Welding device for flip-chip MEMS (Micro Electro Mechanical System) chip

Abstract

The utility model discloses a welding device for flip-chip bonding MEMS chips, and aims to provide a welding device which is suitable for flip-chip bonding MEMS chip application, can position and fix a metal glass sealing column and a chip so as to ensure a circuit position corresponding relation between the metal glass sealing column and the chip, can carry out welding operation on a plurality of chips at one time, and is high in reliability. The welding device of the flip-chip MEMS chip is used for welding the MEMS chip to meet production requirements. The upper surface of the bottom plate is provided with a plurality of bottom plate placing grooves for placing metal glass sealing columns, and the bottom surfaces of the bottom plate placing grooves are provided with connecting needle via holes; the cover plate is placed on the bottom plate, a positioning structure is arranged between the cover plate and the bottom plate, the cover plate and the bottom plate are positioned through the positioning structure, the cover plate is provided with a plurality of chip placing grooves corresponding to the bottom plate placing grooves one by one, the chip placing grooves penetrate through the upper surface and the lower surface of the cover plate, and the chip placing grooves are located above the corresponding bottom plate placing grooves.

Description

Technical Field

[0001] The utility model relates to the field of chip soldering processing, and particularly relates to a soldering device for flip-chip MEMS chips. Background Art

[0002] A flip-chip is a pinless chip, generally with circuit pads at the bottom. Then solder balls are placed on the pads, and the solder balls are soldered to the external circuit to connect to the circuit. Currently, in the practical application of flip-chip MEMS chips (such as pressure sensors, gas sensors, hereinafter referred to as chips), the chips need to be soldered to the corresponding circuit parts. Especially for pressure or gas sensors, a metal-glass seal column (English name: Header) is also required for connection and fixation. The middle part of the metal-glass seal column is several metal connection pins, and the outer shape is a circular metal shell. Glass material is filled between the connection pins and the metal shell to play an insulating and sealing role. Therefore, for MEMS chips that need to be connected and fixed through a metal-glass seal column, we need to solder the solder balls on the chip to the connection pins of the metal-glass seal column. In this soldering process, a tooling is needed to position and fix the metal-glass seal column and the chip to ensure the corresponding relationship of the circuit positions between them; however, there is no existing or standard soldering tooling or fixture available on the market. Therefore, it is necessary to make a device suitable for soldering flip-chip MEMS chips to position and fix the metal-glass seal column and the chip to ensure the corresponding relationship of the circuit positions between them, and at the same time, it can perform soldering operations on multiple chips at one time to meet the production needs. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a soldering device for flip-chip MEMS chips, which is applicable to the application of flip-chip MEMS chips, can position and fix the metal-glass seal column and the chip to ensure the corresponding relationship of the circuit positions between them, and can perform soldering operations on multiple chips at one time to meet the production needs.

[0004] The technical solution of the utility model is as follows:

[0005] A soldering device for flip-chip MEMS chips, comprising:

[0006] A bottom plate, on the upper surface of which there are several bottom plate placement grooves for placing metal-glass seal columns, and connection pin through holes are provided on the bottom surface of the bottom plate placement grooves;

[0007] The cover plate is placed on the bottom plate. A positioning structure is provided between the cover plate and the bottom plate, and the cover plate and the bottom plate are positioned through the positioning structure. The cover plate is provided with a plurality of chip placement grooves corresponding one by one to the placement grooves on the bottom plate. The chip placement grooves penetrate through the upper and lower surfaces of the cover plate, and the chip placement grooves are located above the corresponding placement grooves on the bottom plate. The specific use of a flip-chip MEMS chip welding device in this solution is as follows,

[0008] Place the metal glass sealing column to be welded into the placement groove on the bottom plate (the longer side of the connecting pins in the metal glass seal is placed downward into the placement groove on the bottom plate). Each connecting pin on the metal glass sealing column is inserted into the connecting pin through-hole until the metal glass sealing column abuts against the bottom surface of the placement groove on the bottom plate. One metal glass sealing column can be placed in each placement groove on the bottom plate;

