Chip welding device
By designing the chip welding device of the welding head fixing roller and welding head group, the problem of low efficiency in the chip and antenna packaging process is solved, efficient chip and antenna welding is achieved, and packaging efficiency is improved.
Patent Information
- Application Number
- CN202422452397.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-10-10
AI Technical Summary
In the prior art, the packaging process of chips and antennas is divided into multiple steps, resulting in low packaging efficiency and possible introduction of thermal or mechanical stresses, affecting the packaging effect.
A chip welding device is provided, including a welding assembly, the welding assembly consists of a welding head fixing roller and a plurality of welding head groups. The welding head group is uniformly arranged along the length and circumference of the welding head fixing roller, and the chip and antenna are rotated through multiple welding heads to improve welding efficiency.
It realizes efficient soldering of chips and antennas, improves the packaging efficiency of the chip packaging process, and enhances the connection efficiency of chips and antennas.
Smart Images
Figure CN223057000U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of chip packaging equipment, and more specifically, to a chip welding device. Background Art
[0002] With the rapid development of wireless communication technology, the application fields of radio frequency (RF) chips and antennas have been continuously expanding, covering multiple industries such as mobile communication, Internet of Things, automotive electronics, and medical devices. RF chips are also widely used in logistics, warehousing, inventory management, and access control. For example, RF chips can be combined with RFID tags for item tracking and identification, enabling data reading without contact. Due to the extremely wide application range and large application volume of RF chips, higher requirements are also put forward for the packaging efficiency of RF chips.
[0003] In the prior art, during the packaging process of chips and antennas, generally, three steps of antenna preparation, chip bonding, and lamination need to be carried out separately. Among them, antenna preparation refers to the process of manufacturing an antenna on a substrate through an etching process or a die-cutting process. Chip bonding is the process of physically connecting an RF chip and an antenna. Lamination is the process of re-layout and recombination of the bonded chip and antenna in a specific layout manner. Dividing the chip packaging process into multiple steps will result in a complex process flow of the chip packaging process, which may introduce thermal stress or mechanical stress, and thus may affect the packaging effect of the antenna and the chip, and will also affect the packaging efficiency of the chip packaging process. Summary of the Utility Model
[0004] The purpose of the present application is to provide a chip welding device, which solves the technical problem of low chip packaging efficiency and achieves the technical effect of efficiently welding chips and antennas.
[0005] A chip welding device provided by an embodiment of the present application includes a welding assembly, and the welding assembly is used to weld the chips on the transfer roller and the aluminum foil. The welding assembly includes a welding head fixing roller and a plurality of welding head groups. The plurality of welding head groups are arranged along the length direction of the welding head fixing roller, and each welding head group includes a plurality of welding heads evenly arranged along the circumferential direction of the welding head fixing roller.
[0006] In a possible implementation manner, the welding head fixing roller is rotatably connected to the welding bracket, and a welding driving assembly for driving the welding head fixing roller to rotate is provided on the welding bracket.
[0007] In another possible implementation manner, a plurality of welding head hole groups are provided on the welding head fixing roller, and each welding head hole group includes a plurality of welding head holes. The welding head holes of the welding head hole group are used to fix the welding heads according to the layout requirements of the chips.
[0008] In another possible implementation, the welding head includes two sets of welding electrodes. Each set of welding electrodes includes a welding positive electrode and a welding negative electrode. The welding positive electrode and the welding negative electrode of each set of welding electrodes weld one welding point of the chip and the aluminum foil through parallel welding.
[0009] In another possible implementation, the welding head includes a welding fixing seat. A plurality of springs are provided in the welding fixing seat. Each spring is used to jack up the welding positive electrode or the welding negative electrode, and the spring is used to press the welding positive electrode or the welding negative electrode against the chip and the aluminum foil.
[0010] In another possible implementation, the number of sets of welding heads is 12, and the 12 sets of welding head groups are uniformly arranged along the length direction of the welding head fixing roller.
