stability and easy maintenance of the circuit board 1. The intelligent information communication chassis is composed of components such as the bottom plate 2, the U-shaped cover plate 8, and the front cover plate 9, forming a closed space to protect the internal circuit board 1 and electronic components.

[0043] In terms of heat dissipation, the cooling fan 11 in the fan bracket 10 forms an effective heat dissipation path through the first heat dissipation channel 12, the second heat dissipation channel 13, and the heat dissipation holes on the U-shaped cover plate 8, ensuring that the heat inside the chassis can be discharged in time and maintaining the temperature stability inside the chassis.

[0044] The above are only the embodiments of the present invention, and thus do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A multi-layer circuit board installation structure, characterized in that: The invention comprises a bottom plate (2), wherein a plurality of mounting frames (3) are mounted on the top of the bottom plate (2) near both ends along the vertical direction, a plurality of flanged limiting convex edges (4) are arranged on the side walls of the mounting frames (3), and a limiting track (5) is arranged between adjacent limiting convex edges (4), a circuit board (1) is mounted in the limiting track (5), and the limiting track (5) is arranged horizontally, one end of the plurality of mounting frames (3) is connected to the same connecting plate (6), and the ends of two adjacent mounting frames (3) away from the connecting plate (6) are mounted with the same end cover plate (7), the end cover plate (7) is arranged opposite to the circuit board (1), and the circuit board (1) is limited between the end cover plate (7) and the connecting plate (6).

2. The mounting structure of a multi-layer circuit board according to claim 1, characterized in that: The top and bottom of the end cover plate (7) are respectively provided with an upper bending portion (18) and a lower bending portion (19) perpendicular to the end cover plate (7), and the upper bending portions (18) and the lower bending portions (19) of adjacent end cover plates (7) are in contact with each other.

3. The mounting structure of a multi-layer circuit board according to claim 2, characterized in that: A threaded sleeve (20) for fixing the circuit board (1) is riveted and fixed on the lower bent portion (19).

4. The mounting structure of a multi-layer circuit board according to claim 2, characterized in that: Two adjacent end cover plates (7) share a screw, a limiting plate (27) is sleeved on the screw, the screw fixes one end cover plate (7) with the corresponding mounting frame (3), and at the same time, the screw forms a fixed fit between an adjacent end cover plate (7) and the corresponding mounting frame (3) through the limiting plate (27), a limiting block is provided on the limiting plate (27), and a limiting hole (28) connected to the limiting block is provided on the adjacent end cover plate (7).

5. An intelligent information communication chassis, characterized in that: The intelligent information communication chassis comprises a mounting structure for a multi-layer circuit board as described in any one of claims 1 to 4, wherein the intelligent information communication chassis also comprises a U-shaped cover plate (8) which cooperates with the base plate (2) to form a chassis body, and the U-shaped cover plate (8) is fixedly connected to the top of the mounting frame (3), and a front cover plate (9) is installed between the U-shaped cover plate (8) and the base plate (2), and the front cover plate (9) is arranged parallel to the connecting plate (6).

6. The intelligent information communication box according to claim 5, characterized in that: A fan frame (10) is fixedly mounted on one end of the top of the base plate (2), a heat dissipation fan (11) is fixed inside the fan frame (10), a first heat dissipation channel (12) is provided on the side wall of the fan frame (10), a second heat dissipation channel (13) is provided on the mounting frame (3), and heat dissipation holes (14) are provided on both end side walls of the U-shaped cover plate (8).

7. The intelligent information communication box according to claim 6, characterized in that: The four corners of the fan frame (10) are each provided with a supporting bent portion (15), and the bent portion (15) is in contact with the U-shaped cover plate (8) and the bottom plate (2) respectively.

8. The intelligent information communication box according to claim 5, characterized in that: L-shaped mounting plates (16) are fixed to both sides of the U-shaped cover plate (8), and mounting holes (17) are provided on the L-shaped mounting plates (16).

9. The intelligent information communication box according to claim 5, characterized in that: A fixing frame (21) is fixed on the circuit board (1), one end of the fixing frame (21) is hinged with a clamping plate (22), a hard disk installation slot (23) is provided in the fixing frame (21), one end of the fixing frame (21) is provided with a card slot (24), and one end of the clamping plate (22) is provided with a card plate (25) that matches the card slot (24).

10. The intelligent information communication box according to claim 9, characterized in that: The fixing frame (21) is provided with a taking-in and putting-out notch (26).

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