[0009] Next, place the cover plate on the bottom plate, and the cover plate and the bottom plate are positioned through the positioning structure; then, place the chip with the solder ball facing downward into the chip placement groove so that the chip abuts against each connecting pin on the metal glass sealing column. At this time, the solder ball on the chip is in contact with the connecting pins correspondingly;

[0010] Then, place the flip-chip MEMS chip welding device as a whole on a dedicated solder heating table for heating. When heated to a certain temperature, the solder balls on the back of the chip melt and are welded and fixed on the connecting pins of the metal glass sealing column, thereby forming a stable and reliable welding and fixing structure, enabling the circuit on the chip to be led to the outside through the connecting pins, and at the same time fixing the chip.

[0011] Therefore, the flip-chip MEMS chip welding device in this solution is applicable to the application of flip-chip MEMS chips, can position and fix the metal glass sealing column and the chip to ensure the corresponding relationship of the circuit positions between them, and can perform welding operations on multiple chips at one time to meet the production needs.

[0012] Preferably, the cross-sectional shape of the connecting pin through-hole is adapted to the arrangement structure of each connecting pin on the metal glass sealing column, so that each connecting pin on the metal glass sealing column can only be inserted into the connecting pin through-hole in a set orientation. Since the outer shape of the metal glass sealing column is a circular metal shell, the placement groove on the bottom plate cannot limit the placement orientation of the metal glass sealing column; and the arrangement structure of each connecting pin on the metal glass sealing column is generally arranged in a square pattern. Taking advantage of this feature in this solution, the cross-sectional shape of the connecting pin through-hole is set to be adapted to the arrangement structure of each connecting pin on the metal glass sealing column. In this way, each connecting pin on the metal glass sealing column can only be inserted into the connecting pin through-hole in a set orientation, thereby forming an anti-fooling structure for placing the connecting pins of the metal glass sealing column, enabling the connecting pins of the metal glass sealing column to only be inserted into the connecting pin through-hole in a set orientation and avoiding misplacement of the orientation of the connecting pins of the metal glass sealing column.

[0013] Preferably, the cross-section of the bottom plate placement groove is circular, and the cross-section of the connection pin through-hole is rectangular. Since the arrangement structure of the connection pins on the metallic glass sealing column is generally square, the cross-section of the connection pin through-hole is set to a matching rectangle to ensure that the connection pins on the metallic glass sealing column can only be inserted into the connection pin through-hole in a set orientation.

[0014] Preferably, the bottom plate placement grooves are arranged in several rows, and any two adjacent bottom plate placement grooves in each row are connected by a connection groove, and the connection groove is arranged on the upper surface of the bottom plate. In this way, when picking up and placing the metallic glass sealing column, a finger can reach into the connection groove to facilitate the picking up and placing of the metallic glass sealing column; at the same time, it is also beneficial to reduce the overall weight of the bottom plate.

[0015] Preferably, a plurality of weight-reducing grooves are provided on the lower surface of the bottom plate. In this way, the overall weight of the bottom plate can be reduced, facilitating the movement of a flip-chip MEMS chip welding device.

[0016] Preferably, the positioning structure includes a bottom plate limit groove provided on the lower surface of the cover plate, and the upper end of the bottom plate extends into the bottom plate limit groove. In this way, the cover plate can be conveniently positioned on the bottom plate.

[0017] Preferably, the bottom plate is square, and one corner of the bottom plate is a chamfer, and the bottom plate limit groove corresponding to the bottom plate is also square, and one corner of the bottom plate limit groove is also a chamfer. In this way, when the cover plate and the bottom plate are matched, only when the chamfer at one corner of the bottom plate is aligned with the chamfer at one corner of the bottom plate limit groove, the bottom plate limit groove on the cover plate can be sleeved on the upper end of the bottom plate, thereby forming an anti-misoperation structure, enabling the cover plate and the bottom plate to be matched in only one set orientation.

[0018] Preferably, the chip placement groove is square. Both the chip and the chip placement groove are square, so that the orientation of the chip placed in the chip placement groove can be limited.