[0011] In another possible implementation, the multiple welding heads of each welding head group are uniformly arranged along the circumferential direction of the welding head fixing roller.
[0012] In another possible implementation, each welding head group includes six welding heads.
[0013] In another possible implementation, the welding bracket is made of ceramics.
[0014] In another possible implementation, it further includes a control component. The control component is electrically connected to the welding driving component to control the rotation state of the welding driving component, and the control component is further used to control the power supply state of each welding head in each welding head group.
[0015] The beneficial effects of the embodiments of the present application compared with the prior art are as follows:
[0016] The embodiments of the present application provide a chip welding device, including a welding component for welding the chip and the aluminum foil on the transfer roller. The welding component includes a welding head fixing roller and a plurality of welding head groups. The plurality of welding head groups are arranged along the length direction of the welding head fixing roller, and each welding head group includes a plurality of welding heads uniformly arranged along the circumferential direction of the welding head fixing roller. When the welding head fixing roller in the embodiments of the present application rotates, the plurality of welding heads of the plurality of welding head groups take turns to weld the chip and the antenna simultaneously, which can weld the chip and the antenna, improve the welding efficiency, and improve the packaging efficiency of the chip packaging process. Description of the Drawings
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0018] Figure 1 The front view structural schematic diagram of a chip welding device provided by an embodiment of the present application;
[0019] Figure 2 The cross-sectional structural schematic diagram of a welding head fixing roller provided by an embodiment of the present application;
[0020] Figure 3 The end structural schematic diagram of a welding head provided by an embodiment of the present application;
[0021] Figure 4 is Figure 3 The partial structural schematic diagram at position A of a welding head in
[0022] Figure 5 The partial structural schematic diagram of a welding head during operation provided by an embodiment of the present application;
[0023] Figure 6 The working state schematic diagram of a chip welding device provided by an embodiment of the present application;
[0024] Figure 7 The partial structural schematic diagram of the working state of a chip welding device provided by an embodiment of the present application;
[0025] In the figure, 101, self-adhesive; 2, transfer assembly; 21, transfer roller; 301, chip; 401, aluminum foil; 5, welding assembly; 51, welding head fixing roller; 511, welding head hole group; 511a, welding head hole; 52, welding head group; 521, welding head; 521a, welding positive electrode; 521b, welding negative electrode; 521c, welding fixing seat; 521d, spring; 53, welding bracket; 531, welding drive assembly. Detailed implementation manners
[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0027] It should be noted that when a component or structure is referred to as "fixed to" or "disposed on" another component or structure, it can be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as "connected to" another component or structure, it can be directly connected to the other component or structure or indirectly connected to the other component or structure.
[0028] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.
[0029] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.
[0030] In the prior art, during the process of chip and antenna packaging, generally three steps of antenna preparation, chip bonding, and lamination need to be carried out separately, which affects the packaging efficiency of the chip packaging process.
[0031] For the above reasons, the embodiment of the present application provides a chip welding device, including a welding component. The welding component is used to weld the chip on the transfer roller and the aluminum foil. The welding component includes a welding head fixing roller and a plurality of welding head groups. The plurality of welding head groups are arranged along the length direction of the welding head fixing roller. Each welding head group includes a plurality of welding heads evenly arranged along the circumferential direction of the welding head fixing roller. When the welding head fixing roller in the embodiment of the present application rotates, the plurality of welding heads of the plurality of welding head groups take turns to simultaneously weld the chip and the antenna, which can weld the chip and the antenna, improve the welding efficiency, and can improve the packaging efficiency of the chip packaging process.
[0032] In some scenarios, a chip welding device according to an embodiment of the present application can be applied to the production of RFID tags, and can weld the chips and antennas of RFID tags, improving the connection efficiency of the chips and antennas of RFID tags.
[0033] The following specifically describes a chip welding device provided by the embodiment of the present application with specific examples.
