Heat dissipation device for power tube and power tube assembly comprising same

Abstract

The utility model discloses a heat radiation device for a power tube and a power tube assembly comprising the same, the heat radiation device comprises an insulation heat radiation fin, the insulation heat radiation fin is respectively provided with a first connection hole used for being connected with a heat radiator and a second connection hole used for being connected with the power tube, and the first connection hole and the second connection hole are arranged on the insulation heat radiation fin in a staggered manner; wherein the first connecting hole is a through hole, and the first screw penetrates through the first connecting hole and is screwed on the radiator, so that the insulating radiating fin is fixed on the radiator; the second connecting hole is a blind hole and is a threaded hole, the second screw can penetrate into the second connecting hole and tighten the power tube on the insulating cooling fin, the insulating cooling fin and the radiator are not connected through the same screw, large voltage difference between the power tube and the radiator cannot be generated, the power tube cannot be directly grounded due to the fact that the radiator is grounded, and the service life of the power tube is prolonged. And meanwhile, the second connecting hole is a blind hole, so that the power tube and the radiator are further separated, better heat dissipation and insulation effects are realized, and the high-voltage insulation structure can adapt to a high-voltage insulation environment of more than 2000V.

Description

Technical Field

[0001] The utility model relates to the technical field of power tubes, in particular to a heat dissipation device for a power tube and a power tube assembly containing the same. Background Art

[0002] At present, various power electronic converters are developing towards higher power and higher voltage. With the increase of power and voltage, how to balance the two problems of insulation and heat dissipation is the key point.

[0003] For example, the mainstream structure of the existing power single-tube insulation and heat dissipation is to sandwich a ceramic gasket between the power tube and the radiator, and there are relatively accurate screw holes on the power tube, the ceramic gasket and the radiator. Screws are screwed into the screw holes, and the power tube, the ceramic gasket and the radiator are tightened together, so as to realize the functions of power tube insulation and heat dissipation.

[0004] When the bus voltage exceeds 2000V, especially for some test power supplies, the insulation requirements are higher, because the output voltage of the test power supply must be higher than these high-voltage and high-power power supplies in order to measure their speed, and the floating voltage also needs to be considered, resulting in a further increase in the voltage of the power tube to the ground, which is basically required to be above 2000V.

[0005] In the prior art, the power tube is directly connected to the radiator by screws, and there are at least the following problems:

[0006] 1. If the radiator itself is grounded, if the drain or source of the power tube is connected to a high-voltage source and the radiator is grounded, this may generate a large voltage difference between the semiconductor part of the power tube and the radiator, and the existing installation and insulation methods are difficult to meet the insulation requirements of such a high voltage;

[0007] 2. The volume of the radiator is generally relatively large. If the radiator body is not grounded and reliable fixation is ensured, its installation method is relatively cumbersome and the insulation cost is high;

[0008] 3. If there is no appropriate thermal interface material, the heat conduction between the power tube and the radiator may not be very effective, which may cause the heat to not be well transferred from the power tube to the radiator, affecting the overall thermal management.

[0009] Therefore, the above prior art has at least the following technical problems: The power tubes in the prior art cannot meet the higher voltage insulation requirements. Summary of the Utility Model

[0010] By providing a heat dissipation device for a power tube and a power tube assembly containing the same, the embodiments of the present application solve the technical problem that the power tubes in the prior art cannot meet the higher voltage insulation requirements.

[0011] To solve the above technical problems, in a first aspect, an embodiment of the present application provides a heat dissipation device for a power tube, including: a radiator and an insulating heat sink for being disposed between the radiator and the power tube;

[0012] The insulating heat sink is respectively provided with a first connection hole for connecting with the radiator and a second connection hole for connecting with the power tube, and the first connection hole and the second connection hole are staggeredly arranged on the insulating heat sink, wherein:

[0013] The first connection hole is a through hole, a first screw can pass through the first connection hole and be tightened on the radiator, and the insulating heat sink is fixed on the radiator;

[0014] The second connection hole is a blind hole and is a threaded hole, and a second screw can be inserted into the second connection hole to tighten the power tube on the insulating heat sink.