[0019] Preferably, a plurality of annular avoidance grooves corresponding to the chip placement grooves one by one are provided on the lower surface of the cover plate, and the annular avoidance grooves surround the outside of the corresponding chip placement grooves. After the metallic glass sealing column is placed in the bottom plate placement groove, a protruding part exists at the upper end of the metallic glass sealing column, and this protruding part can be accommodated in the annular avoidance groove to avoid interference between the cover plate and the metallic glass sealing column.

[0020] Preferably, a guiding port with an opening area gradually increasing from bottom to top is provided at the upper port of the chip placement groove. In this way, when the chip is placed, it can slide into the chip placement groove through the guiding port, facilitating the placement of the chip.

[0021] The beneficial effects of the present utility model are as follows: It is applicable to flip-chip MEMS chip applications, can position and fix the metal glass sealing posts and the chips to ensure the corresponding relationship of the circuit positions between them, and can perform welding operations on multiple chips at one time to meet the production requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. is an exploded view of a welding device for flip-chip MEMS chips of the present utility model.

[0023] Figure 2 FIG. is an assembly drawing of a welding device for flip-chip MEMS chips of the present utility model.

[0024] Figure 3 FIG. is a three-dimensional structural schematic diagram of the bottom plate of a welding device for flip-chip MEMS chips of the present utility model.

[0025] Figure 4 FIG. is a bottom view of the cover plate of a welding device for flip-chip MEMS chips of the present utility model.

[0026] Figure 5 FIG. is a sectional structural schematic diagram of a welding device for flip-chip MEMS chips of the present utility model during actual application.

[0027] Figure 6 is Figure 5 a partial enlarged view of part A in

[0028] In the figure:

[0029] Bottom plate 1, bottom plate placement groove 1.1, connection pin through hole 1.2, connection groove 1.3, weight reduction groove 1.4, chamfer 1.5;

[0030] Cover plate 2, chip placement groove 2.1, annular avoidance groove 2.2, bottom plate limit groove 2.3, guiding port 2.4;

[0031] Metal glass sealing post 3, connection pin 3.1, metal shell 3.2;

[0032] Chip 4. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] Specific Embodiment 1, as Figures 1-6As shown in the figure, a soldering device for flip-chip MEMS chips includes a bottom plate 1 and a cover plate 2. On the upper surface of the bottom plate 1, there are several bottom plate placement grooves 1.1 for placing metal glass sealing columns 3. The bottom surface of the bottom plate placement groove 1.1 is provided with connection pin through holes 1.2. In the middle part of the metal glass sealing column 3 are several metal connection pins 3.1, and the connection pins 3.1 are arranged in a square shape. The outer shape is a circular metal shell 3.2. The space between the connection pins 3.1 and the metal shell 3.2 is filled with a glass material to play an insulating and sealing role.

[0034] The cover plate 2 is placed on the bottom plate 1. A positioning structure is provided between the cover plate 2 and the bottom plate 1. The cover plate 2 and the bottom plate 1 are positioned through the positioning structure. The cover plate 2 is provided with several chip placement grooves 2.1 corresponding one-to-one to the bottom plate placement grooves 1.1. The chip placement grooves 2.1 penetrate through the upper and lower surfaces of the cover plate 2. The chip placement grooves 2.1 are located above the corresponding bottom plate placement grooves 1.1.

[0035] The specific use of the soldering device for flip-chip MEMS chips in this embodiment is as follows.

[0036] Place the metal glass sealing column 3 to be soldered into the bottom plate placement groove 1.1 (the side with the longer connection pins 3.1 in the metal glass seal is placed downward into the bottom plate placement groove 1.1), and each connection pin 3.1 on the metal glass sealing column 3 is inserted into the connection pin through hole 1.2 until the metal glass sealing column 3 abuts against the bottom surface of the bottom plate placement groove 1.1; one metal glass sealing column 3 can be placed in each bottom plate placement groove 1.1.