[0034] Figure 1 It is a front view structural schematic diagram of a chip welding device provided by the embodiment of the present application, as Figure 1As shown, the chip welding device includes a welding assembly 5, and the welding assembly 5 is used to weld the chip 301 and the aluminum foil 401 on the transfer roller 21. The welding assembly 5 includes a welding head fixing roller 51 and a plurality of welding head groups 52. The plurality of welding head groups 52 are arranged along the length direction of the welding head fixing roller 51, and each welding head group 52 includes a plurality of welding heads 521 uniformly arranged along the circumferential direction of the welding head fixing roller 51.
[0035] Figure 2 It is a schematic cross-sectional structure diagram of a welding head fixing roller provided by an embodiment of the present application. As Figure 1 and Figure 2 shown, the welding assembly 5 is a working assembly of the chip welding device. The welding assembly 5 is used to weld the chip 301 and the aluminum foil 401 on the transfer roller 21. The aluminum foil 401 is used to make an antenna, and the welding assembly 5 is used to efficiently connect the chip 301 and the aluminum foil 401.
[0036] As Figure 1 shown, the welding assembly 5 includes a welding head fixing roller 51 and a plurality of welding head groups 52. The welding head fixing roller 51 is used to fix the plurality of welding head groups 52. The plurality of welding head groups 52 are arranged along the length direction of the welding head fixing roller 51, so that the plurality of welding head groups 52 can perform chip welding simultaneously, improving the welding efficiency of the chip.
[0037] As Figure 2 shown, each welding head group 52 includes a plurality of welding heads 521 uniformly arranged along the circumferential direction of the welding head fixing roller 51. The plurality of welding heads 521 can weld the chip and the antenna when the welding head fixing roller 51 rotates.
[0038] Figure 6 It is a schematic diagram of the working state of a chip welding device provided by an embodiment of the present application. Figure 7 It is a schematic partial structure diagram of the working state of a chip welding device provided by an embodiment of the present application. As Figure 6 and Figure 7 shown, in the working process of the embodiment of the present application, the chip 301 can be carried and encapsulated through the transfer assembly 2. The transfer assembly 2 includes a transfer roller 21. The transfer roller 21 is used to carry the self-adhesive 101 to encapsulate the chip 301. The self-adhesive 101 is used to adhere to the chip 301 to fix the chip 301. The aluminum foil 401 surrounds the outside of the chip 301 on the transfer roller 21, and the welding assembly 5 can perform welding connection on the chip 301 and the aluminum foil 401.
[0039] The beneficial effect brought by the above implementation method is that when the welding head fixing roller rotates, the welding heads of the plurality of welding head groups can efficiently weld the chip and the antenna, improving the efficiency of welding and encapsulating the chip and the antenna.
[0040] In some implementations, the welding head fixing roller 51 is rotatably connected to the welding bracket 53, and a welding driving assembly 531 for driving the welding head fixing roller 51 to rotate is provided on the welding bracket 53.
[0041] As Figure 1 shown, in terms of structure, the welding head fixing roller 51 is rotatably connected to the welding bracket 53. The welding bracket 53 is used to support the welding head fixing roller 51, and a welding driving assembly 531 for driving the welding head fixing roller 51 to rotate is provided on the welding bracket 53. The welding driving assembly 531 is used to drive the welding head fixing roller 51 to rotate so that the welding heads of multiple welding head groups take turns to weld the chip and the antenna.
[0042] The beneficial effect brought by the above implementation is that the welding driving assembly drives the welding heads of multiple welding head groups to take turns to weld the chip and the antenna on the welding bracket, ensuring the welding efficiency of the chip and the antenna.
[0043] In some implementations, multiple welding head hole groups 511 are provided on the welding head fixing roller 51. Each welding head hole group 511 includes multiple welding head holes 511a. The welding head holes 511a of the welding head hole group 511 are used to fix the welding head 521 according to the layout requirements of the chip 301.