[0015] Further, the insulating heat sink completely covers the corresponding power tube, and any edge of the insulating heat sink extends beyond the same-side edge of the corresponding power tube by at least 4 mm.

[0016] Further, the thickness of the insulating heat sink is at least 2 mm.

[0017] Further, the insulating heat sinks of the respective power tubes are integrated into one piece.

[0018] Further, the radiator is provided with a groove for placing the insulating heat sink, and when the insulating heat sink is placed in the groove, the insulating heat sink is flush with the outer surface of the radiator.

[0019] Further, the groove is provided with a positioning groove, and the insulating heat sink is provided with a positioning protrusion matching with the positioning groove, and the positioning protrusion can be inserted into the positioning groove to guide the installation of the insulating heat sink in the positioning groove.

[0020] Further, a thermal interface material is filled between the radiator and the insulating heat sink, and between the insulating heat sink and the power tube.

[0021] Further, the thermal interface material is a coating applied on the radiator, the insulating heat sink and the power tube.

[0022] Further, the coating is thermal grease.

[0023] In a second aspect, an embodiment of the present application provides a power tube assembly, including a power tube and the power tube heat dissipation device according to any item in the first aspect; wherein:

[0024] The first screw passes through the first connection hole and is tightened on the radiator, and fixes the insulating heat sink on the radiator;

[0025] The second screw penetrates into the second connection hole and tightens the power tube on the insulating heat sink.

[0026] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0027] (1) In the heat dissipation device for the power tube described in the embodiments of the present application, by respectively arranging the first connection hole and the second connection hole on the insulating heat sink, the insulating heat sink is fixed to the radiator through the first screw and the first connection hole, and the insulating heat sink is fixed to the power tube through the second screw and the second connection hole. Then, the insulating heat sink and the radiator are not connected by the same screw, so that a large voltage difference will not be generated between the semiconductor part of the power tube and the radiator, and the power tube will not be directly grounded due to the grounding of the radiator. At the same time, since the second connection hole is a blind hole, the power tube and the radiator are further insulated, achieving better heat dissipation and insulation effects, and can adapt to a high-voltage insulation environment above 2000V.

[0028] (2) The insulating heat sink completely covers the corresponding power tube, and any edge of the insulating heat sink extends beyond the same-side edge of the corresponding power tube by at least 4 mm. Since the area of the insulating heat sink is increased, the distance between the power tube and the metal radiator is naturally increased, thereby increasing the creepage distance, meeting the requirements of high-voltage clearance and high-voltage creepage, and enabling extremely high-voltage insulation. At the same time, excellent heat dissipation performance is ensured. In this way, the high-voltage insulation requirements above 2000V can be met.

[0029] (3) The thickness of the insulating heat sink is at least 2 mm, which can ensure that the material itself will not be broken down along the thickness direction.

[0030] (4) The insulating heat sinks of each power tube are integrated into one piece, which can further increase the area of the insulating heat sink, improve the insulation and heat dissipation effects, and further increase the heat dissipation performance and creepage distance.

[0031] (5) By arranging the positioning groove and the positioning convex head, the installation direction of the insulating heat sink in the positioning groove can be indicated, so that the positions and orientations of the first connection holes and the second connection holes are correct, facilitating the accurate and efficient installation of the insulating heat sink in the positioning groove.

[0032] (6) A thermal interface material is filled between the radiator and the insulating heat sink, and between the insulating heat sink and the power tube. The thermal interface material can eliminate the gap between the insulating heat sink and the radiator, thereby improving the insulation and heat dissipation effects to better meet the high-voltage insulation requirements above 2000V.

[0033] In summary, the heat dissipation device for power tubes described in the embodiments of the present application effectively solves the technical problem in the prior art that power tubes cannot meet the relatively high voltage insulation requirements. It can well meet the high-voltage insulation requirements above 2000V, ensure the reliable operation of high-power and extremely high-voltage power supplies, and accelerate the process of comprehensive electrification. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0035] Figure 1 It is a schematic structural diagram of a power tube assembly in an embodiment of the present invention;

[0036] Figure 2 It is an exploded schematic structural diagram of a power tube assembly in an embodiment of the present invention;

[0037] Figure 3 It is a schematic structural diagram of a radiator in an embodiment of the present invention;

[0038] Figure 4 It is a schematic structural diagram of an insulating heat sink in an embodiment of the present invention;

[0039] Figure 5 It is a top view of an insulating heat sink in an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0040] By providing a heat dissipation device for power tubes and a power tube assembly containing the same in the embodiments of the present application, the technical problem in the prior art that power tubes cannot meet the relatively high voltage insulation requirements is solved.