[0037] Then, place the cover plate 2 on the bottom plate 1, and the cover plate 2 and the bottom plate 1 are positioned through the positioning structure; then, place the chip 4 with the solder balls facing downward into the chip placement groove 2.1 (one chip 4 can be placed in each chip placement groove 2.1), so that the chip 4 abuts against each connection pin 3.1 on the metal glass sealing column 3. At this time, the solder balls on the chip 4 are in corresponding contact with the connection pins 3.1.

[0038] Next, place the soldering device for flip-chip MEMS chips as a whole on a dedicated solder heating table for heating. When heated to a certain temperature, the solder balls on the back of the chip 4 melt and are soldered and fixed on the connection pins 3.1 of the metal glass sealing column 3, thereby forming a stable and reliable soldering and fixing structure, enabling the circuit on the chip 4 to be led to the outside through the connection pins 3.1, and at the same time fixing the chip 4.

[0039] The soldering device for flip-chip MEMS chips in this embodiment is applicable to the application of flip-chip MEMS chips 4, and can position and fix the metal glass sealing column 3 and the chip 4 to ensure the corresponding relationship of the circuit positions between them, and can perform soldering operations on multiple chips 4 at one time to meet the production needs.

[0040] Specific Embodiment 2, as Figures 1-6 shown, a soldering device for a flip-chip MEMS chip, comprising a bottom plate 1 and a cover plate 2.

[0041] On the upper surface of the bottom plate 1, there are several bottom plate placement grooves 1.1 for placing metal glass sealing columns 3. A connection pin through-hole 1.2 is provided on the bottom surface of the bottom plate placement groove 1.1. In the middle part of the metal glass sealing column 3 are several metal connection pins 3.1, and the connection pins 3.1 are arranged in a square pattern. The outer shape is a circular metal shell 3.2. Glass material is filled between the connection pins 3.1 and the metal shell 3.2 to play an insulating and sealing role. The cross-sectional shape of the connection pin through-hole 1.2 is adapted to the arrangement structure of the connection pins 3.1 on the metal glass sealing column 3, so that the connection pins 3.1 on the metal glass sealing column 3 can be inserted into the connection pin through-hole 1.2 only in a set orientation.

[0042] The cover plate 2 is placed on the bottom plate 1. A positioning structure is provided between the cover plate 2 and the bottom plate 1. The cover plate 2 and the bottom plate 1 are positioned by the positioning structure. The cover plate 2 is provided with several chip placement grooves 2.1 corresponding one-to-one to the bottom plate placement grooves 1.1. The chip placement grooves 2.1 penetrate the upper and lower surfaces of the cover plate 2. The chip placement grooves 2.1 are located above the corresponding bottom plate placement grooves 1.1. The chip placement grooves 2.1 are square. The chip 4 is also square. The cross-section of the chip placement groove 2.1 matches the chip 4.

[0043] The specific use of the soldering device for a flip-chip MEMS chip in this embodiment is as follows.

[0044] Place the metal glass sealing column 3 to be soldered into the bottom plate placement groove 1.1 (the side with the longer connection pins 3.1 of the metal glass seal is placed downward into the bottom plate placement groove 1.1), and the connection pins 3.1 on the metal glass sealing column 3 are inserted into the connection pin through-hole 1.2 until the metal glass sealing column 3 abuts against the bottom surface of the bottom plate placement groove 1.1. One metal glass sealing column 3 can be placed in each bottom plate placement groove 1.1.

[0045] In addition, since the outer shape of the metallic glass sealing column 3 is a circular metal shell 3.2, the bottom plate placement groove 1.1 cannot limit the placement orientation of the metallic glass sealing column 3. The arrangement structure of the connecting pins 3.1 on the metallic glass sealing column 3 is generally square (in this embodiment, the connecting pins 3.1 on the metallic glass sealing column 3 are arranged in a square). Taking advantage of this feature in this embodiment, the cross-sectional shape of the connecting pin through-hole 1.2 is set to be adapted to the arrangement structure of the connecting pins 3.1 on the metallic glass sealing column 3. In this way, the connecting pins 3.1 on the metallic glass sealing column 3 can only be inserted into the connecting pin through-hole 1.2 in a set orientation (otherwise, the connecting pins 3.1 on the metallic glass sealing column 3 cannot be inserted into the connecting pin through-hole 1.2), thereby forming an anti-fooling structure for placing the connecting pins 3.1 of the metallic glass sealing column 3, enabling the connecting pins 3.1 of the metallic glass sealing column 3 to only be inserted into the connecting pin through-hole 1.2 in a set orientation and avoiding misplacement of the orientation of the connecting pins 3.1 of the metallic glass sealing column 3.