[0044] As Figure 1 shown, in terms of structure, multiple welding head hole groups 511 are provided on the welding head fixing roller 51. Each welding head hole group 511 includes multiple welding head holes 511a. The welding head holes 511a of the welding head hole group 511 are used to fix the welding head 521 according to the layout requirements of the chip 301. Furthermore, the fixing position of the welding head 521 can be adjusted according to the position arrangement requirements of the welding head 521, improving the position flexibility of arranging the welding head 521.
[0045] The beneficial effect brought by the above implementation is that the welding head can be fixed according to the layout requirements of the chip, which can improve the efficiency of welding and connecting and packaging the chip and the antenna.
[0046] In some implementations, the welding head 521 includes 2 sets of welding electrodes. Each set of welding electrodes includes a welding positive electrode 521a and a welding negative electrode 521b. The welding positive electrode 521a and the welding negative electrode 521b of each set of welding electrodes weld 1 welding point of the chip 301 and the aluminum foil 401 through parallel welding.
[0047] Figure 3 It is a schematic diagram of the end structure of a welding head provided by an embodiment of the present application. Figure 4 For Figure 3 a partial structure schematic diagram at point A of a welding head in Figure 5 It is a partial structure schematic diagram of a welding head provided by an embodiment of the present application when working. AsFigures 3 to 5 As shown, the welding head 521 includes two sets of welding electrodes. Each set of welding electrodes includes a welding positive electrode 521a and a welding negative electrode 521b. The welding positive electrode 521a and the welding negative electrode 521b of each set of welding electrodes are used to weld one welding point of the chip 301 and the aluminum foil 401 through parallel welding. The two sets of welding electrodes of the welding head 521 can efficiently weld the chip 301 and the aluminum foil 401.
[0048] The beneficial effect brought by the above implementation is that the two sets of welding electrodes of the welding head can efficiently weld the chip and the aluminum foil.
[0049] In some implementation manners, the welding head 521 includes a welding fixing base 521c. A plurality of springs 521d are arranged in the welding fixing base 521c. Each spring 521d is used to jack up the welding positive electrode 521a or the welding negative electrode 521b, and the spring 521d is used to press the welding positive electrode 521a or the welding negative electrode 521b against the chip 301 and the aluminum foil 401.
[0050] As Figure 3 shown, in terms of structure, the welding head 521 includes a welding fixing base 521c. A plurality of springs 521d are arranged in the welding fixing base 521c. Each spring 521d is used to jack up the welding positive electrode 521a or the welding negative electrode 521b. The spring 521d can be arranged in the welding fixing base 521c. The welding positive electrode 521a or the welding negative electrode 521b is movably arranged in the welding fixing base 521c. The spring 521d can press the welding positive electrode 521a or the welding negative electrode 521b against the chip 301 and the aluminum foil 401, so that the welding positive electrode 521a or the welding negative electrode 521b can weld the chip 301 and the aluminum foil 401 after pressing, improving the welding quality of the chip 301 and the aluminum foil 401.
[0051] The beneficial effect brought by the above implementation is that the welding positive electrode or the welding negative electrode is welded to the chip and the aluminum foil after being pressed by the spring, improving the welding quality of the chip and the aluminum foil.
[0052] In some implementation manners, the number of the welding head groups 52 is 12 groups, and the 12 groups of welding head groups 52 are uniformly arranged along the length direction of the welding head fixing roller 51.
[0053] As Figure 1 shown, in terms of structure, the number of the welding head groups 52 is 12 groups, and the 12 groups of welding head groups 52 are uniformly arranged along the length direction of the welding head fixing roller 51, so that the 12 groups of welding head groups 52 can weld the chip simultaneously.
[0054] The beneficial effect brought by the above implementation is that the 12 groups of welding head groups can efficiently weld the chip.
[0055] In some implementations, the multiple welding heads 521 of each welding head group 52 are evenly arranged along the circumferential direction of the welding head fixing roller 51.