[0041] In order to better understand the above technical solutions, the following will specifically describe the above technical solutions in detail in combination with the drawings in the specification and specific embodiments.

[0042] One or more embodiments of the present application provide a heat dissipation device for a power tube, including a radiator 100 and an insulating heat sink 200. The heat dissipation device for the power tube can be used to dissipate heat from the power tube 300, and the power tube 300 is fixed on the heat dissipation device for the power tube to form a power tube assembly.

[0043] As Figures 1 to 5 shown, the power tube assembly includes a radiator 100, a power tube 300, and an insulating heat sink 200 disposed between the radiator 100 and the power tube 300. The insulating heat sink 200 is respectively provided with a first connection hole 220 for connecting with the radiator 100 and a second connection hole 230 for connecting with the power tube 300, and the first connection hole 220 and the second connection hole 230 are staggeredly arranged on the insulating heat sink 200, where:

[0044] The first connection hole 220 is a through hole, and the first connection hole 220 is a non-threaded hole (smooth hole). A first screw 400 passes through the first connection hole 220 and is threadedly connected to the radiator 100, and the insulating heat sink 200 is fixed on the radiator 100;

[0045] The second connection hole 230 is a blind hole, and the second connection hole 230 is a threaded hole. A second screw 500 is inserted into the second connection hole 230 and the power tube 300 is tightened on the insulating heat sink 200.

[0046] From the above description, it can be seen that the heat dissipation device for the power tube described in the embodiments of the present application respectively sets the first connection hole 220 and the second connection hole 230 on the insulating heat sink 200, so that the insulating heat sink 200 and the radiator 100 are fixed through the first screw 400 and the first connection hole 220, and the insulating heat sink 200 and the power tube 300 are fixed through the second screw 500 and the second connection hole 230. Then, the insulating heat sink 200 and the radiator 100 are not connected by the same screw, and a large voltage difference will not be generated between the semiconductor part of the power tube 300 and the radiator 100, and the power tube 300 will not be directly grounded due to the grounding of the radiator 100; at the same time, since the second connection hole 230 is a blind hole, the power tube 300 and the radiator 100 are further insulated, achieving better heat dissipation and insulation effects.

[0047] Therefore, the power tube described in the embodiments of the present application has at least the following technical effects:

[0048] 1. The voltage difference between the semiconductor part of the power tube 300 and the radiator 100 is small, and the power tube 300 has good reliability and a long service life;

[0049] 2. The power tube 300 is not directly grounded, and the power tube has good safety;

[0050] 3. The heat conduction effect between the power transistor 300 and the radiator 100 is good;

[0051] 4. The power transistor has good heat dissipation effect and insulation effect, and can adapt to the high-voltage insulation environment above 2000V.

[0052] In summary, the heat dissipation device for the MOS transistor power tube described in the embodiments of the present application effectively solves the technical problem that the power transistors in the prior art cannot meet the relatively high voltage insulation requirements.

[0053] It should be noted that the first connection hole 220 is a threadless hole. After the first screw 400 passes through the first connection hole 220, it is directly threadedly connected to the radiator 100, making the installation simpler and more convenient. The insulating heat sink 200 is clamped between the head of the first screw 400 and the radiator 100.

[0054] In addition, in the embodiments of the present application, the power transistor may be a MOS transistor, an IGBT transistor, etc.

[0055] The creepage distance refers to the shortest distance along the surface of the insulating material between two conductive components in electrical equipment, especially in high-voltage electrical equipment. This distance is crucial for ensuring electrical safety because it can prevent electrical failures caused by arcs or corona.