[0046] Next, place the cover plate 2 on the bottom plate 1, and position the cover plate 2 and the bottom plate 1 through the positioning structure. Then, place the chip 4 with the solder balls facing downwards in the chip placement groove 2.1 (one chip 4 can be placed in each chip placement groove 2.1), so that the chip 4 abuts against the connecting pins 3.1 on the metallic glass sealing column 3. At this time, the solder balls on the chip 4 are in corresponding contact with the connecting pins 3.1 (each solder ball on the chip 4 corresponds to one connecting pin 3.1). In addition, both the chip 4 and the chip placement groove 2.1 are square. After the chip 4 is placed in the chip placement groove 2.1, the placement orientation of the chip 4 can be limited, avoiding misplacement of the orientation of the chip 4, thereby ensuring that the solder balls on the chip 4 are in corresponding contact with the connecting pins 3.1.

[0047] Then, place the welding device for a flip-chip MEMS chip as a whole on a dedicated solder heating table for heating. When heated to a certain temperature, the solder balls on the back of the chip 4 melt and are welded and fixed to the connecting pins 3.1 of the metallic glass sealing column 3, thereby forming a stable and reliable welding and fixing structure, enabling the circuit on the chip 4 to be led to the outside through the connecting pins 3.1 and fixing the chip 4 at the same time.

[0048] The welding device for a flip-chip MEMS chip in this embodiment is applicable to the application of flip-chip MEMS chips 4, can position and fix the metallic glass sealing column 3 and the chip 4 to ensure the corresponding relationship of the circuit positions between them, and can perform the welding operation of multiple chips 4 at one time to meet the production requirements.

[0049] Specifically, both the bottom plate 1 and the cover plate 2 are metal plates, for example, aluminum alloy plates, stainless steel plates, etc.

[0050] Further, as Figure 3 、Figure 6 As shown, the cross-section of the connection pin through-hole 1.2 is rectangular. Since the arrangement structure of the connection pins 3.1 on the metallic glass sealing column 3 is generally square (in this embodiment, the connection pins 3.1 on the metallic glass sealing column 3 are arranged in a square), the cross-section of the connection pin through-hole 1.2 is set to a matching rectangle to ensure that the connection pins 3.1 on the metallic glass sealing column 3 can be inserted into the connection pin through-hole 1.2 only in a set orientation.

[0051] Furthermore, a chamfer is provided at the edge of the upper port of the connection pin through-hole 1.2. This facilitates the insertion of the connection pins 3.1 on the metallic glass sealing column 3 into the connection pin through-hole 1.2.

[0052] The lower end of the connection pin through-hole 1.2 communicates with the lower surface of the base plate 1. Of course, it should be noted that the lower end of the connection pin through-hole 1.2 may not communicate with the lower surface of the base plate 1.

[0053] Furthermore, as Figure 3 shown, the cross-section of the base plate placement groove 1.1 is circular. The base plate placement groove 1.1 is adapted to the circular metal shell 3.2 of the metallic glass sealing column 3. Of course, it should be noted that the cross-section of the base plate placement groove 1.1 may also be polygonal, such as a regular polygon, etc.

[0054] A chamfer is also provided at the edge of the upper port of the base plate placement groove 1.1. This facilitates the placement of the metallic glass sealing column 3 into the base plate placement groove 1.1.

[0055] Furthermore, as Figure 3 shown, the base plate placement grooves 1.1 are arranged in several rows. Any two adjacent base plate placement grooves 1.1 in each row of base plate placement grooves 1.1 are connected by a connection groove 1.3, and the connection groove 1.3 is provided on the upper surface of the base plate 1. In this way, when picking up and placing the metallic glass sealing column 3, a finger can be inserted into the connection groove 1.3 to facilitate the picking up and placing of the metallic glass sealing column 3; at the same time, it is also beneficial to reduce the overall weight of the base plate 1.