[0056] As Figure 2 shown, structurally, the multiple welding heads 521 of each welding head group 52 are evenly arranged along the circumferential direction of the welding head fixing roller 51, so that when the welding head group 52 is driven to rotate by the same angle, the multiple welding heads 521 can be driven to alternately perform efficient welding on the chip and the aluminum foil.
[0057] In some implementations, each welding head group 52 includes six welding heads 521.
[0058] As Figure 2 shown, each welding head group 52 includes six welding heads 521, so that the six welding heads 521 can alternately rotate to perform chip and aluminum foil welding when rotating 60 degrees.
[0059] In some implementations, the welding bracket 53 is made of ceramics.
[0060] As Figure 1 shown, structurally, the welding bracket 53 is made of ceramics. The coefficient of thermal expansion and contraction of the welding bracket 53 made of ceramics is small, which can reduce the error in the welding of the chip and the aluminum foil.
[0061] The beneficial effect brought by the above implementation is that the welding bracket made of ceramics can reduce the error in the welding of the chip and the aluminum foil.
[0062] In some implementations, the chip welding device further includes a control component. The control component is electrically connected to the welding driving component 531 to control the rotation state of the welding driving component 531. The control component is further used to control the power supply state of each welding head 521 in each welding head group 52.
[0063] The chip welding device further includes a control component. The control component is electrically connected to the welding driving component 531 to control the rotation state of the welding driving component 531. The control component is further used to control the power supply state of each welding head 521 in each welding head group 52, so that the control component can control the rotation of the welding driving component 531 and can control the power supply state of each welding head 521 at the same time to achieve accurate control of the welding process.
[0064] The beneficial effect brought by the above implementation is that the control component can control the rotation angle of the welding driving component and can control the power supply state of each welding head at the same time to achieve accurate control of the welding process.
[0065] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.
Claims
1. A chip soldering device, characterized in that, It includes a welding assembly which is used to weld the chips and aluminum foils on the transfer roller. The welding assembly includes a welding head fixing roller and a plurality of welding head groups. The plurality of welding head groups are arranged along the length direction of the welding head fixing roller, and each welding head group includes a plurality of welding heads uniformly arranged along the circumferential direction of the welding head fixing roller.
2. The chip soldering device according to claim 1, wherein, The welding head fixing roller is rotatably connected to the welding bracket, and a welding drive assembly for driving the rotation of the welding head fixing roller is provided on the welding bracket.
3. The chip soldering device according to claim 2, characterized in that A plurality of welding head hole groups are provided on the welding head fixing roller. Each welding head hole group includes a plurality of welding head holes, and the welding head holes of the welding head hole group are used to fix the welding heads according to the layout requirements of the chips.
4. The chip soldering device according to claim 3, wherein, The welding head includes 2 sets of welding electrodes. Each set of welding electrodes includes a welding positive electrode and a welding negative electrode. The welding positive electrode and the welding negative electrode of each set of welding electrodes weld one welding point of the chip and the aluminum foil through parallel welding.
5. The chip soldering device according to claim 4, characterized in that, The welding head includes a welding fixing seat. A plurality of springs are provided in the welding fixing seat. Each spring is used to jack up the welding positive electrode or the welding negative electrode, and the spring is used to press the welding positive electrode or the welding negative electrode against the chip and the aluminum foil.
6. The chip soldering device according to claim 5, wherein, The number of welding head groups is 12 groups, and the 12 groups of welding head groups are uniformly arranged along the length direction of the welding head fixing roller.
7. The chip soldering device according to claim 6, characterized in that The plurality of welding heads of each welding head group are uniformly arranged along the circumferential direction of the welding head fixing roller.
8. The chip soldering device according to claim 7, characterized in that, Each welding head group includes 6 welding heads.
9. The chip soldering device according to claim 8, wherein, The welding bracket is made of ceramics.
10. The chip soldering device according to claim 9, wherein, It further includes a control assembly. The control assembly is electrically connected to the welding drive assembly to control the rotation state of the welding drive assembly, and the control assembly is also used to control the power supply state of each welding head in each welding head group.