[0056] The insulating heat sink 200 mainly plays two roles between the power transistor 300 and the radiator 100. One is to improve the heat conduction efficiency, and the other is to provide electrical isolation. However, if the size of the insulating heat sink 200 is small, it may affect the creepage distance, and the specific understanding is as follows:

[0057] Reducing the creepage distance: The reduction in the size of the insulating heat sink 200 means that its coverage area between the two conductive components decreases, which will directly lead to a reduction in the creepage distance;

[0058] Increasing the risk of surface discharge: The reduction in the creepage distance may increase the risk of surface discharge under high voltage, especially in a humid or polluted environment;

[0059] Affecting electrical safety: If the creepage distance is less than the minimum value specified by the safety standard, it may violate the electrical safety code and increase the risks of electrical failures and personal safety.

[0060] In the prior art, due to the relatively small area of the ceramic gasket, the creepage distance is small and cannot meet the high-voltage insulation requirements. Therefore, in an embodiment of the present application, as Figures 1 to 2As shown, the insulating heat sink 200 completely covers the corresponding power transistor 300, and any edge of the insulating heat sink 200 extends at least 4 mm beyond the same-side edge of the corresponding power transistor 300.

[0061] It can be understood that since the area of the insulating heat sink 200 is increased, the distance between the power transistor 300 and the metal heat sink 100 is naturally increased, thereby increasing the creepage distance, meeting the requirements of high-voltage clearance and high-voltage creepage, enabling extremely high-voltage insulation, and ensuring excellent heat dissipation performance. Thus, it can meet the high-voltage insulation requirements above 2000V.

[0062] It should be noted that the corresponding power transistor 300 of the insulating heat sink 200 refers to the target power transistor 300 for insulation and heat dissipation of the insulating heat sink 200.

[0063] Furthermore, the thickness of the insulating heat sink 200 is at least 2 mm. It can be understood that the insulating heat sink 200 itself has sufficient thickness to ensure that the material itself will not be broken down along the thickness direction.

[0064] In an embodiment of the present application, as Figures 1 to 2 shown, the insulating heat sinks 200 of each power transistor 300 are integrated into one piece. Thus, the area of the insulating heat sink 200 can be further increased, the insulation and heat dissipation effects can be improved, and the heat dissipation performance and creepage distance can be further increased to better adapt to the high-voltage insulation environment above 2000V.

[0065] In an embodiment of the present application, as Figures 2 to 3 shown, the heat sink 100 is provided with a groove 110 for placing the insulating heat sink 200. When the insulating heat sink 200 is placed in the groove 110, the insulating heat sink 200 is flush with the outer surface of the heat sink 100. Thus, the appearance consistency is ensured, which is convenient for cooperation with other components.

[0066] In an embodiment of the present application, as Figures 1 to 4 shown, a positioning groove 120 is provided in the groove 110 of the heat sink 100, and a positioning protrusion 210 is provided on the insulating heat sink 200. The positioning protrusion 210 can be inserted into the positioning groove 120 to guide the installation of the insulating heat sink 200 in the positioning groove 120.

[0067] It can be understood that by providing the positioning groove 120 and the positioning protrusion 210, the installation direction of the insulating heat sink 200 in the positioning groove 120 can be indicated, so that the positions and orientations of the first connection holes 220 and the second connection holes 230 are correct, facilitating the accurate and efficient installation of the insulating heat sink 200 in the positioning groove 120.

[0068] In an embodiment of the present application, a thermal interface material is filled between the radiator 100 and the insulating heat sink 200, and between the insulating heat sink 200 and the power transistor 300.

[0069] Specifically, the thermal interface material can eliminate the gap between the insulating heat sink 200 and the radiator 100, thereby improving the insulation and heat dissipation effects to better meet the high-voltage insulation requirements above 2000V.

[0070] Furthermore, the thermal interface material is a coating applied on the radiator 100, the insulating heat sink 200, and the power transistor 300.

[0071] Even further, the coating is thermal grease. Specifically, thermal grease, also known as heat dissipation paste or thermal paste, is a thermally conductive silicone grease-like composite made mainly of organosiloxane and added with materials with excellent heat resistance and thermal conductivity. It is mainly used for heat conduction and dissipation of electronic components, such as power amplifiers, transistors, electron tubes, CPUs, etc., so as to ensure the stable electrical performance of electronic instruments, meters, etc.