[0056] In this embodiment, the base plate placement grooves 1.1 are evenly arranged and distributed. There are a total of seven rows of base plate placement grooves 1.1 on the base plate 1, and each row of base plate placement grooves 1.1 has seven base plate placement grooves 1.1. In this way, the base plate 1 can place 49 metallic glass sealing columns 3 at a time; the chip placement grooves 2.1 on the cover plate 2 correspond one-to-one with the base plate placement grooves 1.1, and there are also 49 chip placement grooves 2.1. 49 chips 4 can be placed on the cover plate 2 at a time; thus, a flip-chip MEMS chip welding device in this embodiment can perform welding operations on 49 chips 4 at a time to meet the production requirements.

[0057] Furthermore, as Figure 3 、 Figure 5As shown in the figure, a plurality of weight reduction grooves 1.4 are provided on the lower surface of the bottom plate 1. In this way, the overall weight of the bottom plate 1 can be reduced, facilitating the movement of a flip-chip MEMS chip welding device.

[0058] In this embodiment, the weight reduction grooves 1.4 are strip-shaped and penetrate the lower surface of the bottom plate 1. The weight reduction grooves 1.4 are evenly arranged and distributed. In this way, the overall weight of the bottom plate 1 can be reduced as much as possible.

[0059] Further, as Figure 4 、 Figure 6 shown, a plurality of annular avoidance grooves 2.2 corresponding to the chip placement grooves 2.1 one by one are provided on the lower surface of the cover plate 2. The annular avoidance grooves 2.2 surround the outside of the corresponding chip placement grooves 2.1. After the metal glass sealing column 3 is placed in the bottom plate placement groove 1.1, the upper end of the metal glass sealing column 3 has a protruding part, which can be accommodated in the annular avoidance groove 2.2 to avoid interference between the cover plate 2 and the metal glass sealing column 3.

[0060] Further, as Figure 6 shown, a guiding port 2.4 with an opening area gradually increasing from bottom to top is provided at the upper port of the chip placement groove 2.1. In this way, when the chip 4 is placed, it can slide into the chip placement groove 2.1 through the guiding port 2.4, facilitating the placement of the chip 4.

[0061] In this embodiment, avoidance openings are provided at the top corners of the chip placement groove 2.1, and the avoidance openings extend vertically through the upper and lower ends of the chip placement groove 2.1. The cross-section of the avoidance opening is arc-shaped. In this way, when the chip 4 is placed in the chip placement groove 2.1, interference between the top corners of the chip 4 and the top corners of the chip placement groove 2.1 can be avoided.

[0062] A positioning structure is provided between the cover plate 2 and the bottom plate 1, and the cover plate 2 and the bottom plate 1 are positioned through the positioning structure. Specifically,

[0063] In an implementation manner of this embodiment, as Figure 3 、 Figure 4 、 Figure 5 shown, the positioning structure includes a bottom plate limiting groove 2.3 provided on the lower surface of the cover plate 2, and the cross-sectional shape and area of the bottom plate limiting groove 2.3 are adapted to the shape and area of the upper surface of the bottom plate 1. The upper end of the bottom plate 1 extends into the bottom plate limiting groove 2.3. In this way, the cover plate 2 can be conveniently positioned on the bottom plate 1.

[0064] The bottom plate 1 is square. One corner of the bottom plate 1 is a chamfered corner with an angle of 1.5. The bottom plate limiting groove 2.3 corresponding to the bottom plate 1 is also square, and one corner of the bottom plate limiting groove 2.3 is also a chamfered corner. The chamfered corner on the bottom plate is adapted to the chamfered corner in the bottom plate limiting groove. In this way, when the cover plate 2 is matched with the bottom plate 1, only when the chamfered corner at one corner of the bottom plate 1 is aligned with the chamfered corner at one corner of the bottom plate limiting groove 2.3, the bottom plate limiting groove 2.3 on the cover plate 2 can be sleeved on the upper end of the bottom plate 1, thereby forming an anti-misassembly structure, enabling the cover plate 2 and the bottom plate 1 to be matched in only one set orientation.