[0072] Furthermore, the radiator 100 is an aluminum radiator 100. Specifically, aluminum has excellent thermal conductivity, which enables the aluminum radiator 100 to quickly and effectively transfer heat to the environment; at the same time, the density of aluminum is relatively low, making the aluminum radiator 100 lighter than other materials such as copper radiators 100, facilitating portability and installation, and having a lower cost.

[0073] In addition, the insulating heat sink 200 can be made of materials such as ceramic sheets or thermally conductive silicone sheets that have excellent voltage resistance and good heat dissipation performance.

[0074] Furthermore, as Figures 1 to 2 shown, a power transistor connection hole 310 for screwing in the second screw 500 is provided on the power transistor 300.

[0075] It should be understood that although terms such as "first" and "second" may be used here to describe various units, these units should not be limited by these terms. These terms are only used to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, the first unit can be called the second unit, and similarly the second unit can be called the first unit.

[0076] The outer, middle, inner and other directional terms mentioned or likely to be mentioned in this specification are defined with respect to the structures shown in the respective drawings. They are relative concepts and may therefore change accordingly depending on their different positions and usage states. Therefore, these or other directional terms should not be construed as restrictive terms either.

[0077] As described above, the foregoing are only the preferred embodiments of this application and do not impose any formal or substantial limitations on this application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the method of this application, several improvements and supplements can still be made, and these improvements and supplements should also be regarded as within the protection scope of this utility model. Any equivalent changes such as minor modifications, decorations and evolutions that can be made by those skilled in the art by using the technical content disclosed above without departing from the spirit and scope of this application are equivalent embodiments of this application; at the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of this application still fall within the scope of the technical solution of this application.

Claims

1. A heat dissipation device for a power tube, characterized in that: It includes a radiator and an insulating heat sink used to be arranged between the radiator and the power tube; The insulating heat sink is provided with a first connection hole for connecting to the radiator and a second connection hole for connecting to the power tube, and the first connection hole and the second connection hole are staggered on the insulating heat sink, wherein: The first connection hole is a through hole, and the first screw can pass through the first connection hole and be tightened on the heat sink, thereby fixing the insulating heat sink on the heat sink; The second connection hole is a blind hole, and the second connection hole is a threaded hole, and the second screw can be inserted into the second connection hole to tighten the power tube onto the insulating heat sink.

2. A heat dissipation device for a power tube as claimed in claim 1, characterized in that: The insulating heat sink completely covers the corresponding power tube, and any edge of the insulating heat sink exceeds the same side edge of the corresponding power tube by at least 4 mm.

3. A heat dissipation device for a power tube as claimed in claim 1, characterized in that: The thickness of the insulating heat sink is at least 2 mm.

4. A heat dissipation device for a power tube as claimed in claim 1, characterized in that: The insulating heat sinks of the power tubes are integrated into one piece.

5. A heat sink for a power tube as claimed in claim 1, characterized in that: The radiator is provided with a groove for accommodating the insulating radiating fin. When the insulating radiating fin is placed in the groove, the insulating radiating fin is flush with the outer surface of the radiator.

6. A heat dissipation device for a power tube as claimed in claim 5, characterized in that: A positioning groove is provided in the groove, and a positioning convex head matching with the positioning groove is provided on the insulating heat sink. The positioning convex head can be inserted into the positioning groove to guide the installation of the insulating heat sink in the positioning groove.

7. A heat dissipation device for a power tube as claimed in claim 1, characterized in that: Thermal conductive interface materials are filled between the heat sink and the insulating heat sink, and between the insulating heat sink and the power tube.

8. A heat dissipation device for a power tube as claimed in claim 7, characterized in that: The thermal interface material is a coating applied on the heat sink, the insulating heat sink and the power tube.

9. A heat sink for a power tube as claimed in claim 8, characterized in that: The coating is thermally conductive silicone grease.

10. A power tube assembly, characterized in that: The invention comprises a power tube and a power tube heat sink as claimed in any one of claims 1 to 9, wherein: A first screw passes through the first connecting hole and is tightened on the radiator, thereby fixing the insulating radiating sheet on the radiator; The second screw penetrates into the second connection hole and tightens the power tube onto the insulating heat sink.

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