[0065] In another implementation manner of this embodiment, the positioning structure includes a positioning pin and a positioning hole (not shown in the figure), and the positioning pin and the positioning hole are in one-to-one correspondence. One of the positioning pin and the positioning hole is arranged on the upper surface of the bottom plate 1, and the other is arranged on the lower surface of the cover plate 2. For example, the positioning pin is arranged on the upper surface of the bottom plate 1, and the positioning hole is arranged on the lower surface of the cover plate 2.

[0066] In this embodiment, there are two positioning pins, and the two positioning pins are asymmetrically distributed. For example, one positioning pin is arranged in the middle of the upper surface of the bottom plate 1, and the other positioning pin is at the edge of the upper surface of the bottom plate 1. In this way, when the cover plate 2 and the bottom plate 1 are positioned through the positioning structure, an anti-misassembly structure can be formed, enabling the cover plate 2 and the bottom plate 1 to be matched in only one set orientation.

[0067] The above are only the preferred embodiments of the present invention, and do not impose any limitations on the present invention. Any simple modifications, changes, and equivalent transformations made to the above embodiments according to the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A soldering device for flip-chip MEMS chips, characterized in that Comprising: A bottom plate, on the upper surface of which there are a number of bottom plate placement grooves for placing metallic glass sealing columns, and connection pin through-holes are provided on the bottom surface of the bottom plate placement grooves; A cover plate, placed on the bottom plate, a positioning structure is provided between the cover plate and the bottom plate, the cover plate and the bottom plate are positioned through the positioning structure, and a number of chip placement grooves corresponding one-to-one to the bottom plate placement grooves are provided on the cover plate, the chip placement grooves penetrate the upper and lower surfaces of the cover plate, and the chip placement grooves are located above the corresponding bottom plate placement grooves.

2. The welding device for flip-chip MEMS chips according to claim 1, characterized in that, The cross-sectional shape of the connection pin through-hole is adapted to the arrangement structure of the connection pins on the metallic glass sealing column, so that the connection pins on the metallic glass sealing column can only be inserted into the connection pin through-hole in a set orientation.

3. The soldering device for flip-chip MEMS chips according to claim 1 or 2, characterized in that, The cross-section of the bottom plate placement groove is circular, and the cross-section of the connection pin through-hole is rectangular.

4. The welding device for flip-chip MEMS chips according to claim 1 or 2, characterized in that, The bottom plate placement grooves are arranged in a number of rows, and any two adjacent bottom plate placement grooves in each row of bottom plate placement grooves are connected through a connection groove, and the connection groove is provided on the upper surface of the bottom plate.

5. The soldering device for a flip-chip MEMS chip according to claim 1 or 2, characterized in that, A number of weight reduction grooves are provided on the lower surface of the bottom plate.

6. The soldering device for flip-chip MEMS chips according to claim 1 or 2, characterized in that, The positioning structure includes a bottom plate limiting groove provided on the lower surface of the cover plate, and the upper end of the bottom plate extends into the bottom plate limiting groove.

7. The welding device for flip-chip MEMS chips according to claim 6, characterized in that, The bottom plate is square, one corner of the bottom plate is an inclined chamfer, and the bottom plate limiting groove corresponding to the bottom plate is also square, and one corner of the bottom plate limiting groove is also an inclined chamfer.

8. A soldering device for flip-chip MEMS chips according to claim 1 or 2, characterized in that, The chip placement groove is square.

9. The soldering device for a flip-chip MEMS chip according to claim 1 or 2, characterized in that, A number of annular avoidance grooves corresponding one-to-one to the chip placement grooves are provided on the lower surface of the cover plate, and the annular avoidance grooves surround the outside of the corresponding chip placement grooves.

10. The soldering device for a flip-chip MEMS chip according to claim 1 or 2, characterized in that, The upper port of the chip placement groove is provided with a guiding port with an opening area gradually increasing from bottom to top.

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